Precise and Stable Voltage
Low Voltage Overshoot under Surge
V
VV
(Z)
DEVICE
‘4240LP180240
(BO)
V
●Planar Passivated Junctions
Low Off-State Current<10 µA
●Rated for International Surge Wave Shapes
I
WAVE SHAPESTANDARD
10/700 µsCCITT IX K1738
TSP
A
●Package Options
PACKAGEPACKINGPART # SUFFIX
LPBulkNone
LP with fomed leadsTape and ReelR
description
The TISP4240LP is designed specifically for
telephone equipment protection against lightning
and transients induced by a.c. power lines.
These devices consist of a bidirectional
suppressor element connecting the A and B
terminals. They will suppress inter-wire voltage
transients.
A(T)
NC
B(R)
A(T)
NC
B(R)
device symbol
LP PACKAGE
(TOP VIEW)
NC - No internal connection
LP PACKAGE
WITH FORMED LEADS
(TOP VIEW)
NC - No internal connection
1
2
3
MDTRAB
1
2
3
MD4XAF
Transients are initially clipped by zener action
until the voltage rises to the breakover level,
which causes the device to crowbar. The high
crowbar holding current prevents d.c. latchup as
the transient subsides.
These monolithic protection devices are
fabricated in ion-implanted planar structures to
ensure precise and matched breakover control
and are virtually transparent to the system in
normal operation.
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
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TISP4240LP
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
absolute maximum ratings at 25°C case temperature (unless otherwise noted))
RATINGSYMBOLVALUEUNIT
Non-repetitive peak on-state pulse current(see Notes 1, 2 and 3)
5/310 µs(CCITT IX K17, open-circuit voltage wave shape 1.5 kV, 10/700 µs)38
Non-repetitive peak on-state current, 50 Hz, 1 s(see Notes 1 and 2)I
Initial rate of rise of on-state current,Linear current ramp, Maximum ramp value < 38 Adi
Junction temperatureT
Operating free - air temperature range0 to 70°C
Storage temperature rangeT
Lead temperature 1.5 mm from case for 10 sT
NOTES: 1. Above 70°C, derate linearly to zero at 150°C case temperature
2. This value applies when the initial case temperature is at (or below) 70°C. The surge may be repeated after the device has
returned to thermal equilibrium.
3. Most PTT’s quote an unloaded voltage waveform. In operation the TISP essentially shorts the generator output. The resulting
loaded current waveform is specified.
.
electrical characteristics, TJ = 25°C
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Reference zener
V
Z
voltage
Temperature coefficient
∝
V
Z
of reference voltage
Breakover voltage(see Notes 4 and 5)± 240V
current
Off-state capacitanceVD = 0f = 1 kHz70150pF
C
off
NOTES: 4. These parameters must be measured using pulse techniques, t
5. These parameters are measured with voltage sensing contacts seperate from the current carrying contacts located within 3.2 mm
(0.125 inch) from the device body.
6. Linear rate of rise, maximum voltage limited to 80 % V
.
= ± 1mA± 180V
I
Z
(see Note 6)
= ± 50 V± 10µA
V
D
= 100 µs, duty cycle ≤ 2%.
w
(minimum).
Z
I
TSP
TSM
/dt250A/µs
T
J
stg
lead
2.5A rms
150°C
-40 to +150°C
260°C
0.1%/
± 5kV/µs
A
o
C
thermal characteristics
PARAMETERMINTYPMAXUNIT
Junction to free air thermal resistance156°C/W
R
θJA
PRODUCT INFORMATION
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SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
PARAMETER MEASUREMENT INFORMATION
TISP4240LP
Figure 1. VOLTAGE-CURRENT CHARACTERISTICS FOR TERMINALS A AND B
PRODUCT INFORMATION
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TISP4240LP
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92)
3,43 MIN.
Seating Plane
(see Note A)
5,21
4,44
2,67
2,03
1,27
0,56
0,40
LP003 Falls Within JEDEC
TO-226AA Dimensions
4,19
3,17
2,67
2,03
5,34
4,32
12,7 MIN.
1
3
1,40
1,14
2,67
2,41
NOTE A: Lead dimensions are not controlled in this area.
2
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
4
0,41
0,35
MDXXAX
Page 5
TISP4240LP
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92) - Formed Leads Version
5,21
4,44
3,43 MIN.
2,67
2,03
0,56
0,40
1
LP003 Falls Within JEDEC
TO-226AA Dimensions
4,19
3,17
2,67
2,03
5,34
4,32
4,00 MAX.
23
2,90
2,40
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
2,90
2,40
0,41
0,35
MDXXAR
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TISP4240LP
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
LPR
tape dimensions
LP Package (TO-92) Tape (Formed Lead Version)
5,21
4,44
3,43 MIN.
2,67
2,03
MECHANICAL DATA
5,34
4,32
4,00 MAX.
0,56
0,40
4,19
3,17
2,67
2,03
0,41
0,35
32,00
23,00
27,68
17,66
16,50
15,50
13,70
11,70
2,50 MIN.
11,00
8,50
2,90
2,40
6,75
5,95
ALL LINEAR DIMENSIONS IN MILLIMETERS
13,00
12,40
2,90
2,40
9,75
8,50
19,00
5,50
ø
0,50
0,00
19,00
17,50
4,30
3,70
MDXXAS
PRODUCT INFORMATION
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TISP4240LP
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1997 - REVISED SEPTEMBER 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.