Datasheet TDA9880-V1, TDA9880T-V1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1998 Aug 12
File under Integrated Circuits, IC02

1999 Jul 21

INTEGRATED CIRCUITS

TDA9880

Alignment-freemultistandardvision
and FM sound IF-PLL demodulator

1999 Jul 21 2

Philips Semiconductors Product specification

Alignment-free multistandardvisionand
FM sound IF-PLL demodulator

TDA9880

FEATURES

• 5 V supply voltage

• Gain controlled wide-band Vision Intermediate

Frequency (VIF) amplifier (AC-coupled)

• True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics and
excellent pulse response)

• Fully integrated VIF Voltage Controlled Oscillator
(VCO), alignment-free

• Digital acquisition help, VIF frequencies of 38.0, 38.9,

45.75 and 58.75 MHz

• 4 MHz reference frequency input [signal from
Phase-Locked Loop (PLL) tuning system] or operating
as crystal oscillator

• VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector, fast reaction
time

• Precise fullydigital Automatic Frequency Control (AFC)
detector with 4-bit digital-to-analog converter

• Fully integrated sound carrier trap for 4.5, 5.5,

6.0 and 6.5 MHz, controlled by reference signal

• Alignment-freeselectiveFM-PLL demodulator with high
linearity and low noise

• Digital frequency control, sound carrier frequencies

4.5, 5.5, 6.0 and 6.5 MHz

• Stabilizer circuit for ripple rejection and to achieve
constant output signals

• Electrostatic discharge (ESD) protection for all pins.

GENERAL DESCRIPTION

The TDA9880(T) is an integrated circuit for multistandard
vision IF signal processing and FM demodulation in TV
and VTR sets.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA9880 SDIP20 plastic shrink dual in-line package; 20 leads (300 mil) SOT325-1
TDA9880T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1999 Jul 21 3

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage note 1 4.5 5 5.5 V

I

P

supply current 85 100 115 mA

V

i(sens)(VIF)(rms)

VIF input voltage sensitivity
(RMS value)

−1 dB video at output − 50 100 µV

G

VIF(cr)

VIF gain control range see Fig.4 65 69 − dB

f

VIF

VIF frequencies see Table 2 − 38.0 − MHz

− 38.9 − MHz

− 45.75 − MHz

− 58.75 − MHz

∆f

VIF

VIF frequency window of digital
acquisition help

referenced to f

VIF

−±2.38 − MHz

V

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

sound carrier off; see Fig.10 1.7 2.0 2.3 V
trap bypass mode;

see Fig.10

0.95 1.10 1.25 V

G

dif

differential gain

“NTC-7 Composite”

− 25%

ϕ

dif

differential phase

“NTC-7 Composite”

− 2 4 deg

B

v(−3dB)(trap)

−3 dB video bandwidth including
sound carrier trap

CL< 20 pF; RL>1kΩ;
AC load; note 2

f

trap

= 4.5 MHz

(M/N standard)

3.95 4.05 − MHz

f

trap

= 5.5 MHz

(B/G standard)

4.90 5.00 − MHz

α

SC1

trap attenuation at first sound carrier M/N standard 30 36 − dB

B/G standard 30 36 − dB

S/N

W

weighted signal-to-noise ratio of
video signal

see Fig.6; note 3 56 60 − dB

PSRR

13

power supply ripple rejection at
pin 13

f

ripple

= 70 Hz; video signal;

grey level; see Fig.9

25 28 − dB

B

v(−1dB)

−1 dB video bandwidth CL< 20 pF; RL>1kΩ;
AC load; trap bypass mode

56−MHz

I

ch(max)(20)

AGC maximum charge current at
pin 20

6810µA

I

dch(max)(20)

AGC maximum discharge current at
pin 20

7.5 10 12.5 µA

I

sink(14)

sink current of tuner AGC at pin 14 maximum tuner gain

reduction; V14=1V;
see Fig.4

450 600 750 µA

AFC

stps

AFC steepness ∆I19/∆f 0.85 1.05 1.25 µA/kHz

I

o(source)(19)

AFC output source current at pin 19 160 200 240 µA

I

o(sink)(19)

AFC output sink current at pin 19 160 200 240 µA

V

o(intc)(rms)

intercarrier output voltage
(RMS value)

; note 4

− 49 − mV

V

i(SC)

V

i(PC)

--------------

24 dB–=

1999 Jul 21 4

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Notes

1. Values of video and sound parameters can be decreased at VP= 4.5 V.

2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 13 to 18); H (s) is the absolute value of transfer function.

3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz
(M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with

“CCIR 567”

.

4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:

where:

= correction term for RMS value, = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB,

6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude
V

o(intc)(rms)

.

B

intc(−3dB)(ul)

upper limit −3 dB intercarrier
bandwidth

7.5 9 − MHz

V

o(AF)(8)(rms)

audio output signal voltage at pin 8
(RMS value)

25 kHz FM deviation;
75 µs de-emphasis

400 500 600 mV

THD

8

total harmonic distortion at pin 8 − 0.15 0.5 %

B

AF(−3dB)

−3 dB audio frequency bandwidth without de-emphasis;
dependent on loop filter at
pin 4

100 120 − kHz

S/N

W(AF)

weighted signal-to-noise ratio of
audio signal

black picture 50 56 − dB
white picture 45 51 − dB
6 kHz sine wave

(black-to-white modulation)

40 46 − dB

sound carrier
subharmonics;
f = 2.25 MHz ±3 kHz

35 40 − dB

α

AM(sup)

AM suppression of FM demodulator 75 µs de-emphasis;

AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation

40 46 − dB

PSRR

8

power supply ripple rejection at pin 8 f

ripple

= 70 Hz; see Fig.9 14 20 − dB

∆f

FM

frequency window of digital
acquisition help for FM demodulator

−±225 − kHz

f

ref(15)

frequency of reference signal at
pin 15

− 4.0 − MHz

V

ref(15)(rms)

amplitude of referencesignal source
at pin 15 (RMS value)

operation as input terminal 80 − 400 mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

o(intc)(rms)

1.1 V (p-p)

1

22

---------- -

× 10

V

iSC()

V

iPC()

---------------

dB()6 dB 3 dB±+

20

--------------------------------------------------------------- -

×=

1

22

---------- -

V

iSC()

V

iPC()

---------------

dB()

1999 Jul 21 5

Philips Semiconductors Product specification

Alignment-free multistandard vision and

FM sound IF-PLL demodulator

TDA9880

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BLOCK DIAGRAM

d

book, full pagewidth

MHB506

DIGITAL VCO CONTROL AFC DETECTOR

RC VCO

VIF-PLL

AGC

SUPPL Y

LOGIC

NARROW-BAND FM-PLL DETECTOR

SOUND TRAPS

4.5 to 6.5 MHz

TAGC

C

VAGC

VAGC

R

TOP

TOP

14 3 20 15 19 12

645710

911181617

1
2

13

8

external reference

or 4 MHz crystal

REF

AFC

TR

C

TR

trap disable

switch

CVBS

AUD

audio output

video output 2 V (p-p)

[1.1 V (p-p) without trap]

C

AFD

C

FAGC

FAGC

SIO

S1S0

VPLLVPGND

FMPLL DEEM AFD

C

DEEM

sound

intercarrier

output

VIF-PLL

filter

FM-PLL

filter

de-emphasis decoupling

VIF1
VIF2

TDA9880

Fig.1 Block diagram.

