C12.2 µFelectrolytic63 V
C2220 nFfoil
C32.2 µFelectrolytic63 V
C4220 nFfoil
C52.2 µFelectrolytic63 V
C62.2 µFelectrolytic63 V
C72.2 µFelectrolytic63 V
C84.7 µFelectrolytic63 V ±10%
C92.2 µFelectrolytic63 V
C103.3 nFfoil
C11150 pFfoil
C1256 nFfoil
C1356 nFfoil
C14150 pFfoil
C153.3 nFfoil
C162.2 µFelectrolytic63 V
C172.2 µFelectrolytic63 V
C18100 µFelectrolytic16 V
C19100 µFelectrolytic16 V
C2010 µFelectrolytic63 V
C211 µFelectrolytic63 V
C224.7 nFfoil
C2322 nFfoil
R13.3 kΩ
R215 kΩ
R31.3 kΩ
R4100 kΩ
Q1CSB503F58radial leads
CSB503JF958alternative as SMD
2000 Dec 115
Page 6
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
PINNING
SYMBOL PINDESCRIPTION
n.c.1not connected
C
P2
C
P1
COMP4composite input signal
C
MO
C
SS
R
FR
LIL8line input; left channel
LOL9line output; left channel
VIL10volume control input; left channel
VAL11AVL output; left channel
n.c.12not connected
TC1L13treble capacitor 1; left channel
TC2L14treble capacitor 2; left channel
BCL15bass capacitor; left channel
OUTL16left channel output
n.c.17not connected
OUTR18right channel output
BCR19bass capacitor; right channel
TC2R20treble capacitor 2; right channel
TC1R21treble capacitor 1; right channel
n.c.22not connected
VAR23AVL output; right channel
2connector 2 for pilot detector capacitor
3connector 1 for pilot detector capacitor
5capacitor for DC-decoupling mono
6capacitor for DC-decoupling stereo
7resistor for filter reference
TDA9853H
SYMBOL PINDESCRIPTION
VIR24volume control input; right channel
LOR25line output; right channel
LIR26line input; right channel
V
ref
V
CAP
C
AV
TW30capacitor timing
C
W
BPU32band-pass filter upper corner
FDO33fixed de-emphasis output
n.c.34not connected
FDI35fixed de-emphasis input
AGND36analog ground
DGND37digital ground
SDA38serial data input/output
MAD39programmable address bit
SCL40serial clock input
V
CC
C
PH
CER43ceramic resonator
n.c.44not connected
27reference voltage (0.5VCC)
28capacitor for electronic filtering of
supply
29capacitor for AVL
31capacitor for VCA and band-pass filter
lower corner frequency
frequency
(module address)
41supply voltage
42capacitor for phase detector
2000 Dec 116
Page 7
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
n.c.
CER
handbook, full pagewidth
n.c.
C
P2
C
P1
COMP
C
MO
C
SS
R
FR
LIL
LOL
VIL
VAL
44
1
2
3
4
5
6
7
8
9
10
11
CPHVCCSCL
43
42
41
40
TDA9853H
MAD
39
SDA
38
DGND
37
AGND
36
FDI
35
n.c.
34
TDA9853H
33
FDO
32
BPU
31
C
W
30
TW
29
C
AV
28
V
CAP
27
V
ref
26
LIR
25
LOR
24
VIR
23
VAR
12
13
14
15
n.c.
TC1L
TC2L
BCL
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
Stereo decoder
The composite signal is fed into a pilot detector/pilot
cancellation circuit and into the MPX demodulator. The
main L + R signal passes a 75 µs fixed de-emphasis filter
andisfedinto the dematrix circuit. Thedecodedsub-signal
L − R is applied to the Volume Controlled Amplifier (VCA)
circuit. To generatethe pilot signalthe stereo demodulator
uses a PLL circuit including a ceramic resonator.
