Integrated Asynchronous Communications
Element (ACE) Compatible With PCMCIA
PC Card Standard Release 2.01
D
Consists of a Single TL16C550 ACE Plus
PCMCIA Interface Logic
D
Provides Common I-Bus/Z-Bus
Microcontroller Inputs for Most Intel
Zilog
D
Fully Programmable 256-Byte Card
Subsystems
and
Information Structure (CIS) and 8-Byte Card
Configuration Register (CCR)
D
Adds or Deletes Standard Asynchronous
Communication Bits (Start, Stop and
Parity) to or From Serial Data Stream
D
Independently Controlled Transmit,
Receive, Line Status, and Data Set
Interrupts
D
Subsystem Selectable Serial-Bypass Mode
Provides Subsystem With Direct Parallel
Access to the FIFOs
description
The TL16PC564B/BL V† is designed to provide all the functions necessary for a Personal Computer Memory
Card International Association (PCMCIA) universal asynchronous receiver transmitter (UART) subsystem
interface. This interface provides a serial-to-parallel conversion for data to and from a modem
coder-decoder/digital signal processor (CODEC/DSP) function to a PCMCIA parallel data-port format. A
computer central processing unit (CPU), through a PCMCIA host controller, can read the status of the
asynchronous communications element (ACE) interface at any point in the operation. Reported status
information includes the type of transfer operation in process, the status of the operation, and any error
conditions encountered.
Attribute memory consists of a 256-byte card information structure (CIS) and eight 8-byte card configuration
registers (CCR). The CIS, implemented with a dual-port random-access memory (DPRAM), is available to both
the host CPU and subsystem (modem), as are the CCRs. This DPRAM is used in place of the electrically
erasable programmable read-only memory (EEPROM) normally used for the CIS. At power up, attribute
memory is initialized by the subsystem.
The TL16PC564B/BLV uses a TL16C550 ACE-type core with an expanded 64 × 11 receiver first-in-first-out
(FIFO) memory and a 64 × 8 transmitter FIFO memory . The receiver trigger logic flags have been adjusted in
order to take full advantage of the increased capacity when in the extended mode. In addition, eight of the UART
registers have been mapped into the subsystem (modem) memory space as read-only registers. This allows
the subsystem to read UART status information.
D
Fully Programmable Serial-Interface
Characteristics:
– 5-, 6-, 7-, or 8-Bit Characters
– Even-, Odd-, or No-Parity Bit Generation
and Detection
– 1-, 1 1/2-, or 2-Stop Bit Generation
– Baud-Rate Generation
D
Fully Prioritized Interrupt System Controls
D
Modem Control Functions
D
Provides TL16C450 Mode at Reset Plus
Selectable Normal TL16C550 Operation or
Extended 64-Byte FIFO Mode
D
Selectable Auto-RTS Mode Deactivates
RTS
at 14 Bytes in 550 Mode and at
56 Bytes in Extended 550 Mode
D
Selectable Auto-CTS Mode Deactivates
Serial Transfers When CTS
D
Available in 100 Pin Thin Quad Flatpack
is Inactive
(PZ) Package
A subsystem-selectable serial-bypass mode has been implemented to allow the subsystem to bypass the serial
portion of the UART and write directly to the receiver FIFO and read directly from the transmitter FIFO. Interrupt
operation is not affected in this mode.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Intel is a registered trademark of Intel System, Inc.
Zilog is a registered trademark of Zilog Incorporated
†
Patent pending
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The terminal names not enclosed in parentheses correspond to an Intel microcontroller signal, and the terminal
names enclosed in parentheses correspond to a Zilog microcontroller signal.
ALE (AS)26SIAddress-latch enable/address strobe. ALE(AS) is an address-latch enable in the Intel mode
ARBCLKO7MOArbitration clock output. ARBCLKO is equal to the input on ARBCLKI divided by the
ARBCLKI5MIArbitration clock input. ARBCLKI is the base clock used in arbitration for the attribute memory
ARBPGM0
ARBPGM1
BAUDOUT38UOBaud output. BAUDOUT is an active-low 16× signal for the transmitter section of the UART.
CE1
CE2
CS32SIChip select. CS is the active-low chip select from the Zilog or Intel microcontroller.
CTS49UIClear to send. CTS is an active-low modem status signal whose condition can be checked by
DCD48UIData carrier detect. DCD is an active-low modem-status signal whose condition can be
DSR46UIData set ready. DSR is an active-low modem status signal whose condition can be checked
DTR34UOData terminal ready. DSD is an active-low signal. When active, DTR informs the modem or
EXTEND1UIFIFO extend. When EXTEND is high, the UART is configured as a standard TL16C550 with
GND4,6,13,16,30,
†
Host = H, Subsystem = S, UART = U, Miscellaneous = M
8
9
94
62
39,41,43,54,
66,68,69,80,91
INTER-
†
FACE
and an address strobe in the Zilog mode. ALE (AS
active low for a Zilog subsystem.
binary-coded divisor input on ARBPGM (1–0).
DRAM and the reset validation circuitry.
