Pin 2 is in electrical contact with the mounting base.
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
TIP105
Collector-base voltage (I
Collector-emitter voltage (I
Emitter-base voltageV
Continuous collector currentI
Peak collector current (see Note 1)I
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Unclamped inductive load energy (see Note 4)½LI
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.64 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
V
BE(off)
= 0)
E
= 0)
B
= 0, RS = 0.1 Ω, VCC = -20 V.
TIP106
TIP107
TIP105
TIP106
TIP107
V
V
CBO
CEO
EBO
C
CM
B
tot
tot
stg
L
C
j
2
B(on)
MDTRACA
-60
-80
-100
-60
-80
-100
-5V
-8A
-15A
-1A
80W
2W
10mJ
-65 to +150°C
-65 to +150°C
260°C
= -5 mA, RBE = 100 Ω,
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
BE
voltage
Parallel diode
EC
forward voltage
= -30 mA
I
C
IB = 0
(see Note 5)
V
= -30 V
CE
= -40 V
V
CE
= -50 V
V
CE
V
= -60 V
CB
= -80 V
V
CB
= -100 V
V
CB
= -5 VIC= 0-8mA
V
EB
VCE = -4 V
= -4 V
V
CE
IB = -6 mA
= -80 mA
I
B
= -4 VIC= -8 A(see Notes 5 and 6)-2.8V
V
CE
= -8 AIB= 0(see Notes 5 and 6)-3.5V
I
E
I
B
I
B
I
B
I
E
I
E
I
E
I
C
I
C
I
C
I
C
= 0
= 0
= 0
= 0
= 0
= 0
= -3 A
= -8 A
= -3 A
= -8 A
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
-60
-80
-100
1000
200
-50
-50
-50
-50
-50
-50
20000
-2
-2.5
V
µA
µA
V
thermal characteristics
PARAMETERMINTYPMAXUNIT
R
R
C
Junction to case thermal resistance1.56°C/W
θJC
Junction to free air thermal resistance62.5°C/W
θJA
Thermal capacitance of case0.9J/°C
θC
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Delay time
t
d
t
Rise time300ns
r
Storage time900ns
t
s
Fall time1.3µs
t
f
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
= -8 A
I
C
V
BE(off)
= 5 V
I
B(on)
R
L
= -80 mA
= 5 Ω
†
I
= 80 mA
B(off)
= 20 µs, dc ≤ 2%
t
p
MINTYPMAXUNIT
35ns
PRODUCT INFORMATION
2
Page 3
PNP SILICON POWER DARLINGTONS
TYPICAL CHARACTERISTICS
TIP105, TIP106, TIP107
AUGUST 1978 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
50000
10000
1000
- Typical DC Current Gain
FE
h
VCE = -4 V
tp = 300 µs, duty cycle < 2%
100
-0·5-1·0-10
IC - Collector Current - A
Figure 1. Figure 2.
TCS135AA
TC = -40°C
TC = 25°C
TC = 100°C
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
-2·0
tp = 300 µs, duty cycle < 2%
IB = IC / 100
-1·5
-1·0
- Collector-Emitter Saturation Voltage - V
CE(sat)
V
-0·5
-0·5-1·0-10
IC - Collector Current - A
TCS135AB
TC = -40°C
TC = 25°C
TC = 100°C
BASE-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
-3·0
TC = -40°C
TC = 25°C
TC = 100°C
-2·5
-2·0
-1·5
- Base-Emitter Saturation Voltage - V
-1·0
BE(sat)
V
IB = IC / 100
tp = 300 µs, duty cycle < 2%
-0·5
-0·5-1·0-10
IC - Collector Current - A
Figure 3.
TCS135AC
PRODUCT INFORMATION
3
Page 4
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
-100
-10
- Collector Current - A
-1·0
C
I
SAFE OPERATING AREA
tp = 100 µs,
d = 0.1 = 10%
tp = 1 ms,
d = 0.1 = 10%
tp = 5 ms,
d = 0.1 = 10%
DC Operation
SAS135AA
TIP105
TIP106
-0·1
-1·0-10-100-1000
TIP107
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
100
80
60
40
TIS130AA
- Maximum Power Dissipation - W
tot
20
P
0
0255075100125150
TC - Case Temperature - °C
PRODUCT INFORMATION
4
Figure 5.
Page 5
TIP105, TIP106, TIP107
Version 1, 18.0 mm. Version 2, 17.6 mm.
PNP SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
5
Page 6
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.