total identification time on0.35−2.0s
identification voltage sensitivity−28−dBµV
pull-in frequency range of pilot PLLf
osc
GENERAL DESCRIPTION
The TDA9847 is a stereo/dual sound processor for TV and
VTR sets. Its identification ensures safe operation by using
internal digital PLL technique with extremely small
bandwidth, synchronous detection and digital integration
(switching time maximum 2.0 s; identification concerning
the main functions).
TDA9847SDIP24plastic shrink dual in-line package; 24 leads (400 mil)SOT234-1
TDA9847TSO24plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
1995 May 232
Page 3
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
BLOCK DIAGRAMS
i3
V
i4
SCART
V
250 mV
250 mV RMS
RMS
±5%
10 nF
D2
C
D1
C
±5%
10 nF
2.2 µF 2.2 µF
172112 11
o1
V
14
500 mV RMS
6 dB
50 kΩ
refVref
V
50 kΩ
5 kΩ
main
V
RMS
AM
250 mV
o2
13
500 mV RMS
6 dB
L/A/mono
o3
V
16
500 mV RMS
6 dB
RMS250 mV
L
SCART
o4
V
15
500 mV RMS
R/B
250 mV RMS
6 dB
V
1 kΩ
stereo transmission
19
dual bit
(274 Hz)
mute
DIGITAL
INTEGRATOR
AND
DIGITAL PLL
DEMODULATOR
P
18
bit
stereo
DIGITAL
AND
DIGITAL PLL
C1C2C3
dual transmission
1
2
(117 Hz)
INTEGRATOR
DEMODULATOR
C4
3
24
LOGIC
CONTROL
RESET
POWER-ON
SUPPLY
ref
V
2022238
MED803
P
1/2 V
P
V
ref
C
100 µF/
16 V
TDA9847
A/mono
5 kΩ
6 dB (AM)
2.2 µF
2.2 kΩ
0 dB
3 dB
3 dB
9
V
10 kΩ10 kΩ
ref
V
ref
0 dB
V
3 dB
15 kΩ
35 kΩ
50 kΩ
10
2.2 kΩ
, A
2
i1
L + R
250 mV RMS
(AM: 500 mV RMS)
V
TDA9847
2.2 µF
R, B
i2
250 mV RMS
1995 May 233
PLL
DIGITAL
7
= 70
o
2.5 mH
Q
47 pF
30 kΩ
FP
FP
R
C
3.3 nF
tan δ ≤ 0.002
V
ref
6
C
25 kΩ
DCL
ref
V
100 nF
OSCILLATOR
25 kΩ
4
10 µF
AGC
C
10 MHz
Fig.1 Block diagram of the bipolar TV/VTR-stereo decoder.
5
10 nF
LP
C
Input and output levels are nominal values related to the SCART norm (AM: m =0.54, FM: ∆f=±27 kHz).
Page 4
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
i3
V
i4
SCART
V
250 mV
250 mV RMS
RMS
5%
10 nF
D2
C
D1
C
5%
10 nF
2.2 µF 2.2 µF
172112 11
o1
V
14
500 mV RMS
6 dB
50 kΩ
refVref
V
50 kΩ
5 kΩ
main
V
RMS
AM
250 mV
o2
13
500 mV RMS
6 dB
L/A/mono
o3
V
16
500 mV RMS
6 dB
RMS250 mV
L
SCART
o4
V
15
500 mV RMS
R/B
250 mV RMS
stereo transmission
19
6 dB
dual bit
mute
DIGITAL
INTEGRATOR
AND
DIGITAL PLL
P
V
1 kΩ
18
bit
stereo
(274 Hz)
DEMODULATOR
(117 Hz)
DIGITAL
INTEGRATOR
AND
DIGITAL PLL
DEMODULATOR
C1C2C3
dual transmission
1
2
24
LOGIC
CONTROL
POWER-ON
V
C4
3
RESET
SUPPLY
ref
2022238
MED804
P
1/2 V
TDA9847
P
V
ref
C
100 µF/
16 V
A/mono
5 kΩ
6 dB (AM)
2.2 µF
2.2 kΩ
0 dB
3 dB
3 dB
9
V
10 kΩ10 kΩ
ref
V
ref
0 dB
V
3 dB
15 kΩ
35 kΩ
50 kΩ
10
2.2 kΩ
, A
2
i1
L + R
250 mV RMS
(AM: 500 mV RMS)
V
2.2 µF
R, B
i2
TDA9847
250 mV RMS
27 kΩ
FP
R
1995 May 234
180 pF
FP
C
7
±5%
4.7 mH
1.8 nF
PLL
DIGITAL
ref
V
6
= 25
o
Q
±2%
tan δ ≤ 0.01
C
25 kΩ
V
DCL
OSCILLATOR
ref
100 nF
10 MHz
25 kΩ
Fig.2 Block diagram of the bipolar TV/VTR-stereo decoder with fixed coil (alignment-free).
