Datasheet TEA1111AT-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1999 Sep 28
File under Integrated Circuits, IC03

1999 Nov 22

INTEGRATED CIRCUITS

TEA1111A

Speech circuit with dialler interface,
regulated supply and earpiece
volume control

1999 Nov 22 2

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

FEATURES

• Low DC linevoltage; operates down to 1.5 V (excluding
voltage drop across external polarity guard)

• Line voltage regulator with adjustable DC voltage

• 3.25 V regulated strong supply point for peripheral

circuits compatible with:
– Speech mode
– Ringer mode
– Trickle mode.

• Transmit stage with:
– Microphone amplifier with symmetrical high

impedance inputs

– DTMF amplifier with confidence tone on earpiece.

• Receive stage with:
– Earpiece amplifier with adjustable gain and volume

control.

• MUTE input for pulse or DTMF dialling

• AGC line loss compensation for microphone and

earpiece

• LED control output.

APPLICATIONS

• Line powered telephone sets with LCD module

• Cordless telephones

• Fax machines

• Answering machines.

GENERAL DESCRIPTION

The TEA1111A is a bipolar integrated circuit that performs
all speech and line interface functions required in fully
electronic telephone sets. It performs electronic switching
between speech and dialling. The IC operates at a line
voltage down to 1.5 V DC (with reduced performance) to
facilitate the use of telephone sets connected in parallel.

When the line current is high enough, a fixed amount of
current is derived from the LN pin in order to create a
strong supply point at pin VDD. The voltage at pin VDD is
regulated to 3.25 V to supply peripherals such as dialler,
LCD module and microcontroller.

QUICK REFERENCE DATA

I

line

= 15 mA; VEE=0V; V

VCI

=0V; R

SLPE

=20Ω; AGC pin connected to VEE; Z

line

= 600 Ω; f = 1 kHz; measured

according to test circuits given in Figs 14, 15 and 16; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

line current operating range normal operation 11 − 140 mA

with reduced
performance

1 − 11 mA

V

LN

DC line voltage 3.7 4.0 4.3 V

I

CC

internal current consumption VCC= 3.3 V − 1.15 1.4 mA

V

CC

supply voltage for internal circuitry (unregulated) IP=0mA − 3.3 − V

V

DD

regulated supply voltage for peripherals

speech mode I

DD

= −3 mA 2.95 3.25 3.55 V

ringer mode I

DD

= 75 mA 3.0 3.3 3.6 V

I

DD

available supply current for peripherals −−−3mA

G

v(TX)

typical voltage gain for microphone amplifier V

MIC

= 4 mV (RMS) 43.2 44.2 45.2 dB

G

v(QR)

typical voltage gain for earpiece amplifier VIR= 4 mV (RMS) 26.4 27.4 28.4 dB

∆G

v(QR)

volume control range for earpiece amplifier 0 14.5 − dB

∆G

v(trx)

gain control range for microphone and earpiece
amplifiers with respect to I

line

=15mA

I

line

=85mA − 6.0 − dB

∆G

v(trx)(m)

gain reduction for microphone and earpiece
amplifiers

MUTE = LOW − 80 − dB

1999 Nov 22 3

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated
supply and earpiece volume control

TEA1111A

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TEA1111AT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

handbook, full pagewidth

FCA051

VI

VI

VI

VI

CURRENT AND

VOLTAGE

REFERENCE

microphone

amplifier

receive

amplifier

earpiece
amplifier

LOW VOLTAGE

CIRCUIT

AGC

CIRCUIT

VOLUME

CONTROL

V

DD

REGULATOR

ATTENUATOR

0.5V

CC

TEA1111A

4

8

IR

MUTE

13
14

MIC+

6

DTMF

MIC−

10

5

V

EE

AGC

129

11

GARVCI

QR

1

LN

7

V

DD

16

V

CC

SLPELEDCREG

2

153

LED CONTROL

Fig.1 Block diagram.

