Datasheet TEA6330T-V1 Datasheet (Philips)

Page 1
DATA SH EET
Preliminary specification Supersedes data of June 1991 File under Integrated Circuits, IC01
January 1992
INTEGRATED CIRCUITS
TEA6330T
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January 1992 2
Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
FEATURES
• Stereo/hi-fi processor for car radios performed with volume, balance, bass and treble controls
• Sound fader control (front/rear) down to −30 dB in steps of 2 dB
• Fast muting via bus or via setting the muting pin
• Suitable for external audio equalizers, can be looped-in
controlled by the I2C-bus
• Power-on reset on chip sets the device into general mute position
• AC and DC short-circuit protected concerning neighbouring pins
• I2C-bus control for all functions.
GENERAL DESCRIPTION
This bipolar IC is an I2C-bus controlled sound/volume controller for car radios, in addition with fader function and the possibility of an external equalizer.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. Plastic small outline package; 20 leads; body width 7.5 mm; (SOT163A); SOT163-1; 1996 August 02.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
P
supply voltage 7 8.5 10 V
I
P
supply current − 26 − mA
V
i
maximum AF input signal (RMS value) 2 −− V
V
o
maximum AF output signal (RMS value) 1.1 −− V
∆G
v
volume control range, separated −66 −+20 dB fader control range, separated 0 −−30 dB bass control range −12 −+15 dB
treble control range −12 −+12 dB THD total harmonic distortion −− 0.2 % S/N(W) weighted signal-to-noise ratio − 67 − dB
α
CR
crosstalk attenuation − 90 − dB B frequency response (−1 dB) 35 to
− 20000 − Hz
EXTENDED
TYPE NUMBER
PACKAGE
PINS PIN POSITION MATERIAL CODE
TEA6330T
(1)
20 SO plastic SOT163A
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Fig.1 Block and test circuit.
Fig.2 Connection of equalizer (Table 7).
In application with equalizer circuit TEA6360 coupling capacitors are not necessary. Connectors for RIGHT in brackets.
Fig.3 T-filter for enhanced bass control (Fig.5).
Connectors for LEFT in brackets.
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
PINNING
SYMBOL PIN DESCRIPTION
C
PS
1 filtering capacitor for power supply IN-R 2 audio input signal RIGHT GND1 3 analog ground (0 V) C
BR1
4 capacitor for bass control RIGHT
and signal to equalizer
C
BR2
5 capacitor for bass control RIGHT C
TR
6 capacitor for treble control RIGHT,
input signal for equalizer RIGHT
QRR 7 right audio output signal of rear
channel
QRF 8 right audio output signal of front
channel MUTE 9 input to set mute externally GND2 10 digital ground (0 V) for bus control SCL 11 clock signal of I
2
C-bus
SDA 12 data signal of I
2
C-bus
QLF 13 left audio output signal of front
channel QLR 14 left audio output signal of rear
channel C
TL
15 capacitor for treble control LEFT,
input signal for equalizer LEFT C
BL2
16 capacitor for bass control LEFT
C
BL1
17 capacitor for bass control LEFT
and signal to equalizer V
P
18 +8.5 V supply voltage IN-L 19 audio input signal LEFT V
ref
20 reference voltage output (VP/2)
Fig.4 Pin configuration.
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
FUNCTIONAL DESCRIPTION
This bipolar IC is an I2C-bus controlled sound/volume controller for car radios including fader function and the possibility of an external equalizer. The sound signal setting is performed by resistor chains in combination with multi-input operational amplifiers. The advantages of this principle are the combination of low noise, low distortion and a high dynamic range. The separated volume controls of the left and the right channel make the balance control possible. The value and the characteristic of the balance is controlled via the I2C-bus.
The contour function is performed by setting an extra bass control and optional treble, depending on the actual volume position. Its switching points and its range are also controllable via the I2C-bus.
An interface is assigned behind the volume control to loop-in an equalizer (Fig.2). In this case the treble control is switched off, and the bass control can be used to set the contour.
Low level control fader is included independent of the volume controls, because the TEA6330T has four driver outputs (for front and rear).
An extra mute position for the front, the rear or for all channels is built in. The last function may be used for muting during preset selection. No external interface is required between the microcomputer and this circuit, for all switching and controlling functions are controllable via the two-wire I
2
C-bus.
The separate mute-pin allows to switch the fader into mute position without using the I2C-bus.
The on chip power-on reset sets the TEA6330T into the general mute mode.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134). Ground pins 3 and 10 connected together.
* Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. ** Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
SYMBOL PARAMETER MIN. MAX. UNIT
V
P
supply voltage (pin 18) 0 10 V
P
tot
total power dissipation 0 700 mW
T
stg
storage temperature range −55 150 °C
T
amb
operating ambient temperature range −40 85 °C
V
ESD
electrostatic handling* for all pins −±300 V electrostatic handling** for all pins −±4000 V
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
CHARACTERISTICS
V
P
= 8.5 V; load resistors at audio outputs 10 kΩ, fi = 1 kHz (RS = 600 Ω), bass and treble in linear position, fader in off
position and T
amb
= 25 °C; measurements taken in Fig.1 unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
supply voltage range (pin 18) 7 8.5 10 V
I
P
supply current − 26 − mA
V
ref
reference voltage (pin 20) 0.45 VP0.5 V
P
0.55 VPV
V
O
DC voltage at output (pins 7, 8, 13, 14) − 0.5 V
P
− V
Measurements over all
V
i
maximum AF input level for THD = 2 % Gv= −66 to −6 dB at pins 2 and 19 (RMS value) and V
P
= 8.1 V 2 −−V
V
o
maximum AF output level for THD = 2% Gv= −4 to +20 dB at pins 7, 8, 13, 14 (RMS value) and V
P
= 8.1 V 1.1 −−V
G
v
maximum gain by volume setting 19 20 21 dB
B frequency response −1 dB roll-off frequency 35 to
− 20000 − Hz
α
CR
crosstalk attenuation f = 250 to 10000 Hz
G
v
= 0 dB 70 90 − dB
THD total harmonic distortion f = 20 to 12500 Hz
V
i (RMS)
= 50 mV Gv = +20 dB − 0.1 0.3 %
V
i (RMS)
= 500 mV Gv = 0 dB − 0.05 0.2 %
V
i (RMS)
= 1.6 V Gv = −10 dB − 0.2 0.5 %
RR ripple rejection for V
R
< 200 mV RMS Gv = 0 dB
f = 100 Hz − 70 − dB f = 40 Hz to 3 kHz − 60 − dB f = 3 to 12.5 kHz − 50 − dB
P
N
noise power at output of a 25 W powerstage with 26 dB gain (only contribution of TEA6330T)
mute position (V9 = 0)
−−10 nW
α
BUS
crosstalk attenuation between SDA, SCL and signal output Gv = 0 dB − 110 − dB
(20 log V
BUS
(p-p)/Vo RMS)
S/N(W) weighted signal-to-noise ratio for CCIR 468-2 quasi
peak for 6 W power
amplifier Vi = 50 mV RMS Po = 50 mW − 65 − dB V
i
= 500 mV RMS Po = 50 mW − 67 − dB
V
i
= 50 mV RMS Po = 1 W 65 72 − dB
V
i
= 500 mV RMS Po = 1 W 71 78 − dB
V
i
= 50 mV RMS Po = 6 W; Fig.9 − 72 − dB
V
i
= 500 mV RMS Po = 6 W; Fig.9 − 86 − dB
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Audio frequency outputs QLF, QRF, QLR and QRR
V
o
maximum output signal (RMS value) 1.1 −−V
R
o
output resistance (pins 7, 8, 13 and 14) − 100 150 Ω
R
L
admissible output load resistor to ground or V
CC
7.5 −−kΩ
C
L
admissible output load capacitor −−2.5 nF
V
N(W)
weighted noise voltage at output CCIR 468-2 ; Fig.8
quasi peak for maximum gain G
v
= +20 dB − 110 220 µV
for 0 dB gain G
v
= 0 dB − 25 50 µV
for minimum gain G
v
= −66 dB − 19 38 µV
for mute position (V
9
= 0) − 11 22 µV
Volume control
R
G
= 600Ω
R
l
input resistance (pins 2 and 19) 35 50 65 kΩ
G
v
volume control range Table 2 −66 −+20 dB
∆G
v
step width − 2- dB gain set error G
v
= −50 to +20 dB −−2dB
G
v
= −66 to −50 dB −−3dB
gain tracking error balance in mid position −−2dB
α
mute
mute attenuation at volume mute set mute-bits 76 90 − dB
Bass control
G
v
controllable bass range Table 3; Fig.6
maximum boost f = 40 Hz 14 15 16 dB maximum boost f = 100 Hz 12 13 14 dB maximum attenuation f = 40 Hz 11 12 13 dB maximum attenuation f = 100 Hz 10 11 12 dB
∆G
v
step width f = 40 Hz 2.5 3 3.5 dB
Treble control
G
v
controllable treble range Table 4; Fig.7
maximum boost f = 10 kHz 9 10 11 dB maximum boost f = 15 kHz 11 12 13 dB maximum boost f > 15 kHz −−15 dB maximum attenuation f = 10 kHz 9 10 11 dB maximum attenuation f = 15 kHz 11 12 13 dB
∆G
v
