Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
NA 25 50
PA 40 80
QA 63 125
RA 100 200
SA 160 320
TA 250 500
UA 400 800
VA 630 1250
WA 1000 2000
Unit mcd mcd
Luminous Intensity IV
Min Max
Optical Characteristics–2
(Ta = 25°C)
Product Name
TLRE1102B
TLSE1102B
TLOE1102B ⎯ 612
TLYE1102B ⎯ 590
TLGE1102B ⎯ 574
TLPGE1102B ⎯ 562
Unit nm nm nm mA
Peak Emission Wavelength λ
Min Typ Max Typ Min Typ Max
⎯
⎯
644
623
Emission Spectrum
∆λ Dominant Wavelength λd
p
⎯
⎯
⎯ 15 599 605 613
⎯ 13 581 587 595
⎯ 11 565 571 576
⎯ 11 555 558 564
18 624 630 638
15 607 613 621
I
20
F
The cautions
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
• This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
3
2006-06-06
Page 4
TLRE1102B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
50
Ta = 25°C
30
(mA)
F
10
5
3
Forward current I
1
1.6 2.0
1.7 2.2
1.8 2.1 1.9
Forward voltage VF (V) Forward current IF (mA)
I
F
– VF
I
– IF
1000
Ta = 25°C
500
300
(mcd)
V
100
50
30
V
Luminous intensity I
10
150
351030 100
10
V
5
3
I
V
– Tc
1.0
0.8
Wavelength characteristic
IF = 20 mA
Ta = 25°C
1
0.5
0.3
Relative luminous intensity I
0.1
−25 50
0 100
Case temperature Tc (°C)
25 75
0.6
0.4
0.2
Relative luminous intensity
0
580680 660 620600700
640
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
0
60°
70°
1.00.80.6 0.4 0.2
80°
90° 90°
4
2006-06-06
Page 5
TLSE1102B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
100
(mA)
F
Forward current I
Ta = 25°C
50
30
10
5
3
1
1.6 2.1
1.7 1.8 1.92.0 2.2
Forward voltage VF (V)
I
F
– VF
(mcd)
Luminous intensity I
2000
Ta = 25°C
1000
V
500
300
100
50
150
351030 100
Forward current IF (mA)
I
V
– IF
25
I
V
– Tc
50
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
Wavelength characteristic
0
600700
580680 660 620
Wavelength λ (nm)
10
V
5
3
1
0.5
0.3
Relative luminous intensity I
0.1
−25 75
0 100
Case temperature Tc (°C)
640
IF = 20 mA
Ta = 25°C
Radiation pattern
Ta = 25°C
50°
60°
70°
80°
40°
30°
20°
10°
0°
10°
20°
30°
40°
50°
60°
70°
1.00.80.6 0.4 0.2 0
80°
90° 90°
5
2006-06-06
Page 6
TLOE1 102B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
100
Ta = 25°C
50
30
(mA)
F
10
5
3
Forward current I
1
1.7 2.2 2.1 1.8 2.3
10
V
5
3
1
0.5
0.3
Relative luminous intensity I
1
−25 0 50
80°
40°
50°
60°
70°
I
– VF
F
1.9
2.0
Forward voltage VF (V)
I
– Tc
V
25
Case temperature Tc (°C)
Radiation pattern
0°
30°
20°
10°
10°
20°
30°
75 100
Ta = 25°C
40°
50°
60°
70°
1.00.80.6 0.4 0.2 0
80°
90° 90°
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
I
– IF
V
5
10
600
Wavelength λ (nm)
50
IF = 20 mA
Ta = 25°C
2000
Ta = 25°C
1000
(mcd)
V
500
300
100
Luminous intensity I
50
130 3100
Forward current IF (mA)
Wavelength characteristic
1.0
0.8
0.6
0.4
0.2
Relative luminous intensity
0
560660
540640 620 580
6
2006-06-06
Page 7
TLYE1102B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
100
Ta = 25°C
50
30
(mA)
F
10
5
3
Forward current I
1
1.7 2.2 2.1 1.8 2.3
10
V
5
3
1
0.5
0.3
Relative luminous intensity I
0.1
−25 75
80°
40°
50°
60°
70°
I
– VF
F
1.9
2.0
Forward voltage VF (V)
I
– Tc
V
0 100
25
50
Case temperature Tc (°C)
Radiation pattern
Ta = 25°C
0°
30°
20°
10°
10°
20°
30°
40°
50°
60°
1.00.80.6 0.4 0.2 0
70°
80°
90° 90°
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
I
– IF
V
1000
Ta = 25°C
500
(mcd)
300
V
100
50
Luminous intensity I
20
Relative luminous intensity
150
1.0
0.8
0.6
