Datasheet TICP106M, TICP106D Datasheet (Power Innovations)

TICP106 SERIES

SILICON CONTROLLED RECTIFIERS

● 2 A Continuous On-State Current

● 15 A Surge-Current

● Glass Passivated Wafer

● 400 V to 600 V Off-State Voltage

● Max I

of 200 µA

GT

● Package Options

PACKAGE PACKING PART # SUFFIX

LP Bulk (None)

LP with fomed leads Tape and Reel R

G

A K

G

A

LP PACKAGE

(TOP VIEW)

1 2 3

LP PACKAGE

WITH FORMED LEADS

(TOP VIEW)

1 2 3

K

absolute maximum ratings over operating case temperature (unless otherwise noted)

RATING SYMBOL VALUE UNIT

Repetitive peak off-state voltage (see Note 1)

Repetitive peak reverse voltage Continuous on-state current at (or below) 85°C case temperature (see Note 2) I

Surge on-state current (see Note 3) I Peak positive gate current (pulse width Average gate power dissipation (see Note 4) P Operating case temperature range T Storage temperature range T Lead temperature 3.2 mm from case for 10 seconds T

NOTES: 1. These values apply when the gate-cathode resistance RGK = 1 kΩ.

2. These values apply for continuous dc operation with resistive load. Above 85°C derate linearly to zero at 110°C.

3. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.

4. This value applies for a maximum averaging time of 20 ms.

≤ 300 µs) I

TICP106D TICP106M TICP106D TICP106M

V

DRM

V

RRM

T(RMS)

TSM

GM

G(AV)

C

stg

L

400 600 400 600

15 A

0.2 A

0.3 W

-40 to +110 °C

-40 to +125 °C 230 °C

MDC1AA

MDC1AB

V

2 A

PRODUCT INFORMATION

Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.

1

TICP106 SERIES SILICON CONTROLLED RECTIFIERS

MARCH 1988 - REVISED MARCH 1997

electrical characteristics at 25°C case temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

I

Repetitive peak

DRM

off-state current Repetitive peak

RRM

reverse current Gate trigger current VAA = 6 V RL= 100 Ω t

I

GT

Gate trigger voltage VAA = 6 V

V

GT

Holding current VAA = 6 V RGK= 1 kΩ Initiating IT = 10 mA 5 mA

I

H

Peak on-state

V

TM

voltage

NOTE 5: This parameter must be measured using pulse techniques, tp = 1 ms, duty cycle ≤ 2 %. Voltage sensing-contacts, separate from

the current carrying contacts, are located within 3.2 mm from the device body.

= rated V

V

D

= rated V

V

R

= 1 A (see Note 5) 1.5 V

I

TM

DRM

RRM

RGK = 1 kΩ 20 µA

IG = 0 200 µA

≥ 20 µs 60 200 µA

R

= 100 Ω

L

RGK= 1 kΩ

p(g)

t

≥ 20 µs 0.4 1 V

p(g)

PRODUCT INFORMATION

2

TICP106 SERIES

NOTE A: Lead dimensions are not controlled in this area.

SILICON CONTROLLED RECTIFIERS

MARCH 1988 - REVISED MARCH 1997

MECHANICAL DATA

LP003 (TO-92) 3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

LP003 Falls Within JEDEC

LP003 (TO-92)

5,21

5,21 4,44

4,44

3,43 MIN.

2,67

2,67 2,03

2,03

4,19

4,19 3,17

3,17 2,67

2,67 2,03

2,03

LP003 Falls Within JEDEC

TO-226AA Dimensions

Seating Plane

(see Note A)

1,27

0,56

0,56 0,40

0,40

1,40

1,40 1,14

1,14

2,67

2,67 2,41

2,41

5,34

5,34 4,32

4,32

12,7 MIN.

1

3

0,41

0,41 0,35

2

0,35

NOTE A: Lead dimensions are not controlled in this area.

PRODUCT INFORMATION

ALL LINEAR DIMENSIONS IN MILLIMETERS

MDXXAX

3

TICP106 SERIES SILICON CONTROLLED RECTIFIERS

MARCH 1988 - REVISED MARCH 1997

MECHANICAL DATA

LP003 (TO-92) 3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

LP003 (TO-92) - Formed Leads Version

5,21 4,44

3,43 MIN.

2,67 2,03

0,56 0,40

1

LP003 Falls Within JEDEC

TO-226AA Dimensions

4,19 3,17

2,67 2,03

5,34 4,32

4,00 MAX.

2 3

2,90 2,40

ALL LINEAR DIMENSIONS IN MILLIMETERS

PRODUCT INFORMATION

4

2,90 2,40

0,41 0,35

MDXXAR

LPR tape dimensions

LP Package (TO-92) Tape (Formed Lead Version)

5,21 4,44

3,43 MIN.

2,67 2,03

TICP106 SERIES

SILICON CONTROLLED RECTIFIERS

MARCH 1988 - REVISED MARCH 1997

MECHANICAL DATA

4,19 3,17

2,67 2,03

5,34 4,32

32,00 23,00

27,68 17,66

16,50 15,50

11,00

8,50

2,50 MIN.

2,90 2,40

6,75 5,95

4,00 MAX.

0,56 0,40

13,00 12,40

13,70 11,70

2,90 2,40

0,41 0,35

9,75 8,50

19,00

5,50

ø

0,50 0,00

19,00 17,50

4,30 3,70

ALL LINEAR DIMENSIONS IN MILLIMETERS

PRODUCT INFORMATION

MDXXAS

5

TICP106 SERIES SILICON CONTROLLED RECTIFIERS

MARCH 1988 - REVISED MARCH 1997

IMPORTANT NOTICE

Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current.

PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements.

PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.

PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.

PRODUCT INFORMATION

6

Datasheet TICP106M, TICP106D Datasheet (Power Innovations)

Specifications and Main Features

Frequently Asked Questions

User Manual