step width f = 15 kHz 2.5 3 3.5 dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Fader control
G
v
fader control range Table 5 0 to
−−30 − dB
step width 1.5 2 2.5 dB
α
MUTE
mute attenuation GMB-bit = 1; Table 6 74 84 − dB
∆V
o
DC offset output voltage (pins 7, 8, 13,
14) between any adjoining volume step and any step to mute G
v
= −66 to 0 dB − 0.2 10 mV
G
v
= 0 to +20 dB − 215mV
in any treble and fader position G
v
= −66 to 0 dB −− 10 mV
in any bass position G
v
= −66 to 0 dB −− 10 mV
External mute (pin 9)
V
9
input voltage for MUTE-ON (LOW) fader is switched into
general mute position 0 − 1.5 V
input voltage for MUTE-OFF (HIGH) Tables 2 and 5 3 − V
P
V
input voltage for MUTE-OFF pin 9 open-circuit − 5 − V
I
9
input current −−±10 µA
I
2
C-bus, SCL and SDA (pins 11 and 12)
V
11, 12
input voltage HIGH-level 3 − V
P
V
input voltage LOW-level 0 − 1.5 V
I
11, 12
input current −−±10 µA
V
ACK
output voltage at acknowledge (pin 12) I12 = −3 mA −−0.4 V Power-on reset, when reset is active the GMU-bit (general mute) is set and the bus receiver is in reset position V
P
supply voltage for start of reset increasing voltage −−2.5 V
supply voltage for end of reset increasing voltage 5.2 6.0 6.8 V
supply voltage for start of reset decreasing voltage 4.2 5.0 5.8 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Fig.5 Bass control with enhanced control range (T-filter coupling, Fig.1).
Fig.6 Bass control with normal control range (Fig.1).
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Fig.7 Treble control.
Fig.8 Noise voltage on outputs (CCIR 468-2 weighted, quasi-peak).
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Fig.9 Signal-to-noise ratio (CClR 468-2 weighted, quasi-peak) for TEA6330T with a 6 W power amplifier
(20 dB gain, Fig.10). Measurements without noise contribution of the power amplifier.
Fig.10 Signal-to-noise ratio measurement (Fig.9) with Vi = 50 mV RMS, Vo = 500 mV RMS for P
max
= 6 W.
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
I2C-BUS PROTOCOL I
2
C-bus format
If more than 1 byte DATA are transmitted, then auto-increment of the subaddress is performed.
Byte organisation Table 1 I
2
C-bus transmission
Function of the bits:
S SLAVE ADDRESS A SUBADDRESS A DATA P
S = start condition SLAVE ADDRESS = 1000 000X A = acknowledge, generated by the slave SUBADDRESS = subaddress byte, Table 1 DATA = data byte, Table 1 P = stop condition X = read/write control bit
X = 0, order to write (the circuit is slave receiver only)
FUNCTION SUBADDRESS BYTE
DATA BYTE
D7 D6 D5 D4 D3 D2 D1 D0
volume left 0 0 0 0 0 0 0 0 0 0 VL5 VL4 VL3 VL2 VL1 VL0 volume right 0 0 0 0 0 0 0 1 0 0 VR5 VR4 VR3 VR2 VR1 VR0
bass 0 0 0 0 0 0 1 0 0 0 0 0 BA3 BA2 BA1 BA0 treble 0 0 0 0 0 0 1 1 0 0 0 0 TR3 TR2 TR1 TR0
fader 0 0 0 0 0 1 0 0 0 0 MFN FCH FA3 FA2 FA1 FA0 audio switch 0 0 0 0 0 1 0 1 GMU EQN 0 0 0 0 0 0
VL0 to VL5 volume control of left channel (balance control) VR0 to VR5 volume control of right channel (balance control) BA0 to BA3 bass control of both channels TRO to TR3 treble control of both channels FA0 to FA3 fader control front to rear
FCH select fader channels front or rear MFN mute control of the selected channels front or rear GMU mute control, general mute EQN equalizer switchover (0 = equalizer-on)
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Table 2(a) Volume setting LEFT
G
V
DATA
DB VL5 VL4 VL3 VL2 VL1 VL0
+20111111 +18111110 +16111101 +14111100 +12111011 +10111010
+8111001 +6111000 +4110111 +2110110
0110101
−2110100
−4110011
−6110010
−8110001
−10110000
−12101111
−14101110
−16101101
−18101100
−20101011
−22101010
−24101001
−26101000
−28100111
−30100110
−32100101