MIArbitration clock divisor program. These two bits set the divisor for ARBCLKI. Divide by 1, 2,
HICard enable 1 and card enable 2 are active-low signals. CE1 enables even-numbered
MCommon ground
4, and 8 are available.
The clock rate is established by the reference clock (UARTCLK) frequency divided by a divisor
specified by the baud generator divisor latches. BAUDOUT
section by tying this output to the RCLK input.
address bytes, and CE2
on HA0, CE1
These signals have internal pullup resistors.
reading bit 4 (CTS) of the modem status register (MSR). Bit 0 (delta clear to send) of the MSR
indicates that the signal has changed states since the last read from the MSR. If the
modem-status interrupt is enabled when CTS
checked by reading bit 7 (DCD) of the MSR. Bit 3 (delta data carrier detect) of the MSR
indicates that the signal has changed states since the last read from the MSR. If the
modem-status interrupt is enabled when DCD
by reading bit 5 (DSR) of the MSR. Bit 1 (delta data set ready) of the MSR indicates that the
signal has changed states since the last read from the MSR. If the modem-status interrupt is
enabled when DSR
data set that the UART is ready to establish communication. DTR
by setting the DTR bit 0 of the modem control register (MCR) to a high level. DTR
in the inactive state either as a result of a reset, doing a loop-mode operation, or resetting bit
0 (DTR) of the MCR.
16-byte transmit and receive FIFOs. When EXTEND
bit 5 is high, the FIFOs are extended to 64 bytes and the receiver-interrupt trigger levels adjust
accordingly. EXTEND
enables the auto-RTS
, and CE2 allows an 8-bit host to access all data on HD0 through HD7 if desired.
enables odd-numbered address bytes. A multiplexing scheme based
changes states, an interrupt is generated.
low in conjunction with FIFO control register (FCR) bit 4 set high
function.
INPACK71HOInput port acknowledge. INPACK is an active-low output signal that is asserted when the card
IORD63HII/O read strobe. IORD is an active-low input signal activated to read data from the card I/O space.
IOWR64HII/O write strobe. IORW is an active-low input signal activated to write data to the card I/O space.
IREQ88HOInterrupt request. IREQ is an active-low output signal asserted by the card to indicate to the host
IRQ27SOInterrupt request. This active-high IRQ to the subsystem indicates a host CPU write to attribute
NANDOUT12MOThis is a production test output.
OE93HIOutput enable. OE is an active-low input signal used to gate memory read data from the card. This
OUT1
OUT2
RCLK40UIReceiver clock. RCLK is the 16×-baud-rate clock input for the receiver section of the UART.
RD(DS)29SIRead enable or data strobe input. RD(DS) is the active-low read enable in the Intel mode and the
REG73HIAttribute memory select. This active-low input signal is generated by the host CPU and accesses
RESET67HIReset. RESET is an active-high input that serves as the master reset for the device. RESET clears
RI50UIRing indicator. RI is an active-low modem status signal whose condition can be checked by reading
†
Host = H, Subsystem = S, UART = U, Miscellaneous = M
78
79
81
82
83
84
85
87
90
92
77
76
75
100
99
98
96
95
37
44
INTER-
†
FACE
HIThe 10-bit address bus addresses the attribute memory (bits 1 –8) and addresses the internal
HI/OThe 8-bit bidirectional data bus transfers data to and from the attribute memory and the internal
UOOutput 1 and output 2 are active-low signals. OUT1 and OUT2 are user-defined output terminals
UART as either PCMCIA I/O (bits 0–2) or as a standard COM port (bits 0–9).
UART.
responds to an I/O read cycle at the address on the HA bus.
The REG
I/O transfer to take place. This signal has an internal pullup resistor.
The REG
I/O transfer to take place. This signal has an internal pullup resistor.
CPU that a card device requires host software service. This signal doubles as READY/BUSY
during power-up initialization.
memory has occurred.
signal has an internal pullup resistor.
that are set to their active state by setting respective MCR bits (OUT1 and OUT2) high. OUT1
OUT2
resetting bit 2 (OUT1) or bit 3 (OUT2) of the MCR. This signal has an open-drain outputs.
active-low data strobe in the Zilog mode.
attribute memory (OE
memory access is excluded. This signal has an internal pullup resistor and hysteresis on the input
buffer .
the UART, placing the card in an unconfigured state. This signal has an internal pullup resistor.
bit 6 (RI) of the MSR. The trailing-edge ring indicator (TERI) bit 2 of the MSR indicates that RI
transitioned from a low to a high state since the last read from the MSR. If the modem status
interrupt is enabled when this transition occurs, an interrupt is generated.
signal and at least one of the card enable inputs (CE1, CE2) must also be active for the
signal and at least one of the card enable inputs (CE1, CE2) must also be active for the
are set to their inactive (high) state as a result of a reset, doing loop-mode operation, or by
and WE active) and I/O space (IORD or IOWR active). PCMCIA common
RST11MOThis is the qualified active-low reset signal. RST has a fail-safe open-drain output.
RTS35UORequest to send is an active-low signal. When active, RTS informs the modem of the data set
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA824SIAddress bit 8 is bit 8 of the subsystem address bus.
