Datasheet TEA1083A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1083; TEA1083A

Call progress monitor for line
powered telephone sets

Product specification
File under Integrated circuits, IC03A

March 1994

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

FEATURES

• Internal supply
– Optimum current split-up
– Low constant current (adjustable) in transmission IC
– Nearly all line current available for monitoring
– Stabilized supply voltage

• Loudspeaker amplifier with a fixed gain of 35 dB

• Volume controlled by potentiometer

• Power-down input (TEA1083A only)

• Loudspeaker enable input.

GENERAL DESCRIPTION

The TEA1083/83A is a bipolar IC which has been
designed for use in line powered telephone sets. It is
intended to offer a monitoring facility of the line signal via

TEA1083; TEA1083A

a loudspeaker during on-hook dialling. The TEA1083/83A
is intended for use in conjunction with a transmission
circuit of the TEA1060 family. The device uses a part of the
available line current via the internal supply circuit.
The loudspeaker amplifier, which consists of a preamplifier
and a power amplifier, amplifies the received line signals
from the transmission circuit when enabled via the LSE
input. The loudspeaker amplifier can also be used to
amplify dialling tones from the dialler IC. The power
amplifier contains a push-pull output stage to drive the
loudspeaker in a Single Ended Load (SEL) configuration.
The internal voltage stabilizer can be used to supply
external devices. By activating the power-down (PD) input
of the TEA1083A, the current consumption of the circuit
will be reduced, this enables pulse dialling or flash (register
recall).
An internal start circuit ensures normal start-up of the
transmission IC.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

SUP

V

BB

I

SUP

G

v

I

SUP

T

amb

input current range 3.0 − 120 mA
stabilized supply current − 2.95 − V
current consumption PD = HIGH; TEA1083A only − 50 −µA
voltage gain of loudspeaker amplifier − 35 − dB
minimum input current PO = 10 mW (typ) into 50 Ω− 10 − mA
operating ambient temperature range −25 −+75 °C

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

PINS PIN POSITION MATERIAL CODE

TEA1083 8 DIL PLASTIC SOT97D
TEA1083A 16 DIL PLASTIC SOT38
TEA1083AT 16 SOL PLASTIC SOT162AG

PACKAGE

(1)

(2)

(3)

Notes

1. SOT97-1; 1998 Jun 18.

2. SOT38-1; 1998 Jun 18.

3. SOT162-1; 1998 Jun 18.

March 1994 2

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

handbook, full pagewidth

SREF

V

SS

LSI1
LSI2

LSE

3

1
4

5

6

V

SUP

2

SUPPLY

PRE-

AMPLIFIER

BB

8

ENABLE
CIRCUIT

START-

CIRCUIT

POWER

AMPLIFIER

TEA1083

MGR045

TEA1083; TEA1083A

7

QLS

handbook, full pagewidth

SREF

PD

V

SS

LSI1
LSI2

LSE

Fig.1 Block diagram (TEA1083).

V

3
12

1
8

9

13

3, 5, 6, 7,
10, 11, 14

n.c.

SUP

2

SUPPLY

PD

PRE-

AMPLIFIER

BB

16

ENABLE
CIRCUIT

START-

CIRCUIT

POWER

AMPLIFIER

TEA1083A

TEA1083AT

15

MGR046

QLS

Fig.2 Block diagram (TEA1083A/AT).

March 1994 3

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

handbook, halfpage

V

SS

SREF

LSI1

1
2
3
4

TEA1083

MGR047

V

8

BB

QLSSUP

7

LSE

6

LSI2

5

Fig.3 Pin configuration (TEA1083).

handbook, halfpage

Fig.4 Pin configuration (TEA1083A/AT).

V

SS

SUP

n.c.

SREF

n.c.
n.c.
n.c.

LSI1

TEA1083; TEA1083A

1
2
3
4

TEA1083A

TEA1083AT

5
6
7
8

MGR048

V

16

BB

15

QLS

14

n.c.

13

LSE

12

PD

11

n.c.

10

n.c.