Mode selection
The L − R signal is fed via the internal VCA circuit to the
dematrix/switching circuit. Mode selection is achieved via
the I2C-bus (see Table 9).
The dematrix outputs can be muted via the I2C-bus
(see Table 14).
16
17
18
19
20
21
22
MHB790
OUTL
n.c.
OUTR
BCR
TC2R
TC1R
n.c.
Automatic volume level control
The automatic volume level stage controls its output
voltage to a constant level of typically 200 mV (RMS) from
an input voltage range between 0.1 to 1.1 V (RMS). The
circuitadjustsvariationsinmodulationduringbroadcasting
and because of changes in the programme material; this
functioncan be switchedoff. To avoid audibleplops during
the permanent operation of the AVL circuit a soft blending
scheme has been applied between the different gain
stages. A capacitor (4.7 µF) at pin CAV determines the
attack and decay time constants. In addition the ratio of
attack and decay times can be changed via the I2C-bus.
Integrated filters
The filter functions necessary for stereo demodulation are
provided on-chip using transconductor circuits. The filter
frequencies are controlled bythe filter reference circuit via
the external resistor R4.
2000 Dec 117
Page 8
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
Audio processor
SELECTOR
Theselectorenablesthe selection of either theinternalline
output signals LOR and LOL (dematrix output) or the
external line input signals LIR and LIL (see Table 16). The
input signal capability of the line inputs (LIR/LIL) is
2 V (RMS). The output of the selector is DC-coupled to the
automatic volume level control circuit.
VOLUME
The volume control range is from +12 dB to −63 dB in
steps of 1 dB and ends with a mute step (see Table 8).
Balance control is achieved by the independent volume
control of each channel.
BASS FUNCTION
A single external 56 nF capacitor for each channel in
combinationwith a linearoperational amplifier andinternal
resistors provides a bass range of +12 dB for high bass
and +5 dB for low bass.
TDA9853H
TREBLE FUNCTION
Two external capacitors C15 = 3.3 nF and C14 = 150 pF
for each channel in combination with a linear operational
amplifier and internal resistors provide a treble range of
+8 dB for high treble and −1.5 dB for low treble.
MUTE
The mute functioncan be activatedindependently with the
last step of volume control at the left or right output. By
setting the general mute bit GMU the audio outputs OUTL
and OUTR are muted.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
SDA, VSCL
V
n
T
amb
T
stg
V
es
supply voltage−9.5V
voltage at pins SDA and SCL referenced
to GND
voltage of all other pins to GND0V
VCC≤ 9V−0.3+V
V
>9V−0.3+9V
CC
CC
CC
V
V
ambient temperature−20+70°C
storage temperature−65+150°C
electrostatic handling voltagenote 1−200+200V
note 2−2000 +2000 V
Notes
1. Machine model class B, equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor (‘0 Ω’ is actually
0.75 µH+10Ω).