1999 Jul 21 6

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

PINNING

SYMBOL PIN DESCRIPTION

VIF1 1 VIF differential input 1
VIF2 2 VIF differential input 2
TOP 3 tuner AGC TakeOver Point (TOP)
FMPLL 4 FM-PLL filter
DEEM 5 de-emphasis capacitor
AFD 6 AF decoupling capacitor
FAGC 7 FM-PLL AGC capacitor
AUD 8 audio output
S0 9 switch input S0
S1 10 switch input S1

SIO 11 sound intercarrier output
TR 12 trap control
CVBS 13 video output
TAGC 14 tuner AGC output
REF 15 4 MHz crystal or reference input
GND 16 ground supply
V

P

17 supply voltage (+5 V)
VPLL 18 VIF-PLL filter
AFC 19 AFC output
VAGC 20 VIF-AGC capacitor

SYMBOL PIN DESCRIPTION

Fig.2 Pin configuration for SDIP20.

handbook, halfpage

VIF1
VIF2
TOP

FMPLL

DEEM

AFD

FAGC

AUD

S0
S1

VAGC
AFC
VPLL
V

P

REF
TAGC

GND

CVBS
TR
SIO

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

TDA9880

MHB072

Fig.3 Pin configuration for SO20.

handbook, halfpage

VIF1
VIF2
TOP

FMPLL

DEEM

AFD

FAGC

AUD

S0
S1

VAGC
AFC
VPLL
V

P

REF
TAGC

GND

CVBS
TR
SIO

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

TDA9880T

MHB106

1999 Jul 21 7

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

FUNCTIONAL DESCRIPTION

Figure 1 shows the simplified block diagram of the
integrated circuit. The integrated circuit comprises the
following functional blocks:

1. VIF amplifier

2. Tuner-AGC and VIF-AGC

3. VIF-AGC detector

4. Frequency Phase-Locked Loop (FPLL) detector

5. VCO and Travelling Wave Divider (TWD)

6. Digital acquisition help and AFC

7. Video demodulator and amplifier

8. Sound carrier trap

9. Intercarrier mixer

10. FM demodulator and acquisition help

11. Audio amplifier

12. Internal voltage stabilizer.

VIF amplifier

The VIF amplifier consists of three AC-coupled differential
amplifier stages. Each differential stage comprises a
feedback network controlled by emitter degeneration.

Tuner-AGC and VIF-AGC

The AGC capacitor voltage is converted to an internal VIF
gaincontrol signal, and is fedto the tuner AGC togenerate
the tuner AGC output current at pin TAGC (open-collector
output). The tuner AGC takeover point can be adjusted
with R

TOP

. This allows the tuner to be matchedto the SAW

filter in order to achieve the optimum IF input level.

VIF-AGC detector

The AGC detector generates the required VIF gain control
voltage for constant video output by charging or
discharging the AGC capacitor. Gain control is performed
by sync level detection. The newly developed AGC circuit
provides fast reaction time to cope with ‘aeroplane
fluttering’. The time constants for decreasing or increasing
gain are nearly equal.

Frequency Phase-Locked Loop (FPLL) detector

The VIF amplifier output signal is fed into a Frequency
Detector(FD) and into a PhaseDetector (PD) via a limiting
amplifier. During acquisition the frequency detector
produces a DC current proportional to the frequency
difference between the input and the VCO signal.

After frequency lock-in the phase detector produces a DC
current proportional to the phase difference between the
VCO and the input signal. The DC current of either the
frequency detector or the phase detector is converted into
aDCvoltagevia the VIF-PLL filter, which controls the VCO
frequency.

VCO and Travelling Wave Divider (TWD)

The Resistor Capacitor (RC) VCO operates as an
integrated relaxation oscillator atdouble the picture carrier
frequency.The control voltage required totunethe VCO to
actually double the picture carrier frequency is generated
by the FPLL detector and fed via the loop filter to the VCO
control input terminal.

The oscillator signal is divided-by-two with a TWD which
generatestwo differential output signals witha 90 degrees
phase difference independent of the frequency.

Digital acquisition help and AFC

The integrated relaxation oscillator has a very wide
frequency range from approximately 30 to 70 MHz (after
the TWD). To prevent false locking of the FPLL and with
respect to the catching range of the frequency detector of
maximum ±2.5 MHz, the Digital Acquisition Help (DAH)
provides current into the loop filter until the VCO is in a
frequency window of ±2.3 MHz around the wanted VIF
frequency. In this case the analog operating FPLL willlock
the VCO to the VIF carrier and the acquisition help does
not provide any current to the loop filter.

The principle of the digital acquisition help is as follows:
the VCO is connected to a downcounter, which is preset
depending on the required VIF frequency. The counting
time, as well as the counter control, is derived from a
4 MHz reference signal. This signal can be supplied from
the internal 4 MHz crystal oscillator or from the 4 MHz
reference oscillator of an external tuning system.
The counting result after a counting cycle corresponds to
the actual VCO frequency.

The digital AFC is also derived from the counting result
after a counting cycle by digital-to-analog converting the
last four bits of the counter.

Video demodulator and amplifier

The video demodulator is realized by a multiplier which is
designedforlowdistortionandlargebandwidth.Thevision
IF input signal is multiplied with the ‘in phase’ signal of the
travelling wave divider output.

1999 Jul 21 8

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics. The video signal of

1.1 V (p-p) for nominal vision IF modulation is fed
internally to the integrated sound carrier trap as well as to
the VIF-AGC detector. The second stage of the video
amplifier converts and amplifies the differential output
signal from the sound carrier trap to the single-ended
CVBS output signal at pin 13 with a 2 V (p-p) amplitude.

