Pin 2 is in electrical contact with the mounting base.
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
TIP47
Collector-base voltage (I
Collector-emitter voltage (I
E
= 0)
= 0)
B
Emitter-base voltageV
Continuous collector currentI
Peak collector current (see Note 1)I
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Unclamped inductive load energy (see Note 4)½LI
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTE1: This value applies for tp ≤ 1 ms, duty cycle ≤ 2%.
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
= 0, RS = 0.1 Ω, VCC = 20 V.
V
BE(off)
TIP48
TIP49
TIP50
TIP47
TIP48
TIP49
TIP50
V
V
CBO
CEO
EBO
C
CM
B
tot
tot
stg
L
C
j
2
B(on)
MDTRACA
350
400
450
500
250
300
350
400
5V
1A
2A
0.6A
40W
2W
20mJ
-65 to +150°C
-65 to +150°C
260°C
= 0.4 A, RBE = 100 Ω,
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
TIP47, TIP48, TIP49, TIP50
NPN SILICON POWER TRANSISTORS
DECEMBER 1971 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
TIP47
V
(BR)CEO
I
CES
I
CEO
I
EBO
h
V
CE(sat)
V
h
|hfe|
Collector-emitter
breakdown voltage
Collector-emitter
cut-off current
Collector cut-off
current
Emitter cut-off
current
Forward current
FE
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
BE
voltage
Small signal forward
fe
current transfer ratio
Small signal forward
current transfer ratio
= 30 mA
I
C
IB = 0
(see Note 5)
V
= 350 V
CE
= 400 V
V
CE
= 450 V
V
CE
= 500 V
V
CE
V
= 150 V
CE
= 200 V
V
CE
= 250 V
V
CE
= 300 V
V
CE
= 5 VIC= 01mA
V
EB
VCE = 10 V
= 10 V
V
CE
= 0.2 AIC= 1 A(see Notes 5 and 6)1V
I
B
= 10 VIC= 1 A(see Notes 5 and 6)1.5V
V
CE
= 10 VIC= 0.2 Af = 1 kHz25
V
CE
= 10 VIC= 0.2 Af = 2 MHz5
V
CE
V
BE
V
BE
V
BE
V
BE
I
B
I
B
I
B
I
B
I
C
I
C
= 0
= 0
= 0
= 0
= 0
= 0
= 0
= 0
= 0.3 A
= 1 A
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
6
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
Page 7
TIP47, TIP48, TIP49, TIP50
NPN SILICON POWER TRANSISTORS
DECEMBER 1971 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.