2. Human body model class B, equivalent to discharging a 100 pF capacitor through a 1500 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to ambientin free air70K/W
2000 Dec 118
Page 9
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
TDA9853H
decoder and audio processor
CHARACTERISTICS
All voltages are measured relative to GND; VCC=8V; Rs= 600 Ω; AC-coupled; RL=10kΩ; CL= 2.5 nF; f
mono signal; composite input voltage 250 mV (RMS) for 100% modulation L + R (25 kHz deviation); pilot 50 mV (RMS);
Gv= 0 dB; linear tone control; AVL off; T
=25°C; see Fig.1; unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
CC
I
CC
V
ref
supply voltage7.889V
supply current253345mA
internal reference voltage at
pin V
ref
0.45VCC0.5V
CC
0.55VCCV
Input stage
V
i(max)(rms)
maximum input voltage
2−−V
(RMS value)
Z
i
input impedance202532kΩ
Stereo decoder
HRheadroom for L + R, L and Rf
V
pil(rms)
nominal stereo pilot voltage
= 300 Hz; THD < 15%9−−dB
mod
−50−mV
(RMS value)
V
th(on)(rms)
pilot threshold voltage, stereo
−−35mV
on (RMS value)
V
th(off)(rms)
pilot threshold voltage, stereo
15−−mV
off (RMS value)
hyshysteresis−2.5−dB
V
o(rms)
α
cs(L,R)
THD
L,R
S/Nsignal-to-noise ratio at line
output voltage (RMS value)100% modulation L + R;
f
= 300 Hz
mod
stereo channel separation
L and R
total harmonic distortion
L and R
output and AF output
14% modulation; fL= 300 Hz;
fR= 3 kHz
100% modulation L or R;
f
= 1 kHz
mod
2
mono via I
C-bus; referenced
to 500 mV output signal
CCIR 468-2 weighted;
−500−mV
1520−dB
−0.21%
5060−dB
quasi peak
DIN noise weighting filter
−73−dBA
(RMS value)
α
mute
mute attenuation atLOL, LOR,
VAL and VAR
100% modulation L + R;
f
= 300 Hz; mute via bit E6
mod
63−−dB
Stereo decoder, oscillator (VCXO); note 1
f
∆f
∆f
o
fr
cr
nominal VCXO output
frequency (32fH)
spread of free-running
frequency
with nominal ceramic
resonator
with nominal ceramic
resonator
−503.5−kHz
500−507kHz
capture range frequencynominal pilot±190±265−Hz
mod
= 1 kHz
2000 Dec 119
Page 10
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
TDA9853H
decoder and audio processor
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Audio control part; input pins VIL and VIR to pins OUTL and OUTR
V
O
Z
i
Z
o
R
L
C
L
V
i(max)(rms)
DC output voltage0.45VCC0.5V
CC
volume input impedance253038kΩ
output impedance−80120Ω
output load resistance5−−kΩ
output load capacitance0−2.5nF
maximum input voltage
THD < 0.5%tbf2−V
(RMS value)
THDtotal harmonic distortion1 V (RMS) input voltage−0.05−%
V
no
noise output voltageCCIR 468-2 weighted;
quasi peak
G
=10dB−110220µV
v
=0dB−3350µV
G
v
mute position−10−µV
G
c
volume control rangemaximum boost−12−dB
maximum attenuation−63−dB
G
step
∆G
a
∆G
L
α
m
V
DC(OS)
step resolution−1−dB
step error between adjoining
step
= +12 to −15 dB and
G
v
Gv= −16 to −63 dB; note 2
−−0.5dB
attenuator set errorGv= +12 to −50 dB−−2dB
G
=−51 to −63 dB−−3dB
v
gain tracking errorGv= +12 to −50 dB−−2dB
mute attenuation80−−dB
DC step offset between any
adjacent step
DC step offset between any
step to mute
Gv= +12 to 0 dB−0.210mV
G
=0to−63 dB−−5mV
v
G
= +12 to 0 dB−215mV
v
=−1to−63 dB−110mV
G
v
Tone control part
L
linear
L
bass(max)
L
bass(min)
L
treble(max)
L
treble(min)
linear tone control−0−dB
tone control with maximum
bass
tone control with minimum
bass
tone control with maximum
treble
tone control with minimum
treble
referenced to linear position;
f
=20Hz
mod
referenced to linear position;
f
=20Hz
mod
referenced to linear position;
f
= 20 kHz
mod
referenced to linear position;
f
= 20 kHz
mod
1012−dB
3.55−dB
68−dB
−−1.5−dB
0.55VCCV
2000 Dec 1110
Page 11
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
TDA9853H
decoder and audio processor
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
VCA
I
s
nominal timing current for
nominal release rate of VCA
detector
Rel
rate
nominal detector release ratenominal timing current and
Automatic volume level control
G
v
G
step
voltage gainmaximum boost; note 3567dB
equivalent step width between