Noise clipping is provided. Furthermore the trap can be
bypassed by the implemented input switch of the second
amplifier stage, forced by connecting pin 12 to ground.

Sound carrier trap

The sound carrier trap consists of a reference filter, a
phase detector and the sound trap itself.

A sound carrier reference signal is fed into the reference
low-pass filter and is shifted by a nominal 90 degrees.
The phasedetectorcomparestheoriginalreferencesignal
with the signal shiftedby the reference filter and produces,
at the external capacitor CTR, a DC voltage by charging or
discharging the capacitor with a current proportional to the
phase difference between both signals, respectively to the
frequency error of the integrated filters. The DC voltage is
converted to currents which control the frequency position
of the reference filter and the sound trap.

The sound trap itselfis constructed of three separate traps
to realize sufficient suppression of the first and second
sound carrier. The right frequency position of the different
standards is set by the sound carrier reference signal.

Intercarrier mixer

The intercarrier mixer is realized by a multiplier, operating
inquadraturemodeforsuppressionoflowfrequencyvideo
signals. The VIF amplifier output signal is fed to the
intercarrier mixer and converted to an intercarrier
frequency by the regenerated 90 degree picture carrier
from the VCO. The mixer output signal is fed via a
band-pass filter and amplifier for attenuation of the high
frequency video signal components and carrier harmonics
to the output pin 11. The intercarrier signal is fed also to
the integrated FM demodulator.

FM demodulator and acquisition help

The FM demodulator is realized as a narrow-band PLL
with external loop filter, which provides the necessary
selectivity. To achieve good selectivity, a linear phase
detector and constant input level are required.
The intercarrier signal from the intercarrier mixer is fed via
a gain controlled amplifier to the phase detector and it’s
output signal controls (via the loop filter) the integrated
relaxation oscillator. The possible frequency range is from
4 to 7 MHz. As a result of locking the oscillator frequency
tracks with the FM modulation of the input signal;
therefore,theoscillator control voltage is superimposed by
the AF voltage. In this way the FM-PLL operates as an
FM demodulator. The AF voltage is present at the loop
filter and is fed via a buffer with 0 dB gain to the audio
amplifier.

The digital acquisition help operates in the same way as
described in Section “Digital acquisition help and AFC”.

Audio amplifier

The audio amplifier consists of two parts:

1. The AF preamplifier is an operational amplifier with
internal feedback, high gain and high common mode
rejection. The AF voltage from the PLL demodulator,
by principle a small output signal, is amplified by
30 dB. A DC operating point control circuit (pin 6)
decouples the AF amplifier from the DC voltage of the
PLL. The low-pass characteristic of the amplifier
reduces the harmonics of the intercarrier signal at the
sound output terminal. If required, a de-emphasis
network can be realized by the amplifier output
resistance and an external capacitor.

2. The AF output amplifier (10 dB) provides the required
output level by a rail-to-rail output stage. This amplifier
makes use of an input selector for switching to mute
state, automatically controlled by the mute switching
voltage from the digital acquisition help in order to
avoid lock-in noise. During normal operation the
automatic audio mute function is not active.
Application of a 2.2 kΩ resistor between the
intercarrier output (pin 11)and ground will activate the
automatic audio mute function.

Internal voltage stabilizer

The band gap circuit internally generates a voltage of
approximately 2.4 V, independent of the supply voltage
and the temperature. Avoltage regulator circuit, controlled
by this voltage, produces a constant voltage of 3.55 V
which is used as an internal reference voltage.

1999 Jul 21 9

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75 µH inductance.

2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage IP= 115 mA; T

amb

=70°C; at

maximum chip temperature of 125 °C

− 5.5 V

V

n

voltage at

pins 1 to 4, 6 to 10, 12 and 17 to 20 0 V

P

V

pin 14 0 13.2 V

t

sc

short-circuit time to ground or V

P

− 10 s

T

stg

storage temperature −25 +150 °C

T

amb

ambient temperature −20 +70 °C

V

es

electrostatic handling voltage for all
pins

note 1 −250 +250 V
note 2 −3000 +3000 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

TDA9880 (SDIP20) 85 K/W
TDA9880T (SO20) 85 K/W

1999 Jul 21 10

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

CHARACTERISTICS

VP=5V; T

amb

=25°C; see Table 2 for input frequencies; M standard (fPC= 45.75 MHz; fSC= 41.25 MHz;

PC/SC = 10 dB) is used for specification; V

i(VIF)(rms)

= 10 mV (sync level); IF input from 50 Ω via broadband transformer

1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with

“NTC-7 Composite”

; measurements

taken in test circuit of Fig.19; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin 17)

V

P

supply voltage note 1 4.5 5 5.5 V

I

P

supply current 85 100 115 mA

P

tot

total power dissipation − 500 633 mW

VIF amplifier (pins 1 and 2)

V

i(sens)(VIF)(rms)

VIF input voltage sensitivity
(RMS value)

−1 dB video at output − 50 100 µV

V

i(max)(rms)

maximum input signal voltage
(RMS value)

1 dB video at output;
note 2

110 −−mV

∆V

int

internal IF amplitudedifference
between picture and sound
carrier

within AGC range;

∆f = 4.5 MHz

− 0.7 1 dB

G

VIF(cr)

VIF gain control range see Fig.4 65 69 − dB

B

VIF(−3dB)(ll)

lower limit −3 dB VIF
bandwidth

− 15 25 MHz

B

VIF(−3dB)(ul)

upper limit −3 dB VIF
bandwidth

70 100 − MHz

R

i(dif)

differential input resistance note 3 1.7 2.2 2.7 kΩ

C

i(dif)

differential input capacitance note 3 1.2 1.7 2.5 pF

V

I

DC input voltage − 3.35 − V
FPLL and true synchronous video demodulator; note 4
f

VCO(max)

maximum oscillator frequency

for carrier regeneration

f=2f

PC

120 140 − MHz

f

VIF

vision carrier operating

frequencies

see Table 2 − 38.0 − MHz

− 38.9 − MHz

− 45.75 − MHz

− 58.75 − MHz

∆f

VIF

VIFfrequency window of digital

acquisition help

referenced to f

VIF

−±2.38 − MHz

t

acq

acquisition time BL = 70 kHz; note 5 −−30 ms
V

i(sens)(VIF)(rms)

