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TFMM5..0
Vishay T elefunken
Photo Modules for PCM Remote Control Systems
Available types for different carrier frequencies
Type fo Type fo
TFMM 5300 30 kHz TFMM 5330 33 kHz
TFMM 5360 36 kHz TFMM 5370 36.7 kHz
TFMM 5380 38 kHz TFMM 5400 40 kHz
TFMM 5560 56 kHz
Description
The TFMM5..0 – series are miniaturized receivers for
infrared remote control systems. PIN diode and preamplifier are assembled on PC board, the epoxy
package is designed as IR filter.
The demodulated output signal can directly be decoded by a microprocessor. The main benefit is the
reliable function even in disturbed ambient and the
protection against uncontrolled output pulses.
Features
Photo detector and preamplifier in one package
Output active low
Internal filter for PCM frequency
High immunity against ambient light
High shielding against electric field disturbance
Block Diagram
Input
PIN
AGC
Control
Circuit
Band
Pass
95 10266
5 Volt supply voltage, low power consumption
TTL and CMOS compatibility
Continuous transmission possible (tpi/T0.4)
SMD
2
V
S
100 k
3
OUT
Demodu-
lator
1
GND
Document Number 82003
94 8136
www.vishay .com
1 (10)Rev. 3, 14-Sep-00
Page 2
TFMM5..0
Su ly Current (Pin 2)
160
Vishay Telefunken
Absolute Maximum Ratings
T
= 25_C
amb
Parameter Test Conditions Symbol Value Unit
Supply Voltage (Pin 2) V
Supply Current (Pin 2) I
Output Voltage (Pin 3) V
Output Current (Pin 3) I
Junction Temperature T
Storage Temperature Range T
Operating Temperature Range T
Power Consumption (T
Soldering Temperature t 10 s, 1 mm from case T
Basic Characteristics
T
= 25_C
amb
Parameter Test Conditions Symbol Min Typ Max Unit
Supply Current (Pin 2) VS = 5 V, Ev = 0 I
VS = 5 V, Ev = 40 klx, sunlight I
Transmission Distance Ev = 0, test signal see fig.7,
IR diode TSIP5201, IF = 1.5 A
Output Voltage Low (Pin 3) I
Irradiance (30 – 40 kHz) Pulse width tolerance:
Irradiance (56 kHz)
Irradiance E
Directivity Angle of half transmission distance ϕ
= 0.5 mA,Ee = 0.7 mW/m2,
OSL
f = fo, tp/T = 0.4
tpo = tpi±
test signal (see fig.7)
85 C) P
amb
ms,
SD
SH
d 35 m
V
OSL
E
e min
E
e min
e max
1/2
S
S
O
O
j
stg
amb
tot
sd
–0.3...6.0 V
5 mA
–0.3...6.0 V
5 mA
100 C
–40...+85 C
–25...+85 C
50 mW
230 C
0.4 0.5 0.8 mA
1.0 mA
250 mV
0.6 mW/m
0.8 mW/m
20 W/m
±40 deg
2
2
2
Application Circuit
TSUS 5...
TSIP 5...