1999 Nov 22 4

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated
supply and earpiece volume control

TEA1111A

PINNING

SYMBOL PIN DESCRIPTION

LN 1 positive line terminal
SLPE 2 slope (DC resistance) adjustment
REG 3 line voltage regulator decoupling
IR 4 receive amplifier input
AGC 5 automatic gain control/

line loss compensation
DTMF 6 dual-tone multi-frequency input
V

DD

7 regulated supply for peripherals

MUTE 8 mute input to select speech or

dialling mode (active LOW)
VCI 9 volume control input
V

EE

10 negative line terminal
QR 11 earpiece amplifier output
GAR 12 earpiece amplifier gain adjustment
MIC+ 13 non-inverting microphone amplifier

input
MIC− 14 inverting microphone amplifier input
LEDC 15 LED control output
V

CC

16 supply voltage for internal circuit

handbook, halfpage

TEA1111A

FCA052

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

LN

SLPE

REG

IR

AGC

DTMF

V

DD

MUTE

VCI

V

EE

QR

GAR

MIC+

MIC−

V

CC

LEDC

Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION

All data given in this chapter concerns typical values,
except when otherwise specified.

Supply (pins LN, SLPE, REG, VCCand VDD)

The supply for the TEA1111A and its peripherals is
obtained from the telephone line (see Fig.3).

T

HE LINE INTERFACE (PINS LN, SLPE AND REG)

The IC generates a stabilized reference voltage (V

ref

)

across pins LN and SLPE. V

ref

is temperature
compensated and can be adjusted by using an external
resistor (RVA). V

ref

equals 3.8 V and can be increased by
connecting RVA between pins REG and SLPE or
decreased by connecting R

VA

between pins REG and LN.
The voltage at pin REG is used by the internal regulator to
generate V

ref

and is decoupled by C

REG

, which is
connected to VEE. This capacitor, converted to an
equivalent inductance, (see Section “Set impedance”)
determines the set impedance conversion from its DC
value (R

SLPE

) to its AC value (RCCin the audio-frequency
range). The voltage at pin SLPE is proportional to the line
current.

The voltage at pin LN is:
V

LN=Vref+RSLPE

× I

SLPE

I

SLPE=Iline

− ICC− IP− I

SUP

− I

LEDC

where:

I

line

= line current
ICC= current consumption of the IC
IP= supply current for external circuits
I

SUP

= current consumed between LN and VEE by the

VDD regulator
I

LEDC

= supply current for external LED circuitry.

Thepreferredvaluefor R

SLPE

is 20 Ω.ChangingR

SLPE

will
affect more than the DC characteristics; it also influences
the microphone and DTMF gains, the gain control
characteristics, the sidetone level and the maximum
output swing on the line.

The DC line current flowing into the set is determined by
the exchange supply voltage (V

EXCH

), the feeding bridge

resistance (R

EXCH

), the DC resistance of the telephone

line (R

line

) and the reference voltage (V

ref

). With line

currents below I

low

(9 mA), the internal reference voltage

(generatingV

ref

)isautomaticallyadjusted to a lower value.

1999 Nov 22 5

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated
supply and earpiece volume control

TEA1111A

This means that several sets can operate in parallel with
DC line voltages (excluding the polarity guard) down to an
absolute minimum voltage of 1.5 V. At line currents below
I

low

, the circuit has limited sending and receiving levels.

This is called the low voltage area.

THE INTERNAL SUPPLY POINT (PIN VCC)
The internal circuitry of the TEA1111A is supplied from

pin V

CC

. This voltage supply is derived from the line
voltage by means of a resistor (RCC) and must be
decoupled by a capacitor C

VCC

. It may also be used to

supply some external circuits.