VIF input voltage sensitivity at

pins 1 and 2 (RMS value)

for PLL to be locked maximum IF gain − 30 70 µV

for C/N = 10 dB notes 6 and 7 − 100 140 µV
SIGNAL AT PIN 18
I

o(source)(PD)(max)

maximum source current of
phase detector output

− 17 −µA

1999 Jul 21 11

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

I

o(sink)(PD)(max)

maximum sink current of
phase detector output

− 17 −µA

I

o(source)(DAH)

output source current of digital
acquisition help

− 23 −µA

I

o(sink)(DAH)

output sink current of digital
acquisition help

− 23 −µA

t

W(min)(DAH)

minimum pulse width of digital
acquisition help current

− 64 −µs

K

O(VIF)

VCO steepness ∆f

VIF

/∆V

18

− 20 − MHz/V

K

D(VIF)

phase detector steepness
∆I18/∆ϕ

VIF

− 23 −µA/rad

Video output signal and sound carrier trap (pin 13; sound carrier off)

V

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

see Fig.10 1.7 2.0 2.3 V

V

sync

sync pulse voltage level see Fig.10 1.15 1.35 1.55 V

V

zc

zero carrier voltage level see Fig.10 3.27 3.57 3.87 V

V

v(clu)

upper video clipping voltage
level

VP− 1.1 VP− 1 − V

V

v(cll)

lower video clipping voltage
level

− 0.7 1.0 V

R

o

output resistance note 3 −−30 Ω

I

bias(int)

internal DC bias current for
emitter-follower

2.0 2.5 − mA

I

o(source)(max)

maximum AC and DC output
source current

2.4 −−mA

I

o(sink)(max)

maximum AC and DC output
sink current

1.4 −−mA

∆V

o

deviation of CVBS output
signal voltage

50 dB gain control −−0.5 dB
30 dB gain control −−0.1 dB

∆V

o(bl)

black level tilt −−1%

G

dif

differential gain

“NTC-7 Composite”

− 25%

ϕ

dif

differential phase

“NTC-7 Composite”

− 2 4 deg

B

v(−3dB)(trap)

−3 dB video bandwidth
including sound carrier trap

CL< 20 pF; RL>1kΩ;
AC load; note 8

f

trap

= 4.5 MHz

(M/N standard)

3.95 4.05 − MHz

f

trap

= 5.5 MHz

(B/G standard)

4.90 5.00 − MHz

f

trap

= 6.0 MHz

(I standard)

5.2 5.50 − MHz

f

trap

= 6.5 MHz

(D/K standard)

5.5 5.95 − MHz

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 12

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

α

SC1

trap attenuation at first sound
carrier

M/N standard 30 36 − dB
B/G standard 30 36 − dB
I standard 26 32 − dB
D/K standard 26 32 − dB

α

SC1(60 kHz)

trap attenuation at first sound
carrier f

SC1

±60 kHz

M/N standard 21 27 − dB
B/G standard 24 30 − dB
I standard 20 26 − dB
D/K standard 20 26 − dB

α

SC2

trap attenuation at second
sound carrier

M/N standard 21 27 − dB
B/G standard 21 27 − dB
I standard 12 18 − dB
D/K standard 18 24 − dB

α

SC2(60 kHz)

trap attenuation at second
sound carrier f

SC2

±60 kHz

M/N standard 15 21 − dB
B/G standard 15 21 − dB
I standard 10 15 − dB
D/K standard 13 18 − dB

t

d(g)(CC)

group delay at chrominance
carrier frequency

3.58 MHz at
M/N standard

110 180 250 ns

4.43 MHz at B/G standard 110 180 250 ns

4.43 MHz at I standard − 90 160 ns

4.28 MHz at D/K standard − 60 130 ns

S/N

W

weighted signal-to-noise ratio weighted in accordance

with

“CCIR 567”

;

see Fig.6; note 9

56 60 − dB

S/N

UW

unweighted signal-to-noise
ratio

note 9 47 51 − dB

αd

blue

intermodulation attenuation at
‘blue’

f = 0.92 MHz; see Fig.7;
note 10

58 64 − dB

f = 2.76 MHz; see Fig.7;
note 10

58 64 − dB

αd

yellow

intermodulation attenuation at
‘yellow’

f = 0.92 MHz; see Fig.7;
note 10

60 66 − dB

f = 2.76 MHz; see Fig.7;
note 10

59 65 − dB

∆V

r(vc)(rms)

residual vision carrier
(RMS value)

fundamental wave and
harmonics

− 25mV

α

H(sup)

harmonics suppression in
video signal

CL< 20 pF; RL>1kΩ;
AC load; note 11a

35 40 − dB

α

H(spur)

spuriouselements suppression
in video signal

note 11b 40 −−dB

PSRR

13

powersupply ripple rejectionat
pin 13

f

ripple

= 70 Hz; video
signal; grey level;
see Fig.9

25 28 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 13

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Video output signal (pin 13; trap bypass mode; V12< 0.8 V; sound carrier off); see Fig.10; note 12
V

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

see Fig.10 0.95 1.10 1.25 V

V

sync

sync pulse voltage level 1.4 1.5 1.6 V

V

zc

zero carrier voltage level 2.57 2.72 2.87 V

V

v(clu)

upper video clipping voltage
level

3.1 3.25 − V

V

v(cll)

lower video clipping voltage
level

− 1.15 1.3 V

B

v(−1dB)

−1 dB video bandwidth CL< 20 pF; RL>1kΩ;
AC load

56−MHz

B

v(−3dB)

−3 dB video bandwidth CL< 20 pF; RL>1kΩ;
AC load

78−MHz

S/N

W

weighted signal-to-noise ratio weighted in accordance

with

“CCIR 567”

;

see Fig.6; note 9

56 60 − dB

S/N

UW

unweighted signal-to-noise
ratio

note 9 49 53 − dB

Trap control (pin 12)

I

o(source)(max)

maximum output source
current

5913µA

I

o(sink)(max)

maximum output sink current 9 13 17 µA

K

D(trap)

frequency detector steepness
∆I12/∆f

trap

f

trap

= 4.5 MHz

(M/N standard)

−−8−µA/MHz

f

trap

= 6.5 MHz

(D/K standard)

−−5.5 −µA/MHz

V

12

operating voltage range of trap
frequency control at pin 12

1.5 − 3.5 V

I

L(12)

leakage current at pin 12 ∆f

trap

< ±25 kHz −−±80 nA

CR

stps

control steepness ∆f

trap

/∆V

12

f

trap

= 4.5 MHz

(M/N standard)

− 4.5 − MHz/V

f

trap

= 6.5 MHz

(D/K standard)

− 9 − MHz/V

V

sw

switching voltage trap bypass mode active −−0.8 V

I

source

source current trap bypass mode active;

