supply voltage8.08.59.0V
supply current−7595mA
input signal voltage (RMS value)100% modulation L + R; fi= 300 Hz −250−mV
output signal voltage (RMS value) 100% modulation L + R; fi= 300 Hz −500−mV
input level adjustment control−3.5−+4.0dB
stereo channel separationfL= 300 Hz; fR= 3 kHz2535−dB
total harmonic distortion L + Rfi= 1 kHz−0.2−%
L,R
signal handling (RMS value)THD < 0.5%2−−V
volume control range−71−+16dB
maximum loudness boostfi=40Hz−17−dB
= 0.5 V (RMS)
o
CCIR noise weighting filter
−60−dB
(peak value)
DIN noise weighting filter
−73−dBA
(RMS value)
= 2 V (RMS);
o
gain = 0 dB
CCIR noise weighting filter
−94−dB
(peak value)
DIN noise weighting filter
−107−dBA
(RMS value)
1996 Feb 283
Page 4
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
BLOCK DIAGRAM
OUTR
42
OUT
RIGHT
C12
R3
R2
C11
C9
C8C28
C10
VIR
41
4039
38375
RIGHT
VOLUME
LOUDNESS
CONTROL
ZERO
CROSSING
EFFECTS
OUTL
1
OUT
LEFT
LEFT
VOLUME
LOUDNESS
C
2
I
LOGIC
MHA309
C14
34212068972523
VIL
CONTROL
222
TRANSCEIVER
C29
TDA9852
R5
R4
C30
SDASCL
C6
C7
(EIR)
External Input Right
C20
C16
Q1
CERAMIC
C5
C4
C3
C2
RESONATOR
MURATA
R1
LIR
LOR
3233363435
31
CSB503F58
2627282930
TDA9852
AUTOMATIC
VOLUME AND
INPUT
+
DEMATRIX
SAP
STEREO/
STEREO DECODER
INPUT
24
COMP
LEVEL
LEVEL CONTROL
SELECT
SELECT
LINEOUT
SWITCH
ADJUST
C1
STEREO
SUPPLY
LIL
LOL
11 1012
ADJUST
1314
DBX
SAP
R6
1516
171819
DEMODULATOR
C26
C27
R7
C19
C18C17
C34
C15
C49
C47
C25
C24
C23
C22
C21
CC
V
(EIL)
External Input Left
handbook, full pagewidth
Fig.1 Block diagram.
1996 Feb 284
Page 5
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
Component list
Electrolytic capacitors ±20%; foil or ceramic capacitors ±10%; resistors ±5%; unless otherwise specified; see Fig.1.
COMPONENTVALUETYPEREMARK
C110 µFelectrolytic63 V
C2470 nFfoil
C34.7 µFelectrolytic63 V
C4220 nFfoil
C510 µFelectrolytic63 V; I
C62.2 µFelectrolytic16 V
C72.2 µFelectrolytic63 V
C815 nFfoil±5%
C915 nFfoil±5%
C102.2 µFelectrolytic16 V
C118.2 nFfoil or ceramic±5% SMD 2220/1206
C12150 nFfoil±5%
C14150 nFfoil±5%
C15100 µFelectrolytic16 V
C164.7 µFelectrolytic63 V
C174.7 µFelectrolytic63 V
C18100 nFfoil
C1910 µFelectrolytic63 V
C204.7 µFelectrolytic63 V
C2147 nFfoil±5%
C221 µFelectrolytic63 V
C231 µFelectrolytic63 V
C2410 µFelectrolytic63 V ±10%
C2510 µFelectrolytic63 V ±10%
C262.2 µFelectrolytic16 V
C272.2 µFelectrolytic63 V
C284.7 µFelectrolytic63 V ±10%
C292.2 µFelectrolytic16 V
C308.2 nFfoil or ceramic±5% SMD 2220/1206
C34100 µFelectrolytic16 V
C47220 µFelectrolytic25 V
C49100 nFfoil or ceramicSMD 1206
R12.2 kΩ−
R220 kΩ−
R32.2 kΩ−
R420 kΩ−
R52.2 kΩ−
R68.2 kΩ−±2%
leak
< 1.5 µA
1996 Feb 285
Page 6
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
COMPONENTVALUETYPEREMARK
R7160 Ω−±2%
Q1CSB503F58radial leads
CSB503JF958alternative as SMD
PINNING
SYMBOLPINDESCRIPTION
OUTL1output, left channel
LDL2input loudness, left channel
VIL3input volume, left channel
EOL4output effects, left channel
C
AV
V
ref
LIL7input line control, left channel
AVL8input automatic volume control, left channel
SOL9output selector, left channel
LOL10output line control, left channel
C
TW
C
TS
C
W
C
S
VEO15variable emphasis output for dbx
VEI16variable emphasis input for dbx
C
NR
C
M
C
DEC
GND20ground
SDA21serial data input/output
SCL22serial clock input
V
CC
COMP24composite input signal
V
CAP
C
P1
C
P2
C
PH
C
ADJ
CER30ceramic resonator
C
MO
C
SS
LOR33output line control, right channel
SOR34output selector, right channel
5automatic volume control capacitor