SAD0
SAD1
SAD2
SAD3
SAD4
SAD5
SAD6
SAD7
SELZ/I28SISelect Zilog or Intel mode. SELZ/I is used to select between a Zilog-like or Intel-like
SIN33UISerial data input. SIN moves information from the communication line or modem to the
SOUT45UOSerial out. SOUT is the composite serial data output to a connected communication device.
SSAB3SISeparate subsystem address bus. SSAB is used to select between a multiplexed address/data
STSCHG74HOStatus change. STSCHG is an optional active-low output signal used to alert the host that a
TESTOUT70MOThis is a production test output.
UARTCLK51MOUART clock. UARTCLK is a clock output whose frequency is determined by the frequency on
V
CC
VTEST2MIVTEST is an active-high production test input with an internal pulldown resistor. It can be left
WE89HIWrite enable. WE is an active-low input signal used for strobing attribute-memory write data into
WR(R/W)31SIWrite or read/write enable. WR(R/W) is the active-low write enable in the Intel mode and
XIN42MICrystal input. XIN is a clock input divided internally based on the PGMCLK register value, then
†
Host = H, Subsystem = S, UART = U, Miscellaneous = M
53
55
56
57
58
59
61
65
25
23
20
19
18
17
15
14
10,21,22,36,
47,52,60,
72,86,97
INTERFACE
I/ODESCRIPTION
†
that the UART is ready to receive data. RTS
control register bit and is set to its inactive (high) state either as a result of a reset, doing
loop-mode operation, or by resetting bit 1 (RTS) of the MCR.
SIWhen SSAB is high, this is the subsystem address bus and SAD (7–0) is the subsystem data
SI/OSubsystem address/data 7 – 0. This is a multiplexed bidirectional address/data bus to the
M3.3-V or 5-V supply voltage
bus. When SSAB is low, this bus is not used and SAD(7–0) is the subsystem multiplexed
address/data bus.
attribute-memory DPRAM and CCRs when SSAB is low . This becomes a bidirectional data bus
when SSAB is high.
microcontroller. 1 = Zilog, 0 = Intel.
TL16PC564B UART receiver circuits. Data on the serial bus is disabled when operating in the
loop mode.
SOUT is set to the marking (logic 1) state as a result of a reset.
bus subsystem interface (SSAB = 0) and a subsystem interface with separate address and data
buses (SSAB = 1). This signal has an internal pulldown resistor.
subsystem write to attribute memory has occurred. This signal has an open-drain output.
XIN and the divisor value on the PGMCLK register.
open or tied to ground.
the card. This signal has an internal pullup resistor
read/write
used as the primary UART clock input.
in the Zilog mode.
is set to its active state by setting the RTS modem
A reset-validation circuit has been implemented to qualify the active-high RESET input. At power up, the level
on the RST
inverted state of that stable value of RESET . Any changes on RESET must be valid for eight ARBCLKI clocks
before the change is reflected on RST
RST
is driven by a low-noise, open-drain, fail-safe output buffer.
host CPU memory map
The host CPU attribute memory space is mapped as follows:
output is unknown. Whenever RESET is stable for at least eight ARBCLKIs, RST reflects the
. This 8-clock filter provides needed hysteresis on the master reset input.
Host CPU Address Bits 9–1 (HA0 = 0)Attribute Memory Space
3F82F83E82E8UART receiver buffer register (RBR) – read only
†
3F82F83E82E8UART transmitter holding register (THR) – write only
†
3F82F83E82E8UART divisor latch LSB (DLL)
†
3F92F93E92E9UART interrupt enable register (IER)
†
3F92F93E92E9UART divisor latch MSB (DLM)
23FA2FA3EA2EAUART interrupt identification register (IIR) – read only
23FA2FA3EA2EAUART FIFO control register (FCR) – write only
33FB2FB3EB2EBUART line control register (LCR)
43FC2FC3EC2ECUART modem control register (MCR) – bit 5 read only
53FD2FD3ED2EDUART line status register (LSR)
63FE2FE3EE2EEUART modem status rgister (MSR)
73FF2FF3EF2EFUART scratch register (SCR)
†
DLAB is bit 7 of the line control register (LCR).
subsystem memory map
The subsystem attribute memory space is mapped as follows:
The host CPU/attribute-memory interface is comprised of one port of the internal DPRAM, the eight CCRs, and
necessary control circuitry . Signals HA0 and CE1
low when both signals have been asserted by the host CPU. This output is combined with REG
address, HA(9–1), to provide the chip enable for the DPRAM and CCRs. This composite chip enable in
combination with WE
subsystem/attribute-memory interface
The subsystem/attribute-memory interface is comprised of the second port of the internal DPRAM, the eight
CCRs, and necessary control circuitry. When in multiplexed mode (SSAB = 0), the combination of signals
SELZ /I
to latch the address on SA8 and SAD(7–0). When in the Zilog mode (SELZ/I
[WR
(SELZ/I
When in nonmultiplexed mode (SSAB = 1), SA(7–0) become the lower-order address bits, SAD(7–0) are strictly
the bidirectional data bus, and ALE(AS
and ALE(AS) allows either a positive-pulse Intel or a negative-pulse Zilog address latch-enable strobe
(R/W)], data strobe [RD(DS)], and decoded address allows ZBUS access. When in the Intel configuration
low), the combination of read [RD(DS)], write [WR(R/W)], and decoded address allows IBUS access.
