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TLP525G,TLP525G−2,TLP525G−4
TOSHIBA Photocoupler GaAs IRed & Photo−Triac
TLP525G,TLP525G−2,TLP525G−4
Triac Drive
Programmable Controllers
AC−Output Module
Solid State Relay
The TOSHIBA TLP525G, −2 and −4 consist of a photo−triac optically
coupled to a gallium arsenide infrared emitting diode.
The TLP525G−2 offers two isolated channels in an eight lead plastic
DIP package, while the TLP525G−4 provides four isolated channels in a
sixteen lead plastic DIP package.
• Peak off−stage voltage: 400V (min.)
• Trigger LED current: 10mA (max.)
• Peak on−stage current: 2Apk (max.)
• Isolation voltage: 2500V
• UL recognized: File no.E67349
Pin Configurations (top view)
rms
(min.)
Unit in mm
TOSHIBA 11−5B2
Weight: 0.26g
TOSHIBA 11−10C4
Weight: 0.54g
TOSHIBA 11−20A3
Weight: 1.1g
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TLP525G,TLP525G−2,TLP525G−4
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic Symbol
Forward current I
Forward current derating IF / °C −0.7 (Ta ≥ 53°C) −0.5 (Ta ≥ 25°C) mA / °C
Pulse forward current I
LED
Reverse voltage VR 5 V
Junction temperature Tj 125 °C
Off−state output terminal
voltage
On−state RMS
current
Ta = 25°C 100 80
Ta = 70°C
On−state current derating
(Ta≥25°C)
Detector
Peak on state current I
Peak nonrepetitive surge
current (P
= 10ms, DC = 10%)
W
Junction temperature T
Storage temperature range T
Operating temperature range T
Lead soldering temperature T
Isolation voltage (Note) BV
Rating
TLP525G
F
FP
V
DRM
I
T (RMS)
/ °C
I
T
TP
I
1.2 A
TSM
j
stg
opr
sol
S
50 50 mA
1 (100μs pulse, 100pps) A
50 40
−1.1 −0.9 mA / °C
2 (100μs pulse, 120pps) A
−55~125 °C
−40~100 °C
260 (10s) °C
2500 (AC, 1min., R.H. ≤ 60%) V
TLP525G−2
TLP525G−4
400 V
115 °C
Unit
mA
rms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: Device considered a two terminal device: LED side pins shorted together and detector side pins shorted
together.
Recommended Operating Conditions
Characteristic Symbol Min. Typ. Max. Unit
Supply voltage V
AC
Forward current IF 15 20 25 mA
Peak on−state current I
Operating temperature T
TP
opr
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
― ― 120 Vac
― ― 1 A
−25 ― 85 °C
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TLP525G,TLP525G−2,TLP525G−4
Individual Electrical Characteristics
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Forward voltage V
Reverse current IR VR = 5V ― ― 10 μA
LED
Capacitance C
Peak off−state current
Peak on−state voltage
Holding current IH ⎯ ― 0.2 ― mA
Critical rate of rise
Detector
of off−state voltage
Critical rate of rise
of commutating voltage
F
T
I
DRM
V
TM
dv / dt
dv / dt (c)
(Ta = 25°C)
IF = 10mA 1.0 1.15 1.3 V
V = 0, f = 1MHz ― 30 ― pF
V
= 400V ― 10 100 nA
DRM
ITM = 100mA ― 1.7 3.0 V
Vin = 120V
(Figure 1)
Vin = 30V
(Figure 1)
, Ta = 85°C
rms
, IT = 15mA
rms
Coupled Electrical Characteristics
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Trigger LED current I
Capacitance input to output C
Isolation resistance RS VS = 500V, R.H. ≤ 60% 5×10
Isolation voltage
BV
FT
S
S
(Ta = 25°C)
VT = 3V ― 5 10 mA
VS = 0, f = 1MHz ― 0.8 ― pF
AC, 1 minute 2500 ― ―
AC, 1 second, in oil ― 5000 ―
DC, 1 minute, in oil ― 5000 ― Vdc
200 500
― 0.2 ― V / μs
10
1014 ― Ω
―
V / μs
Vrms
Fig.1 dv / dt Test Circuit
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RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
20070701-EN
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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