V12≤ 0.8 V

− 185 −µA

VIF-AGC detector (pin 20)

I

ch(max)(20)

maximum charge current 6 8 10 µA

I

dch(max)(20)

maximum discharge current 7.5 10 12.5 µA

t

res(inc)

AGC response time to an
increasing VIF step

6 dB; note 13 − 2.0 − ms
20 dB; note 13 − 2.5 − ms
40 dB; note 13 − 4.0 − ms

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 14

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

t

res(dec)

AGC response time to a
decreasing VIF step

−6 dB; note 13 − 1.0 − ms

−20 dB; note 13 − 1.5 − ms

−40 dB; note 13 − 2.5 − ms

V

20

gain control voltage range at
pin 20

1.7 − 3.6 V

CR

stps

control steepness ∆GIF/∆V

20

V20= 2.2 to 3.2 V −−40 − dB/V

Tuner AGC (pin 14); see Figs 4 and 5
V

i(VIF)(min)(rms)

VIF input signal voltage for
minimumstarting point of tuner
takeover at pins 1 and 2
(RMS value)

R

TOP

=22kΩ;

I14= 120 µA

− 25mV

V

i(VIF)(max)(rms)

VIF input signal voltage for
maximum starting point of
tuner takeover at pins 1 and 2
(RMS value)

R

TOP

=0Ω; I14= 120 µA45 90 − mV

QV

i(VIF)(rms)

tuner takeover point accuracy
(RMS value)

R

TOP

=12kΩ;

I14= 120 µA

5 1020mV

V

o

permissible output voltage from external source −−13.2 V

V

sat

saturation voltage I14= 450 µA −−0.2 V

V

i(VIF)(rms)

/∆T variation of takeover point with

temperature

I14= 120 µA − 0.03 0.07 dB/K

I

sink

sink current no tuner gain reduction;

see Fig.4

V

14

=12V −−0.75 µA

V

14

= 13.2 V −−1.5 µA

maximum tuner gain
reduction; V

14

=1V;

see Fig.4

450 600 750 µA

∆G

IF

IF slip by automatic gain
control

tuner gain current from
20% to 80%

− 58dB

AFC circuit (pin 19); notes 14 and 15
AFC

stps

AFC steepness ∆I19/∆f

VIF

0.85 1.05 1.25 µA/kHz

Qf

VIF

accuracy of AFC circuit I

o(19)

= 0; f15= 4.0 MHz −20 − +20 kHz

V

sat(ul)

upper limit saturation voltage see Fig.8 VP− 0.6 VP− 0.3 − V

V

sat(ll)

lower limit saturation voltage see Fig.8 − 0.3 0.6 V

I

o(source)

output source current 160 200 240 µA

I

o(sink)

output sink current 160 200 240 µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 15

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Intercarrier mixer (pin 11)

V

o(intc)(rms)

intercarrier output voltage
(RMS value)

; note 16

− 49 − mV

B

intc(−3dB)(ul)

upper limit −3 dB intercarrier
bandwidth

7.5 9 − MHz

∆V

r(SC)(rms)

residual sound carrier
(RMS value)

fundamental wave and
harmonics

− 2 − mV

R

o

output resistance note 3 −−70 Ω

V

O

DC output voltage 1.85 2.05 2.35 V

I

bias(int)

internal DC bias current for
emitter-follower

0.9 1.15 − mA

I

o(source)(max)

maximum AC output source
current

note 17 0.6 0.8 − mA

I

o(sink)(max)

maximum AC output sink
current

note 17 0.6 0.8 − mA

I

O(source)

DC output source current automatic audio mute

function activated;
note 17

0.75 0.93 1.20 mA

FM-PLL demodulator; notes 15 and 18 to 21
f

intc

sound intercarrier operating
frequencies

see Table 2 − 4.5 − MHz

− 5.5 − MHz

− 6.0 − MHz

− 6.5 − MHz

∆f

FM

frequency window of digital
acquisition help for
FM demodulator

−±225 − kHz

V

FM(rms)

IF intercarrier level for gain
controlled operation of FM-PLL
(RMS value)

corresponding PC/SC
ratio at input pins 1 and 2
is 7to40dB

6 − 320 mV

V

FM(lock)(rms)

IF intercarrier level for lock-in
of PLL (RMS value)

−−3mV

G

FM

IF intercarrier gain control
range

30 34 − dB

SIGNAL AT PIN 7
V

7

gain control voltage range at
pin 7

1.5 − 3.5 V

I

ch(max)(7)

maximum charge current 1.5 2.2 2.9 µA

I

dch(max)(7)

maximum discharge current 1.5 2.2 2.9 µA

CR

stps

control steepness ∆GFM/∆V

7

V7= 2.2 to 2.7 V −−30 − dB/V

SIGNAL AT PIN 8
V

o(AF)(rms)

audio output signal voltage
(RMS value)

25 kHz FM deviation 400 500 600 mV
27 kHz FM deviation 432 540 648 mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

i(SC)

V

i(PC)

--------------

24 dB–=

1999 Jul 21 16

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

V

o(AF)(cl)(rms)

audio output clipping signal
voltage level (RMS value)

THD < 1.5% 1.3 1.4 − V

THD total harmonic distortion − 0.15 0.5 %
∆V

o(AF)

/∆T temperature drift of AF output

signal voltage

− 3 × 10−37 × 10−3dB/K

∆f

AF

audio frequency deviation THD < 1.5%; note 22 −−±55 kHz

B

AF(−3dB)

−3 dB audio frequency

bandwidth

without de-emphasis;
dependent on loop filter at
pin 4; measured in
accordance with Fig.19

80 100 − kHz

S/N

W

weighted signal-to-noise ratio
of audio signal

black picture 50 56 − dB
white picture 45 51 − dB
6 kHz sine wave

(black-to-white
modulation)

40 46 − dB

sound carrier
subharmonics;
f = 2.25 MHz ±3 kHz

35 40 − dB

∆V

r(SC)(rms)

residual sound carrier
(RMS value)

fundamental wave and
harmonics; without
de-emphasis

−−2mV

α

AM(sup)

AM suppression of
FM demodulator

75 µs de-emphasis;
AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation

40 46 − dB

PSRR

8

powersupply ripple rejectionat
pin 8

f

ripple

= 70 Hz; see Fig.9 14 20 − dB

SIGNAL AT PIN 4
I

o(source)(PD)(max)

maximum phase detector
output source current

− 86 −µA

I

o(sink)(PD)(max)

maximum phase detector
output sink current

− 80 −µA

I

o(source)(DAH)

output source current of digital
acquisition help

− 110 −µA

I

o(sink)(DAH)

output sink current of digital
acquisition help

− 110 −µA

t

W(DAH)

pulse width of digital
acquisition help current

− 16 −µs

T

cy(DAH)

cycle time of digital acquisition
help

− 64 −µs

K

O(FM)