5
4
10 nF
10 µF
LP
C
AGC
C
Input and output levels are nominal values related to the SCART norm (AM: m = 0.54, FM: ∆f=±27 kHz).
The components of the external LC band-pass filter have the following order-No.: Philips Germany only No: 4312 020 17525 or Fastron Sdn. Bha., Malaysia type SMCC 472 J
for L = 4.7 MHz (±5%) Philips Components No: 2222 429 71802, C = 1.8 nF (±2%).
Page 5
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
PINNING
SYMBOLPINDESCRIPTION
C11control input Port C1
C22control input Port C2
C43control input Port C4
C
AGC
C
LP
C
DCL
V
i pil
C
ref
V
i1
V
i2
V
i3
V
i4
V
o2
V
o1
V
o4
V
o3
C
D1
LEDDU18LED (dual)
LEDST19LED (stereo)
GND20ground (0 V)
C
D2
V
P
XTAL2310 MHz crystal input
C324control input Port C3
4AGC capacitor of pilot frequency amplifier
5identification low-pass capacitor
6DC loop capacitor
7pilot frequency input voltage
8capacitor of reference voltage (1⁄2VP)
9AF input signal voltage 1 [from sound carrier 1 or
AM sound (standard L)]
10AF input signal voltage 2 (from sound carrier 2)
11AF input signal voltage 3 (SCART)
12AF input signal voltage 4 (SCART)
13AF output signal voltage 2 (main)
14AF output signal voltage 1 (main)
15AF output signal voltage 4 (SCART)
16AF output signal voltage 3 (SCART)
1750 µs de-emphasis capacitor of AF Channel 1
2150 µs de-emphasis capacitor of AF Channel 2
22supply voltage (5 to 8 V)
TDA9847
1
C1
2
C2
3
C4
4
C
AGC
5
C
LP
6
C
DCL
V
i pil
C
ref
V
V
V
V
Fig.3 Pin configuration.
TDA9847
7
8
9
i1
10
i2
11
i3
12
i4
MED805
24
23
22
21
20
19
18
17
16
15
14
13
C3
XTAL
V
P
C
D2
GND
LEDST
LEDDU
C
D1
V
o3
V
o4
V
o1
V
o2
1995 May 235
Page 6
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
FUNCTIONAL DESCRIPTION
AF signal handling
The input AF signals, derived from the two sound carriers,
are processed in analog form using operational amplifiers.
De-matrixing uses the technique of two amplifiers
processing the AF signals. Finally, a source selector
provides the facility to route the mono signal through to the
outputs (‘forced mono’).
De-emphasis is performed by two RC low-pass filter
networks with internal resistors and external capacitors.
This provides a frequency response with the tolerances
given in Fig.4.
A source selector, controlled via the control input ports
allows selection of the different modes of operation in
accordance with the transmitted signal. The device was
designed for a nominal input signal (FM: 54% modulation
is equivalent to ∆f=±27 kHz) of 250 mV RMS value (V
and Vi2) and for a nominal input signal (AM: m = 0.54) of
500 mV RMS value (Vi1), respectively 250 mV RMS (V
and Vi4). A nominal gain of 6 dB for Vi1 and Vi2 signals
(0 dB for Vi1signal (AM sound)) and 6 dB for Vi3 and V
signals is built-in. By using rail-to-rail operational
amplifiers, the clipping level (THD ≤ 1.5%) is 1.60 V RMS
for VP= 5 V and 2.65 V RMS for VP= 8 V at outputs
Vo1to Vo3 and Vo4. Care has been taken to minimize
switching plops. Also total harmonic distortion and random
noise are considerably reduced.
i1
i3
i4
TDA9847
to obtain the AGC voltage for controlling the gain of the
pilot signal amplifier.
The identification stages consist of two digital PLL circuits
with digital synchronous demodulation and digital
integrators to generate the stereo or dual sound
identification bits which can be indicated via LEDs.