Arbitration for the attribute memory is necessary whenever there is simultaneous access to the same DPRAM
or CCR address for the conditions of:
•Host CPU read and subsystem write
•Host CPU write and subsystem read
•Host CPU write and subsystem write
If arbitration were not provided, attribute-memory data would be corrupted and invalid data read due to
uncontrolled access to the same DPRAM or CCR address.
The arbitration control circuitry synchronizes the asynchronous accesses of the host CPU and subsystem to
the DPRAM and CCR and controls the access based on the pending host CPU and subsystem
attribute-memory operation. The synchronizing and control circuitry needs a clock called the arbitration clock.
The external clock (ARBCLKI) goes through a programmable divider and can be divided by one, two, four, or
eight to generate a clock frequency within an allowed range for the arbitration logic to work correctly . The output
of this frequency divider is named ARBCLKO. The programmable divider bits are defined as follows:
ARBPGM1ARBPGM0
L
LHARBCLKI/2
HLARBCLKI/4
HHARBCLKI/8
The upper period limit of ARBCLKO is N/6, where N (ns) is the shortest of the two attribute-memory accesses,
host CPU or subsystem. The lower period limit of ARBCLKO is based on the DPRAM specifications at the supply
voltage used:
5 V = 14-ns clock cycle (71 MHz)
3 V = 26-ns clock cycle (38.5 MHz)
For any arbitration condition, attribute-memory access is controlled to ensure valid data is read for a port that
is doing a read operation and valid data is written for a port that is doing a write operation. When both the host
CPU and subsystem are performing simultaneous write operations to the same address, the host CPU is
allowed to write and the subsystem write is ignored.
host CPU/subsystem handshake
Two signals are provided for handshaking between the host CPU and the subsystem. The active-high IRQ
signifies to the subsystem that the host CPU has written data into attribute memory . The subsystem can clear
IRQ by writing a 1 to bit 6 of the subsystem control register. The active-low STSCHG
that the subsystem has written data to attribute memory provided bit 2 of the subsystem control register
(STSCHG
control of these signals is synchronized to ARBCLKO to ensure there are no false assertions/deassertions.
enable) is high. The host CPU can clear STSCHG by reading any location in attribute memory . The
LARBCLKI/1
INTERNAL
ARITRATION CLOCK
signifies to the host CPU
There is additional arbitration performed for instances of simultaneous assertion/deasseration of IRQ or
STSCHG
deasserted prior to being asserted, but the write ultimately wins arbitration. When the host CPU read occurs
more than one-half an arbitration clock after the subsystem write, STSCHG
a similar fashion.
. When a subsystem write and host CPU read occurs simultaneously, STSCHG may be briefly
The UART select is derived from either host CPU address information or logic levels on CE1
, CE2 and REG.
In the address mode, host CPU address bits HA9, HA7, HA6, HA5, and HA3 are combined with conditional
derivatives of HA4 and HA8 to select the UART (HA4 and HA8 select COM ports 1–4 based on settings in the
subsystem control register). CE1
with REG
enable the UART in the event that these signals are present. In the event that CE1 or CE2 are not
and CE2 are combined such that either of these two signals in combination
present, the UART must be accessed in the address mode previously described. The UART select in
conjunction with IORD
and IOWR allows host CPU accesses to the UART. Host CPU address bits HA2–HA0
are decoded to select which UART register is to be accessed.
All UART registers remain intact with the exception of the FIFO control register (FCR) and the modem-control
register (MCR). The FCR (host CPU write-only address 2) bits 4 and 5 in conjunction with EXTEND
FCR bit 5 high and EXTEND low redefine the receiver FIFO trigger levels set by FCR bits 6 and 7 as follows:
BIT 7BIT 6TRIGGER LEVEL
001
0116
1032
1156
The MCR (host CPU address 4) bit 5 is read only. Bit 5 is controlled by the subsystem to enable (high) the
auto-CTS
mode of operation
subsystem/UART interface
The UART provides a serial-communications channel to the subsystem with enhanced RTS
auto-RTS
description). This channel is capable of operating at 115 kbps and is the main communications
control (see
channel to the subsystem (refer to the TL16C550 specification for the detailed description of the
serial-communications channel).
Many of the UART registers have been mapped into the subsystems memory space as read only . In addition,
MCR bit 5 (subsystem address 130 hex) is controlled by the subsystem to enable (high) auto-CTS
subsystem can read the MCR at address 134 hex. When reading the FCR (subsystem address 132 hex), bits
1 and 2 are always high, and bits 4 and 5 are low only when EXTEND
high (64-byte FIFOs and auto-RTS
The subsystem control register is an 8-bit register located at subsystem address 110 (hex). This register is
programmed based on host CPU configuration information and has a default selection of COM2 after a valid
reset. The bit definitions are as follows (0 = LSB):
Bits 0 and 1 define which host COM port the UART is connected to when the chip is in the address mode.