VCO steepness ∆fFM/∆V

4

− 3.3 − MHz/V

K

D(FM)

phase detector steepness
∆I4/∆ϕ

FM

− 9 −µA/rad

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 17

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Audio amplifier (pins 5, 6 and 8)

R

o(5)

output resistance at pin 5 note 23 4.4 5.0 5.6 kΩ

V

AF(5)(rms)

audio signal (RMS value) at
pin 5

− 170 − mV

V

O(5)

DC output voltage at pin 5 − 2.37 − V

R

o(8)

output resistance at pin 8 note 3 −−200 Ω

V

O(8)

DC output voltage at pin 8 − 2.37 − V

I

o(source)(max)(8)

maximum AC and DC output
source current at pin 8

−−0.5 mA

I

o(sink)(max)(8)

maximum AC and DC output
sink current at pin 8

−−0.5 mA

V

6

DC decoupling voltage at pin 6 dependent on intercarrier

frequency f

FM

1.5 − 3.3 V

I

L(6)

leakage current at pin 6 ∆V

O(8)

< ±50 mV −−±25 nA

I

ch(max)(6)

maximum charge current at
pin 6

1.15 1.5 1.85 µA

I

dch(max)(6)

maximum discharge current at
pin 6

1.15 1.5 1.85 µA

B

AF(−3dB)

−3 dB audio frequency

bandwidth of audio amplifier

upper limit 150 −−kHz
lower limit; note 24 −−20 Hz

α

mute(8)

mute attenuation of AF signal
at pin 8

note 17 70 75 − dB

∆V

8

DC jump voltage at pin 8 for
switching AF output to mute
state and vice versa

activated by digital
acquisition help; note 17

−±50 ±150 mV

Standard switch (pins 9 and 10); see Table 2
V

i

input voltage pin open-circuit;

I

i(9,10)

< 0.1 µA

2.8 3.0 3.6 V

for LOW 0 − 0.8 V
for MID 1.3 1.8 2.3 V
for HIGH 2.8 − V

P

V

I

i(source)

input source current V

i(9,10)

= 0 V 87 105 122 µA

V

i(9,10)

=1.8V 333945µA
Reference input (pin 15); note 25
V

I

DC input voltage 2.3 2.6 2.9 V

R

i

input resistance 2.5 3.0 3.5 kΩ

R

xtal

resonance resistance of crystal operation as crystal

oscillator

−−200 Ω

C

x

pull-up/down capacitance note 26 −−−pF

f

ref

frequency of reference signal − 4.0 − MHz

∆f

ref

tolerance of reference
frequency

note 15 −−±0.1 %

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jul 21 18

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Notes

1. Values of video and sound parameters can be decreased at VP= 4.5 V.

2. This parameter is tested with 110 mV to ensure maximum input level.

3. Thisparameter is not tested during production andisonly given as application information for designingthetelevision
receiver.

4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range).
Calculation of the VIF-PLL filter can be done by use of the following formulae:

, valid for d ≥ 1.2

,
where:
K

O

= VCO steepness or ; KD= phase detector steepness ;

R = loop resistor; C = loop capacitor; BL

−3dB

= loop bandwidth for −3 dB; d = damping factor.

5. V

i(VIF)(rms)

= 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video

modulation.

6. V

i(VIF)

signal for nominal video signal.

7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level,
RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video
modulation.

8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 13 to 18); H (s) is the absolute value of transfer function.

9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13).
B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard).

10. The intermodulation figures are defined:

; αd

0.92

value at 0.92 MHz referenced to black or white signal;

; αd

2.76

value at 2.76 MHz referenced to chrominance carrier.

11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz.
a) Modulation Vestigial Side-Band (VSB); sound carrier off; f

video

> 0.5 MHz.

b) Sound carrier on; f

video

= 10 kHz to 10 MHz.

12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video
spectrum appears at pin 13. The amplitude is 1.1 V (p-p).

13. Response time valid for a VIF input level range of 200 µVto70mV.

V

ref(rms)

amplitude of reference signal
source (RMS value)

operation as input
terminal

80 − 400 mV

R

o(ref)

output resistance of reference
source

−−4.7 kΩ

C

K

decoupling capacitance to
external reference source

operation as input
terminal

22 100 − pF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

BL

3 dB–

1

2π

------ -

K

OKD

R=

d

1
2

-- -

RKOKDC=

rad

V

--------





2π

Hz

V

------ -





µA

rad

--------





αd

0.92

20

V

0

at 3.58 MHz

V

0

at 0.92 MHz

---------------------------------------





3.6 dB+log=

αd

2.76

20

V

0

at 3.58 MHz

V

0

at 2.76 MHz

---------------------------------------





log=

1999 Jul 21 19

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is
given in Fig.8. The AFC steepness can be changed by resistors R1 and R2.

15. Thetoleranceof the reference frequency determines theaccuracyof the VIF AFC, FM demodulator centrefrequency
and maximum FM deviation.

16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:

where:

= correction term for RMS value, = sound-to-picture carrier ratio at VIF input(pins 1 and 2) in dB,

6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude
V

o(intc)(rms)

.

17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active.
By connecting a 2.2 kΩ resistor between pin 11 and ground the automatic audio mute function will be activated.
With this application also the series capacitor C

S

of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF.

18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae:

The formulae are only valid under the following conditions:
ϑ≤1 and C

S

>5C

P

where:
K

O

= VCO steepness or ; KD= phase detector steepness ;

R

S

= loop resistor; CS= series capacitor; CP= parallel capacitor; fo= natural frequency of PLL;

BL

−3dB

= loop bandwidth for −3 dB; ϑ = damping factor. For examples see Table 1.

19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white
jump of less than 0.5 degrees.

20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB).
Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) V

i(VIF)(rms)

= 10 mV (sync

level), 25 kHz FM deviation for sound carrier, fAF= 400 Hz. Measurement in accordance with

“CCIR 468-4”

.

De-emphasis = 75 µs.

21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC
ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values.

22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using Rx=20kΩ the
AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the
AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to
100 kHz an attenuation of 6 dB is recommended.

23. C

DEEM

= 10 nF results in τ =50µs and C

DEEM

= 15 nF results in τ =75µs.