the input stages(soft switching
system)
V
i(rms)
V
o(AVL)(rms)
input voltage (RMS value)maximum boost; note 3−0.1−V
output voltage in AVL
operation (RMS value)
V
offset(DC)
DC offset voltage between
different gain steps
R
att
discharge resistors for attack
time constant
I
dec
charge current for decay timenormal mode; CCD = 0; note 6 1.622.4µA
output load capacitancewith 100 Ω in series−−2.5nF
Muting at power supply voltage drop for OUTR and OUTL
∆V
CC
supply voltage drop for mute
−V
CAP
active
Power-on reset; note 7
V
POR(start)
start of reset voltageincreasing supply voltage−−2.5V
decreasing supply voltage−tbf−V
V
POR(end)
Digital part (I
V
IH
V
IL
I
IH
I
IL
V
OL
end of reset voltageincreasing supply voltage−tbf−V
2
C-bus pins); note 8
HIGH-level input voltage3−V
LOW-level input voltage−0.3−+1.5V
HIGH-level input current−10−+10µA
LOW-level input current−10−+10µA
LOW-level output voltageIIL=3mA−− 0.4V
Notes
1. The oscillator isdesigned to operatetogether withMurata resonator CSB503F58or CSB503JF958 as SMD.Change
of the resonator supplier is possible, but the resonator specification must be close to the specified ones.
2. 1.5 dB step error between −15 and −16 dB.
3. The AVL input voltage is internal. It corresponds to the output voltage OUTL and OUTR at AVL off.
4. The listed pin voltage corresponds with typical gain steps of +6 dB, +3 dB, 0 dB, −6 dB and −15 dB.
=2µA; G1= −9 dB; G2=+6dB→ decay time results in 4.14 s.
7. When reset is active the GMU bit (mute) is set and the I2C-bus receiver is in the reset position.
8. The AC characteristics are in accordance with the I2C-bus specification for standard mode (clock frequency
maximum 100 kHz). A higher frequency, up to 280 kHz, can be used if all clock and data times are interpolated
between standard mode (100 kHz) and fast mode (400 kHz) in accordance with the I2C-bus specification.
Information about the I2C-bus can be found in brochure
“I2C-bus and how to use it”
(order number 9398 393 40011).
9. Maximum 9 V if VCC>9V.
−V
− 0.7 −V
(9)
CC
V
2000 Dec 1112
Page 13
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
12
handbook, full pagewidth
gain
(dB)
8
4
0
−4
10
(1)
(3)
2
10
10
TDA9853H
MHB791
(2)
(4)
3
4
10
f (Hz)
5
10
(1) Maximum bass.
(2) Maximum treble.
(3) Minimum bass.
(4) Minimum treble.
Fig.3 Tone control.
2000 Dec 1113
Page 14
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
I2C-BUS PROTOCOL
2
C-bus format to read (slave transmits data)
I
SSLAVE ADDRESSR/
Table 1Explanation of I
SSTART condition; generated by the master
Standard SLAVE ADDRESS (MAD)1011011; pin MAD not connected
Pin programmable SLAVE ADDRESS1011010; pin MAD connected to ground
R/
Wlogic 1 (read); generated by the master
Aacknowledge; generated by the slave
DATAslave transmits an 8-bit data word
ANacknowledge not; generated by the master
PSTOP condition; generated by the master
Table 2Definition of the transmitted bytes after read condition
2
C-bus format to read (slave transmits data)
NAMEDESCRIPTION
WADATAANP
TDA9853H
MSBLSB
D7D6D5D4D3D2D1D0
YYYYYYPONRSTP
Table 3Bit functions of Table 2
BITFUNCTION
STPstereo pilot identification (stereo received = 1)
PONRPower-on reset; if PONR = 1, then Power-on reset is detected
Yindefinite
2
I
C-bus format to write (slave receives data)
SSLAVE ADDRESSR/
2
Table 4Explanation of I
NAMEDESCRIPTION
SSTART condition
Standard SLAVE ADDRESS101 101 1; pin MAD not connected
Pin programmable SLAVE ADDRESS101 101 0; pin MAD connected to ground
R/
Wlogic 0 (write)
Aacknowledge; generated by the slave
SUBADDRESS (SAD)see Table 5
DATAsee Table 6
PSTOP condition
C-bus format to write (slave receives data)
WASUBADDRESSADATAAP
2000 Dec 1114
Page 15
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
TDA9853H
decoder and audio processor
If more than 1 byte of DATA is transmitted, then auto-increment is performed, starting from the transmitted subaddress
and auto-increment of subaddress in accordance with the order of Table 5 is performed.