6reference voltage 0.5V
CC
11capacitor timing wideband for dbx
12capacitor timing spectral for dbx
13capacitor wideband for dbx
14capacitor spectral for dbx
17capacitor noise reduction for dbx
18capacitor mute for SAP
19capacitor DC-decoupling for SAP
23supply voltage
25capacitor for electronic filtering of supply
26capacitor for pilot detector
27capacitor for pilot detector
28capacitor for phase detector
29capacitor for filter adjustment
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
SYMBOLPINDESCRIPTION
AVR35input automatic volume control, right channel
LIR36input line control, right channel
C
PS2
C
PS1
EOR39output effects, right channel
VIR40input volume, right channel
LDR41input loudness, right channel
OUTR42output, right channel
handbook, halfpage
OUTL
LDL
VIL
EOL
C
V
AVL
SOL
LOL
C
TW
C
C
VEO
VEI
C
NR
C
C
DEC
GND
SDA
AV
ref
LIL
TS
C
1
2
3
4
5
6
7
8
9
10
11
TDA9852
12
13
W
14
S
15
16
17
18
M
19
20
Fig.2 Pin configuration.
37capacitor 2 pseudo function
38capacitor 1 pseudo function
FUNCTIONAL DESCRIPTION
Stereo decoder
I
NPUT LEVEL ADJUSTMENT
The composite input signal is fed to the input level
adjustment stage. The control range is from
−3.5 to +4.0 dB in steps of 0.5 dB. The subaddress
control 3 of Tables 5 and 6 and the level adjust setting of
Table 21 allows an optimum signal adjustment during the
set alignment. The maximum input signal voltage is
2 V (RMS).
TEREO DECODER
S
The output signal of the level adjustment stage is coupled
to a low-pass filter which suppresses the baseband noise
above 125 kHz. The composite signal is then fed into a
pilot detector/pilot cancellation circuit and into the MPX
demodulator. The main L + R signal passes a 75 µs fixed
de-emphasis filter and is fed into the dematrix circuit.
The decoded sub-signal L − R is sent to the stereo/SAP
switch. To generate the pilot signal the stereo demodulator
uses a PLL circuit including a ceramic resonator.
The stereo channel separation is adjusted by an automatic
procedure to be performed during set production. For a
detailed description see Section “Adjustment procedure”.
The stereo identification can be read by the I2C-bus
(see Table 2). Two different pilot thresholds
(data STS = 1; STS = 0) can be selected via the I2C-bus
(see Table 19).
SAP
The composite signal is fed from the output of the input
level adjustment stage to the SAP demodulator circuit
MHA310
OUTR
42
LDR
41
VIR
40
EOR
39
C
38
PS1
C
37
PS2
LIR
36
AVR
35
SOR
34
LOR
33
C
32
SS
C
31
MO
CER
30
C
29
ADJ
C
28
PH
C
27
P2
C
26
P1
V
25
CAP
COMP
24
V
23
CC
SCL
2221
through a 5fH (fH= horizontal frequency) band-pass filter.
The demodulator level is automatically controlled. The
SAP demodulator includes internal noise and field strength
detectors that mute the SAP output in the event of
DEMODULATOR
TDA9852
1996 Feb 287
Page 8
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
insufficient signal conditions. The SAP identification signal
can be read by the I2C-bus (see Table 2).
WITCH
S
The stereo/SAP switch feeds either the L − R signal or the
SAP demodulator output signal via the internal dbx noise
reduction circuit to the dematrix/switching circuit. Table 12
shows the different switch modes provided at the output
pins LOR and LOL.
dbx
DECODER
The circuit includes all blocks required for the noise
reduction system in accordance with the BTSC system
specification. The output signal is fed through a 73 µs fixed
de-emphasis circuit to the dematrix block.