A 10 MHz crystal oscillator provides the reference clock
frequency. The corresponding detection bandwidth is
larger than ±50 Hz for the pilot carrier signal, so that
-variations from the transmitter can be tracked in the
f
p
event of missing synchronization with the horizontal
frequency fH. However the detection bandwidth for the
identification signal is made small (±1 Hz) to reduce
mis-identification.
Figure 2 shows an example of the alignment-free f
band-pass filter. To achieve the required QL of around 12,
the Q0 at fp of the coil was chosen to be around 25
(effective Q0 including PCB influence). Using coils with
other Q0, the RC-network (RFP and CFP) has to be adapted
accordingly. It is assumed that the loss factor tan δ of the
resonance capacitor is ≤0.01 at fp.
Copper areas under the coil might influence the loaded Q
and have to be taken into account. Care has also to be
taken in environments with strong magnetic fields when
using coils without magnetic shielding.
Control input ports
p
Identification
The pilot signal is fed via an external RC high-pass filter
and single tuned LC band-pass filter to the input of a gain
controlled amplifier. The external LC band-pass filter in
combination with the external RC high-pass filter should
have a loaded Q-factor of approximately 40 to 50 to
ensure the highest identification sensitivity. By using a
fixed coil (±5%) to save the alignment (see Fig.2), a
Q-factor of approximately 12 is proposed. This may cause
a loss in sensitivity of approximately 2 to 3 dB. A digital
PLL circuit generates a reference carrier, which is
synchronized with the pilot carrier. This reference carrier
and the gain controlled pilot signal are fed to the
AM-synchronous demodulator. The demodulator detects
the identification signal, which is fed through a low-pass
filter with external capacitor CLP (pin 5) to a
Schmitt trigger for pulse shaping and suppression of LOW
level spurious signal components. This is a measure
against mis-identification.
The identification signal is amplified and fed through an
AGC low-pass filter with external capacitor CAGC (pin 4)
1995 May 236
The complete IC is controlled by the four control input ports
C1, C2, C3 and C4. Which AF output channel pair can be
selected is determined by the control input Port C4 [LOW:
main; HIGH: SCART; 3-state: preset position
(see Section “General information”)]. With the other
control input ports C1, C2 and C3 the user can select
between different AF sources in accordance with the
transmitter status (see Tables 1 and 2). Finally,
Schmitt triggers are added in the input Port interfaces to
suppress spikes on the control lines C1, C2, C3 and C4.
After a Power-On Reset (POR) both registers are reset
(mute mode for both AF channel pairs). After some time
(≤1 ms), when the POR is automatically deactivated, the
switch positions of the main channel (C4 = LOW) are
changed in accordance with the other control input Port
levels. If C4 is HIGH after a POR, the switch positions of
the SCART channel cannot change. The reason is, that
the main register is reset (mute mode; see Table 1). Thus,
at first the main register byte has to be changed out of the
mute function, e.g. sound mute.
Page 7
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
After that, when C4 is HIGH (see Table 2), the switch
positions of the SCART channel are changed in
accordance with the other control line levels.
When the supply voltage of the TDA9847 is not connected
(standby function), the control lines remain undisturbed.
The logic level combination 1000 of the control input ports
(C4, C3, C2 and C1) is not allowed (see Tables 1 and 2).
Operating mode selection
Tables 1 and 2 show the different operating modes of this
stereo decoder.
UTE MODE
M
This IC has two different mute modes:
1. Mute mode.
2. Sound mute mode.
In the mute mode, when all control input lines are set LOW,
all AF channels are muted (‘fast mute’). Finally, the
integrators are reset provided the user does not leave this
mode (identification is disabled). When the user changes
this mode, the identification circuit starts with the
detection.
In the sound mute mode each AF channel can be
separately muted (0100 = main and 1100 = SCART). The
identification circuit is activated and the LEDs are on or off
in accordance with the detection status of this circuit.
ONO MODE
M
For the transmitter status mono the user must set the
TDA9847 in the mono mode with X001 or X010
(see Tables 1 and 2). The level combination X011 is
reserved for the AM sound (standard L), because in this
mode the de-emphasis is deactivated and the gain of the
AF signal from input to output is reduced from
6 dB to 0 dB. At the AF outputs the signal has the same
level for standards with FM or AM modulated sound
assuming the same modulation degree.
S
TEREO MODE
In this mode the choice between stereo and mono (‘forced
mono’) signals is common for both AF channel pairs. The
mode for main and SCART is achieved by control of the
main channel (see Tables 1 and 2).
D
UAL MODE
In this mode there is no restriction to select AF inputs and
outputs independently in both channels.
