Pin 2 is in electrical contact with the mounting base.
3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
TIP36
Collector-base voltage (I
Collector-emitter voltage (I
E
= 0)
= 0)
B
Emitter-base voltageV
Continuous collector currentI
Peak collector current (see Note 1)I
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Unclamped inductive load energy (see Note 4)½LI
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 1 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
= 0, RS = 0.1 Ω, VCC = -20 V.
V
BE(off)
TIP36A
TIP36B
TIP36C
TIP36
TIP36A
TIP36B
TIP36C
V
V
CBO
CEO
EBO
C
CM
B
tot
tot
stg
L
C
j
2
B(on)
-80
-100
-120
-140
-40
-60
-80
-100
-5V
-25A
-40A
-5A
125W
3.5W
90mJ
-65 to +150°C
-65 to +150°C
250°C
= -0.4 A, RBE = 100 Ω,
MDTRAA
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
TIP36, TIP36A, TIP36B, TIP36C
PNP SILICON POWER TRANSISTORS
JULY 1968 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
TIP36
V
(BR)CEO
I
CES
I
CEO
I
EBO
h
V
CE(sat)
V
h
|hfe|
Collector-emitter
breakdown voltage
Collector-emitter
cut-off current
Collector cut-off
current
Emitter cut-off
current
Forward current
FE
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
BE
voltage
Small signal forward
fe
current transfer ratio
Small signal forward
current transfer ratio
= -30 mA
I
C
IB = 0
(see Note 5)
V
= -80 V
CE
= -100 V
V
CE
= -120 V
V
CE
= -140 V
V
CE
VCE= -30 V
= -60 V
V
CE
= -5 VIC= 0-1mA
V
EB
VCE = -4 V
= -4 V
V
CE
IB = -1.5 A
= -5 A
I
B
VCE = -4 V
= -4 V
V
CE
= -10 VIC= -1 Af = 1 kHz25
V
CE
= -10 VIC= -1 Af = 1 MHz3
V
CE
V
BE
V
BE
V
BE
V
BE
I
= 0
B
= 0
I
B
I
= -1.5 A
C
= -15 A
I
C
I
= -15 A
C
= -25 A
I
C
I
= -15 A
C
= -25 A
I
C
= 0
= 0
= 0
= 0
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Turn-on timeIC = -15 A
t
on
t
Turn-off time0.8µs
off
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= 4.15 V
I
B(on)
R
= 2 Ω
L
= -1.5 A
†
I
= 1.5 A
B(off)
= 20 µs, dc ≤ 2%
t
p
MINTYPMAXUNIT
1.1µs
PRODUCT INFORMATION
2
Page 3
PNP SILICON POWER TRANSISTORS
TYPICAL CHARACTERISTICS
TIP36, TIP36A, TIP36B, TIP36C
JULY 1968 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
1000
VCE = -4 V
TC = 25°C
tp = 300 µs, duty cycle < 2%
100
- DC Current Gain
FE
h
10
1
-0·1-1-10-100
IC - Collector Current - A
Figure 1. Figure 2.
TCS636AA
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
BASE CURRENT
-10
-1·0
-0·1
- Collector-Emitter Saturation Voltage - V
IC = -300 mA
IC = -1 A
CE(sat)
V
IC = -3 A
-0·01
-0·001-0·01-0·1-1·0-10-100
IB - Base Current - A
TCS636AB
IC = -25 A
IC = -20 A
IC = -15 A
IC = -10 A
BASE-EMITTER VOLTAGE
vs
COLLECTOR CURRENT
-1·8
VCE = -4 V
TC = 25°C
-1·6
-1·4
-1·2
-1·0
- Base-Emitter Voltage - V
BE
V
-0·8
-0·6
-0·1-1·0-10 -100
IC - Collector Current - A
Figure 3.
TCS636AC
PRODUCT INFORMATION
3
Page 4
TIP36, TIP36A, TIP36B, TIP36C
PNP SILICON POWER TRANSISTORS
JULY 1968 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
-100
-10
-1·0
- Collector Current - A
C
I
-0·1
-0·01
-1·0-10-100-1000
SAFE OPERATING AREA
tp = 300 µs, d = 0.1 = 10%
tp = 1 ms, d = 0.1 = 10%
tp = 10 ms, d = 0.1 = 10%
DC Operation
TIP36
TIP36A
TIP36B
TIP36C
VCE - Collector-Emitter Voltage - V
SAS636AA
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
140
120
100
80
60
40
- Maximum Power Dissipation - W
tot
P
20
0
0255075100125150
TC - Case Temperature - °C
TIS635AA
PRODUCT INFORMATION
4
Figure 5.
Page 5
TIP36, TIP36A, TIP36B, TIP36C
PNP SILICON POWER TRANSISTORS
JULY 1968 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
4,1
ø
4,0
12,2 MAX.
1,30
1,10
12
15,2
14,7
11,1
10,8
4,90
4,70
1,37
3,95
4,15
16,2 MAX.
31,0 TYP.
18,0 TYP.
3
1,17
0,78
0,50
2,50 TYP.
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab.
PRODUCT INFORMATION
MDXXAW
5
Page 6
TIP36, TIP36A, TIP36B, TIP36C
PNP SILICON POWER TRANSISTORS
JULY 1968 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.