V

o(intc)(rms)

1.1 V (p-p)

1

22

---------- -

× 10

V

iSC()

V

iPC()

---------------

dB()6 dB 3 dB±+

20

--------------------------------------------------------------- -

×=

1

22

---------- -

V

iSC()

V

iPC()

---------------

dB()

f

o

1

2π

------ -

K

OKD

C

P

---------------=

ϑ

1

2R K

OKDCP

------------------------------------

=

BL

3 dB–

fo1.55 ϑ2–()=

rad

V

--------





2π

Hz

V

------ -





µA

rad

--------





1999 Jul 21 20

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of C

AFD

= 470 nF leads to

f

AF(−3 dB)

≈ 20 Hz and C

AFD

= 220 nF leads to f

AF(−3 dB)

≈ 40 Hz.

25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external
reference signal, e.g. from the tuning system.

26. The value of Cxdetermines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal
used.

Table 1 Examples to note 18 of Chapter “Characteristics”

Table 2 Standard switch settings

BL

−3dB

(kHz) CS (nF) CP (pF) R (kΩ) ϑ

100 33 820 2.7 0.5
160 33 330 3.9 0.5

S0 S1 f

VIF

(MHz) f

intc

(MHz) STANDARD REMARK

LOW LOW 38.9 5.5 B/G Europe
LOW MID 38.9 6.5 D/K
LOW HIGH 38.9 6.0 I United Kingdom

MID LOW 38.0 5.5 B/G
MID MID 38.0 6.0 I

MID HIGH 38.0 6.5 D/K
HIGH LOW 45.75 4.5 M/N USA
HIGH MID 38.0 4.5 M
HIGH HIGH 58.75 4.5 M Japan

1999 Jul 21 21

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.4 Typical VIF and tuner AGC characteristic.

(1) VIF AGC voltage.
(2) I

tuner

; R

TOP

=22kΩ.

(3) I

tuner

; R

TOP

=12kΩ.

(4) I

tuner

; R

TOP

=0Ω.

handbook, halfpage

30 50 110

3

2

1

4

0

300

600

200

500

100

400

MHB158

70 90

V

i(VIF)

(dB/µV)

V

20

(V)

I

14

(µA)

(2) (3) (4)(1)

Fig.5 Typical tuner takeoverpoint as a function of

R

TOP

.

handbook, halfpage

024

120

60

70

100

90

80

MHB159

12820416

V

i(VIF)

(dB/µV)

R

TOP

(kΩ)

Fig.6 Typical signal-to-noise ratio as a function of

VIF input voltage.

handbook, halfpage

0

30 50 110

70

30

60

20

50

10

40

MHB160

70 90

V

i(VIF)

(dB/µV)

S/N

(dB)

Fig.7 Input signal conditions.

SC = sound carrier, with respect to sync level.
CC = chrominance carrier, with respect to sync level.
PC = picture carrier, with respect to sync level.
The sound carrier levels are taking into account a sound shelf

attenuation of 20 dB (SAW filter M1963M).

handbook, halfpage

SC CC PC SC CC PC

BLUE YELLOW

21 dB

13.2 dB

3.2 dB

21 dB

13.2 dB

10 dB

MHA739

1999 Jul 21 22

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.8 Measurement conditions and typical AFC characteristic.

handbook, full pagewidth

TDA9880

19

R1
22 kΩ

R2
22 kΩ

V

P

I

19

−200

−100

0

100

200

I

19

(µA)

V

19

(V)

43 48

5

0

1

MHB075

2

3

4

44 45 46

45.94

45.56

45.75

47

f (MHz)

lock range without SAW filter

Fig.9 Ripple rejection condition.

handbook, full pagewidth

TDA9880

VP = 5 V

VP = 5 V

t

100 mV

(f

ripple

= 70 Hz)

MHB076

1999 Jul 21 23

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.10 Typical video signal levels on output pin 13 (sound carrier off).

handbook, full pagewidth

1.35 V

1.95 V

3.35 V

white level

3.57 V

1.5 V

2.72 V

2.6 V

1.83 V

zero carrier level

black level

sync level

MHB163

trap bypass mode
normal mode

Conditions: 25 kHz FM deviation; 75 µs de-emphasis.
(1) Signal.
(2) Noise at H-picture.
(3) Noise at black picture.

Fig.0 Audio S/N as a function of picture-to-sound carrier ratio.

handbook, full pagewidth

4

10

0

−70
49 46 43 40 1337 10 728 2225 193134 16

MHB164

−50

−30

−20

−10

−40

−60

audio

S/N

(dB)

(1)

(2)

(3)

gain controlled operation of FM-PLL

PC/SC ratio at pins 1 and 2 (dB)

1999 Jul 21 24

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.12 Front-end level diagram.

(1) Depends on TOP.

handbook, full pagewidth

video 1.1 V (p-p)

0.66 × 10

−3

0.66 × 10

−5

MHB079

20

40

60

80

100

antenna input

(dBµV)

120

10

VHF/UHF tuner VIF

VIF amplifier, demodulator

and video

tuner SAW filter

TDA9880

IF signals

RMS value

(V)

10

−1

10

−2

(TOP)

10

−3

10

−4

10

−5

1

(1)

SAW insertion

loss 14 dB

SAW insertion

loss 14 dB

tuner gain

control range

40 dB

RF gain

70 dB

VIF AGC

IF slip

6 dB

1999 Jul 21 25

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.13 Typical amplitude response for sound trap at M/N standard (including Korea).

handbook, full pagewidth

MHB166

−40
2 2.5 3 3.5 4 4.5 5

−30

−20

−10

0

10

f (MHz)

H (s)

(dB)

minimum
requirements

Remark: overall delay is not shown, here the maximum ripple is specified.

Fig.14 Typical group delay for sound trap at M/N standard.

handbook, full pagewidth

MHB167

−100
0 0.5 1.5 2 31 2.5 3.5 4

0

100

200

300

400

f (MHz)

group

delay

(ns)

ideal characteristic

due to pre-correction

in the transmitter

minimum
requirements

1999 Jul 21 26

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.15 Typical amplitude response for sound trap at B/G standard.

handbook, full pagewidth

MHB168

−40
4 4.5 5 5.5 6 6.5 7

−30

−20

−10

0

10

f (MHz)

H (s)

(dB)

minimum
requirements

Fig.16 Typical group delay for sound trap at B/G standard.

