Datasheet TDA9818T, TDA9818, TDA9817TS, TDA9817T, TDA9817 Datasheet (Philips)

Download

Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA9817; TDA9818

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

Preliminary speciﬁcation Supersedes data of 1997 May 12 File under Integrated Circuits, IC02

2001 Oct 19

Page 2

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

FEATURES

• 5 V supply voltage

• Applicable for Intermediate Frequencies (IFs) of

38.9, 45.75 and 58.75 MHz

• Gain controlled wide band Video IF (VIF) amplifier (AC-coupled)

• True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics and excellent pulse response)

• Robustness for over-modulation better than 105% due to gated phase detector at L/L accent standard and PLL-bandwidth controlat negative modulated standards

• Voltage Controlled Oscillator (VCO) frequency switchablebetweenL and L accent(alignmentexternal) picture carrier frequency

• VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector for B/G, peak white detector for L; signal controlled reaction time for L

• Tuner AGC with adjustable TakeOver Point (TOP)

• Automatic Frequency Control (AFC) detector without

extra reference circuit

TDA9817; TDA9818

• AC-coupled limiter amplifier for sound intercarrier signal

• Alignment-free FM Phase-Locked Loop (PLL)

demodulator with high linearity

• Sound IF (SIF) input for single reference Quasi Split Sound (QSS) mode (PLL controlled); SIF AGC detector for gain controlled SIF amplifier; single reference QSS mixer able to operate in high performance single reference QSS mode and in intercarrier mode

• AM demodulator without extra reference circuit

• Stabilizer circuit for ripple rejection and to achieve

constant output signals

• ElectroStatic Discharge (ESD) protection for all pins.

GENERAL DESCRIPTION

The TDA9817 is an integrated circuit for single standard vision IF signal processing and FM demodulation.

The TDA9818 is an integrated circuit for multistandard vision IF signal processing, sound AM and FM demodulation.

ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA9817 SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 TDA9817T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 TDA9817TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 TDA9818 SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 TDA9818T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 TDA9818TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

PACKAGE

2001 Oct 19 2

Page 3

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

i(VIF)(rms)

o(CVBS)(p-p)

v(−3dB)

S/N

IM(1.1)

IM(3.3)

H(sup)

i(SIF)(rms)

o(FM)(rms)

o(AM)(rms)

THD

audio

S/N

W(audio)

supply voltage 4.5 5 5.5 V supply current 76 90 104 mA vision IF input signal voltagesensitivity

−1 dB video at output − 60 100 µV

(RMS value) video output signal voltage

0.97 1.1 1.23 V

(peak-to-peak value)

−3 dB video bandwidth on pin CVBS B/G and L standard;

78−MHz

CL< 50 pF; RL>1kΩ; AC load weighted signal-to-noise ratio for video 56 60 − dB intermodulation attenuation at ‘blue’ f = 1.1 MHz 58 64 − dB intermodulation attenuation at ‘blue’ f = 3.3 MHz 58 64 − dB suppression of video signal harmonics 35 40 − dB sound IF input signal voltage

−3 dB at intercarrier output − 50 100 µV

sensitivity (RMS value) audio output signal voltage for FM

(RMS value)

B/G standard; 27 kHz,

54% modulation

M/N standard;

0.4 0.5 0.6 V

0.36 0.45 0.54 V

25 kHz modulation audio output signal voltage for AM

L standard; 54% modulation 0.4 0.5 0.6 V (RMS value)

total harmonic distortion audio signal 54% modulation

FM − 0.2 0.5 % AM − 0.5 1.0 %

weighted signal-to-noise ratio audio

54% modulation signal

FM 55 60 − dB AM 47 53 − dB

2001 Oct 19 3

Page 4

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

2001 Oct 19 4

L/L accent switch

and adjust

2 × f

VIF

SAW

SIF

SAW

TAGC

VIF1 VIF2

SIF1 SIF2

TUNER

AGC

1 2

23 24

VIF AMPLIFIER FPLL

SIF AMPLIFIER

VAGC

BLTOP LADJ VCO2 VCO1

(1)

422

VIF

AGC

PLL

615

(1)

QSS MIXER

INTERCARRIER MIXER

AM DEMODULATOR

VCO TWD

AFC

DETECTOR

VIDEO DEMODULATOR AND AMPLIFIER

AFC

VOLTAGE

REFERENCE

GND

2021171819

CVBS

1.1 V (p-p)

SOUND

TRAP

video 1 V (p-p)

audio

BLOCK DIAGRAM

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

FM-PLL/AM demodulators

intercarrier

mode

SIF

AGC

(1) Not connected for TDA9817, TDA9817T and TDA9817TS.

INTERCARRIER

MODE SWITCH

5 C

SAGC

standards

selection

switch

(1)

TDA9817 TDA9818

Fig.1 Block diagram.

12 QSSSTD

5.5 MHz

handbook, full pagewidth

FM-PLL

DEMODULATOR

10 11

de-em

mute

switch

de-em

DEC

MHA663

TDA9817; TDA9818

Page 5

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PINNING

SYMBOL PIN DESCRIPTION

VIF1 1 VIF differential input signal voltage 1 VIF2 2 VIF differential input signal voltage 2 STD 3 standards selection switch; note 1 C

VAGC

SAGC

PLL

LADJ 7 L/L accent switch and adjust; note 1 AF 8 audio output V

de-em

DEC

QSS 12 single reference QSS/intercarrier

TAGC 14 tuner AGC output C

CVBS 16 composite video output voltage AFC 17 AFC output VCO1 18 VCO1 resonance circuit VCO2 19 VCO2 resonance circuit GND 20 ground V

TOP 22 tuner AGC takeover point adjust SIF1 23 SIF differential input signal voltage1 SIF2 24 SIF differential input signal voltage2

4 VIF AGC capacitor 5 SIF AGC capacitor 6 PLL ﬁlter

9 de-emphasis output 10 de-emphasis input 11 decoupling capacitor

output voltage

13 sound intercarrier input voltage

15 black level detector; note 1

21 supply voltage

handbook, halfpage

C C

LADJ

V C

(1) Not connected for TDA9817.