COM2 is the default (power-up) condition.
BIT 1BIT 0COM PORT
00COM1
10COM2
01COM3
11COM4
Bit 2 is a host CPU interrupt-enable bit. When bit 2 is set, any subsystem attribute-memory write cycle
causes STSCHG
Bit 3 enables or disables address-mode selection as described in the host CPU/UART interface description.
Bit 3 is cleared (disabling the address mode) after a valid reset.
Bits 4 and 5 together ensure adherence to PCMCIA power-up requirements. At power up, the card must
operate as a memory card and all host CPU I/O operations must be disabled. IREQ
host CPU READY/BUSY
initializes attribute memory , the subsystem sets bit 4 to indicate that the memory card is ready . Then bit 5 is
reset, changing the configuration from a memory card to an I/O card, enabling host CPU UART accesses.
IREQ
now becomes the host CPU interrupt-request line.
to be asserted. Bit 2 is cleared after a valid reset.
, which doubles as the
line, powers up low, indicating that the memory card is busy . Once the subsystem
BIT 5BIT 4CONFIGURATION
10Memory card, I/O operation (UART) disabled; IREQ is low, indicating card is busy (power-up and reset
11Memory card, I/O operation (UART) disabled; IREQ is high, indicating card is ready
0XI/O card, I/O operation (UART) enabled; IREQ now functions as the host CPU interrupt-request line
condition)
Bit 6 is a self-clearing bit that resets the subsystem IRQ signal. Writing a 1 to this location clears the IRQ
interrupt.
Bit 7 enables or disables serial-bypass mode as described in the subsystem serial-bypass-mode
description. Bit 7 is cleared (disabling serial-bypass mode) after a valid reset.
subsystem PGMCLK register/divide-by-n circuit
The subsystem PGMCLK register is a 6-bit write-only register located at address 120 hex and is used to select
the divisor of the divide-by-n-and-a-half circuitry . Any write to this register generates a reset to the UART and
the divide-by-n circuitry.
The divide-by-n circuitry allows for a divisor from 0 to 31.5 in 0.5 increments (PGMCLK0 is the half bit). The
divided clock output drives the UART clock input and can be seen on UARTCLK. The UART requires a clock
with a minimum high pulse duration of 50 ns and a minimum low pulse duration of 50 ns (10-MHz maximum
operating frequency). A programmed divisor between 2 and 7.5 drives the UART clock low for one XIN clock
cycle for integer divisors and one-and-a-half XIN clock cycles for integer-plus-a-half divisors. A programmed
divisor of eight or greater drives the UART clock low for four XIN clock cycles for integer divisors. A
four-and-a-half XIN clock cycles for integer-plus-a-half divisors. Based on the above parameters, the
acceptable XIN/divisor combinations can be derived. The precision of the programmable clock generator for
integer-plus-a-half divisors depends on the closeness to a 50% duty cycle for the XIN input clock.
NOTE
With a divisor less than or equal to 8 (whole number), the UART clock will have a low pulse equal
to one clock cycle of the XIN clock. Caution should be used as noted in the following example.
A 20 MHz clock period yields 50 ns total, including rise time and fall time, if a divisor of less than
or equal to 8 (whole number) is used. This provides a total down period less than 50 ns to the UART
clock, which is less than that which is required for the UART to function properly.
Caution should be used when selecting the XIN and divisor combination.
PGMCLK(0–5) VALUE (HEX)RESULT
0 (0)No clock (driven high)
0.5 (1)Divide-by-1
1 (2)Divide-by-1
1.5 (3)Divide-by-1
2 (4) to 31.5 (3F)Divide-by-2 to divide-by-31.5
subsystem serial-bypass mode
The optional serial-bypass mode is implemented to allow a high-throughput path to/from the host CPU. When
this mode is enabled and subsystem control register bit 7 is high, the serial portion of the UART is bypassed
and the subsystem has direct parallel access to the receiver FIFO (write address 140 hex) and the transmitter
FIFO (read address 140 hex). All host CPU interrupts operate normally except for receiver parity , framing, and
breaking interrupts.
auto-CTS
auto-RTS
operation
The optional auto-CTS
buffer . Auto-CTS
operation is implemented so that the host CPU cannot overflow the modem receive
operation is enabled when the subsystem sets MCR (subsystem address 130 hex) bit 5 high.
When enabled, deactivating CTS
transfer. Once CTS
enabling auto-CTS
is reactivated (low) by the modem, transfers resume. Interrupt operation is not affected by
.
operation
The optional auto-RTS
Auto-RTS
operation is enabled when FCR bit 4 is high and EXTEND is low and operates independently from
operation is implemented so that the subsystem cannot overflow the receiver FIFO.
