Pin 2 is in electrical contact with the mounting base.
absolute maximum ratings over operating case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
TIC106D
Repetitive peak off-state voltage (see Note 1)
Repetitive peak reverse voltage
Continuous on-state current at (or below) 80°C case temperature (see Note 2)I
Average on-state current (180° conduction angle) at (or below) 80°C case temperature
(see Note 3)
Surge on-state current (see Note 4)I
Peak positive gate current (pulse width
Peak gate power dissipation (pulse width
Average gate power dissipation (see Note 5)P
Operating case temperature rangeT
Storage temperature rangeT
Lead temperature 1.6 mm from case for 10 secondsT
NOTES: 1. These values apply when the gate-cathode resistance RGK = 1 kΩ.
2. These values apply for continuous dc operation with resistive load. Above 80°C derate linearly to zero at 110°C.
3. This value may be applied continuously under single phase 50 Hz half-sine-wave operation with resistive load. Above 80°C derate
linearly to zero at 110°C.
4. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage
and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.
5. This value applies for a maximum averaging time of 20 ms.
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
TIC106 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
I
I
dv/dt
Repetitive peak
DRM
off-state current
Repetitive peak
RRM
reverse current
Gate trigger currentVAA = 6 VRL= 100 Ωt
I
GT
Gate trigger voltage
V
GT
Holding current
I
H
Peak on-state
V
TM
voltage
Critical rate of rise of
off-state voltage
NOTE6: This parameter must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2 %. Voltage sensing-contacts, separate from
the current carrying contacts, are located within 3.2 mm from the device body.
= rated V
V
D
= rated V
V
R
V
= 6 V
AA
≥ 20 µs
t
p(g)
= 6 V
V
AA
≥ 20 µs
t
p(g)
= 6 V
V
AA
≥ 20 µs
t
p(g)
V
= 6 V
AA
Initiating I
= 6 V
V
AA
Initiating I
= 5 A(See Note 6)1.7V
I
TM
= rated V
V
D
DRM
RRM
= 10 mA
T
= 10 mA
T
D
RGK = 1 kΩTC = 110°C400µA
IG = 0TC = 110°C1mA
≥ 20 µs60200µA
R
= 100 Ω
L
RGK= 1 kΩ
R
= 100 Ω
L
RGK= 1 kΩ
R
= 100 Ω
L
RGK= 1 kΩ
R
= 1 kΩTC = - 40°C
GK
R
= 1 kΩ
GK
p(g)
TC = - 40°C
TC = 110°C
1.2
0.40.61
0.2
8
5
RGK= 1 kΩTC = 110°C10V/µs
V
mA
thermal characteristics
PARAMETERMINTYPMAXUNIT
R
R
Junction to case thermal resistance3.5°C/W
θJC
Junction to free air thermal resistance62.5°C/W
θJA
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Gate-controlled
t
gt
turn-on time
Circuit-commutated
t
q
turn-off time
= 5 AIG = 10 mASee Figure 11.75µs
I
T
IT = 5 A
= 8 A
I
RM
I
= 10 mASee Figure 2
G
7.7µs
PRODUCT INFORMATION
2
Page 3
TIC106 SERIES
30 V
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
PARAMETER MEASUREMENT INFORMATION
I
ΩΩ
6
R
G
G
V
G
I
G
T
V
V
A
G
10%
DUT
V
A
Figure 1. Gate-controlled turn-on time
30 V
t
gt
90%
PMC1AA
G1
ΩΩ
6
0.1 µµF
to 0.5 µµF
R2
NOTES: A. Resistor R1 is adjusted for the specified value
of IRM.
B. Resistor R2 value is 30/IH, where IH is the
I
A
R1
holding current value of thyristor TH1.
C. Thyristor TH1 is the same device type as the
DUT.
V
A
ΩΩ
DUT
V
K
(IRM Monitor)
R
G
V
G1
I
G
0.1
TH1
R
G
I
G
D. Pulse Generators, G1 and G2, are
synchronised to produce an on-state anode
current waveform with the following
characteristics:
tP = 50 µs to 300 µs
G2
duty cycle = 1%
V
G2
E. Pulse Generators, G1 and G2, have output
pulse amplitude, VG, of ≥ 20 V and duration of
10 µs to 20 µs.