VIF1 VIF2

STD

VAGC SAGC

PLL

de-em de-em

DEC QSS

1 2

(1)

3 4 5 6

(1)

7 8

9 10 11 12

Fig.2 Pin configuration SDIP24.

TDA9817; TDA9818

SIF2

SIF1

TOP

GND

VCO2

MHA664

VCO1

AFC

CVBS

(1)

TAGC

14 13

TDA9818 TDA9817

Note

1. Not connected for TDA9817, TDA9817T and TDA9817TS.

2001 Oct 19 5

Page 6

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

handbook, halfpage

STD

VAGC

SAGC

LADJ

de-em

de-em C

VIF1 VIF2

PLL

DEC

QSS

1 2

(1)

3 4 5 6

TDA9818T

7 8

9 10 11 12

TDA9817T

(1)

MGU397

SIF2

SIF1

TOP

GND

VCO2

VCO1

AFC

CVBS

(1)

TAGC FM

handbook, halfpage

STD

VAGC

SAGC

LADJ

de-em

de-em C

VIF1 VIF2

PLL

DEC QSS

(1)

10 11 12

TDA9817; TDA9818

1 2 3 4 5 6

TDA9818TS TDA9817TS

7 8 9

MGU398

SIF2

SIF1

TOP

GND

VCO2

VCO1

AFC CVBS

(1)

TAGC FM

(1) Not connected for TDA9817T.

Fig.3 Pin configuration SO24.

2001 Oct 19 6

(1) Not connected for TDA9817TS.

Fig.4 Pin configuration SSOP24.

Page 7

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

FUNCTIONAL DESCRIPTION

The integrated circuit comprises the functional blocks as shown in Fig.1:

• Vision IF amplifier and VIF AGC detector

• Tuner AGC

• Frequency Phase Locked Loop detector (FPLL)

• VCO, Travelling Wave Divider (TWD) and AFC

• Video demodulator and amplifier

• Sound IF amplifier and SIF AGC

• Single reference QSS mixer

• AM demodulator

• FM-PLL demodulator

• Audio Frequency (AF) signal processing

• Internal voltage stabilizer.

Vision IF ampliﬁer and VIF AGC detector

The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration.

The AGC detector generates therequired VIF gain control voltage for constant video output by charging/discharging the AGC capacitor. Therefore for negative video modulation the sync level and for positive video modulation the peak white level of the video signal is detected. In order to reduce the reaction time for positive modulation, where a very large time constant is needed, an additional level detector increases the discharging current of the AGC capacitor (fast mode) in the event of a decreasing VIF amplitude step. The additional level information is given by the black-level detector voltage.

Tuner AGC

The AGC capacitor voltage is converted to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted at pin TADJ. This allows to match the tuner to the SAW filter in order to achieve the optimum IF input level.

Frequency Phase Locked Loop detector (FPLL)

The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current

TDA9817; TDA9818

proportionalto the phase differencebetween the VCO and the input signal. The DC current of either frequency detector or phase detector is converted into a DC voltage viathe loop filter, whichcontrols the VCO frequency.Inthe event of positive modulated signals the phase detector is gated by composite sync in order to avoid signal distortion for overmodulated VIF signals.

VCO, Travelling Wave Divider (TWD) and AFC

The VCO operates with a resonance circuit (with L and C in parallel) at double the picture carrier frequency. The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to actually double the picture carrier frequency is generated by the frequency-phase detector (FPLL) and fed via the loop filter to the first variable capacitor. This control voltage is amplified and additionally converted into a current which represents the AFC output signal. At centre frequency the AFC output current is equal to zero.

For TDA9818: the VCO centre frequency can be decreased (required for L accent standard) by activating an additional internal capacitor. This is achieved by using the L accent switch. In this event the second variable capacitor can be controlled by a variable resistor at the L accentswitchforsettingtheVCOcentrefrequencytothe required L accent value.

The oscillator signal is divided by 2 with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency.

Video demodulator and ampliﬁer

The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the ‘in phase’ signal of the travelling wave divider output. In the demodulator stage the video signal polarity can be switched in accordance with the TV standard.

The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics for B/G and L standard. The standard dependent level shift in this stage delivers the same sync level for positive and negative modulation. The video output signal at pin CVBS is 1.1 V (p-p) for nominal vision IF modulation, in order to achieve 1 V (p-p) at sound trap output.

2001 Oct 19 7

Page 8

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

Sound IF ampliﬁer and SIF AGC

The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration.

The SIF AGC detector is related to the SIF input signal (average level of AM or FM carrier) and controls the SIF amplifier to provide a constant SIF signal to the AM demodulator and single reference QSS mixer. At L standard (AM sound) the SIF AGC reaction time is set to ‘slow’ for nominal video conditions. But with a decreasing VIF amplitude step the SIF AGC is set to ‘fast’ mode controlled by the VIF AGC detector. In FM mode this reaction time is always ‘fast’.

Single reference QSS mixer

The single reference QSS mixeris realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass for attenuation of the video signal components to the output pin QSS. With this system a high performance hi-fi stereo sound processing can be achieved.