NTEGRATED FILTERS
I
The filter functions necessary for stereo and SAP
demodulation and part of the dbx filter circuits are provided
on-chip using transconductor circuits. The required filter
accuracy is attained by an automatic filter alignment
circuit.
Audio processor
ELECTOR
S
The selector allows selecting either the internal line out
signals LOR or LOL (dematrix output) or the external line
in signals LIR and LIL and combines the left and right
signals in several modes (see Tables 5 and 6 for
subaddress and Table 11 for data). The input signal
capability of the line inputs (LIR/LIL) is 2 V (RMS). The
output of the selector is AC-coupled to the automatic
volume level control circuit via pins SOR/SOL and
AVR/AVL to avoid offset voltages.
UTOMATIC VOLUME LEVEL CONTROL
A
The automatic volume level stage controls its output
voltage to a constant level of typically 200 mV (RMS) from
an input voltage range of 0.1 to 1.1 V (RMS). The circuit
adjusts variations in modulation during broadcasting and
due to changes in the programme material. The function
can be switched off. To avoid audible ‘plops’ during the
permanent operation of the AVL circuit a soft blending
scheme has been applied between the different gain
stages. A capacitor (4.7 µF) at pin CAV determines the
attack and decay time constants. In addition the ratio of
attack and decay time can be changed via I2C-bus
(see Table 15). At power on, the discharged 4.7 µF
capacitor at CAV must be loaded by the internal decay
TDA9852
current. If AVL is chosen, this would result in an attenuated
AVL gain for about 10 seconds after poweron. This can be
speeded up by choosing via I
current (about 10 times higher) for about the first
2 seconds after power on (see Table 6, CCD bit in
control 1 and Table 18).
FFECTS
E
The audio processor section offers the following mode
selections: linear stereo, pseudo stereo, spatial stereo and
forced mono.The spatial mode provides an antiphase
crosstalk of 30% or 52% (switchable via I
see Table 10).
OLUME/LOUDNESS
V
The volume control range is from +16 dB to −71 dB in
steps of 1 dB and ends with a mute step (see Table 8).
Balance control is achieved by the independent volume
control of each channel. The volume control blocks
operate in combination with the loudness control. The filter
is linear when maximum gain for volume control is
selected. The filter characteristic changes automatically
over a range of 28 dB down to a setting of −12 dB.
At −12 dB volume control the maximum loudness boost is
obtained. The filter characteristic is determined by external
components. The proposed application provides a
maximum boost of 17 dB for bass and 4.5 dB for treble.
The loudness may be switched on or off via I2C-bus
control (see Table 9). The left and right volume control
stages include two independent zero crossing detectors.
A change in volume is automatically activated but not
executed. The execution is enabled at the next zero
crossing of the signal. If a new volume step is activated
before the previous one has been processed, the previous
value will be executed first, and then the new value will be
activated. If no zero crossing occurs the next volume
transmission will enforce the last activated volume setting.
The zero crossing is realized between adjoining steps and
between any steps, but not from any step to mute. In this
case the GMU bit is needed to use. In case only one
channel has to be muted, two steps are necessary.
The first step is a transmission of any step to −71 dB and
the second step is the−71 dB step to mute mode. The step
of −71 dB to mute mode has no zero crossing but this is
not relevant.
UTE
M
The mute function can be activated independently with last
step of volume control at the left or right output. By setting
the general mute bit GMU via the I2C-bus all outputs are
2
C-bus an increased charge
2
C-bus;
1996 Feb 288
Page 9
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
muted. All channels include an independent zero cross
detector. The zero crossing mute feature can be selected
via bit TZCM:
TZCM = 0: forced mute with direct execution
TZCM = 1: execution in time with signal zero crossing.
In the zero cross mode a change in the GMU polarity is
activated but not executed. The execution is enabled at
the next zero crossing of the signal. To avoid a large delay
of mute switching, when very low frequencies are
processed, or the output signal amplitude is lower than the
DC offset voltage, the following I2C-bus transmissions are
needed:
a first transmission for mute execution
a second transmission about 100 ms later, which must
switch the zero crossing mode to forced mute
(TZCM = 0)
a third transmission to reactivate the zero crossing
mode (TZCM = 1). This transmission can take place
immediately, but must follow before the next mute
execution.