The V

CC

voltage (see also Figs 4 and 5) depends on the

current consumed by the IC and the peripheral circuits as:
V

CC0=VLN

− RCC× I

CC

VCC=V

CC0

− RCC× (IP+I

rec

)

Where I

rec

is the current consumed by the output stage of

the earpiece amplifier.

handbook, full pagewidth

C

REG

4.7 µF

R

SLPE

20 Ω

I

SLPE

FCA053

I

line

I

LEDC

R

line

V

CC

V

EE

REGSLPE

LN

LEDC

V

DD

C

VCC

100 µF

C

VDD

220 µF

TEA1111A

R

CC

I

CC

I

LN

I

P

I

DD

I

SUP

R

EXCH

V

EXCH

peripherals

external

circuits

from preamplifier

V

DD

REGULATOR

internal

circuitry

LED

CONTROL

LED

CIRCUIT

Fig.3 Supply configuration.

1999 Nov 22 6

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

handbook, halfpage

MGK806

I

rec

EXTERNAL

CIRCUITS

I

P

V

EE

V

CC

V

CC0

R

CC

Fig.4 VCC used as supply voltage for external circuits.

handbook, halfpage

2.2 2.6 3.4

2

0

1.6

FCA054

3.0

1.2

0.8

0.4

(1) (2)

I

P

(mA)

VCC (V)

Fig.5 Typical current IP available from VCC for peripheral circuitry.

VCC≥ 2.2 V; VLN= 4 V at I

line

= 15 mA; RCC= 619 Ω; R

SLPE

=20Ω.

(1) Curve 1 is valid when the earpiece amplifier is driven: V

QR(rms)

= 150 mV; RL= 150 Ω.

(2) Curve 2 is valid when the earpiece amplifier is not loaded.

1999 Nov 22 7

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

THE REGULATED SUPPLY POINT (PIN VDD)
The V

DD

regulator delivers a stabilized voltage for the
peripherals in transmission mode (nominal VLN) as well as
in ringer mode (VLN= 0 V). The regulator (see Fig.6)
consists of a sense input circuit fed by pin LN, a current
switch and a V

DD

output stabilizer.

Theregulatorfunctiondependsonthetransmission,ringer
and trickle modes as follows:

• Transmissionmode:Theregulatoroperatesasacurrent

source at the LN input; it takes a constant current of
I

SUP

= 4.3 mA (at nominal conditions) from pin LN.
The current switch reduces the distortion on the line at
large signal swings. Output V

DD

follows the DC voltage
at pin LN (with typically 0.35 V difference) up to
VDD= 3.25 V. The input current of the regulator is
constant while the output (source) current is determined
by the consumption of the peripherals. The difference
between input and output currents is shunted by the
internal VDD stabilizer.

• Ringer mode: The regulator operates as a shunt
stabilizer to keep V

DD

at 3.3 V. The input voltage
VLNequals 0 V while the input current into pin VDD is
delivered by the ringingsignal. VDDhas to be decoupled
by a capacitor C

VDD

.

• Trickle mode: When VDD is below 2 V, the regulator is
inhibited. The current consumption of the VDDregulator
in trickle mode is very low to save most of the trickle
current for memory retention of a dialler.

handbook, full pagewidth

FCA055

I

line

R

line

V

CC

V

EE

LN

V

DD

C

VCC

100 µF

C

VDD

220 µF

TEA1111A

R

CC

I

CC

I

LN

R

EXCH

V

EXCH

peripherals

SENSE

SWITCH

VDD regulator

I

SUP

I

DD

Fig.6 VDD regulator configuration.

1999 Nov 22 8

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

LED control (pin LEDC)

The TEA1111A gives an on-hook/off-hook status
indication. This is achieved by a current made available at
pin LEDC to drive an external LED circuit connected
between pins SLPE and LN (see Fig.7). In the low voltage
area, which corresponds to low line current conditions, no
current is available for this LED. For line currents higher
than a threshold, the LEDC current increases
proportionally to the line current (with a ratio of 1:150).
The LEDC current is internally limited to 470 µA
(see Fig.8).