0.4
0.2
0
3510 30 100
Forward current IF (mA)
Wavelength characteristic
IF = 20 mA
Ta = 25°C
600 540640 620 580560
Wavelength λ (nm)
660
7
2006-06-06
Page 8
TLGE1 102B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
100
Ta = 25°C
50
30
(mA)
F
10
5
3
Forward current I
1
1.7 2.2 2.1 1.8 2.3
1.9
Forward voltage VF (V)
I
F
– VF
2.0
1000
Ta = 25°C
500
300
(mcd)
V
100
50
30
Luminous intensity I
10
150
351030 100
Forward current IF (mA)
I
V
– IF
25
I
V
– Tc
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
0
540
Wavelength characteristic
Wavelength λ (nm)
10
V
5
3
1
0.5
0.3
Relative luminous intensity I
0.1
−25 75 50 0 100
Case temperature Tc (°C)
IF = 20 mA
Ta = 25°C
620600 580 560
Radiation pattern
Ta = 25°C
50°
60°
70°
80°
40°
30°
20°
10°
0°
10°
20°
30°
40°
50°
0
60°
70°
1.00.80.6 0.4 0.2
80°
90° 90°
8
2006-06-06
Page 9
TLPGE1 1 02B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
100
(mA)
F
Ta = 25°C
50
30
10
5
3
Forward current I
1
1.7 2.2 2.1 1.8 2.3
1.9
Forward voltage VF (V)
I
F
– VF
2.0
200
Ta = 25°C
100
(mcd)
V
50
30
10
Luminous intensity I
5
150
351030 100
Forward current IF (mA)
I
V
– IF
25
I
– Tc
V
1.0
0.8
0.6
0.4
0.2
Relative luminous intensity
75
100
0
520
Wavelength characteristic
Wavelength λ (nm)
10
V
5
3
1
0.5
0.3
Relative luminous intensity I
0.1
−25 0 50
Case temperature Tc (°C)
IF = 20 mA
Ta = 25°C
600580 560540
Radiation pattern
Ta = 25°C
50°
60°
70°
80°
40°
30°
20°
10°
0°
10°
20°
30°
40°
50°
60°
1.00.80.6 0.4 0.2 0
70°
80°
90° 90°
9
2006-06-06
Page 10
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an
environment of 5°C to 30°C/60% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking can cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be
sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermeticity of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less Time : within 3 s
•Do not perform wave soldering.
Temperature profile (example)
240°C max
140~160°C max
(*)
4°C/s max
Package surface
temperature (°C)
60~120 s max
(*)
(*)
Time (s)
10 s max
4°C/s max
(*)
(*)
(*)
Recommended soldering pattern
1.65 1.15
1.65
Unit: mm
2.41
10
2006-06-06
Page 11
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN TROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)
(FRW-17, FRW-1, FRV-100)
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method
of classification is as below. (This method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications.)
(1) Tape Type: T10 (8-mm pitch)
(2) Example
2. Tape dimensions
Unit: mm
TLYE1102B (T10)
Tape type
Toshiba product No.
Symbol Dimension Tolerance Symbol Dimension Tolerance
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1)Example: TLYE1102B (T10)
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
Reel 500 pcs
Carton 2,000 pcs
P/N: TO SH IB A
TYPE TLYE1102B
ADDC(T10) Q’TY500 pcs
Lot Number Key code for TSB 32C 500
(RANK SYMBOL)
Use under 5-30degC/60%RH within 168h
SEAL DATE:
[[G]]/RoHS COMPATIBLE DIFFUSED IN *****
*Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN *****
(2)Label location
• Reel
Carton
Tape reel direction
• The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
Label position
Label position
13
2006-06-06
Page 14
TL(RE,SE,OE,YE,GE,PGE)1102B(T10)
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
14
2006-06-06
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