9

LSI2

PINNING

SYMBOL

V

SS

PIN

DIL16

PIN

DIL8

1 1 negative supply terminal
SUP 2 2 positive supply terminal
n.c. 3 − not connected
SREF 4 3 supply reference input
n.c. 5 − not connected
n.c. 6 − not connected
n.c. 7 − not connected
LSI1 8 4 loudspeaker amplifier input 1
LSI2 9 5 loudspeaker amplifier input 2
n.c. 10 − not connected
n.c. 11 − not connected
PD 12 − power-down input
LSE 13 6 loudspeaker enable input
n.c. 14 − not connected
QLS 15 7 loudspeaker amplifier output
V

BB

16 8 stabilized supply voltage

DESCRIPTION

March 1994 4

Philips Semiconductors Product specification

Call progress monitor for line powered

TEA1083; TEA1083A

telephone sets

Table 1 Comparison of the TEA108X family.

PRODUCT CONDITIONS TEA1083 TEA1083A TEA1085/85A

Application area note 1 call progress monitoring listening-in
PD facility − XX
MUTE or LSE facility note 2 X X X
Dynamic limiter −− X
Howling limiter −− X
V

setting −− X

BB

SEL note 3 X X X
BTL note 3 −− X
Number of pins note 4 8 16 24

Notes

1. A call progress monitor is recommended by the
European Telecommunications Standards Institute
(ETSI) for telephone sets with automatic on-hook
dialling facilities so that audible, or visual, progress of
a call attempt can be monitored. In accordance with
the ETSI (at a frequency of 440 Hz and a line level of
20 dBm (600 Ω)), a minimum level of 50 dBA shall be
guaranteed at a distance of 50 cm from the set. This
corresponds to a minimum level of approximately
100 mV (RMS) (PO≥ 0.2 mW) across a loudspeaker;
Philips type AD2071/Z50.

A listening-in set has to offer the user more facilities
e.g. howling limiting to reduce annoying loudspeaker
and line signals. Dynamic limiting of the loudspeaker
signal, with respect to supply conditions, can also be
required. Acoustic output levels for listening-in sets are
approximately 70 to 75 dBA. This corresponds to a
loudspeaker level of approximately 1 mV (RMS)
(PO≈ 20 mW).

2. The MUTE function of the TEA1085A has a logic input;
the MUTE function of the TEA1085 has a toggle input.

3. SEL: loudspeaker connected in a single-ended-load
configuration
BTL: loudspeaker connected in a bridge-tied-load
configuration

4. Consult the product specification for the package
outline/s.

FUNCTIONAL DESCRIPTION

The TEA1083/83A is normally used in conjunction with a
transmission circuit of the TEA1060 family. The circuit
must be connected between the positive line terminal
(pin 2) and pin SLPE of the transmission IC. The
transmission characteristics (impedance, gain settings,
etc.) are not affected.
An interconnection between the TEA1083/83A and a
member of the TEA1060 family is illustrated in Fig.5.

Supplies SUP, SREF, V

BB

and V

SS

In Fig.6 the line current is divided into ITR for the
transmission IC and I

for the monitoring circuit

SUP

TEA1083/83A.
ITR is constant:
ITR=V
I

SUP=Iline

/ R20

int

− ICC− I

TR

Where:

• V

is an internal temperature compensated reference

int

voltage of 500 mV (typ) between pins SUP and SREF

• R20 is a resistor connected between SUP and SREF

• ICC is the internal current consumption of the TEA106X

(approximately 1 mA).

A practical value for resistor R20 is 150 Ω; this produces a
current of approximately 3.3 mA (typ) for ITR and I
approximately equal to I

− 4.3 mA.

line

SUP

is

March 1994 5

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

The circuit stabilizes its own supply voltage at VBB.
Transistor TR1 provides the supplies for the internal
circuits. Transistor TR2 is used to minimize signal
distortion on the line by momentarily diverting the input
current to VSS whenever the instantaneous value of the
voltage at V
fixed to a typical value of 2.95 V.
The supply at VBB is decoupled with respect to VSS by a
220 µF capacitor (C20).