94 8137
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2 (10)
TFM. 5..0
2
4.7 mF *)
330 W *)
>10 kW
+5V **)
optional
3
mC
1
*) only necessary to suppress power supply disturbances
**) tolerated supply voltage range : 4.5 V<VS<5.5V
Document Number 82003
GND
Rev. 3, 14-Sep-00
Page 3
TFMM5..0
Vishay Telefunken
T ypical Characteristics (T
amb
1.0
0.8
0.6
0.4
e
0.2
E / E – Rel. Responsitivity
e min
f = f0"5%
Df ( 3dB ) = f0/10
0.0
94 8143
0.7 0.8 0.9 1.0 1.1
f/f0 – Relative Frequency
1.2
Figure 1. Frequency Dependence of Responsivity
1000
m
800
600
400
200
po
t – Output Pulse Length ( s )
l = 950 nm, Optical Test Signal, Fig.7
0
0.1 1 10 100 1000
95 10187
Ee – Irradiance ( mW/m2 )
Input Burst Duration
= 25_C unless otherwise specified)
4
2
3
2
1
e min
E – Threshold Irradiance ( mW/m )
1.3
10000
0
0 0.4 0.8 1.2 1.6
95 10188
E – Field Strength of Disturbance ( kV/m )
Figure 4. Sensitivity vs. Electric Field Disturbances
100
2
f = f
0
10
10 kHz
1
e min
E – Threshold Irradiance ( mW/m )
0.1
0.1 1 10 100
95 10194
DV
AC Voltage on DC Supply Voltage (mV)
sRMS –
2.0
100 Hz
1000
Figure 2. Sensitivity in Dark Ambient
10
2
1
e min
E – Threshold Irradiance ( mW/m )
0.1
0.01 0.1 1 10
95 10189
Figure 3. Sensitivity in Bright Ambient
Document Number 82003
E – Irradiance ( W/m2 )
100
Figure 5. Sensitivity vs. Supply Voltage Disturbances
1.0
2
0.8
Sensitivity in dark Ambient
0.6
0.4
0.2
e min
E – Threshold Irradiance ( mW/m )
0.0
90
95 10195
–30 0 30 60
T
– Ambient Temperature ( °C )
amb
Figure 6. Sensitivity vs. Ambient Temperature
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3 (10)Rev. 3, 14-Sep-00
Page 4
TFMM5..0
Vishay Telefunken
Optical Test Signal
E
( IR diode TSIP 5201, IF = 1.5 A, 30 pulses, f = f0, T = 10 ms )
e
1.0
V
O
V
OH
V
OL
E
V
O
V
OH
V
OL
tpi *
T
* tpi w 400 ms is recommended for optimal function
Output Signal
tpo = tpi "160 ms
t
po
Figure 7. Output Function
Optical Test Signal
e
600 ms 600 ms
T = 60 ms
Output Signal, ( see Fig.10 )
T
on
0.8
t
T
on
0.6
T
off
94 8133
0.4
off
0.2
on
T ,T - Output Pulse Length ( ms )
l = 950 nm, Optical Test Signal, Fig.8
0.0
0.1 1 10 100 1000
t
95 10191
Ee – Irradiance ( mW/m2 )
10000
Figure 10. Output Pulse Diagram
1.0
0.8
t
0.6
94 8134
0.4
s
I – Supply Current ( mA )
0.2
0.0
–30 0 30 60
T
off
t
94 8150
T
– Ambient Temperature ( °C )
amb
Vs = 5 V
90
Figure 8. Output Function
2
8
6
4
2
e min
E – Threshold Irradiance ( mW/m )
0
0.05 0.25
95 10190
0.15 0.35
Figure 9. Sensitivity vs. Duty Cycle
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4 (10)
tp/T – Duty Cycle
0.45
Figure 1 1. Supply Current vs. Ambient Temperature
1.2
1.0
0.8
0.6
0.4
rel
0.2
l
S ( ) – Relative Spectral Sensitivity
0
1150
94 8408
750 850 950 1050
l – Wavelength ( nm )
Figure 12. Relative Spectral Sensitivity vs. Wavelength
Document Number 82003
Rev. 3, 14-Sep-00
Page 5
TFMM5..0
Vishay Telefunken
–30
–40
0.6
d
– Relative Transmission Distance
rel
Figure 13. Vertical Directivity ϕ
010–10–20 20
00.4 0.2 0.2 0.4
0.6
f
y
f
x
95 10192
y
Soldering Pads for Reflow Soldering
1.6
2.2 2.8 2.22.8
1.7
1.7
1.6
2.0
GND1
(Case GND)
1.6
–30
–40
0.6
d
95 10193
– Relative Transmission Distance
rel
Figure 14. Horizontal Directivity ϕ
010–10–20 20
00.4 0.2 0.2 0.4
0.6
x
Note: Mounting area on the PC board for
TFMM.... series has to be solid grounded
and has to be insulated by resist.