For 12 mA < I

line

< 82 mA:

This LED circuit is referenced to SLPE. Consequently, all
theLEDsupply current will flow through the R

SLPE

resistor,

and does not affect the behaviour of the AGC.

Set impedance

In the audio frequency range, the dynamic impedance is
mainly determined by the RCC resistor. The equivalent
impedance of the circuit is illustrated in Fig.9.

I

LEDC

I

line

12–

150

---------------------

=

FCA056

2.4
kΩ

24

Ω

BC858B

LN

LEDC

SLPE

Fig.7 LED circuit configuration.

handbook, halfpage

0 20 40 100

500

0

400

FCA057

60 80

300

200

100

I

LEDC

(µA)

I

line

(mA)

Fig.8 LEDC current versus line current.

handbook, halfpage

LN

V

EE

SLPE

R

SLPE

C

REG

REG V

CC

R

CC

4.7 µF

100 µF

C

VCC

619 Ω

20 Ω

R

P

V

ref

L

EQ

MBE788

Fig.9 Equivalent impedance between LN and VEE.

LEQ=C

REG

× R

SLPE

× RP.
RP= internal resistance.
RP= 17.5 kΩ.

1999 Nov 22 9

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
The TEA1111A has symmetrical microphone inputs.

The input impedance between pins MIC+ and MIC− is
68 kΩ (2 × 34 kΩ). The voltage gain from pins MIC+/MIC−
to pin LN is set at 44.2 dB (typical) at 600 Ω line load.

Automatic gain control is provided on this amplifier for line
loss compensation.

DTMF AMPLIFIER (PIN DTMF)
When the DTMF amplifier is enabled, dialling tones may

be sent on line. These tones are also sent to the receive
output QR at a low level (confidence tone), the level is
controlled by pin VCI.

The TEA1111A has an asymmetrical DTMF input.
The input impedance between DTMF and VEE is 20 kΩ
and it is biased at VEE. The voltage gain from pin DTMF to
pin LN is set at 25.9 dB.

Automatic gain control has no effect on the DTMF
amplifier.

Receiving stage (pins IR, GAR, QR and VCI)

The receive part consists of an earpiece amplifier and a
volume control block.

EARPIECE AMPLIFIER
The earpiece amplifier has one input (IR) and one output

(QR). The input impedance between pin IR and pin VEEis
22 kΩ. When pin VCI is tied to VEE, the voltage gain from
pin IR to pin QR is set at 27.4 dB (typical) which reduces
the attenuation of the receive signal by the anti-sidetone
network from 32 dB to 4.6 dB. The gain can be decreased
by connecting an external resistor R

GARext

between
pins GAR and QR; the adjustment range is 6 dB.
Two external capacitors C

GAR

(connected between

pins GAR and QR) and C

GARS

(connected between

pins GAR and VEE) ensure stability. Capacitor C

GAR

provides a first-order low-pass filter. The cut-off frequency
corresponds to the time constant C

GAR

× R

GARint

. Where

R

GARint

is the internal resistor (123 kΩ typical) which sets

the gain. The relationship C

GARS

=10×C

GAR

must be

complied with to ensure stability.
Theoutput voltage of the earpiece amplifier is specified for

continuous wave drive. The maximum output swing
depends on the DC line voltage, the RCC resistor, the I

CC

current consumption of the circuit, the IP current
consumption of the peripheral circuits and the load
impedance.

Automatic gain control is provided on this amplifier for line
loss compensation.

VOLUME CONTROL (PIN VCI)
A positive DC voltage applied to pin VCI allows the gain of

the earpiece amplifier to be increased in steps of 4.85 dB.
The volume control range is 27.4 to 41.9 dB (14.5 dB
typical). A proportional voltage decoder at pin VCI defines
a gain of 27.4 dB when V

VCI

equals VEE and a gain of

41.9 dB when V

VCI

equals VDD.

The intermediate steps correspond to:

and .