The DC voltage (V
transmission IC and V
V

− VSS = V

SUP

The reference voltage of the transmission IC has to be
adjusted to a level where V
400 mV. The minimum voltage space between SUP and
VBB (400 mV) is required to maintain a 'high' efficiency of
the internal supply for mean speech levels. V
specified maximum level.

The internal current consumption of the TEA1083/83A
(I

) is typically 2.5 mA (where V

SUP0

The current I

0.4 mA) for the circuitry connected to SUP and I

(approximately 2.1 mA) for the internal circuitry connected
to VBB(see Fig.6).

LOUDSPEAKER AMPLIFIER (LSI1/LSI2 and QLS)

The TEA1083/83A has symmetrical inputs at LSI1 and
LSI2. The input signal is normally taken from the earpiece
output of the transmission circuit (see Fig.5) and/or from
the signal output of the DTMF generator via a resistive
attenuator.
The attenuation factor must be chosen in accordance with
the output levels from the transmission IC and/or DTMF
generator and, in accordance with the required output
power and permitted signal distortion from the
loudspeaker signal.

The output QLS drives the loudspeaker as a single-ended
load. The output stage has been optimized for use with a
50 Ω loudspeaker (e.g. Philips type AD2071). The
loudspeaker amplifier is enabled when the LSE input goes
HIGH. The gain of the amplifier is fixed at 35 dB.

Volume control of the loudspeaker signal can be obtained
by using a level control at the input (see Fig.5).

drops below the supply voltage VBB. VBB is

SUP

− VSS) is determined by the

SUP

; thus

int

+ V

LN−SLPE

consists of currents I

SUP0

int

SUP

.

− V

SUP

is greater than

BB (max)

BB (max)

− VSS= 3.6 V).
(approximately

BIAS

BB0

is the

TEA1083; TEA1083A

The maximum voltage swing at the QLS output is
V
V
I
available voltage space (VBB). Higher input levels and/or
lower supply currents will result in an increase of the
harmonic distortion due to signal clipping.

With a limit of 2.5 V (p-p), the maximum output swing is
dependent on the supply current and loudspeaker
impedance. It can be approximated, for low distortions, by
the following equation:

V
Where;

• V

• RLS= the loudspeaker impedance

• I

POWER-DOWN INPUT (PD)

During pulse dialling or register recall (timed loop break)
the telephone line is interrupted, thereby breaking the
supply current to the transmission IC. The capacitor
connected to V
TEA1083/83A during the supply breaks.

By making the PD input HIGH during the loop break, the
requirement on the capacitor is eased and, consequently,
the internal current consumption I
reduced from 2.1 mA to 400 µA typically. Transistors TR1
and TR2 are inhibited during power-down and the bias
current is reduced from approximately 400 µA to
approximately 50 µA with V
equation:

I
Where 3.6 < V
2Vd is the voltage drop across 2 internal diodes

(approximately 1.3 V)
Ra is an internal resistor (typical 50 kΩ)

LOUDSPEAKER ENABLE INPUT (LSE)

The LSE input has a pull-down structure. It switches the
loudspeaker amplifier, in the monitoring condition, by
applying a HIGH level at the input. The amplifier is in the
standby condition when LSE is LOW (input open-circuit or
connected to V

= 2.5 V (typical with 50 Ω load). The input level

O(p-p)

is approximately 16 mV(rms) and the supply current

LSI

> 11 mA. In this condition the signal is limited by the

SUP

O(p-p)

O(p-p)

SUPO

SUP(PD)

=2×(I

= the peak-to-peak level of the loudspeaker

= 2.5 mA (typ.)

= I

BIAS(PD)

− I

SUP

provides the supply for the

BB

= (V

< VBB+ 3V

SUP

).

