Datasheet tea0665 DATASHEETS (Philips)

Download

Page 1

INTEGRATED CIRCUITS

DATA SH EET

TEA0665 TEA0665T

Dolby B and C type noise reduction circuit

Product speciﬁcation File under Integrated Circuits, IC01

May 1992

Page 2

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

GENERAL DESCRIPTION

The TEA0665 is designed for use in Dolby provides the high and low level stages for one channel of a Dolby C-type NR system, including NR ON/OFF switching and all electronic switching necessary for Dolby C-type systems. In addition the TEA0665 includes a preamplifier for the record and playback functions and a multiplex buffer amplifier. The circuit offers two different line-output levels (−6 and 0 dBm) and a low-pass filter, which can be fed into the signal path in playback mode.

Features

• Few external components required

• Included RECORD/PLAY preamplifiers plus multiplex filter buffer amplifier

• Two different line-output levels

• All electronic switching

PACKAGE OUTLINES

TEA0665: 28-lead DIL; plastic (SOT117); SOT117-1; 1996 September 9. TEA0665T: 28-lead mini-pack; plastic (SO28; SOT136A); SOT136-1; 1996 September 9.

(1)

B and Dolby C type audio Noise Reduction (NR) systems. The device

TEA0665

TEA0665T

(1) Available only to licensees of Dolby Laboratories Licensing Corporation, San Francisco, CA94111 U.S.A., from

whom licensing and application information must be obtained. Dolby is a registered trademark of Dolby Laboratories Licensing Corporation.

May 1992 2

Page 3

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

May 1992 3

Fig.1 Block diagram and application circuit.

Page 4

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

PINNING

1 PREAMP OUT record/playback preampliﬁer

output 2 PB BUFFER IN play back ampliﬁer input buffer 3 REC BUFFER IN record ampliﬁer input buffer 4 SSN spectral skewing network 5 LINE OUT 1 line output 1 6 LINE OUT 2 line output 2 7 HLS SC IN high level stage side chain input 8 SC SW side chain ﬁlter switch 9 HLC SC high level stage side chain 10 HLS AC GND high level stage AC ground 11 HLS HP high level stage high pass ﬁlter 12 HLS INT high level stage integrating ﬁlter 13 HLS INT high level stage integrating ﬁlter 14 V

REF

15 V

16 LLS INT low level stage integrating ﬁlter 17 LLS INT low level stage integrating ﬁlter 18 LLS HP low level stage high pass ﬁlter 19 LLS AC GND low level stage AC ground 20 LLS SC low level stage side chain 21 REC OUT record output 22 AS anti-saturation ﬁlter 23 AS anti-saturation ﬁlter 24 REC/PB SW record/playback switch input 25 MODE SW mode switch input 26 REC IN record input 27 GND ground 28 PB IN playback input

reference voltage

positive supply voltage

TEA0665

TEA0665T

Fig.2 Pinning diagram.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 15) V Input voltage (pins 26 and 28) V Total power dissipation P Storage temperature range T Operating ambient temperature range T

May 1992 4

max. 18 V

max.−0,3 to VCCV

I tot stg amb

−55 to + 150 °C

−40 to + 85 °C

600 mW

Page 5

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

CHARACTERISTICS

= 14 V; f = 20 Hz to 15 kHz; T

test circuit Fig.5; record mode; unless otherwise speciﬁed.

PARAMETER

Supply

Supply voltage range C − note 1

single V (split) V

Supply current OFF − no input

Input sensitivity C note 2

of record amplifier pin 26 V of playback amplifier pin 28 V

Signal handling C 1 V

of record output THD = 1% 12 15 − dB (note 3; see Fig.8) 1 V

Line output 1 note 3 −0,5 0 +0,5 dB Line output 2;

amplifier gain V

o/Vi

(pin 6 to pin 5)

Total harmonic

distortion OFF 1 TPL = 0 dB

Total harmonic distortion B 1 TPL = 0 dB THD − 0,1 0,15 %

Total harmonic

distortion C 1 TPL 0 dB THD − 0,15 0,3 %

Signal plus noise- C R

to-noise ratio CCIR/ARM

= 25 °C; all levels with reference to 387,5 mV = 0 dB = −6 dBm at test point pin 7;

amb

CONDITIONS

SYMBOL MIN. TYP. MAX. UNIT

MODE F (KHZ)

8 1416V (±4) (±7) (±8) V

− 17 25 mA

43 50 57 mV 25 30 35 mV

signal I

= 8 V

= 14 V

CC CC

i i

THD = 1% − 20 − dB

(6)

THD − 0,02 0,1 %

+5,5 +6 +6,5 dB

TPL = + 10 dB THD − 0,05 0,3 %

TPL = + 10 dB THD − 0,08 0,3 %

10 TPL = 0 dB THD − 0,06 0,1 %

TPL + 10 dB THD − 0,13 0,5 %

= 10 kΩ

weighted (S+N)/N 62 66 − dB

May 1992 5

Page 6

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

PARAMETER

MODE F (KHZ)

Frequency response B 2 TPL = −25 dB −19,0 −18,0 −17,0 dB

C 0,2 TPL = −40 dB −33,4 −31,9 −30,4 dB

Switching thresholds note 4; pin 24

for record V for playback V

Switching thresholds note 5; pin 25

OFF V (switch in open position) B V (external voltage) B V

Switch input current pin 25

OFF V

Frequency response shift as

a function of temperature deviation, range

−40 to +85 °C, measured as deviation from 25 °C

as a function of voltage deviation, rang 8 to 16 V, measured as deviation from 14 V ∆f −±0,1 dB