TDA9847
E
XTERNAL MODE
External sound sources, e.g. from SCART input, are fed to
both AF channel pair outputs. When the user chooses the
external mode of the main channel (see Table 1), the
identification circuit is still running, but the LEDs are
switched-off.
Programming of the main and SCART register
G
ENERAL INFORMATION
The switch positions of both AF channels are directly
controlled by the data of the main and SCART register.
These registers are programmable by a microcontroller.
In the 3-state mode the logic content of the C1, C2 and C3
control lines remains stored in the registers for main and
SCART, so the switch positions in the source selector do
not change. The logic content of these control lines can be
changed without changing the switch positions of the
source selector (preset position) to prepare the new
operating mode selection for the main or SCART channel.
The execution of this new mode is achieved by leaving the
preset position (3-state): When the C4 level goes LOW,
the logic content of the control lines C1, C2 and C3 are
valid for the main channel (see Table 1) and in the event
of HIGH the C1, C2 and C3 are valid for the SCART
channel (see Table 2).
The identification bits and the control lines influence the
operating mode selection for the AF switches in the source
selector and de-matrix, e.g. both AF channels are
programmed in the mono mode (X001,
see Tables 1 and 2). The LEDs are switched-off. When
the identification circuit detects the stereo identification
frequency (fs= 117 Hz) the de-matrix is immediately
switched in the stereo mode without changing the control
line levels. The stereo signals are routed to all AF outputs.
In the event of dual frequency detection (fD= 274 Hz) both
dual sounds are fed to the AF output pairs.
ICROCONTROLLER WITH 3-STATE OUTPUT PORTS
M
Figure 10 shows an example of an application circuit for
TDA9847 (VP= 4.5 to 8.8 V) in conjunction with a
microcontroller, which has a LOW/high-ohmic/HIGH
output port to control the main and SCART channel (C4
control line). For the C1, C2 and C3 line the microcontroller
requires only LOW/HIGH output ports. Two resistors R
and R
are necessary for the C4 line to generate the
C4B
3-state voltage. The values and tolerances of these
components are given in Fig.10.
C4A
1995 May 237
Page 8
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
When the microcontroller has only open drain ports
available for the C1, C2 and C3 control line, external
pull-up resistors must be connected to these control lines.
Figure 7 shows an example of a timing diagram to program
the main and SCART register of the TDA9847 with a
microcontroller via the control lines C1, C2, C3 and C4.
Both registers are programmed with the same control line
levels: C1 = LOW, C2 = HIGH and C3 = LOW. The dual
identification frequency is detected and the dual LED is
switched-on. The A-signal (dual mode) is fed to all
AF outputs (see Tables 1 and 2). This is shown in the
beginning of this timing diagram.
The second period of time shows the programming of the
external mode (C3 goes to HIGH: CC-signal) for the main
channel. The switch positions are immediately changed to
the external AF source, because the C4 level is LOW. The
dual LED is switched-off by the logic (see Section
“External mode”).
The next periods of time show the way to change the
switch positions for the SCART channel to route B-signals
to the AF outputs (dual mode: BB). At first the control
output Port of the microcontroller for the C4 line goes into
the high ohmic state. The changing of the C1, C2 or C3
level has no influence on the register data. In the timing
diagram the C1 level changes from LOW-to-HIGH and the
C3 level goes from HIGH-to-LOW. In the next steps the C4
line goes from 3-state-to-HIGH, and the level of the other
control lines are valid for the SCART channel, and the
B-signals are fed (dual mode: BB) to the AF outputs of the
main channel.
After some time in this example the C1 and C2 levels
change from HIGH-to-LOW and the C3 level goes from
LOW-to-HIGH (sound mute). The SCART channel is
immediately muted, because the level of the C4 line is
HIGH.
The last period of time shows the programming of the dual
mode (AA) for the main channel. At first the control output
Port of the microcontroller for the C4 line goes into the high
ohmic state. The changing of the C1, C2 or C3 level has
no influence on the register data. The switch positions of
the SCART channel stay in the sound mute.
In the 3-state mode the C2 level changes from
LOW-to-HIGH, and the C3 level goes from HIGH-to-LOW.
When the C4 level is LOW, the level of the other control
lines are valid for the main channel. The A-signal (dual
mode) is fed to the main outputs.
TDA9847
Figure 5 shows the hold and set-up time of the C1,
C2 and C3 control line in the 3-state mode,
see Chapter “Characteristics”.