Automatic gain control (pin AGC)

The TEA1111A performs automatic line loss
compensation. The automatic gain control varies the gain
of the microphone amplifier and the gain of the receive
amplifier in accordance with the DC line current.

The control range is 6.0 dB (which corresponds
approximately to a line length of 5 km for a 0.5 mm
diametertwisted-paircopper cable with a DC resistance of
176 Ω/km and an average attenuation of 1.2 dB/km).

The ICcan be used with differentconfigurations of feeding
bridge (supply voltage and bridge resistance) by
connecting an external resistor R

AGC

between

pins AGC and VEE. This resistor enables the I

start

and I

stop

line currents to be increased (the ratio between I

start

and

I

stop

is not affected by the resistor). The AGC function is

disabled when pin AGC is left open circuit.

Mute function (pin MUTE)

The mute function performs the switching between the
speech mode and the dialling mode.

When MUTE is LOW, the DTMF input is enabled and the
microphone and receive amplifier inputs are disabled.
In this mode, the DTMF tones are sent to the receive
output at a low level (confidence tone).

When MUTE is HIGH, the microphone and receiving
amplifiers inputs are enabled while the DTMF input is
disabled. The MUTE input is provided with an internal
pull-up current source to VDD.

V

VCI

1
3

-- -

V

DD

=

V

VCI

2
3

-- -

V

DD

=

1999 Nov 22 10

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

Sidetone suppression

The TEA1111A anti-sidetone network comprising
RCC// Z

line,Rast1,Rast2,Rast3,RSLPE

and Z

bal

(see Fig.10)
suppresses the transmitted signal in the earpiece.
Maximum compensation is obtained when the following
conditions are fulfilled:

The scale factor k is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z

bal

.

In practice, Z

line

varies considerably with the line type and

thelinelength.Therefore, the value of Z

bal

shouldbeforan
average line length, which gives satisfactory sidetone
suppression with short and long lines. The suppression
also depends on the accuracy of the match between Z

bal

and the impedance of the average line.

The anti-sidetone network for the TEA1111A attenuates
the receive signal from the line by 32 dB before it enters
the receive stage. The attenuation is almost constant over
the whole audio frequency range.

A Wheatstone bridge configuration (see Fig.11) may also
be used.

More information on the balancing of an anti-sidetone
bridgecan be obtained in our publication

“Semiconductors
for Wired Telecom Systems; Applications Handbook
IC03b”

.

For ordering information, please contact the Philips
Semiconductors sales office.

R

SLPERast1

× R

CC

R

ast2

( R

ast3

)+×=

k

R

ast2

R

ast3RSLPE

+()×

R

ast1RSLPE

×

------------------------------------------------------------

=

Z

bal

kZ

line

×=

handbook, full pagewidth

MBE787

I

m

Z

ir

IR

R

ast1

R

ast3

R

ast2

SLPE

R

SLPE

V

EE

Z

line

R

CC

LN

Z

bal

Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge.

1999 Nov 22 11

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

handbook, full pagewidth

MBE786

I

m

Z

ir

IR

Z

bal

R

ast1

SLPE

R

SLPE

V

EE

Z

line

R

CC

LN

R

A

Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

positive continuous line voltage VEE− 0.4 12 V
repetitive line voltage during switch-on or

line interruption

V

EE

− 0.4 13.2 V

I

DD

maximum input current at pin V

DD

− 75 mA

V

CC

supply voltage VEE− 0.4 12 V

V

MUTE,VVCI

maximum voltage on pins MUTE and VCI VEE− 0.4 VDD+ 0.4 V

V

n(max)

maximum voltage on all pins except
pins VDD, MUTE and VCI

VEE− 0.4 VCC+ 0.4 V

I

line

line current R

SLPE

=20Ω;see Fig.12 − 140 mA

P

tot

TEA1111AT total power dissipation T

amb

=75°C; see Fig.12 − 416 mW

T

stg

storage temperature −40 +125 °C

T

amb

ambient temperature −25 +75 °C

T

j

junction temperature − +125 °C

1999 Nov 22 12

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

THERMAL CHARACTERISTICS

Note

1. Mounted on epoxy board 40.1 × 19.1 × 1.5 mm.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air; note 1 110 K/W

handbook, full pagewidth

12

150

30

24365981110

FCA058

7

50

70

90

110

130

(4) (3) (2) (1)

I

LN

(mA)

V

LN

− V

SLPE

(V)

Fig.12 SO16 safe operating area (TEA1111AT).