−34100100
−36100011
−38100010
−40100001
−42100000
−44011111
−46011110
−48011101
−50011100
−52011011
−54011010
−56011001
−58011000
−60010111
−62010110
−64010101
−66010100
mute
left
010011
mute
left
010010
--- --- ---
--- --- ---
--- --- ---
mute
left
000000
G
V
DATA
DB VL5 VL4 VL3 VL2 VL1 VL0
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Table 2(b) Volume setting RIGHT
G
V
DATA
DB VR5 VR4 VR3 VR2 VR1 VL0
+20111111 +18111110 +16111101 +14111100 +12111011 +10111010
+8 111001 +6 111000 +4 110111
+2110110
0 110101
−2110100
−4110011
−6110010
−8110001
−10110000
−12101111
−14101110
−16101101
−18101100
−20101011
−22101010
−24101001
−26101000
−28100111
−30100110
−32100101
−34100100
−36100011
−38100010
−40100001
−42100000
−44011111
−46011110
−48011101
−50011100
−52011011
−54011010
−56011001
−58011000
−60010111
−62010110
−64010101
−66010100
mute
right
010011
mute
right
010010
--- --- ---
--- --- ---
--- --- ---
mute
right
000000
G
V
DATA
DB VR5 VR4 VR3 VR2 VR1 VL0
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Table 3(a) Bass setting with equalizer passive (EQN =1)
G
V
DATA
DB D3 D2 D1 D0
+15 1 1 1 1 +15 1 1 1 0 +15 1 1 0 1 +15 1 1 0 0
+12 1 0 1 1
+9 1 0 1 0 +6 1 0 0 1 +3 1 0 0 0
00 1 1 1
−30 1 1 0
−60 1 0 1
−90 1 0 0
−12 0 0 1 1
−12 0 0 1 0
−12 0 0 0 0
Table 3(b) Bass setting with equalizer active (EQN = 0)
G
V
DATA
DB D3 D2 D1 D0
+15 1 1 1 1 +15 1 1 1 0 +15 1 1 0 1 +15 1 1 0 0
+12 1 0 1 1
+91 0 1 0 +61 0 0 1
+31 0 0 0
00 1 1 1 00 1 1 0 00 1 0 1 00 1 0 0
00 0 1 1 00 0 1 0 00 0 0 0
Table 4(a) Treble setting with equalizer passive (EQN = 1)
G
V
DATA
DB D3 D2 D1 D0
+12 1 1 1 1 +12 1 1 1 0 +12 1 1 0 1 +12 1 1 0 0 +12 1 0 1 1
+91 0 1 0 +61 0 0 1 +31 0 0 0
00 1 1 1
−30 1 1 0
−60 1 0 1
−90 1 0 0
−12 0 0 1 1
−12 0 0 1 0
−12 0 0 0 0
Table 4(b) Treble setting with equalizer active (EQN = 0)
G
V
DATA
DB D3 D2 D1 D0
01 1 1 1 01 1 1 0 01 1 0 1 01 1 0 0 01 0 1 1
01 0 1 0 01 0 0 1 01 0 0 0
00 1 1 1 00 1 1 0 00 1 0 1 00 1 0 0
00 0 1 1 00 0 1 0 00 0 0 0
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
Table 5(a) Fader function front
SETTING DATA
FRONT REAR
DB DB MFN FCH FA3 FA2 FA1 FA0
fader-off
00111111 00011111
fader-front
−20111110
−40111101
−60111100
−80111011
−10 0 111010
−12 0 111001
−14 0 111000
−16 0 110111
−18 0 110110
−20 0 110101
−22 0 110100
−24 0 110011
−26 0 110010
−28 0 110001
−30 0 110000
mute front
−84 0 011110
--- --- ---
--- --- ---
--- --- ---
−84 0 010000
Table 5(b) Fader function rear
SETTING DATA
FRONT REAR
DB DB MFN FCH FA3 FA2 FA1 FA0
fader-off
0 0 101111 0 0 001111
fader rear
0 −2 101110 0 −4 1 01101 0 −6 1 01100 0 −8 1 01011 0 −101 01010 0 −121 01001 0 −141 01000 0 −161 00111 0 −181 00110 0 −201 00101 0 −221 00100 0 −241 00011 0 −261 00010 0 −281 00001 0 −301 00000
mute rear
0 −840 01110
--- --- ---
--- --- ---
--- --- ---
0 −840 00000
Table 6 Mute control
MUTE
CONTROL
DATA
GMU-BIT
REMARKS
active 1 outputs QLF, QLR, QRF
and QRR are muted
passive 0 no general mute
Table 7 Equalizer
EQUALIZER
CONTROL
DATA
EQN-BIT
REMARKS
active 0 signal outputs for
equalizer are pins 4 and 17, inputs are pins 6 and 15; Tables 3(b) and 4(b)
passive 1 no general mute;
Tables 3(a) and 4(a)
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A2A
3
b
p
cD
(1)E(1) (1)
eHELLpQ
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8 0
o o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
95-01-24 97-05-22
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors Preliminary specification
Sound fader control circuit for car radios
TEA6330T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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