Adjustment procedure
OMPOSITE INPUT LEVEL ADJUSTMENT
C
Feed in from FM demodulator the composite signal with
100% modulation (25 kHz deviation) L + R; fi= 300 Hz.
Set input level control via I2C-bus monitoring line out
(500 mV ±20 mV). Store the setting in a non-volatile
memory.
A
UTOMATIC ADJUSTMENT PROCEDURE
• Capacitors of external inputs LIL and LIR must be
grounded at EIL and EIR
• Composite input signal L = 300 Hz, R = 3.1 kHz,
14% modulation for each channel; volume gain +16 dB
via I2C-bus
• Effects, AVL, loudness off.
TDA9852
• Line out setting bits: STEREO = 1, SAP = 0
(see Table 12)
• Start adjustment by transmission ADJ = 1 in register
ALI3; the decoder will align itself
• After 1 second minimum stop alignment by transmitting
ADJ = 0 in register ALI3 read the alignment data by an
2
C-bus read operation from ALR1 and ALR2
I
(see Chapter “I2C-bus protocol”) and store it in a
non-volatile memory; the alignment procedure
overwrites the previous data stored in ALI1 and ALI2
• Disconnect the capacitors of external inputs from
ground.
M
ANUAL ADJUSTMENT
Manual adjustment is necessary when no dual tone
generator is available (e.g. for service).
• Spectral and wideband data have to be set to 10000
(middle position for adjustment range)
• Composite input L = 300 Hz; 14% modulation
• Adjust channel separation by varying wideband data
• Composite input L = 3 kHz; 14% modulation
• Adjust channel separation by varying spectral data
• Iterative spectral/wideband operation for optimum
adjustment
• Store data in non-volatile memory.
IMING CURRENT FOR RELEASE RATE
T
Due to possible internal and external spreading, the timing
current can be adjusted via I2C-bus, see Table 20, as
recommended by dbx.
1996 Feb 289
Page 10
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
Requirements for the composite input signal to ensure correct system performance
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
COMP
L+R(rms)
composite input level for 100%
modulation L + R
(25 kHz deviation);
RMS value; fi= 300 Hz
∆COMPcomposite input level
spreading under operating
conditions
Z
o
f
lf
f
hf
THD
L,R
output impedancenote 1−low-ohmic 5kΩ
low frequency roll-off25 kHz deviation L + R; −2dB −−5Hz
high frequency roll-off25 kHz deviation L + R; −2 dB100−−kHz
total harmonic distortion L + Rfi= 1 kHz; 25 kHz deviation−−0.5%
S/Nsignal-to-noise ratio
L + R/noise
α
SB
side band suppression mono
into unmodulated SAP carrier;
SAP carrier/side band
α
SP
spectral spurious attenuation
L + R/spurious
measured at COMP162250363mV
= −20 to +70 °C; aging;
T
amb
−0.5−+0.5dB
power supply influence
= 1 kHz; 125 kHz deviation;
f
i
−−1.5%
note 2
CCIR 468-2 weighted quasi
peak; L + R; 25 kHz deviation;
= 1 kHz; 75 µs de-emphasis
f
i
critical picture modulation;
44−−dB
note 3
with sync only54−−dB
mono signal: 25 kHz deviation,
46−−dB
fi= 1 kHz; side band: SAP
carrier frequency ±1 kHz
50 Hz to 100 kHz;
mainly n × fH; no de-emphasis;
L + R; 25 kHz deviation,
f = 1 kHz as reference
n = 1, 535−−dB
n = 4, 640−−dB
n = 2, 326−−dB
Notes
1. Low-ohmic preferred, otherwise the signal loss and spreading at COMP, caused by Z
impedance (see Chapter “Characteristics”, Section “Input level adjustment control”) must be taken into account.
2. In order to prevent clipping at over-modulation
(maximum deviation in the BTSC system for 100% modulation is 73 kHz).