(1) T

amb

=45°C; P

tot

= 0.666 W.

(2) T

amb

=55°C; P

tot

= 0.583 W.

(3) T

amb

=65°C; P

tot

= 0.500 W.

(4) T

amb

=75°C; P

tot

= 0.416 W.

1999 Nov 22 13

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

CHARACTERISTICS

I

line

= 15 mA; VEE=0V; V

VCI

=0V; R

SLPE

=20Ω; pin AGC connected to VEE; Z

line

= 600 Ω; f = 1 kHz; measured

according to test circuits given in Figs 14, 15 and 16; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins LN, V

CC

, SLPE, REG and VDD)

T

HE LINE INTERFACE (PINS LN, SLPE AND REG)

V

ref

stabilized reference voltage
between pins LN and SLPE

3.5 3.8 4.1 V

V

LN

DC line voltage I

line

=1mA − 1.5 − V

I

line

=4mA − 2.5 − V

I

line

= 15 mA 3.7 4.0 4.3 V

I

line

= 140 mA − 6.7 7.2 V

V

LN(Rext)

DC line voltage with an
external resistor R

VA

RVA=90kΩ (between
pins LN and REG)

− 3.6 − V

∆V

LN(T)

DC line voltage variation with
temperature referenced to
25 °C

T

amb

= −25 to +75 °C −±40 − mV

THE INTERNAL SUPPLY POINT (PIN VCC)
I

CC

internal current consumption VCC= 3.3 V − 1.15 1.4 mA

V

CC

supply voltage for internal
circuitry

IP=0mA − 3.3 − V

THE REGULATED SUPPLY POINT (PIN VDD)
I

SUP

input current of the V

DD

regulator (current from pin LN
not flowing through pin SLPE)

I

line

=1mA − 0 − mA

I

line

=4mA − 1.2 − mA

I

line

≥ 11 mA − 4.3 − mA

V

DD

regulated supply voltage in:

speech mode I

DD

= −3 mA;
VLN> 3.6 V + 0.28 V (typ.);
I

line

≥ 11 mA

2.95 3.25 3.55 V

speech mode at reduced
performance

I

line

=4mA − VLN− 0.35 − V

ringer mode I

line

= 0 mA; IDD= 75 mA 3.0 3.3 3.6 V

I

DD

regulated supply current
available in:

speech mode I

line

≥ 11 mA −− −3mA

speech mode at reduced
performance

I

line

=4mA −−1−mA

trickle mode I

line

= 0 mA;
VCCdischarging;
VDD= 1.2 V

−− 100 nA

1999 Nov 22 14

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

LED control (pin LEDC)

I

line(h)

highest line current for
I

LEDC

<5µA

− 13 − mA

I

line(l)

lowest line current for
maximum I

LEDC

− 82 − mA

I

LEDC(max)

maximum available output
current from pin LEDC

− 470 −µA

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
Z

i

 input impedance

differential between
pins MIC+ and MIC−

− 68 − kΩ

single-ended between
pins MIC+/MIC− and V

EE

− 34 − kΩ

G

v(TX)

voltage gain from
pins MIC+/MIC− to pin LN

V

MIC

= 4 mV (RMS) 43.2 44.2 45.2 dB

∆G

v(TX)(f)

voltage gain variation with
frequency referenced to 1 kHz

f = 300 to 3400 Hz −±0.2 − dB

∆G

v(TX)(T)

voltage gain variation with
temperature referenced to
25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