For a simplified application without a sound IF SAW filter the single reference QSS mixer can be switched to the intercarrier mode byconnecting pin SIF2 to ground. In this mode the sound IF passes the vision IF SAW filter and the composite IF signal is fed to the single reference QSS mixer. This IF signal is multiplied with the 90 degree TWD output signal for converting the sound IF to intercarrier frequency. This composite intercarrier signal is fed to the output pin QSS, too. By using this quadrature detection, the low frequency video signals are removed.

AM demodulator

The AM demodulator is realized by a multiplier. The modulated SIF amplifier output signal is multiplied in phase with the limited (AM is removed) SIF amplifier output signal. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the AF amplifier.

TDA9817; TDA9818

FM-PLL demodulator

The FM-PLL demodulator consists of a limiter and an FM-PLL. The limiter provides the amplification and limitation of the FM sound intercarrier signal. The result is high sensitivity and AM suppression. The amplifier consists of 7 stages which are internally AC-coupled in order to minimize the DC offset.

Furthermore the AF output signal can be muted by connecting a resistor between the limiter input pin FM and ground.

TheFM-PLL consists of anintegrated relaxation oscillator, an integrated loop filter and a phase detector. The oscillator is locked to the FM intercarrier signal, output from the limiter. As a result of locking, the oscillator frequency tracks with the modulation of the input signal and the oscillator control voltage is superimposed by the AF voltage. The FM-PLL operates as an FM demodulator.

Audio Frequency signal processing

The AF amplifier consists of two parts:

1. The AF pre-amplifier for FM sound is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by approximately 33 dB. The low-pass characteristicoftheamplifierreducestheharmonicsof the intercarrier signal at the sound output terminal pin V sound is applied. An additional DC control circuit is implemented to keep the DC level constant, independent of process spread.

2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail outputstage. This amplifier makes use of an input selector for switching to AM, FM de-emphasis or mute state, controlled by the standard switching voltage and the mute switching voltage.

Internal voltage stabilizer

The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage.

at which the de-emphasis network for FM

de-em

2001 Oct 19 8

Page 9

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

sc(max)

TAGC

stg

amb

esd

supply voltage TDA9817, TDA9817T,

TDA9818 and TDA9818T: maximum chip temperature of 120 °C; note 1

TDA9817TS and TDA9818TS: maximum chip temperature of 130 °C; note 1

voltage at pins VIF1, VIF2, STD, C C

, T

SAGC

PLL

, V

de-em

, C

de-em

, C

DEC

VAGC

, FMin,

TAGC, CBL, AFC, VP, TOP, SIF1 and SIF2 maximum short-circuit time to ground or V

tuner automatic gain control output voltage 0 13.2 V storage temperature −25 +150 °C ambient temperature −20 +70 °C electrostatic handling voltage note 2 −300 +300 V

− 5.5 V

− 10 s

Notes

1. I

= 104 mA; T

TDA9818T, R

=70°C; R

amb

= 110 K/W for TDA9817TS and TDA9818TS.

th(j-a)

= 65 K/W for TDA9817 and TDA9818, R

th(j-a)

= 85 K/W for TDA9817T and

th(j-a)

2. Machine model class B (L = 2.5 µH).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air

TDA9817; TDA9818 65 K/W TDA9817T; TDA9818T 85 K/W TDA9817TS; TDA9818TS 110 K/W

2001 Oct 19 9

Page 10

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

CHARACTERISTICS

VP=5V; T peak white level for L); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier B/G: 10%; L = 3%; video signal in accordance with Fig.15; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin V

Vision IF ampliﬁer (pins VIF1 and VIF2)

i(VIF)(rms)

i(VIF)(max)(rms)

∆V

(IF)(int)

IF(ctrl)

i(dif)

I(VIF)

True synchronous video demodulator; note 3 f

VCO(max)

∆f

/∆T oscillator drift as a function

osc

∆f

/∆V

osc

VCO(rms)

cr(pc)

∆f

pc(fr)

algn(Laccent)

acq

=25°C; see Table 1 for input frequencies and levels; input level V

amb

“CCIR, line 17”

)

supply voltage note 1 4.5 5 5.5 V supply current 76 90 104 mA

input signal voltage sensitivity (RMS value)

maximum input signal voltage (RMS value)

internal IF amplitude difference between picture and sound carrier

B/G standard; −1 dB video at output

B/G standard; 1 dB video at output

within AGC range; B/G standard;

∆f = 5.5 MHz IF gain control range see Fig.5 65 70 − dB differential input resistance note 2 1.7 2.2 2.7 kΩ differential input

note 2 1.2 1.7 2.5 pF capacitance

DC input voltage note 2 − 3.4 − V

maximum oscillator

f=2f

frequency for carrier regeneration

oscillator is free-running; of temperature

oscillator shift as a function of supply voltage

= 0; note 4

AFC

oscillator is free-running;

note 4 oscillator voltage swing at

pins VCO1 and VCO2 (RMS value)

picture carrier capture range

picture carrier frequency (free-running) accuracy

L accent alignment

B/G, M/N and L standard ±1.4 ±1.8 − MHz

L accent standard;

= 33.9 MHz;

= 5.6 kΩ

LADJ

L accent standard;

fpc= 33.9 MHz;

= 5.6 kΩ

LADJ

L accent standard; I

AFC

frequency range acquisition time BL = 70 kHz; note 5 −−30 ms

i(VIF)(rms)

“NTC-7 Composite”