Table 5Subaddress definition (second byte after slave address)
FUNCTION
Volume right00000000
Volume left00000001
Control 100000010
Control 200000011
Note
1. Significant subaddress bits.
Table 6Data definition (third byte after slave address)
FUNCTION
Volume right0B6B5B4B3B2B1B0
Volume left0C6C5C4C3C2C1C0
Control 10E6E5E4E3E2E1E0
Control 2000F4F3F2F1F0
MSBLSB
D7D6D5D4D3D2D1
MSBLSB
D7D6D5D4D3D2D1D0
(1)
D0
(1)
Table 7Bit functions of Table 6
BITSSYMBOLFUNCTION
B0 to B6VR0 to VR6volume control right
C0 to C6VL0 to VL6volume control left
E0STEREOmode selection for line out
E1GMUmute control for OUTL and OUTR
E2AVLONAVL on/off
E3CCDincreased AVL decay current on/off
E4 and E5AT1 and AT2attack time at AVL
E6LMUline out mute on/off
F0 and F1TONEselection between four fixed tone controls
F2MODEselection between intern and extern
F3MONOforced mono on/off at OUTL and OUTR
F4LITOlinear tone control on/off
I2C-bus controlled economic BTSC stereo
decoder and audio processor
INTERNAL PIN CONFIGURATIONS
+
2
8.5kΩ12
Fig.4 Pin 2: CP2.
kΩ
MHB792
TDA9853H
3
+
3.5 kΩ
MHB793
Fig.5 Pin 3: CP1.
4
+
25 kΩ
25 kΩ
25 kΩ
50 pF
100 pF
Fig.6 Pin 4: COMP.
1 kΩ
MHB794
+
Fig.7 Pin 5: CMO; pin 6: CSS.
+
5, 6
10 kΩ10 kΩ
4 V
8, 26
MHB795
+
MHB796
7
Fig.8 Pin 7: RFR.
2000 Dec 1119
20 kΩ
MHB797
Fig.9 Pin 8: LIL; pin 26: LIR.
Page 20
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
9, 25
+
4 V
MHB798
4 V
30 kΩ
4 V
TDA9853H
10, 24
+
MHB799
Fig.10 Pin 9: LOL; pin 25: LOR.
11, 23
+
80 Ω
4 V
MHB800
Fig.11 Pin 10: VIL; pin 24: VIR.
13, 14
4 V
20, 21
+
5.4 kΩ
12 kΩ
+
MHB801
Fig.12 Pin 11: VAL; pin 23: VAR.
2000 Dec 1120
Fig.13 Pin 13: TC1L; pin 14: TC2L; pin 20: TC2R;
pin 21: TC1R.
Page 21
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
15, 19
4 V
+
28.5 kΩ
9.5 kΩ
4 V
MHB802
Fig.14 Pin 15: BCL; pin 19: BCR.
27
TDA9853H
16, 18+
80 Ω
MHB803
Fig.15 Pin 16: OUTL; pin 18: OUTR.
+
28
3.4
kΩ
3.4
kΩ
Fig.16 Pin 27: V
+
4.7 kΩ
300 Ω
5 kΩ
MHB804
.
ref
29
MHB805
Fig.17 Pin 28: V
.