Pinning
Light Receiving Window
V
cc
Out
95 10186
Document Number 82003
95 10185
Case GND
GND1
GND2
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5 (10)Rev. 3, 14-Sep-00
Page 6
TFMM5..0
Vishay Telefunken
Dimensions in mm
15904
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6 (10)
Document Number 82003
Rev. 3, 14-Sep-00
Page 7
Operating Instructions
Reflow Soldering
DReflow soldering must be done within 48 hoursstored
under max. 30°C, 80% RH after opening envelop
DRecommended soldering paste
(composition: SN 63%, Pb 37%)
Melting temperature 178 to 192°C
DApply solder paste to the specified soldering padsusing a dispenser or by screen printing.
DRecommended thickness of metal mask is 0.2 mmfor
screen printing.
DThe recommended reflow furnace is a combinationtype with upper and lowewr heaters.
DSet the furnace temperatures for pre-heating andheating in accordance with the reflow
temperatureprofile as schown below. Excercise extreme care tokeep the maximum temperature below
230_C. Thefollowing temperature profile means the
temperature at the device surface. Since temperature
difference occurs between the work and the surface of
the circuit board depending on the pes of circuit board
or reflow furnace, the operating conditions should be
verified prior to start of operation.
DHandling after reflow should be done only after the
work surface has been cooled off.
TFMM5..0
Vishay T elefunken
Manual Soldering
DUse the 6/4 solder or the solder containing silver.
DUse a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300_C.
DFinish soldering within three seconds.
DHandle products only after the temperature is cooled
off.
Cleaning
DPerform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 m
corresponding to a conductivity of 2 mS/m.
DTemperature and time: 30 seconds under the
temperature below 50_C or 3 minutes below 30_C.
DUltrasonic cleaning: Below 20 W.
300
max. 240°C
250
200
150
Temperature ( C )°
100
50
2–4 K/s
ca. 230°C
max. 160°C
90 – 120 s
10 s
215°C
max. 40 s
full line : typical
dotted line : process limits
94 8625
Lead Temperature
0 50 100 150 200 250
Time ( s )
Document Number 82003
www.vishay .com
7 (10)Rev. 3, 14-Sep-00
Page 8
TFMM5..0
Vishay Telefunken
T aping Specifications
(1) Shape and dimensions of reels (in accordance with EIAJRC-1009B); unit in mm
∅ 13.5
12.5
∅ 24.8
23.2
2.6
1.4
95 10204
(2) Dimensions of tape
95 10200
Label
8.8
8.6
4.1
3.9
18.4
16.4
R=0.80
0.75
∅ 101
99
2.5
1.5
∅ 332
328
1.85
1.65
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8 (10)
3.7
0.35
0.25
8.4
8.2
12.1
11.9
7,6
7,4
16.3
15.7
2.05
1.95
Direction of Pulling Out
Document Number 82003
Rev. 3, 14-Sep-00
Page 9
(3) Configuration of tapes
Empty Parts mounted Empty Leader
TFMM5..0
Vishay Telefunken
End
<> <><>
40 mm min. 40 mm min. 200 mm min.
(4) Quantity
1000 pcs. per reel
Packing
(1) Dampproof packing
Products will be packed in anti-humidity aluminium
bags to prevent the products from moisture absorption
during transportation and storage. Each bag contains
Aluminiumbag
Start
a desiccant with moisture indicators. In the event bags
absorb moisture, the indicators change their color from
blue to pink.
Desiccant
Label
Reel
95 10203
(2) Recommended method of storage
Dry box storage is recommended to prevent the parts
from moisture absorption. The following conditions
In case of moisture absorption the device will recover
to the former conditon by drying under the following
recommended conditions:
should be preserved if dry boxes are not available.
Storage temperature: 10 – 30_C
Storage humidity: 60% RH max
taped version: 60_C/48 h
untaped version: 125_C/2 h
Lot Number
3 digits
5 18
Last digit of calendar year Month code
Lot number is labeled on the aluminum bag and also indicated on the reverse side of each part.
Document Number 82003
www.vishay .com
9 (10)Rev. 3, 14-Sep-00
Page 10
TFMM5..0
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. V arious national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively .
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use V ishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
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10 (10)
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 82003
Rev. 3, 14-Sep-00
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