(high) halts the transmitter section of the UART after it completes the current
the trigger-level circuitry . In the 16-byte FIFO mode, the RTS bit in the modem-control register (bit 1) clears when
14 characters are in the receive FIFO. This action causes RTS
to go high (inactive). In the 64-byte FIFO mode,
the MCR RTS bit clears when 56 characters are in the receiver FIFO. Interrupt operation is not affected and
operates the same way in either auto-RTS
or nonauto-RTS mode. When enabled, a receive-dataavailable interrupt occurs after the trigger level is reached. The MCR RTS bit must then be set by the host CPU
after the receiver FIFO has been read.
The TL16PC564A has low power consumption under the following conditions:
•32-MHz signal on XIN
•Divide-by-n is set to give a 1.8432-MHz UARTCLK signal
•Nominal data
TL16PC564B, TL16PC564BLV
SLLS225A – MARCH 1996 – REVISED FEBRUARY 1998
•V
The current (I
= 5 V
CC
) and power consumption are 18 mA (typical) and 90 mW (typical), respectively . These current
CC
and power figures fluctuate with changes in the above conditions.
absolute maximum ratings over operating free-air temperature range
Supply voltage range, V
Input voltage range, V
Input voltage range, V
Output voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Operating free-air operating temperature range, T
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Applies for external input and bidirectional buffers. VI > VCC does not apply to fail-safe pins.
2. Applies for external output and bidirectional buffers. VO > VCC does not apply to fail-safe pins.
Input voltage, V
High-level input voltage (CMOS), VIH (see Note 3)0.7V
Low-level input voltage (CMOS), VIL (see Note 3)0.3V
Output voltage, VO (see Note 4)0V
High-level output current, I
Input transition time, t
Operating free-air temperature range, T
Junction temperature range, TJ (see Note 6)025115°C
NOTES: 3. Meets TTL levels, VIHmin = 2 V and VILmax = 0.8 V on nonhysteresis inputs
CC
I
OH
p
4. Applies for external output buffers
5. RST
6. These junction temperatures reflect simulation conditions. Absolute maximum junction temperature is 150°C. The customer is
responsible for verifying junction temperature.
OL
t
, STSCHG, OUT1, and OUT2 are open-drain outputs, so IOH does not apply.
TL16PC564B33.33.6V
TL16PC564BL V2.733.3V
0V
CC
All outputs except RST, STSCHG, OUT1, OUT2 (see Note 5)1.8mA
All outputs except RST3.2
RST6.4
Supply voltage, V
Input voltage, V
High-level input voltage (CMOS), V
Low-level input voltage (CMOS), V
Output voltage, VO (see Note 4)0V
High-level output current, I
Input transition time, t
Operating free-air temperature range, T
Junction temperature range, TJ (see Note 6)025115°C
NOTES: 4. Applies for external output buffers
CC
I
IH
IL
OH
p
5. RST
, STSCHG, OUT1, and OUT2 are open-drain outputs, so IOH does not apply.
6. These junction temperatures reflect simulation conditions. Absolute maximum junction temperature is 150°C. The customer is
responsible for verifying junction temperature.
OL
t
All outputs except RST, STSCHG, OUT1, OUT2 (see Note 5)4mA
All outputs except RST4
RST8
A
electrical characteristics over recommended ranges of operating free-air temperature and supply
voltage (unless otherwise noted)
4.7555.25V
0V
0.7V
CC
025ns
02570°C
0.2V
CC
CC
CC
V
V
V
V
low voltage (3.3 V nominal)
PARAMETERTEST CONDITIONSMINMAXUNIT
V
High-level output voltageIOH = ratedVCC–0.55V
OH
V
Low-level output voltageIOL = rated0.5V
OL
V
Positive-going input threshold voltage (see Note 7)0.7 V
IT+
V
Negative-going input threshold voltage (see Note 7)0.3 V
IT–
V
Hysteresis (V
hys
I
3-state-output high-impedance current (see Note 8)VI = VCC or GND±10µA
OZ
I
Low-level input current (see Note 9)VI = GND–1µA
IL
I
High-level input current (see Note 10)VI = V
IH
IT+
– V
) (see Note 7)0.1 V
IT–
standard voltage (5 V nominal)
PARAMETERTEST CONDITIONSMINMAXUNIT
V
High-level output voltageIOH = ratedVCC–0.8V
OH
V
Low-level output voltageIOL = rated0.5V
OL
V
Positive-going input threshold voltage (see Note 7)0.7 V
IT+
V
Negative-going input threshold voltage (see Note 7)0.2 V
IT–
V
Hysteresis (V
hys
I
3-state-output high-impedance current (see Note 8)VI = VCC or GND±10µA
OZ
I
Low-level input current (see Note 9)VI = GND–1µA
IL
I
High-level input current (see Note 10)VI = V
IH
NOTES: 7. Applies for external input and bidirectional buffers with hysteresis
8. The 3-state or open-drain output must be in the high-impedance state.
9. Specifications only apply with pullup terminator turned off.
10. Specifications only apply with pulldown terminator turned off.
host CPU I/O read-cycle timing requirements over recommended ranges of operating free-air
temperature and supply voltage (see Figure 2 and Note 12)
MINMAXUNIT
t
t
t
t
t
t
t
t
t
NOTE 12: The maximum load on INPACK is one low power shot with 50-pF total load. All timing is measured in nanoseconds.