3. For example colour bar or flat field white; 100% video modulation.
1996 Feb 2810
and the composite input
O
Page 11
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
CC
V
n
T
amb
T
stg
V
es
Note
1. Human body model: C = 100 pF; R = 1.5 kΩ; V = 2 kV; Charge device model: C = 200 pF; R = 0 Ω; V = 300 V.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
supply voltage09.5V
voltage of all other pins to pin V
gain tracking errorGv= +16 to −50 dB−−2dB
mute attenuation80−−dB
DC step offset between any
adjacent step
DC step offset between any
step to mute
Gv= +16 to 0 dB−0.210.0mV
=0to−71 dB−−5mV
G
v
= +16 to +1 dB−215mV
G
v
=0to−71 dB−110mV
G
v
maximum loudness boostloudness on; referred to
loudness off; boost is
determined by external
components; see Fig.5
=40Hz−17−dB
f
i
= 10 kHz−4.5−dB
f
i
loudness control range−12−+16
supply drop for mute active−V
− 0.7 −V
CAP
start of reset voltageincreasing supply voltage−−2.5V
decreasing supply voltage4.255.8V
end of reset voltageincreasing supply voltage5.266.8V
1996 Feb 2817
Page 18
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
2
Digital part (I
V
IH
V
IL
I
IH
I
IL
V
OL
Notes to the characteristics
1. The oscillator is designed to operate together with MURAT A resonator CSB503F58. Change of the resonator supplier
is possible, but the resonator specification must be close to CSB503F58.
2. The internal SAP carrier level is determined by the composite input level and the level adjustment gain.
3. Frequency range 20 Hz to 20 kHz; select in to input line control; effects: linear stereo.
4. Crosstalk:
5. The transmission contains:
a) Total initialization with MAD and SAD for volume and 11 DATA words, see also definition of characteristics
b) Clock frequency = 50 kHz
c) Repetition burst rate = 400 Hz
d) Maximum bus signal amplitude = 5 V (p-p).
6. The listed pin voltage corresponds with typical gain steps of +6 dB, +3 dB, 0 dB, −6 dB and −15 dB.
7. Attack time constant = CAV× R
Decay time
8.
Example: C
9. When reset is active the GMU-bit (general mute) and the LMU-bit (LINE OUT mute) is set and the I
is in the reset position.
10. The AC characteristics are in accordance with the I2C-bus specification. The maximum clock frequency is 100 kHz.
Information about the I2C-bus can be found in the brochure
(order number 9398 393 40011).
C-bus pins); note 10
HIGH level input voltage3−V
CC
V
LOW level input voltage−0.3−+1.5V
HIGH level input current−10−+10µA
LOW level input current−10−+10µA
LOW level output voltageIIL=3mA−−+0.4V
=2µA; G1= −9 dB; G2=+6dB→ decay time results in 4.14 s.
G2–
---------20
10
–
2
C-bus receiver
“The I2C-bus and how to use it”
1996 Feb 2818
Page 19
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
I2C-BUS PROTOCOL
2
C-bus format to read (slave transmits data)
I
SSLAVE ADDRESSR/
2
Table 1Explanation of I
SSTART condition; generated by the master
Standard SLAVE ADDRESS (MAD)101 101 1
W1 (read); generated by the master
R/
Aacknowledge; generated by the slave
DATAslave transmits an 8-bit data word
MAacknowledge; generated by the master
PSTOP condition; generated by the master
Table 2Definition of the transmitted bytes after read condition
STPstereo pilot identification (stereo received = 1)
SAPPSAP pilot identification (SAP received = 1)
A1X to A2Xstereo alignment read data
A1Xfor wideband expander
A2Xfor spectral expander
Yindefinite
The master generates an acknowledge when it has received the first data word ALR1, then the slave transmits the next
data word ALR2. Afterwards the master generates an acknowledge, then the slave begins transmitting the first data word
ALR1 etc. until the master generates no acknowledge and transmits a STOP condition.
1996 Feb 2819
Page 20
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
I2C-bus format to write (slave receives data)
SSLAVE ADDRESSR/
Table 4Explanation of I
SSTART condition
Standard SLAVE ADDRESS (MAD)101 101 1
W0 (write)
R/
Aacknowledge; generated by the slave
SUBADDRESS (SAD)see Table 5
DATAsee Table 6
PSTOP condition
If more than 1 byte of DATA is transmitted, then auto-increment is performed, starting from the transmitted subaddress
and auto-increment of subaddress in accordance with the order of Table 5 is performed.