ICROCONTROLLER WITH LOW/HIGH OUTPUT PORTS
M
Figure 11 shows an example of an application circuit for
TDA9847 (VP= 4.5 to 8.8 V) in conjunction with a
microcontroller, which has open drain output ports to
control the main and SCART channel. Four resistors and
two output ports of the microcontroller are necessary to
generate the 3-state voltage. The other control lines have
a pull-up resistor (10 kΩ) in the event of open drain output
stages. These resistors are not necessary for LOW/HIGH
output ports of the microcontroller having internal pull-up
or push-pull stages. The values and tolerances of these
components are given in this figure. Table 4 shows the
conversion logic truth table.
For information about programming the different operation
mode selections see Section “Operating mode selection”.
Power supply
The different supply voltages and currents required for the
analog and digital circuits are derived from an internal
band-gap reference circuit. The AF reference voltage is
1
⁄2VP. For a fast setting to1⁄2VP an internal start-up circuit
is added. A good ripple rejection is achieved with the
external capacitor C
the high ohmic input of the1⁄2VPpin (pin 8). No additional
DC load on this pin is allowed.
Power-On Reset (POR)
When a POR is activated by switching on the supply
voltage or because of a supply voltage breakdown, the
117/274 Hz DPLL, the 117/274 Hz integrator and the logic
will be reset. Both AF channels (main and SCART) are
muted (≤1 ms).
ESD protection
All pins are ESD protected. The protection circuits
represent the latest state of the art.
Internal circuit
The internal pin configuration is given in Fig.7.
= 100 µF/16 V in conjunction with
ref
The operation mode mute (see Table 1) can be achieved
from any position of the C4 control line without going via
3-state.
1995 May 238
Page 9
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
TDA9847
with digital identification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
P
V
i
V
i
V
i
T
stg
T
amb
V
es
Note
1. Charge device model class B: discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOLPARAMETER VALUE UNIT
R
th j-a
supply voltage (pin 22)−0.3+10V
input voltage at pins 1 to 3 and 24−0.3+9.0V
input voltage at pins 4 to 17, 21 and 23−0.3V
P
input voltage at pins 18 and 19−0.3+10V
storage temperature−25+150°C
operating ambient temperature 0+70°C
electrostatic handling for all pinsnote 1−±300V
thermal resistance from junction to ambient in free air
SDIP2469K/W
SO2495K/W
V
CHARACTERISTICS
=5V; T
V
P
=25°C; nominal input signal V
amb
= 0.25 V RMS value (FM: 54% modulation is equivalent to
i1, 2
∆f=±27 kHz); nominal input signal Vi1= 0.5 V RMS value (AM: m = 0.54); nominal input signal
V
= 0.25 V RMS value (AM: m = 0.54); nominal output signal V
operating oscillator frequency
(running in parallel resonance
mode)
over operating
temperature range
including ageing and
9.98810.00810.028MHz
influence of drive
circuit
equivalent crystal series
resistance
even at extremely low
drive level (<1 pW)
−60200Ω
over operating
temperature range
with C0=6pF
crystal series resistance of
2 × R
r
−− Ω
unwanted mode
crystal parallel capacitancewith Rr≤ 100 Ω−610pF
crystal motional capacitance−2550fF
level of drive in operation−−5µW
oscillator operating voltage
500550600mV
(peak-to-peak value)
Pilot processing
V
i pil(rms)
pilot input voltage level at pin 7
unmodulated5−100mV
(RMS value)
R
i pil
C
i pil
pilot input resistance5001000−kΩ
pilot input capacitance−−3pF
mmodulation depthAM255075%
1995 May 2311
Page 12
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
TDA9847
with digital identification
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
∆f
pil
t
pil
f
LP
R
5
V
5(rms)
Q
L
t
acqui AGC
pilot PLL pull-in frequency
range (referenced to
f
= 54.6875 kHz)
pil
f
= 9.988 MHz
osc
lower side−405−−405Hz
upper side192−192Hz
= 10.008 MHz
f
osc
lower side−296−−296Hz
upper side302−302Hz
= 10.028 MHz
f
osc
lower side−188−−188Hz
upper side411−411Hz
pilot PLL pull-in time0−1.7ms
low-pass frequency response−3 dB450600750Hz
low-pass output resistance18.752531.25kΩ
identification threshold voltage
−−70mV
(RMS value)
loaded quality factor of
resonance circuit
loaded quality factor of
resonance circuit with fixed
high sensitivity;
see Fig.1
sensitivity loss
2 to 3 dB; see Fig.2
40−50
−12−