Input resistance

Output resistance

CONDITIONS

SYMBOL MIN. TYP. MAX. UNIT

5 TPL = −40 dB −30,7 −29,7 −28,7 dB 10 TPL = −30 dB −24,5 −23,5 −22,5 dB

1 TPL = −30 dB −20,1 −18,6 −17,1 dB 1 TPL = −20 dB −16,1 −14,1 −12,1 dB 5 TPL = −0dB −3,8 −2,3 −0,8 dB 5 TPL = −20 dB −19,1 −17,1 −15,1 dB 5 TPL = −40 dB −28,5 −26,5 −24,5 dB

8,5 − 14 V 0 − 4V

0 − 3,5 V

− 7 − V 6,3 7 7,7 V 10,8 − 14 V

−−40 µA

= 0 V −I

25-27

= V

25-27

24-27 24-27

25-27 25-27 25-27 25-27

∆f − ± 0,5 − dB

pin 26 R pin 28 R

pin 6 R pin 21 R

26-27 28-27

6-27 21-27

35 50 65 kΩ 35 50 65 kΩ

− 160 220 Ω

− 60 100 Ω

May 1992 6

Page 7

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

Notes to the characteristics

1. Operation with minimum of 12 dB headroom; system remains functional to 7 V.

2. Attenuation between pins 1 and 3 is 3,5 dB (MPX-filter). Playback input sensitivity is 45 mV if a switchable MPX-low pass filter is used in playback mode (pins 2 and 3 short-circuited).

3. System headroom is determined by the line output channel in use. For low supply voltages line output 2 (pin 6) will saturate at high signal levels. Headroom for line output 1 (pin 5) tracks with record output (pin 21).

4. The equation for REC/PB switch input voltage is: REC: V PB: V

5. The equation for C/B/OFF mode switch input voltage is: OFF: V B: 0,45 VCC< V B: 0,5 VCC(switch in open position), C: V

25-27

The voltage drop across the external time constant resistor must be taken in to account.

6. TPL is Test Point Level.

> 0,55 VCC− VBE+ 1,5 V,

24-27

< 0,45 VCC− VBE−1,5 V.

24-27

< 0,38 VCC− VBE− 1 V,

25-27

< 0,55 VCC(external voltage),

25-27

> 0,75 VCC− VBE+ 1 V.

May 1992 7

Fig.3 Mode switch input configuration.

Fig.4 REC/PB switch input configuration.

Page 8

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

Fig.5 Test circuit.

May 1992 8

Page 9

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

Fig.6 Supply current as a function of supply

voltage; ICC= f(VCC); no input signal.

Fig.7 Power supply ripple rejection measured at

REC OUT as a function of frequency; level at pin 15 = 100 mV (rms). RG= 10 kΩ; record mode; NR OFF.

Fig.8 Signal handling = f(VCC) measured at REC

OUT as function of the supply voltage; THD = 1%. Fig.9 Encoder frequency response for B-mode.

May 1992 9

Page 10

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

Fig.10 Encoder frequency response for C-mode.

Fig.11 Total harmonic distortion measured at REC

OUT as a function of frequency; for NR OFF mode; VCC= 14 V; LPF 80 kHz.

Fig.12 Total harmonic distortion measured at REC

OUT as a function of frequency; for B-mode; VCC= 14 V; LPF 80 kHz.

May 1992 10

Fig.13 Total harmonic distortion measured at REC

OUT as a function of frequency; for C-mode; VCC= 14 V; LPF 80 kHz.

Page 11

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

Fig.14 Total harmonic distortion as a function of

the record output level (pin 21); for C-mode; VCC= 14 V; LPF 80 kHz.

Fig.15 Crosstalk from record input (pin 26) to line

output as a function of frequency in playback mode; record input level is 50 mV; NR OFF; RG= 10 kΩ.

May 1992 11

Page 12

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

PACKAGE OUTLINES

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

seating plane

TEA0665

TEA0665T

SOT117-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

1 2

min.

max.

1.7

1.3

0.066

0.051

0.53

0.38

0.020

0.014

cD E weM

0.32

0.23

0.013

0.009

(1) (1)

36.0

35.0

1.41

1.34

14.1

13.7

0.56

0.54

(1)

3.9

3.4

15.80

15.24

0.62

0.60

17.15

15.90

0.68

0.63

0.252.54 15.24

0.010.10 0.60

0.15

0.13

max.

1.75.1 0.51 4.0

0.0670.20 0.020 0.16

OUTLINE VERSION

SOT117-1

May 1992 12

REFERENCES

IEC JEDEC EIAJ

051G05 MO-015AH

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17 95-01-14

Page 13

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

SO28: plastic small outline package; 28 leads; body width 7.5 mm

TEA0665

TEA0665T

SOT136-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

18.1

7.6

17.7

7.4

0.71

0.30

0.69

0.29

w M

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

0.043

0.016

1.1

0.4

ywv θ

0.9

0.4

0.035

0.004

0.016

0.25 0.1

0.01

(A )

detail X

1.1

0.25

1.0

0.043

0.01

0.039

OUTLINE

VERSION

SOT136-1

May 1992 13

REFERENCES

IEC JEDEC EIAJ

075E06 MS-013AE

EUROPEAN

PROJECTION

ISSUE DATE

91-08-13

95-01-24

Page 14

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

DIP

OLDERING BY DIPPING OR BY WAVE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TEA0665

TEA0665T

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

May 1992 14

Page 15

Philips Semiconductors Product speciﬁcation

Dolby B and C type noise reduction circuit

TEA0665

TEA0665T

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

May 1992 15