SS

) ×π×R

SUPO

SUP

− 2Vd)/Ra

SUP

LS

(see Fig.5) is

BB0

= 3.6 V in the following

March 1994 6

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

handbook, full pagewidth

line

V

CC

IR

TEA106x

V

EE SLPE

LN

MIC

QR

SREF SUP V

PD

TEA1083

TEA1083A

LSE

LSI1 LSI2

TEA1083; TEA1083A

BB

QLS

V

SS

MGR049

handbook, full pagewidth

line

Fig.5 Interconnection with a transmission IC of the TEA106X family.

I

line

C1

I

CC

R1

V

CC

TEA106x

V

EE

V

SUP

I

TR

LN

SLPE

R20

R9

I

SUP

SUP

SREF

TEA1083

V

int

TR1

TR1/TR2

CONTROL

I

BIAS

TR2

STABILIZER

V

SS

VOLTAGE

TEA1083A

SLPE

V

EE

I

BBO

V

BB

C28

MGR050

Fig.6 Supply arrangement.

March 1994 7

Philips Semiconductors Product specification

Call progress monitor for line powered

TEA1083; TEA1083A

telephone sets

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

SUP

V

SUP

V

SREF

V Voltage on all other pins V
I

SUP

P

tot

T

stg

T

amb

T

j

Supply voltage

continuous − 12 V
during switch-on or line interruption − 13.2 V

Repetitive supply voltage from 1 ms to

− 28 V
5 s with 12 Ω current limiting resistor
in series with supply

Supply reference voltage VSS − 0.5 V

− 0.5 VBB + 0.5 V

SS

+ 0.5 V

SUP

Supply current see Fig.6 − 120 mA
Total power dissipation T

= 75 °C; Tj = 125 °C

amb

TEA1083 − 500 mW
TEA1083A − 769 mW

TEA1083AT − 555 mW
Storage temperature range −40 +125 °C
Operating ambient temperature range −25 +75 °C
Junction temperature −+125 °C

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE

R

th j-a

from junction to ambient in free air (TEA1083) 100 K/W
from junction to ambient in free air (TEA1083A) 65 K/W
from junction to ambient in free air (TEA1083AT) 90 K/W

March 1994 8

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

MGR051

handbook, halfpage

120

I

SUP

(mA)

100

(1)

80

60

40

212

46810

(3)

(2)

V

SUP

− VSS (V)

handbook, halfpage

120

I

SUP

(mA)

100

80

60

40

212

TEA1083; TEA1083A

MGR052

(1)

(2)

(3)

46810

V

− VSS (V)

SUP

Fig.7 Safe operating area; see Table 2 (TEA1083).

handbook, halfpage

120

I

SUP

(mA)

100

80

60

40

212

(2)

(3)

46810

V

SUP

MGR053

(1)

− VSS (V)

Fig.8 Safe operating areas see Table 3

(TEA1083A).

Table 2

CURVE T

amb

P

tot

155°C 700 mW
265°C 600 mW
375°C 500 mW

Table 3

CURVE T

amb

P

tot

155°C 1077 mW
265°C 923 mW
375°C 769 mW

Table 4

CURVE T

amb

P

tot

155°C 777 mW
265°C 666 mW
375°C 555 mW

Fig.9 Safe operating area; see Table 4

(TEA1083AT).

March 1994 9

Philips Semiconductors Product specification

Call progress monitor for line powered

TEA1083; TEA1083A

telephone sets

CHARACTERISTICS

= 3.6 V; VSS = 0 V; I

V

SUP

loudspeaker amplifier load = 50 Ω; all measurements taken in test circuit Fig.10; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

SUP

V

SUP−SREF

V

BB

∆V

BB

∆V

/∆T Variation of supply voltage with

BB

Minimum DC input voltage − VBB + 0.6 − V
Internal reference voltage 400 500 600 mV
Stabilized supply voltage I
Variation of supply voltage from I

temperature, referred to 25 °C

I

SUP

Minimum operating current − 2.5 4.0 mA

THD Distortion of AC signal between

SUP and V

V

no(RMS)

Noise between SUP and V
(RMS value)