= 10 mV (sync level for B/G,

; measurements taken in

− 60 100 µV

120 200 − mV

− 0.7 1 dB

125 130 − MHz

−−±20 × 10−6K

−−±1.5 × 10−3V

50 80 110 mV

±0.9 ±1.2 − MHz

−±200 ±400 kHz

=0 ±400 ±600 − kHz

−1

2001 Oct 19 10

Page 11

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

i(VIF)(sens)(rms)

Composite video ampliﬁer (pin CVBS); sound carrier off

o(CVBS)(p-p)

V/S ratio between video

∆V

o(CVBS)

sync

clip(u)

clip(l)

bias(int)

o(sink)(max)

o(source)(max)

∆V

o(CVBS)(B/G)

∆V

o(BL)(B/G)

∆V

o(BL)(L)

dif

v(−1dB)

v(−3dB)

S/N

S/N unweightedsignal-to-noise

VIF input signal voltage

maximum IF gain; note 6 − 30 70 µV sensitivity for PLL to be locked (RMS value); pins VIF1 and VIF2

output signal voltage

see Fig.10 0.97 1.1 1.23 V (peak-to-peak value)

1.9 2.33 3.0 (black-to-white) and sync level

output signal voltage difference

difference between B/G and L standard

−−±12 %

sync voltage level B/G and L standard 1.4 1.5 1.6 V upper video clipping

VP− 1.1 VP− 1 − V

voltage level lower video clipping

− 0.7 0.9 V voltage level

output resistance note 2 −−10 Ω internal DC bias current for

2.2 3.0 − mA emitter-follower

maximum AC and DC

1.6 −− mA output sink current

maximum AC and DC

2.9 −− mA output source current

deviation of CVBS output signal voltage at

50 dB gain control −−0.5 dB 30 dB gain control −−0.1 dB

B/G standard black level tilt in

gain variation; note 7 −−1%

B/G standard vertical black level tilt for

worst case in L standard

vision carrier modulated by test line (VITS) only; gain

−−1.9 %

variation; note 7 differential gain differential phase

−1 dB video bandwidth B/G and L standard;

“CCIR, line 330”

− 25 %

− 1 2 deg

56− MHz CL< 50 pF; RL> 1kΩ; AC load

−3 dB video bandwidth B/G and L standard;

78− MHz CL< 50 pF; RL> 1kΩ; AC load

weighted signal-to-noise

see Fig.7; note 8 56 60 − dB

ratio

see Fig.7; note 8 49 53 − dB

ratio

2001 Oct 19 11

Page 12

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IM(1.1)

IM(3.3)

∆f

unwanted(p-p)

∆ϕ robustness for modulator

vc(rms)

H(sup)

H(spur)

PSRR power supply ripple

VIF AGC detector (pins C

dch

resp(inc)

resp(dec)

∆IF VIF amplitude step for

th(CBL)

intermodulation attenuation at ‘blue’

intermodulation attenuation at ‘yellow’

intermodulation attenuation at ‘blue’

intermodulation attenuation at ‘yellow’

robustness for unwanted frequency deviation of picture carrier (peak-to-peak value)

imbalance

f = 1.1 MHz; see Fig.8; note 9

f = 3.3 MHz; see Fig.8; note 9

L standard; residual carrier: 3%; serration pulses: 50%; note 2

L standard; residual carrier: 0%;

58 64 − dB

60 66 − dB

58 64 − dB

59 65 − dB

−−12 kHz

−−3%

serration pulses: 50%; note 2

residual vision carrier (RMS value)

fundamental wave and harmonics; B/G and

− 25 mV

L standard

suppression of video

note 10a 35 40 − dB

signal harmonics spurious elements note 10b 40 −− dB

video signal; grey level;

rejection at pin CVBS

see Fig.13

B/G standard 30 35 − dB L standard 26 30 − dB

and CBL)

VAGC

charging current B/G and L standard; note 7 0.75 1 1.25 mA additional charging current L standard in event of

1.9 2.5 3.1 µA missing VITS pulses and no white video content

discharging current B/G standard 15 20 25 µA

normal mode L 225 300 375 nA fast mode L 30 40 50 µA

AGC response to an increasing VIF step

AGC response to a decreasing VIF step

B/G and L standard;

− 0.05 0.1 ms/dB note 11

B/G standard − 2.2 3.5 ms/dB fast mode L − 1.1 1.8 ms/dB normal mode L; note 11 − 150 240 ms/dB L standard −2 −6 −10 dB

activating fast AGC mode threshold voltage level

additional charging current

see Fig.10

L standard 1.95 2.0 2.05 V L standard; fast mode L 1.6 1.66 1.72 V

2001 Oct 19 12

Page 13

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Tuner AGC (pin TAGC)

i(rms)

IF input signal voltage for minimum starting point of tuner takeover (RMS value)

IF input signal voltage for maximum starting point of tuner takeover (RMS value)

o(TAGC)

sat(TAGC)

∆V

TOP(TAGC)

permissible output voltage from external source;

saturation voltage I

/∆T variation of takeover point

by temperature

TAGC(sink)

∆G

sink current see Fig.5

IF slip by automatic gain

control AFC circuit (pin AFC); see Fig.9; note 12 CR

stps

∆f

/∆T frequency variation by

control steepness ∆I

AFC

temperature

o(AFC)

o(source)(AFC)

o(sink)(AFC)

∆I

AFC(p-p)

output voltage upper limit VP− 0.6 VP− 0.3 − V

output source current 150 200 250 µA

output sink current 150 200 250 µA

residual video modulation

current

(peak-to-peak value)

input at pins VIF1 and VIF2; R I

TAGC

TOP

= 0.4 mA

input at pins VIF1 and VIF2; R I

TAGC

TOP

= 0.4 mA

=22kΩ;