Table 5Subaddress second byte after MAD
2
C-bus format to write (slave receives data)
NAMEDESCRIPTION
WASUBADDRESSADATAAP
FUNCTIONREGISTER
Volume rightVR00000000
Volume leftVL00000001
Control 1 (note 1)CON100000101
Control 2CON200000110
Control 3CON300000111
Alignment 1ALI100001000
Alignment 2ALI200001001
Alignment 3ALI300001010
Note
1. In auto-increment mode it is necessary to insert 3 dummy data words between volume left and control 1.
Table 6Definition of third byte, third byte after MAD and SAD
FUNCTIONREGISTER
Volume rightVR0VR6VR5VR4VR3VR2VR1VR0
Volume leftVL0VL6VL5VL4VL3VL2VL1VL0
Control 1CON1GMUAVLONLOFFCCD0SC2SC1SC0
Control 2CON2SAPSTEREOTZCM1LMUEF2EF1EF0
Control 3CON30000L3L2L1L0
Alignment 1ALI1000A14A13A12A11A10
Alignment 2ALI2STS00A24A23A22A21A20
Alignment 3ALI3ADJAT1AT201TC2TC1TC0
MSBLSB
D7D6D5D4D3D2D1D0
MSBLSB
D7D6D5D4D3D2D1D0
1996 Feb 2820
Page 21
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
TDA9852
decoder and audio processor
Table 7Function of the bits in Table 6
BITSFUNCTION
VR0 to VR6volume control right
VL0 to VL6volume control left
GMUmute control for all outputs (generate mute)
AVLONAVL on/off
CCDincreased AVL decay current on/off
LOFFswitch loudness on/off
SC0 to SC2selection between line in and line out
STEREO, SAPmode selection for line out
TZCMzero cross mode in mute operation (right and left output stage)
LMUmute control for line out
EF0 to EF2selection between mono, stereo linear, spatial stereo and pseudo mode
L0 to L3input level adjustment
ADJstereo adjustment on/off
A1X to A2Xstereo alignment data
A1Xfor wideband expander
A2Xfor spectral expander
AT1 and AT2attack time at AVL
TC0 to TC2timing current alignment data
STSstereo level switch
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
Table 9Loudness setting
CHARACTERISTICDATA LOFF
With loudness0
Linear1
Table 10 Effects setting
FUNCTION
EF2EF1EF0
Stereo linear on000
Pseudo on001
Spatial stereo;
30% anti-phase crosstalk
Spatial stereo;
50% anti-phase crosstalk
Forced mono111
Table 12 Switch setting at line out
DATA
010
011
TDA9852
Table 11 Selector setting
FUNCTION
Inputs LOR and LOL000
Inputs LOR and LOR001
Inputs LOL and LOL010
Inputs LOL and LOR011
Inputs LIR and LIL100
Inputs LIR and LIR101
Inputs LIL and LIL110
Inputs LIL and LIR111
Note
1. Input connected to outputs SOR and SOL.
(1)
SC2SC1SC0
DATA
LINE OUT SIGNALS ATDATA
LOLLORSTEREOSAP
SAPSAPSAP received11
Mutemuteno SAP received11
LeftrightSTEREO received10
Monomonono STEREO received10
MonoSAPSAP received01
Monomuteno SAP received01
Monomonoindependent00
Table 13 Zero cross detection setting
Direct mute control0
Mute control delayed until the next zero crossing1
Table 14 Mute setting
FUNCTION
Forced mute at OUTR, OUTL and OUTS1forced mute at LOR and LOL1
Audio processor controlled outputs0stereo processor controlled outputs0
INTERNAL SWITCH, READABLE BITS: STP, SAPP
FUNCTIONDATA TZCM
TRANSMISSION STATUS
DATA
GMU
FUNCTION
SETTING BITS
DATA
LMU
1996 Feb 2824
Page 25
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
Table 15 AVL attack time
FUNCTION
= 420 Ω00
R
att
= 730 Ω10
R
att
= 1200 Ω01
R
att
= 2100 Ω11
R
att
Table 16 ADJ bit setting
FUNCTIONDATA
Stereo decoder operation mode0
Auto adjustment of channel separation1
Table 17 AVLON bit setting
FUNCTIONDATA
Automatic volume control off0
Automatic volume control on1
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT270-1
1996 Feb 2834
REFERENCES
IEC JEDEC EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
90-02-13
95-02-04
Page 35
Philips SemiconductorsPreliminary specification
I2C-bus controlled BTSC stereo/SAP
decoder and audio processor
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
(order code 9398 652 90011).
TDA9852
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2
PURCHASE OF PHILIPS I
C COMPONENTS
1996 Feb 2835
2
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
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