Current consumption in
power-down condition

I

SUP

I

BB

V

= 3.6 V − 50 75 µA

SUP

VBB = 2.95 V − 400 550 µA

Loudspeaker amplifier inputs LSI1 and LSI2

Z

G

∆G

i

v

v

input impedance (LSI1 and LSI2) single ended 7.5 9.5 11.5 kΩ

Voltage gain from LSI1/2 to QLS I

Total gain variation with input
signal from 2 mV(RMS) to
10 mV(RMS)

∆G/∆T Total gain variation with

temperature referred to 25 °C

= 15 mA; V

SUP

EE

= 0 V (RMS); f = 800 Hz; T

SUP

= 15 mA 2.75 2.95 3.15 V

SUP

= 15 to 120 mA − 15 − mV

SUP

T

= −25 to +75 °C;

amb

I

= 15 mA

sup

EE

V

SUP(RMS)

psophometrically

= 1 V − 0.3 − %

weighted (P53 curve)
PD = HIGH

differential (LSI1 to LSI2) 15 19 23 kΩ

= 15 mA;

SUP

Vi = 2 mV (RMS)

= −25 to +75 °C −±0.4 − dB

T

amb

= 25 °C; PD = LOW; LSE = HIGH;

amb

−±0.2 − mV/K

−−71 − dBmp

34 35 36 dB

− 0.2 − dB

Output capabilities

V

O(p-p)

Maximum output voltage

THD = 3%; 50 Ω load 2.0 2.5 − V

(peak-to-peak value)

V

O(p-p)

V

no(RMS)

Output voltage (peak-to-peak
value)

Noise output voltage (RMS
value)

Vi= 10 mV(RMS);
I

= 15 mA;

SUP

V

SUP−VEE

1kΩ between inputs
LSI1 and LSI2;
psophometrically
weighted (P53 curve)

Power-down input (PD) (TEA1083A only)

V

IL

V

IH

I

PD

LOW level input voltage 0 − 0.3 V
HIGH level input voltage 1.5 − V
Input current PD = HIGH − 2.3 2.8 µA

March 1994 10

= 1 V (RMS)

− 1.6 − V

− 250 −µV

BB

V

Philips Semiconductors Product specification

Call progress monitor for line powered

TEA1083; TEA1083A

telephone sets

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

LSE input

V

IL

V

IH

I

I

∆G Reduction of gain from LSI1/LSI2

handbook, full pagewidth

I

line

LOW level input voltage 0 − 0.3 V
HIGH level input voltage 1.5 − V

BB

V

Input current LSE = HIGH − 510µA

LSE = LOW 60 80 − dB

to QLS

I

in

A

R1

I

CC

620 Ω

V

CC

GAS1 MIC−

3

GAS2

QR+

GAR

V

EE SLPEREGSTAB

TEA1060

R5

3.6
kΩ

C1

100

µF

5

6

V

SUP

R20

I

TR

150 Ω

115

LN

72

8

MIC+

18

16910

C3

R9

4.7

20 Ω

µF

V

SUP − VSREF

V

CC

V

CC

V

LSI

I

SUP

SUP

SREF

LSE QLS

(12)

PD

TEA1083

LSI1

LSI2

(TEA1083A)

V

(8) 4

(9) 5

SS

2 (2)

1 (1)

I

BB

8 (16)3 (4)

V

BB

7 (15)(13) 6

C21
220

µF

V

V

O

R

LS

50 Ω

BB

MGR054

C20
470

µF

Fig.10 Test circuit.

Notes to figure 10

1. I

SUP=IIN

2.

Gv20 log

I

3.

TR

=

V

SUP SREF–

-------------------------------=

− I

R20

TR

V

-----------

V

LSI

o

4. The pin numbers in parenthesis refer to the TEA1083A/AT

5. LSE has to be HIGH to measure the voltage gain

6. PD has to be HIGH to measure in PD conditions

7. The pins not shown in the TEA1060 are left open-circuit

8. An impedance in series with pin SUP (e.g. an ammeter) should
be avoided as it interferes with the values of I

TR

and I

SUP

.