=0Ω;

− 25 mV

50 100 − mV

−−13.2 V

note 2

= 1.5 mA −−0.2 V

TAGC

= 0.4 mA − 0.03 0.07 dB/K

TAGC

no tuner gain reduction; V

= 13.2 V

TAGC

maximum tuner gain

−−5 µA

1.5 2 2.6 mA

reduction

tuner gain current from

− 68 dB

20% to 80%

/∆f note 13

33.9 MHz 0.5 0.75 1.0 µA/kHz

38.9 MHz 0.5 0.75 1.0 µA/kHz

45.75 MHz 0.45 0.65 0.85 µA/kHz

58.75 MHz 0.38 0.55 0.72 µA/kHz

B/G and L standard; I

= 0; note 4

AFC

L accent standard; I

= 0; note 4

AFC

−−±20 × 10−6K

−−±60 × 10−6K

lower limit − 0.3 0.6 V

B/G and L standard − 20 30 µA

−1

2001 Oct 19 13

Page 14

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Sound IF ampliﬁer (pins SIF1 and SIF2)

i(SIF)(rms)

input signal voltage

sensitivity (RMS value)

i(max)(rms)

maximum input signal

voltage (RMS value)

SIF(ctrl)

i(dif)

SIF gain control range FM and AM mode;

differential input resistance note 2 1.7 2.2 2.7 kΩ

differential input

capacitance V

I(SIF)

SIF,VIF

DC input voltage − 3.4 − V

crosstalk attenuation

between SIF and VIF

inputs

SIF AGC detector (pin C

ch(CSAGC)

dch(CSAGC)

charging current FM mode 8 12 16 µA

discharging current FM mode 8 12 16 µA

SAGC

)

Single reference QSS intercarrier mixer (B/G standard; pin QSS)

o(rms)

IF intercarrier output level

(RMS value)

o(peak)

IF intercarrier output level

(peak value)

s(−3dB)

−3 dB intercarrier

bandwidth

sc(rms)

residual sound carrier

(RMS value)

FM mode; −3 dB at

− 50 100 µV

intercarrier output pin QSS AM mode; −3 dB at

− 50 100 µV

AF output pin AF FM mode; 1 dB at

65 100 − mV

intercarrier output pin QSS AM mode; 1 dB at

65 100 − mV

AF output pin AF

60 66 − dB

see Fig.6

note 2 1.2 1.7 2.5 pF

between pins VIF1

50 −− dB and VIF2, and pins SIF1 and SIF2; note 14

AM mode 0.8 1.2 1.6 µA

normal mode AM 1 1.4 1.8 µA fast mode AM 60 85 110 µA

QSS mode;

100 140 180 mV sound carrier 1; sound carrier 2 off

L standard; without

100 140 180 mV modulation

intercarrier mode;

− note 15 − mV sound carrier 1; sound carrier 2 off

QSS mode 141 198 225 mV L standard;

255 356 458 mV

80% AM modulation upper limit 7.5 9 − MHz

QSS mode; fundamental

− 25 mV wave and harmonics

intercarrier mode;

− 25 mV fundamental wave and harmonics

2001 Oct 19 14

Page 15

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

vc(rms)

H(sup)

o(QSS)

O(QSS)

int(QSS)

sink(max)(QSS)

source(max)(QSS)

Limiter ampliﬁer (pin FMin); note 16

residual vision carrier (RMS value)

QSS mode; fundamental wave and harmonics

intercarrier mode;

− 25 mV

− 520 mV

fundamental wave and harmonics

suppression of video signal harmonics

intercarrier mode; f

≤ 5 MHz

video

39 −− dB

output resistance note 2 −−25 Ω DC output voltage − 2.0 − V DC internal bias current for

1.9 2.5 − mA

emitter follower maximum AC and DC

1.4 1.9 − mA

output sink current maximum AC and DC

3.0 3.5 − mA

output source current

i(FMin)(rms)

input signal voltage for lock-in (RMS value)

i(FMin)(rms)

input signal voltage (RMS value)

allowed input signal voltage (RMS value)

i(FMin)

I(FMin)

AM suppression 50 µs de-emphasis;

input resistance note 2 480 600 720 Ω DC input voltage − 2.8 − V

FM-PLL demodulator

acq

catching range of PLL upper limit 7.0 −− MHz

holding range of PLL upper limit 9.0 −− MHz

acquisition time −−4 µs

−−100 µV

SN+

 

-------------N

weighted

− 250 400 µV

40 dB=

200 −− mV

46 50 − dB AM: f = 1 kHz; m = 0.3 refer to 27 kHz (54% FM deviation)

lower limit −−4.0 MHz

lower limit −−3.5 MHz

2001 Oct 19 15

Page 16

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

FM operation (B/G standard; pin AF); notes 16 and 16a

o(AF)(rms)

AF output signal voltage (RMS value)

o(AF)(clip)

AF output clipping signal voltage level

∆f

∆V

/∆T temperature drift of

frequency deviation THD < 1.5%; note 17 −−±53 kHz

AF output signal voltage

de-em(DC)

DC voltage at decoupling capacitor

sink(max)(AF)

output resistance note 2 −−100 Ω DC output voltage − 2.3 − V maximum AC and DC

output sink current

source(max)(AF)

maximum AC and DC output source current

AF(−3dB)