G2 tP Synchronisation
V
G1
V
G2
I
I
A
t
P
T
0
I
RM
V
A
V
Figure 2. Circuit-commutated turn-off time
PRODUCT INFORMATION
T
0
t
q
PMC1AB
3
Page 4
TIC106 SERIES
AVERAGE ANODE ON-STATE CURRENT
MAX CONTINUOUS ANODE POWER DISSIPATED
SURGE ON-STATE CURREN
T
TRANSIENT THERMAL RESISTANC
E
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
DERATING CURVE
6
Continuous DC
5
4
ΦΦ = 180º
3
2
0°180°
1
- Maximum Average Anode Forward Current - A
T(AV)
0
I
30405060708090100110
ΦΦ
Conduction
Angle
TC - Case Temperature - °C
Figure 3. Figure 4.
TI20AA
vs
CONTIN UOUS ON-STATE CURRENT
100
TJ = 110°C
10
- Max Continuous Anode Power Dissipated - W
A
P
1
110100
IT - Continuous On-State Current - A
TI20AB
vs
CYCLES OF CURRENT DURATION
100
TC ≤≤ 80 °C
No Prior Device Conduction
Gate Control Guaranteed
10
- Peak Half-Sine-Wave Current - A
TM
I
1
110100
Consecutive 50 Hz Half-Sine-Wave Cycles
Figure 5. Figure 6.
TI20AC
vs
CYCLES OF CURRENT DURATION
10
1
- Transient Thermal Resistance - °C/W
θ
θJC(t)
R
0·1
110100
Consecutive 50 Hz Half-Sine-Wave Cycles
TI20AD
PRODUCT INFORMATION
4
Page 5
SILICON CONTROLLED RECTIFIERS
GATE TRIGGER CURREN
T
GATE TRIGGER VOLTAG
E
V
- Gate Trigger Voltage - V
G
F
HOLDING CURRENT
TYPICAL CHARACTERISTICS
TIC106 SERIES
APRIL 1971 - REVISED MARCH 1997
vs
CASE TEMPERATURE
VAA = 6 V
RL = 100
t
≥≥ 20 µs
p(g)
100
- Gate Trigger Current - µA
GT
I
10
-50-250255075100125
TC - Case Temperature - °C
Figure 7. Figure 8.
GATE FORWARD VOLTAGE
vs
GATE FORWARD CURRENT
10
ΩΩ
TC20AA
TC20AC
vs
CASE TEMPERA TURE
1
VAA = 6 V
0·8
0·6
0·4
GT
0·2
0
-50-250255075100125
TC - Case Temperature - °C
RL = 100
RGK = 1 kΩΩ
t
≥≥ 20 µs
p(g)
vs
CASE TEMPERATURE
10
TC20AB
ΩΩ
TC20AD
IA = 0
TC = 25 °C
tp = 300 µs
Duty Cycle ≤≤ 2 %
1
- Gate Forward Voltage - V
GF
V
0·1
0·11101001000
I
- Gate Forward Current - mA
- Holding Current - mA
H
I
1
-50-250255075100125
TC - Case Temperature - °C
VAA = 6 V
RGK = 1 kΩΩ
Initiating IT = 10 mA
Figure 9. Figure 10.
PRODUCT INFORMATION
5
Page 6
TIC106 SERIES
PEAK ON-STATE VOLTAGE
GATE-CONTROLLED TURN-ON TIM
E
CIRCUIT-COMMUTATED TURN-OFF TIM
E
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
vs
PEAK ON-STATE CURRENT
2.5
TC = 25 °C
2.0
tp = 300 µs
Duty Cycle ≤≤ 2 %
1.5
1.0
- Peak On-State Voltage - V
TM
V
0.5
0.0
0·1110
ITM - Peak On-State Current - A
Figure 11. Figure 12.
TC20AE
vs
GATE CURRENT
10.0
VAA = 30 V
RL = 6 ΩΩ
8.0
6.0
4.0
2.0
- Gate-Controlled Turn-On Time - µs
gt
t
0.0
0·1110
TC = 25 °C
See Test Circuit and Waveforms
IG - Gate Current - mA
TC20AF
vs
CASE TEMPERATURE
16
14
12
10
- Circuit-Commutated Turn-Off Time - µs
q
t
VAA = 30 V
RL = 6 ΩΩ
IRM ≈≈ 8 A
See Test Circuit and Waveforms
8
6
4
2
0
20406080100120
TC - Case Temperature - °C
Figure 13.
TC20AG
PRODUCT INFORMATION
6
Page 7
TIC106 SERIES
Version 1, 18.0 mm. Version 2, 17.6 mm.
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
7
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TIC106 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.