coil
AGC acquisition timeV
switched from
i pil(rms)
−−0.1s
0 to 100 mV (RMS
value)
Identification (internal functions)
V
i tuner
C/Npilot carrier-to-noise ratio for
identification voltage sensitivity note 4−28−dBµV
note 5−33-dB/Hz
start of identification
Hhysteresisnote 4−−2dB
f
det
pull-in frequency range of
identification PLL (referred to
f
det stereo
f
det dual
= 117.48 Hz and
= 274.12 Hz)
lower side
stereo−0.63−−0.63Hz
dual−0.69−−0.69Hz
upper side
stereo0.63−0.63Hz
dual0.69−0.69Hz
t
det
f
ident
t
integr
pull-in time of identification
PLL (referenced to
f
det stereo
f
det dual
= 117.48 Hz and
= 274.12 Hz)
identification window
frequency width (referred to
f
det stereo
f
det dual
= 117.48 Hz and
= 274.12 Hz)
integrator time constant0.94−0.94s
stereo0−0.8s
dual0−0.8s
stereo; note 62.2−2.2Hz
dual; note 62.3−2.3Hz
1995 May 2312
Page 13
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
TDA9847
with digital identification
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
t
ident(on)
t
ident(off)
LED (pins 18 and 19)
V
L(off)
V
L(on)
I
L(off)
I
L(on)
Control input ports C1 to C3 (pins 1, 2 and 24)
V
IL
V
IH
I
IL
I
IH
Control input Port C4 (pin 3)
V
IL
V
CT
V
IH
I
IL
I
CT
I
IH
t
h1
t
h2
t
su1
t
su2
Notes to the characteristics
1. Vo= 0.5 V (RMS value); f = 1 kHz.
2. Without de-emphasis capacitors with respect to nominal gain.
3. In dual mode: A (B)-signal into B (A) channel; in stereo mode: R-signal into left channel; L-signal = 0.
4. Tuner input signal, measured with PCALH reference front end (
PC/SC1= 13 dB; PC/SC2= 20 dB. The pilot band-pass has to be aligned.
5. Bandwidth of the pilot BP-filter B
noise.
6. Identification window is defined as twice the pull-in frequency range (lower plus upper side) of identification PLL
(steady detection) plus window increase due to integrator (fluctuating detection).
7. The maximal total system identification time on is equal to t
8. The maximal total system identification time off is equal to t
total identification time onstereo; note 70.35−2.0s
dual; note 70.35−2.0s
total identification time offstereo; note 80.60−1.5s
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
OUTLINE
VERSION
SOT234-1
max.
4.70.513.8
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
cEeM
0.32
0.23
(1)(1)
D
22.3
21.4
9.1
8.7
E
12
(1)
Z
L
3.2
2.8
EUROPEAN
PROJECTION
M
10.7
10.2
E
12.2
10.5
e
1
w
H
0.181.77810.16
ISSUE DATE
92-11-17
95-02-04
max.
1.6
1995 May 2322
Page 23
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
SO24: plastic small outline package; 24 leads; body width 7.5 mm
D
c
y
Z
24
13
TDA9847
SOT137-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A1A2A
0.30
2.45
0.10
2.25
0.012
0.096
0.004
0.089
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
15.6
15.2
0.61
0.60
12
w M
b
p
scale
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.42
0.39
A
1.4
0.055
Q
2
A
1
detail X
1.1
1.1
0.4
0.043
0.016
1.0
0.043
0.039
0.25
0.01
L
p
L
(A )
0.250.1
0.01
A
3
θ
ywvθ
Z
0.9
0.4
0.035
0.004
0.016
o
8
o
0
OUTLINE
VERSION
SOT137-1
IEC JEDEC EIAJ
075E05 MS-013AD
REFERENCES
1995 May 2323
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
Page 24
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
SOLDERING
Plastic dual in-line packages
Y DIP OR WAVE
B
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
EPAIRING SOLDERED JOINTS
R
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
Plastic small outline packages
YWAVE
B
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
TDA9847
Y SOLDER PASTE REFLOW
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
R
IRON OR PULSE
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
-HEATED SOLDER TOOL)
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
1995 May 2324
Page 25
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
TDA9847
with digital identification
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 May 2325
Page 26
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
NOTES
TDA9847
1995 May 2326
Page 27
Philips SemiconductorsPreliminary specification
TV and VTR stereo/dual sound processor
with digital identification
NOTES
TDA9847
1995 May 2327
Page 28
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/02/pp28Date of release: 1995 May 23
Document order number:9397 750 00154
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