−3 dB audio frequency bandwidth

THD total harmonic distortion 27 kHz

S/N

weighted signal-to-noise ratio

sc(rms)

residual sound carrier (RMS value)

mute attenuation of AF signal

∆V

DC jump voltage of AF output terminal for switching AF output to mute state and vice versa

PSRR power supply ripple

rejection at pin AF

27 kHz (54% FM deviation); see Fig.15; note 17

= 470 Ω 200 250 300 mV

=0Ω 400 500 600 mV

25 kHz

360 450 540 mV (50% FM deviation);

=0Ω; see Fig.15;

note 17 THD < 1.5% 1.0 − 1.2 V

−3

voltagedependentonVCO

− 3 × 10−37 × 10

1.2 − 3.0 V

frequency; note 18

−−0.5 mA

without de-emphasis

100 125 − kHz capacitor

− 0.2 0.5 %

(54% FM deviation) FM-PLL only; with 50 µs

55 60 − dB de-emphasis; 27 kHz (54% FM deviation);

“CCIR 468-4”

fundamental wave and

−−75 mV

harmonics B/G and L standard 70 75 − dB

FM-PLL in lock mode −±50 ±150 mV

=0Ω; f = 70 Hz;

20 26 − dB see Figs 13 and 15

dB/K

2001 Oct 19 16

Page 17

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Single reference QSS AF performance for FM operation (B/G standard); see Table 1; notes 19, 20 and 21

S/N

weighted signal-to-noise ratio

Intercarrier AF performance for FM operation (standard B/G); see Table 1; notes 19, 20 and 22 S/N

weighted signal-to-noise ratio

AM operation (L standard; pin AF); note 23 V

o(AF)(rms)

AF output signal voltage

(RMS value) THD total harmonic distortion 54% modulation − 0.5 1.0 % B

AF(−3dB)

S/N

−3 dB AF bandwidth 100 125 − kHz

weighted signal-to-noise

ratio V

DC potential voltage − 2.3 − V PSRR power supply ripple

rejection at pin AF

Switching level for standard switch (pin STD)

logic

DC potential for logic

HIGH or pin not connected

DC potential for logic LOW L/L accent standard 0 − 0.8 V I

LOW level input current Vi= 0 V 190 250 310 µA

pc/sc1 ratio at pins VIF1

40 −− dB and VIF2; 27 kHz (54% FM deviation);

“CCIR 468-4”

black picture 53 58 − dB white picture 50 55 − dB 6 kHz sine wave

42 48 − dB

(black-to-white modulation)

sound carrier

45 51 − dB

subharmonics; f = 2.75 MHz ±3 kHz

pc/sc1 ratio at pins VIF1

27 −− dB andVIF2;27 kHz(54% FM deviation);

“CCIR 468-4”

black picture 47 51 − dB white picture 47 51 − dB 6 kHz sine wave

40 46 − dB

(black-to-white modulation)

sound carrier

35 39 − dB

subharmonics; f = 2.75 MHz ±3 kHz

54% modulation 400 500 600 mV

“CCIR 468-4”

47 53 − dB

see Fig.13 20 26 − dB

B/G standard 2.8 − V

2001 Oct 19 17

Page 18

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

Notes

1. Values of video and sound parameters are decreased at VP= 4.5 V.

2. This parameter is not tested during production and is only given as an application information for designing the television receiver.

3. Loop bandwidth BL = 70 kHz (natural frequency fn= 12 kHz; damping factor d ≈ 3; calculated with sync level within gain control range). Resonance circuit of VCO: Q0> 50; C approximately 2.7 V).

4. Temperature coefficient of external LC circuit is equal to zero.

5. V

i(VIF)(rms)

= 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture

video modulation.

6. VIF signal for nominal video signal.

7. The leakage current of the AGC capacitor should not exceed 1 µA at B/G standard, respectively 10 nA current at L standard. Larger currents will increase the tilt.

8. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin CVBS). B=5MHz weighted in accordance with

“CCIR 567”

9. The intermodulation figures are defined:

at 4.4 MHz

1.1

3.3



--------------------------------------



at 1.1 MHz

at 4.4 MHz



log=

--------------------------------------



at 3.3 MHz

3.6 dB+log=

; α

value at 1.1 MHz referenced to black/white signal;

1.1

value at 3.3 MHz referenced to colour carrier.

3.3

10. Measurements taken with SAW filter K3953 (sound carrier suppression: 40 dB); loop bandwidth BL = 70 kHz: a) Modulation VSB; sound carrier off; f b) Sound carrier on; SIF SAW filter K9453; f

video

> 0.5 MHz.

= 10 kHz to 10 MHz.

video

11. Response speed valid for a VIF input level range of 200 µVupto70mV.

12. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.9. The AFC-steepness can be changed by the resistors at pin AFC.

13. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0> 50; note 3; C0=C

14. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF= 38.9 MHz.