Hold time, HA(9–0) valid after IORD↑20ns
h1
Hold time, REG↑ valid after IORD↑0ns
h2
Pulse duration, IORD low165ns
w4
Setup time, HA(9–0) valid before IORD↓70ns
su1
Setup time, CEx↓ before IORD↓5ns
su2
Hold time, CEx↑ after IORD↑20ns
h3
Hold time, HD(7–0) valid after IORD↑0ns
h4
Setup time, REG↓ before IORD↓5ns
su3
Delay time, HD(7–0) valid after IORD↓100ns
d6
host CPU I/O read-cycle switching characteristics over recommended ranges of operating free-air
temperature and supply voltage (see Figure 2 and Note 11)
PARAMETERMINMAXUNIT
t
t
NOTE 12: The maximum load on INP ACK is one low power Schottky (LSTTL) diode with 50-pF total load. All timing is measured in nanoseconds.
host CPU I/O write-cycle timing requirements over recommended ranges of operating free-air
temperature and supply voltage (see Figure 3)
MINMAXUNIT
t
Setup time, HD(7–0) valid before IOWR↓60ns
su4
t
Hold time, HA(9–0) valid after IOWR↑20ns
h5
t
Pulse duration, IOWR low165ns
w6
t
Setup time, HA(9–0) valid before IOWR↓70ns
su5
t
Hold time, REG↑ after IOWR↑0ns
h6
t
Setup time, CEx↓ before IOWR↓5ns
su6
t
Hold time, CEx↑ after IOWR↑20ns
h7
t
Setup time, REG↓ before IOWR↓5ns
su7
t
Hold time, HD(7–0) valid after IOWR↑30ns
h8
transmitter switching characteristics over recommended ranges of operating free-air temperature
and supply voltage (see Figure 4)
PARAMETERTEST CONDITIONSMINMAXUNIT
t
Delay time, SOUT↓ after IOWR↑824
d9
t
Delay time, IREQ↓ after SOUT↓88
d10
t
Delay time, IREQ↓ after IOWR↑1632
d11
t
Delay time, IREQ↑ after IOWR↑CL = 100 pF140ns
d12
t
Delay time, IREQ↑ after IORD↑CL = 100 pF140ns
d13
Baud
cycles
Baud
cycles
Baud
cycles
receiver switching characteristics over recommended ranges of operating free-air temperature
and supply voltage (see Figure 5)
PARAMETERTEST CONDITIONSMINMAXUNIT
t
d14
t
d15
t
d16
Delay time, sample CLK↑ after RCLK↑100ns
Delay time, IREQ↓ after SIN↓1
Delay time, IREQ↑ after IORD↑CL = 100 pF150ns
RCLK
cycles
modem-control switching characteristics over recommended ranges of operating free-air
temperature and supply voltage, C
t
d17
t
d18
t
d19
t
d20
Delay time, RTS, DTR, OUT1, OUT2 ↓ or ↑ after IOWR↑
Delay time, IREQ↓ after CTS, DSR, DCD↓30ns
Delay time, IREQ↑ after IORD↑35ns
Delay time, IREQ↓ after RI↑30ns
host CPU attribute-memory write-cycle timing requirements over recommended ranges of
operating free-air temperature and supply voltage (see Figures 7 and 8)
MINMAXUNIT
t
t
t
t
t
t
t
t
t
t
t
t
NOTE 13: The REG signal timing is identical to address signal timing.
host CPU attribute-memory write-cycle switching characteristics over recommended ranges of
operating free-air temperature and supply voltage (see Figure 7)
t
t
t
t
Write cycle tIme, HA(9–0)250ns
c2
Pulse duration, WE low150ns
w8
Setup time, CEx↓ before WE↑180ns
su8
Setup time, HA(9–0) before WE↑ (see Note 12)180ns
su9
Setup time, HA(9–0) before WE↓ and CEx↓(see Note 13)30ns
su10
Setup time, OE↑ before WE↓10ns
su11
Hold time, HD(7–0) after WE↑30ns
h9
Recovery time, HA(9–0) after WE↑30ns
rec1
Setup time, HD(7–0) before WE↑80ns
su12
Hold time, OE↓ after WE↑10ns
h10
Setup time, CEx↓ before WE↓0ns
su13
Hold time, CEx↑ after WE↑20ns
h11
PARAMETERMINMAXUNIT
Disable time, HD(7–0) after WE↓100ns
dis1
Disable time, HD(7–0) after OE↑100ns
dis2
Enable time, HD(7–0) after WE↑5ns
en1
Enable time, HD(7–0) after OE↓5ns
en2
host CPU attribute-memory read-cycle timing requirements over recommended ranges of
operating free-air temperature and supply voltage (see Figure 9)
MINMAXUNIT
t
t
t
t
t
t
t
t
t
Read cycle time300ns
c3
Delay time, HD(7–0) after HA(9–0)300ns
d22
Delay time, HD(7–0) after CEx↓300ns
d23
Delay time, HD(7–0) after OE↓150ns
d24
Hold time, HD(7–0) after HA(9–0)0ns
h12
Setup time, CEx↓ before OE↓0ns
su14
Hold time, HA(9–0) after OE↑20ns
h13
Setup time, HA(9–0) before OE↓30ns