CMRR common mode rejection ratio − 80 − dB
V

LN(max)(rms)

maximum sending signal
(RMS value)

I

line

= 15 mA; THD = 2% 1.8 2 − V
I

line

= 4 mA; THD = 10% − 0.45 − V

V

no(LN)

noise output voltage at pin LN psophometrically weighted

(P53 curve);
pins MIC+/MIC− short
circuited through 200 Ω

−−77 − dBmp

DTMF AMPLIFIER (PIN DTMF)
Z

i

 input impedance − 20 − kΩ

G

v(DTMF)

voltage gain from pin DTMF to
pin LN

V

DTMF

= 20 mV (RMS);

MUTE = LOW

24.9 25.9 26.9 dB

∆G

v(DTMF)(f)

voltage gain variation with
frequency referenced to 1 kHz

f = 300 to 3400 Hz −±0.2 − dB

∆G

v(DTMF)(T)

voltage gain variation with
temperature referenced
to 25 °C

T

amb

= −25 to +75 °C −±0.4 − dB

G

v(ct)

voltage gain from pin DTMF to
pin QR (confidence tone)

V

DTMF

= 20 mV (RMS);
RL= 150 Ω;
MUTE = LOW; V

VCI

=0V

−−15.6 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Nov 22 15

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

Receive stage (pins IR, GAR, QR and VCI)

THE EARPIECE AMPLIFIER (PINS IR AND QR)
Z

i

 input impedance − 22 − kΩ

G

v(QR)

voltage gain from pin IR to
pin QR

VIR= 4 mV (RMS);
V

VCI

=0 V

26.4 27.4 28.4 dB

∆G

v(QR)(f)

voltage gain variation with
frequency referenced to 1 kHz

f = 300 to 3400 Hz −±0.2 − dB

∆G

v(QR)(T)

voltage gain variation with
temperature referenced to
25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

∆G

v(QR)

voltage gain reduction range externalresistorconnected

between
pins GAR and QR

−− 6dB

V

QR(max)(rms)

maximum receiving signal on
pin QR (RMS value)

IP= 0 mA; sine wavedrive;
RL= 150 Ω; THD = 2%;
V

VCI=VDD

0.5 0.6 − V

I

P

= 0 mA; sine wavedrive;
RL= 450 Ω; THD = 2%;
V

VCI=VDD

0.8 0.9 − V

V

no(QR)(rms)

noise output voltage at pin QR
(RMS value)

IR open circuit;
RL= 150 Ω; V

VCI

=0V;
psophometrically weighted
(P53 curve)

−−90 − dBVp

V

VCI=VDD

−−75 − dBVp
VOLUME CONTROL (PIN VCI)
∆G

v(QR)max

maximum increase in voltage
gain

VIR= 4 mV (RMS);
V

VCI=VDD

12 14.5 17 dB

∆G

v(QR)step

step voltage gain VIR= 4 mV (RMS) 3.85 4.85 5.85 dB

Automatic gain control (pin AGC)

∆G

v(trx)

voltage gain control range for
microphone and earpiece
amplifiers w.r.t. I

line

=15mA

I

line

=85mA − 6.0 − dB

I

start

highest line current for
maximum gain

− 23 − mA

I

stop

lowest line current for min. gain − 59 − mA

Mute function (pin MUTE)