15. Without using an SIF SAW filter the mixer can be switched to intercarrier mode by connecting pin SIF1 and/or pin SIF2 to ground. In this mode the SIF passes the VIF SAW filter and IF intercarrier levels are depending on the sound shelf of the VIF SAW filter. The intercarrier output signal at pin QSS can becalculated by thefollowing formula taking into account the video output signal at pin CVBS (V

i(sc)

dB()6dB 3dB±+

-----------V

i(pc)

o(rms)

1.1 V p p–()

× 10

---------- 22

------------------------------------------------------------- -

×=

= 8.2 pF ±0.25 pF; C

ext

o(CVBS)(p-p)

= 1.1 V typical) as a reference:

where:

≈ 8.5 pF (loop voltage

int

int+Cext

a) = correction term for RMS value

---------- 22

i(sc)

b) = sound-to-picture carrier ratio at VIF inputs in dB

------------- V

i(pc)

(dB)

c) 6 dB = correction term of internal circuitry d) ±3 dB = tolerance of video output and intercarrier output amplitude V

2001 Oct 19 18

o(rms)

Page 19

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

e) Example for SAW filter G1962: sound shelf value = 20 dB,

i(sc)

------------V

i(pc)

16. Input level for second IF from an external generator with 50 Ω source impedance. AC-coupled with 10 nF capacitor, f

= 1 kHz, 27 kHz (54% FM deviation) of audio references. A VIF/SIF input signal is not permitted. Pins C

mod

and C

SAGC

taken at 50 µs de-emphasis at pin V steepness ∆V

a) Second IF input level 10 mV (RMS value).

17. Measured with an FM deviation of 27 kHz the typical AF output signal is 500 mV (RMS) (Rx=0Ω). By using Rx= 470 Ω the AF output signal is attenuated by 6 dB [250 mV (RMS)]. For handling a frequency deviation of more than 53 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended with Rx= 470 Ω.

18. The leakage current of the decoupling capacitor (2.2 µF) should not exceed 1 µA.

19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees b) QSS AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio) better

than 60 dB (deviation 27 kHz) for 6 kHz sine wave black-to-white video modulation

c) Picture-to-sound carrier ratio; pc/sc1 = 13 dB (transmitter).

20. The pc/sc1 ratio is calculated as the addition of TV transmitter pc/sc1 ratio and SAW filter pc/sc1 ratio. This pc/sc1 ratio is necessary to achieve the S/NW values as noted. A different pc/sc1 ratio will change these values.

21. Measurements taken with SAW filter K3953 for vision IF (suppressed sound carrier) and K9453 for sound IF (suppressed picture carrier). Input level V

22. Measurements taken with SAW filter G1962 (sound shelf: 20 dB) for vision and sound IF. Pin SIF1 and/or pin SIF2 has to be connected to ground for switching the single reference QSS mixer to intercarrier mode.

23. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier).

27 dB– V

o(rms)

32 mV (typical value)=⇒=

VAGC

have to be connected to positive supply voltage for minimum IF gain. S/N and THD measurements are

(modulator pre-emphasis has to be activated). The FM demodulator

de-em

/∆fAF is positive.

o(AF)

i(SIF)(rms)

= 10 mV, 27 kHz (54% FM deviation).

Table 1 Input frequencies and carrier ratios

DESCRIPTION SYMBOL B/G STANDARD M/N STANDARD L STANDARD

picture or IF carrier f sound carrier f

or f

sc1

sc2

38.9 45.75/58.75 38.9 33.9 MHz

33.4 41.25/54.25 32.4 40.4 MHz

33.158 −−−MHz

L ACCENT

STANDARD

picture-to-sound carrier sc1 13 7 10 10 dB

sc2 20 −−−dB

2001 Oct 19 19

UNIT

Page 20

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

; R

70 gain (dB)

600.06

206

060

−10 1 2.521.5 3 3.5 4

TOP

=22kΩ.

(3) I (4) I

tuner tuner

; R ; R

TOP TOP

=11kΩ. =0Ω.

handbook, full pagewidth

i(VIF)(rms)

(mV)

0.6

(1) I

tuner

(2) Gain.

TDA9817; TDA9818

(1) (2) (3) (4)

CVAGC

MHA665

(V)

4.5

tuner (mA)

handbook, full pagewidth

100

i(SIF)(rms)

(mV)

0.1

0.01

(dBµV)

Fig.5 Typical VIF and tuner AGC characteristics.

110

100

1 2.521.5 3 3.5 4

CSAGC

MHA666

(V)

4.5

Fig.6 Typical SIF AGC characteristic (FM and AM mode).

2001 Oct 19 20

Page 21

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

handbook, halfpage

S/N (dB)

−60 −40 −20 20

0.06 0.6 6 60060

TDA9817; TDA9818

MED684

i(VIF)(rms)

(dB)

(mV)

Fig.7 Typical signal-to-noise ratio as a function of IF input voltage.

handbook, halfpage

13.2 dB

27 dB

sc cc pc sc cc pc

sc = sound carrier, with respect to sync level. cc = chrominance carrier, with respect to sync level. pc = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter G1962).

3.2 dB

13.2 dB

27 dB

BLUE YELLOW

10 dB

MED685

Fig.8 Input signal conditions.

2001 Oct 19 21

Page 22

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

handbook, full pagewidth

TDA9817 TDA9818

VP = 5 VV

AFC

22 kΩ V

22 kΩ

100

AFC

AFC (V)

2.5

AFC

(µA)

−200

−100

100

200

38.5 38.9 39.3

TDA9817; TDA9818

MHA667

(source current)

(sink current)

f (MHz)

handbook, full pagewidth

Fig.9 Measurement conditions and typical AFC characteristic.

2.6 V

1.83 V

1.5 V

B/G and M/N standard

2.6 V

2.0 V

1.83 V

1.66 V

1.5 V

L standard

white level

black level

sync level

white level

threshold level black level threshold level sync level

MHA668

Fig.10 Typical video signal levels on output pin CVBS (sound carrier off).

2001 Oct 19 22

Page 23

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

Vi (dBµV)

MHA669

handbook, halfpage

(dB)

−10

−30

−50

−70

(1) Signal. (2) AM rejection. (3) Noise.

(1)

(2)

(3)

70 110

handbook, halfpage

(dB)

−10

−30

−50

−70

(1) Signal. (2) THD. (3) Noise.