su15
Hold time, CEx↑ after OE↑20ns
h14
host CPU attribute-memory read-cycle switching characteristics over recommended ranges of
operating free-air temperature and supply voltage (see Figure 9)
subsystem Intel-mode timing requirements (32 MHz) (see Figure 10)
INTEL
SYMBOL
t
LHLL
t
AVLL
t
PLLL
t
LLAX
t
LLWL
t
LLRL
t
WHLH
t
AFRL
t
RLRH
t
WLWH
t
RHAX
t
WHDX
t
WHPH
t
RHPH
t
PHPL
JEDEC
SYMBOL
t
w11
t
su16
t
d25
t
h15
t
d26
t
d27
t
d28
t
d29
t
w12
t
w13
t
d30
t
h16
t
d31
t
d32
t
w14
Pulse duration, ALE high48ns
Setup time, SA8, SAD(7–0) valid to ALE low21ns
Delay time, CS low to ALE low21ns
Hold time, SA8, SAD(7–0) valid after ALE↓21ns
Delay time, ALE low to WR low16ns
Delay time, ALE low to RD low16ns
Delay time, WR high to ALE high21ns
Delay time, SA8, SAD(7–0) in high-impedance state to RD low0ns
Pulse duration, RD low120ns
Pulse duration, WR low120ns
Delay time, RD high to SA8, SAD(7–0) active48ns
Hold time, SA8, SAD(7–0) valid after WR high48ns
Delay time, WR high to CS high21ns
Delay time, RD high to CS high21ns
Pulse duration, CS high21ns
MINMAXUNIT
subsystem Zilog-mode timing requirements (20 MHz) (see Figure 11)
ZILOG
SYMBOL
t
dA(AS)
t
dAS(A)
t
dAS(DR)
t
wAS
t
dA(DS)
t
wDS(read)
t
wDS(write)
t
dDS(DR)
t
hDS(DR)
t
dDS(A)
t
dDS(AS)
t
dDO(DS)
t
dRW(AS)
JEDEC
SYMBOL
t
su17
t
d33
t
d34
t
w15
t
d35
t
w16
t
w17
t
d36
t
h17
t
h18
t
d37
t
d38
t
d39
Setup time, SA8 and SAD(7–0) valid before AS high20ns
Delay time, AS high to SA8 and SAD(7–0) invalid35ns
Delay time, AS high to data in on SAD(7–0)150ns
Pulse duration, AS low35ns
Delay time, SA8 and SAD(7–0) invalid to DS low0ns
Pulse duration, DS low (read)125ns
Pulse duration, DS low (write)65ns
Delay time, DS low to data in valid80ns
Hold time, DS high to data in invalid0ns
Hold time, DS high to data out invalid20ns
Delay time, DS high to AS low30ns
Delay time, SAD(7–0) (write data from µP) valid to DS low10ns
Delay time, R/W active to AS high20ns
subsystem Intel nonmultiplexed timing requirements (see Figure 12)
t
su18
t
w18
t
w19
t
su19
t
en4
t
d40
t
h19
t
h20
t
dis3
subsystem Zilog nonmultiplexed timing requirments (see Figure 13)
t
su20
t
su21
t
w20
t
w21
t
su22
t
en5
t
d41
t
h21
t
h22
t
dis4
Setup time, SA(8–0), CS valid to RD, WR↓30ns
Pulse duration, RD low120ns
Pulse duration, WR low120ns
Setup time, SAD(7–0) valid to WR↑50ns
Enable time, RD↓ to SAD(7–0) driving5ns
Delay time, RD↓ to SAD(7–0) valid105ns
Hold time, SA(8–0), CS valid after RD, WR↑30ns
Hold time, SAD(7–0) valid after WR↑30ns
Disable time, RD↑ to SAD(7–0) high impedance515ns
Setup time, SA(8–0), CS, R/W valid to DS↓ (write)90ns
Setup time, SA(8–0), CS, R/W valid to DS↓ (read)30ns
Pulse duration, DS low (write)65ns
Pulse duration, DS low (read)125ns
Setup time, SAD(7–0) valid to DS↑50ns
Enable time, DS↓ to SAD(7–0) driving5ns
Delay time, DS↓ to SAD(7–0) valid105ns
Hold time, SA(8–0), CS, R/W valid after DS↑30ns
Hold time, SAD(7–0), CS, R/W valid after DS↑30ns
Hold time, DS↑ to SAD(7–0) high impedance515ns
MINMAXUNIT
MINMAXUNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
19
Page 20
TL16PC564B, TL16PC564BLV
tc4Cycle time, internal arbitration clock ( ARBCLKI
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-136
0,75
0,45
Seating Plane
0,08
4040149/A 03/95
32
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 33
IMPORTANT NOTICE
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product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current and complete.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED
TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS.
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer . Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Copyright 1998, Texas Instruments Incorporated
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