V

IL

LOW-level input voltage VEE− 0.4 − VEE+ 0.3 V

V

IH

HIGH-level input voltage VEE+ 1.5 − VDD+ 0.4 V

I

MUTE

input current −10 −2 −µA

∆G

v(trx)(m)

voltage gain reduction for:

microphone amplifier

MUTE = LOW − 80 − dB

earpiece amplifier

MUTE = LOW − 80 − dB

DTMF amplifier

MUTE = HIGH − 80 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Nov 22 16

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

FCA059

R

bal1

130 Ω

R

bal2

820 Ω

R

SLPE

20 Ω

R

ast2

3.92 kΩ
R

ast3

R

prot

1N4004

392 Ω

R

CC

619 Ω

24 Ω

2.4
kΩ

R

ast1

130 kΩ

4.7 µF

C

REG

C

MIC−

R

AGC

Rz

R

TX1

R

TX2

C

DTMF

C

VDD

220 µF

C

GAR

100 pF

C

bal

220 nF

220 nF

TEA1111A

LN

BA

AB

SLPE

100 µF

C

VCC

Cz

C

IR

100 nF

10 µF

C

MIC+

REG

IR

AGC

DTMF

DTMF

peripheral

supply

V

DD

V

DD

V

EE

MUTE

MUTE

V

CC

LEDC

MIC−

MIC−

MIC+

MIC+

QR

GAR

V

EE

VCI

C

EAR

1 nF

C

GARS

R

TX3

D1 D2

Dz
V

d

10 V

C

emc

10 nF

D3 D4

VCI

1

VCI

0

earpiece

BC858

R

GARext

R

2R

Fig.13 Basic application diagram.

1999 Nov 22 17

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

handbook, full pagewidth

FCA060

V

CC

V

DD

LN

LEDC

TEA1111A

R

CC

619 Ω

I

DD

I

CC

I

LN

I

line

I

line

IR

MIC−

MIC+

DTMF

QR

C

REG

4.7 µF

R

SLPE

20 Ω

100

µF

BC858

600 Ω

REG AGCSLPE

V

EE

VCIMUTE

GAR

10 µF

C

VDD

220 µF

C

VCC

100 µF

C

GARS

C

GAR

R

L

R

GARext

V

O

V

MIC

S1

V

DTMF

3 mA

24 Ω 2.4 kΩ

Fig.14 Test circuit for defining transmit gains.

Voltage gain defined as Gv= 20 log ; VI=V

MIC

or V

DTMF

.
Microphone gain: S1 = open.
DTMF gain: S1 = closed.
Inputs not being tested should be open circuit.

V

O

V

I

-------

1999 Nov 22 18

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

handbook, full pagewidth

FCA061

V

CC

V

DD

LN

LEDC

TEA1111A

R

CC

619 Ω

I

DD

I

CC

I

LN

I

line

100

µF

BC858

I

line

IR

MIC−

MIC+

DTMF

QR

C

REG

4.7 µF

R

SLPE

20 Ω

600 Ω

REG AGCSLPE

V

EE

VCIMUTE

GAR

10 µF

C

VDD

220 µF

C

VCC

100 µF

C

GARS

C

GAR

R

L

R

GARext

S1

V

DTMF

E

VCI

3 mA

24 Ω 2.4 kΩ

220
nF

V

IR

V

O

Fig.15 Test circuit for defining earpiece gains.

Voltage gain defined as Gv= 20 log ; VI=VIRor V

DTMF

.
Earpiece gain: S1 = open.
Confidence tone: S1 = closed.
Inputs not being tested should be open circuit.

V

O

V

I

-------

1999 Nov 22 19

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

handbook, full pagewidth

FCA062

V

CC

V

DD

LN

IR

10 µF

TEA1111A

R

CC

619 Ω

I

DD

V

CC

V

DD

MIC−
MIC+
DTMF
LEDC

QR

GAR

VCI

C

REG

4.7 µF

R

SLPE

20 Ω

REG AGC SLPE

V

EE

MUTE

Fig.16 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes.

Inputs not being tested should be open circuit.

1999 Nov 22 20

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

PACKAGE OUTLINE

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A1A

2

A

3

b

p

cD

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

95-01-23
97-05-22

076E07S MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

1999 Nov 22 21

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Nov 22 22

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Nov 22 23

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEA1111A

NOTES

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

68

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
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Printed in The Netherlands 465002/02/pp24 Date of release: 1999 Nov 22 Document order number: 9397 750 06482