CAP
30
+
MHB806
MHB807
Fig.18 Pin 29: CAV.
2000 Dec 1121
Fig.19 Pin 30: TW.
Page 22
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
31
+
6 kΩ
MHB808
Fig.20 Pin 31: CW.
TDA9853H
+
Fig.21 Pin 32: BPU; pin 35: FDI.
35
+
16 kΩ
MHB809
32
33
+
MHB810
Fig.22 Pin 33: FDO.
39
+
MHB812
1.8 kΩ
38
1.8 kΩ
MHB811
Fig.23 Pin 38: SDA.
40
5 V
1.8 kΩ
MHB813
Fig.24 Pin 39: MAD (I2C-bus address switch).
2000 Dec 1122
Fig.25 Pin 40: SCL.
Page 23
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
41
+
MHB814
Fig.26 Pin 41: VCC.
42
+
10 kΩ10 kΩ
Fig.27 Pin 42: CPH.
TDA9853H
4 V
MHB815
43
+
3 kΩ
Fig.28 Pin 43: CER.
MHB816
2000 Dec 1123
Page 24
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
PACKAGE OUTLINE
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm
c
y
X
3323
34
Z
22
E
A
TDA9853H
SOT205-1
e
w M
b
p
B
v M
scale
(1)
eH
H
19.2
1
18.2
e
pin 1 index
2.3
2.1
b
0.25
12
11
Z
w M
p
D
H
D
0.50
0.25
0.35
0.14
D
0510 mm
(1)(1)(1)
D
14.1
14.1
13.9
13.9
44
1
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.60
0.25
0.05
UNITA1A2A3bpcE
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
v M
D
E
A
B
E
19.2
18.2
H
E
LL
2.0
1.2
A
p
A
2
A
1
detail X
Z
D
0.152.350.10.3
2.4
1.8
(A )
3
L
p
L
Zywvθ
E
o
2.4
7
o
1.8
0
θ
OUTLINE
VERSION
SOT205-1
IEC JEDEC EIAJ
133E01
REFERENCES
2000 Dec 1124
EUROPEAN
PROJECTION
ISSUE DATE
97-08-01
99-12-27
Page 25
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
decoder and audio processor
SOLDERING
Introduction to soldering surface mount packages
Thistext gives a verybriefinsightto a complextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemount ICs, but itisnotsuitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
TDA9853H
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswith leads on foursides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement andbefore soldering,the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
If wave soldering is used the following conditions must be
observed for optimal results:
2000 Dec 1125
Page 26
Philips SemiconductorsProduct specification
I2C-bus controlled economic BTSC stereo
TDA9853H
decoder and audio processor
Suitability of surface mount IC packages for wave and reflow soldering methods
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP andTSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJsuitablesuitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Objective specificationDevelopmentThis data sheet contains the design target or goal specifications for
Preliminary specificationQualificationThisdata sheet contains preliminary data, and supplementary data will be
Product specificationProductionThis data sheet contains final specifications. Philips Semiconductors
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at anyotherconditions above those giveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that such applicationswillbe
suitable for the specified use without further testing or
modification.
PRODUCT
STATUS
DEFINITIONS
product development. Specification may change in any manner without
notice.
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result inpersonal injury. Philips
Semiconductorscustomersusing or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof any of theseproducts,conveysno licence or title
under any patent, copyright, or mask work right to these
products,and makes no representationsor warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
(1)
2
PURCHASE OF PHILIPS I
2000 Dec 1127
C COMPONENTS
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C components conveys a license under the Philips’ I2C patent to use the
Page 28
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Indonesia: PTPhilips Development Corporation, SemiconductorsDivision,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
70
Printed in The Netherlands753504/01/pp28 Date of release: 2000 Dec 11Document order number: 9397 750 07474
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