March 1994 11

Philips Semiconductors Product specification

o

Call progress monitor for line powered
telephone sets

APPLICATION INFORMATION

An application of the TEA1083/83A, in conjunction with a
member of the TEA1060 family, is illustrated in figure 11.
The TEA1083/83A is used for call progress monitoring
during on-hook dialling. The dialling facilities are
performed by a microcontroller (e.g. PCD3344,
PCD3349).
Only the most important components have been shown.
For detailed information refer to a data sheet of the
TEA1060 family.
The electronic hook switch can be replaced by a
mechanical system (hook switch) with a hold/release
function which is intended for on-hook dialling.

a/b

line

b/a

R8

390 Ω

R1

11

IR

7

MIC−

8

MIC+

14

MUTE

620 Ω

15 1

V

CC

TEA1060

V

EE

10 16 18

R2
130 kΩ

C5

100 nF

R3

3.9 kΩ

Z

bal

C1

100

µF

LN

GAR

DTMF

REG SLPE

C3

4.7
µF

R20
150 Ω

PD

QR

R9
20 Ω

12
6
5

13

150 nF

10 µF

C14

R4

50 kΩ

C2

ok, full pagewidth

R21

2.2 kΩ

C24

150 nF

R22

2.2
kΩ

L1

150 µH

TEA1083; TEA1083A

3 (4) 8 (16)2 (2)

SREF V

SUP

BB

(15)
7

QLS

(12)

TEA1083

(TEA1083A)

6

PD

LSI1 LSI2

4 (8) 5 (9) 1 (1)

C22

220

nF

C23
220

nF

(13)

LSE

V

SS

C21

47 µF

C20
220

µF

line-interrupter
electronic
hook switch

V

cradle switch

DD

CRS

MICROCONTROLLER AND

INTERFACE CIRCUITRY

V

SS

Pin numbers in parenthesis refer to the TEA1083A/AT.

Fig.11 Application example when the TEA1083/83A is used in conjunction with the TEA1060.

March 1994 12

DTMFDP/FLMUTE

XTAL

ENABLE

MGR055

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

1

w M

b

1

b

2

5

TEA1083; TEA1083A

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

E

1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT97-1

12

min.

max.

050G01 MO-001AN

b

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

0.021

0.015

b

1

0.53

0.38

4

0 5 10 mm

scale

b

cD E e M

2

0.36

1.07

0.23

0.89

0.014

0.042

0.009

0.035

REFERENCES

(1) (1)

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

92-11-17
95-02-04

(1)

Z

March 1994 13

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

e

b

b

1

9

A

w M

TEA1083; TEA1083A

SOT38-1

M

E

A

2

A

1

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

1

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

D

21.8

21.4

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

E

(1)

Z

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

w

H

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02
95-01-19

max.

2.2

0.087

March 1994 14

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TEA1083; TEA1083A

SOT162-1

E

H

E

A

X

v M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w M

b

p

0 5 10 mm

scale

(1)E(1) (1)

cD

10.5

10.1

0.41

0.40

0.30

0.29

eHELLpQ

7.6

1.27

7.4

0.050

A

2

10.65

10.00

0.419

0.394

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.25 0.1

0.01

A

θ

ywv θ

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE

VERSION

SOT162-1

IEC JEDEC EIAJ

075E03 MS-013AA

REFERENCES

March 1994 15

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“Data Handbook IC26; Integrated Circuit Packages”

our
(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

stg max

). If the

TEA1083; TEA1083A

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

March 1994 16

Philips Semiconductors Product specification

Call progress monitor for line powered

TEA1083; TEA1083A

telephone sets

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

March 1994 17

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

NOTES

TEA1083; TEA1083A

March 1994 18

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

NOTES

TEA1083; TEA1083A

March 1994 19

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie BesantRoad, Worli, MUMBAI 400 025,
Tel. [phone], Fax.[phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext.2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax.[phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax.[phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Middle East: see Italy
Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC,MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax.[phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax.[phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax.[phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax.[phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax.[phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax.[phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax.[phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 415102/00/02/pp20 Date of release: March 1994 Document order number: 9397 750 nnnnn