Remark: Overall delay is not shown, here the maximum ripple is specified.

handbook, full pagewidth

MHB169

−100
0 0.5 1.5 2 31 2.5 3.5 4 4.5 5

0

100

200

300

400

f (MHz)

group

delay

(ns)

ideal characteristic

due to pre-correction

in the transmitter

minimum
requirements

1999 Jul 21 27

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.17 Typical amplitude response for sound trap at I standard.

handbook, full pagewidth

MHB170

−40
4 4.5 5 5.5 6 6.5 7

−30

−20

−10

0

10

f (MHz)

H (s)

(dB)

minimum
requirements

Fig.18 Typical amplitude response for sound trap at D/K standard.

handbook, full pagewidth

MHB171

−40
4 4.5 5 5.5 6 6.5 7

−30

−20

−10

0

10

f (MHz)

H (s)

(dB)

minimum
requirements

1999 Jul 21 28

Philips Semiconductors Product specification

Alignment-free multistandard vision and

FM sound IF-PLL demodulator

TDA9880

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

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TEST CIRCUIT

handbook, full pagewidth

MHB162

13 72456

1819 1417 16 15

8910

13 12 11

sound

intercarrier

output

AFC

output

(1)

VIF-PLL

filter

V

P

f

ref

4 MHz

20

470 nF

C

P

820

pF

C

DEEM
15 nF

C

FAGC

100 nF

22 kΩ

(4)

VIF1 VIF2 TOP FMPLL

VAGC AFC VPLL

V

P

GND REF

DEEM AFD FAGC AUD S0 S1

100

nF

TAGC
output

CVBS
output

10
nF

TAGC CVBS TR SIO

R

S

2.7 kΩ

C

S

33 nF

R

x

R

TOP

FM-PLL

filter

(2)

1.5
kΩ

22
kΩ

22 kΩ

2.2
kΩ

3.3
MΩ

R
150 Ω

C
220 nF

C

x

(3)

C

TR

470

nF

C

VAGC

10 nF

47
kΩ

logicaudio

output

TDA9880

50

Ω

1

: 1

IF

input

LM

H

47
kΩ

LM

H

10 nF

bypass

auto
mute

Fig.19 Test circuit.

(1) See note 4 of Chapter “Characteristics”.
(2) See notes 17 and 18 of Chapter “Characteristics”.
(3) See note 26 of Chapter “Characteristics”.
(4) See note 22 of Chapter “Characteristics”.

1999 Jul 21 29

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

INTERNAL PIN CONFIGURATIONS

Fig.20 Pin 1 (VIF1) and pin 2 (VIF2).

handbook, halfpage

MHB087

1

+

2

+

1.1 kΩ 5 kΩ

1.1 kΩ

2.65 V

3.55 V

Fig.21 Pin 3 (TOP).

handbook, halfpage

MHB088

3

+

20 kΩ

30 kΩ

9 kΩ

1.9 V

3.55 V

Fig.22 Pin 4 (FMPLL).

handbook, halfpage

MHB089

4

+

maximum 100 µA

maximum 100 µA

Fig.23 Pin 5 (DEEM).

andbook, halfpage

MHB090

5

+

240 µA

5.0 kΩ

1999 Jul 21 30

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.24 Pin 6 (AFD).

handbook, halfpage

+

maximum 1.5 µA

maximum 1.5 µA

MHB091

6

+

Fig.25 Pin 7 (FAGC).

handbook, halfpage

1.5 V

maximum

2.2 µA

2 kΩ

maximum 2.2 µA

MHB092

7

+

Fig.26 Pin 8 (AUD).

handbook, halfpage

MHB093

8

+

++

600 µA

15 kΩ

10 pF

Fig.27 Pin 9 (S0).

handbook, halfpage

3.55 V

27 kΩ

MHB094

9

+

Fig.28 Pin 10 (S1).

handbook, halfpage

3.55 V

27 kΩ

MHB095

10

+

Fig.29 Pin 11 (SIO).

handbook, halfpage

14.7 kΩ

MHB096

11

1.2 mA

+

1999 Jul 21 31

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.30 Pin 12 (TR).

handbook, halfpage

MHB165

12

+

maximum 13 µA

maximum 9 µA

maximum 150 µA

1 kΩ

500 Ω

1.1 V

Fig.31 Pin 13 (CVBS).

handbook, halfpage

7 kΩ10 kΩ

MHB098

13

2.5 mA

+

+

Fig.32 Pin 14 (TAGC).

handbook, halfpage

MHB099

14

maximum

600 µA

Fig.33 Pin 15 (REF).

handbook, halfpage

3 kΩ

MHB100

15

200 µA

+

Fig.34 Pin 16 (GND).

handbook, halfpage

MHB101

16GND

Fig.35 Pin 17 (VP).

handbook, halfpage

MHB102

17

+

1999 Jul 21 32

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.36 Pin 18 (VPLL).

handbook, halfpage

+

MHB103

18

+

maximum

15 µA

25 kΩ

VCO

maximum

5 µA

Fig.37 Pin 19 (AFC).

handbook, halfpage

1 kΩ

MHB104

19

+

1 kΩ

maximum 200 µA

Fig.38 Pin 20 (VAGC).

handbook, halfpage

MHB105

20

+

maximum 10 µA

maximum 8 µA

1999 Jul 21 33

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

PACKAGE OUTLINES

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT325-1

92-10-13
95-02-04

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

20

1

11

10

E

pin 1 index

b

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

UNIT

A

max.

12

b

1

(1) (1)

(1)

cD E e M

Z

H

L

mm

DIMENSIONS (mm are the original dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.3

1.0

0.53

0.38

0.32

0.20

19.50

18.55

6.48

6.14

3.2

2.8

0.181.778 7.62

8.25

7.80

10.0

8.3

1.94.2 0.51 3.2

SDIP20: plastic shrink dual in-line package; 20 leads (300 mil)

SOT325-1

1999 Jul 21 34

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1999 Jul 21 35

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

SOLDERING
Introduction

Thistextgivesa very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surfacemount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing,stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides,the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Jul 21 36

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

MOUNTING PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

(2)

− suitable

Surface mount BGA, SQFP not suitable suitable −

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

suitable −

PLCC

(4)

, SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended

(4)(5)

suitable −

SSOP, TSSOP, VSO not recommended

(6)

suitable −

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Jul 21 37

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

NOTES

1999 Jul 21 38

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

NOTES

1999 Jul 21 39

Philips Semiconductors Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

NOTES

© Philips Electronics N.V.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

67

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

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Middle East: see Italy

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Printed in The Netherlands 545004/03/pp40 Date of release: 1999 Jul 21 Document order number: 9397 750 05318