TDA9817; TDA9818

(1)

(2)

(3)

70 110

Vi (dBµV)

MHA670

1.6 THD

(%)

1.2

0.8

0.4

Fig.11 Typical audio level, noise and AM rejection

(54% FM deviation) for FM.

handbook, full pagewidth

VP = 5 V

TDA9817 TDA9818

MHA671

VP = 5 V

Fig.12 Typical audio level, noise and THD

(54% AM modulation) for AM.

100 mV

= 70 Hz)

ripple

Fig.13 Ripple rejection condition.

2001 Oct 19 23

Page 24

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

(dBµV)

140

120

100

(1)

tuning gain

control range

handbook, full pagewidth

antenna input

SAW insertion

loss 14 dB

IF slip

6 dB

TDA9817; TDA9818

IF signals

RMS value

(V)

video 1.1 V (p-p)

−1

−2

(TOP)

70 dB

VIF AGC

(1) Depends on TOP.

−3

MHA672

0.66 × 10

−4

−5

0.66 × 10

−3

−5

SAW insertion

loss 14 dB

40 dB

RF gain

VHF/UHF tuner VIF

tuner SAW filter

VIF amplifier, demodulator

and video

TDA9817; TD A9818

Fig.14 Front end level diagram.

2001 Oct 19 24

Page 25

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

INTERNAL CIRCUITRY Table 2 Equivalent pin circuits and pin voltages

PIN NO.

1 VIF1 3.4 2 VIF2 3.4

3 STD

SYMBOL

(1)

DC VOLT AGE

(V)

0toV

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

TDA9817; TDA9818

1.1 kΩ

1.1 kΩ800 Ω

3.4 V

3.6 V

26 kΩ

650 µA

MHA673

VAGC

1.5 to 4.0

3.6 V

16 kΩ

24 kΩ

MHA674

40 µA

1 mA

2.5 µA

0.3/20/40 µA

MHA675

2001 Oct 19 25

Page 26

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PIN NO.

6 PLL 1.5 to 4.0

SYMBOL

SAGC

DC VOLT AGE

(V)

1.5 to 4.0

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

TDA9817; TDA9818

15 µA

+++

±1 µA

MHA676

++++

7 LADJ

(1)

0toV

VCO

200 µA

MHA677

17 kΩ

3.6 V

100 µA

9 kΩ 9 kΩ

7.6 kΩ

7.2 kΩ

1 V

2.5 V

MHA678

2001 Oct 19 26

Page 27

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PIN NO.

8 AF 2.3

10 C

SYMBOL

de-em

DC VOLT AGE

(V)

2.3

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

21.7 kΩ

23.7 kΩ

25 pF

TDA9817; TDA9818

120 Ω

MHA679

10 pF 39 kΩ

5.6 kΩ

8.4 kΩ

11 C

DEC

1.2 to 3.0

290 Ω27.4 kΩ

5.6 kΩ

3.5 kΩ

MHA680

90 µA

1 kΩ

MHA681

2001 Oct 19 27

Page 28

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PIN NO.

12 QSS 2.0

13 FM

SYMBOL

DC VOLT AGE

(V)

2.65

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

2.65 V 35 µA

14.7 kΩ

400 Ω

40 kΩ640 Ω

TDA9817; TDA9818

150 Ω

1.9 mA

MHA682

600 µA

MHA683

14 TAGC 0 to 13.2

15 C

(1)

0 to 3.2

MHA684

10 µA

MHA685

5 µA

2.5 µA

30 µA

2.5 µA

0.15 µA

16 µA

2.5 µA

2001 Oct 19 28

Page 29

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PIN NO.

16 CVBS sync level: 1.5

17 AFC 0.3 to V

SYMBOL

DC VOLT AGE

(V)

− 0.3

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

TDA9817; TDA9818

100 Ω

2.1 pF

3.0 mA

AFC

±200 µA

MHA686

18 VCO1 2.7 19 VCO2 2.7

20 GND 0 21 V

MHA687

420 Ω420 Ω

B/G

500 µA

50 Ω

2.8 V

20 kΩ

L accent

MHA688

2001 Oct 19 29

Page 30

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PIN NO.

22 TOP 0 to 1.9

23 SIF1 3.4 24 SIF2 3.4

SYMBOL

DC VOLT AGE

(V)

EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)

1.1 kΩ

TDA9817; TDA9818

30 kΩ

5 kΩ

9 kΩ

1.9 V

20 kΩ 3.6 V

MHA689

100 µA

400 µA

10 kΩ

1.1 kΩ

Note

1. Not connected for TDA9817, TDA9817T and TD9817TS.

800 Ω

3.4 V

1.8 V

400 µA

MHA690

2001 Oct 19 30

Page 31

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

2001 Oct 19 31

TEST AND APPLICATION INFORMATION

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

FM-PLL/AM demodulators

SIF

input

VIF

input

22 kΩ

100 nF

1:1

Ω

intercarrier

mode

1:1

TOP

22 kΩ

2223 1821 20

(2)

2456

standards

selection

switch

VIF

AGC

10 nF

2.2

µF

GND

SIF

AGC

2.2

µF

(1)

TDA9817 TDA9818

330

Ω

220

loop

L/L accent

filter

and adjust

22 kΩ

(2)

switch

AFC

1.1 V (p-p) video

17 16

8 9 10 11

22 kΩ

output

2.4 kΩ

22 nF

de-emphasis

≈50 µs

tuner AGC

100

(2)

DEC

5.6 kΩ

QSS intercarrier

output

560 Ω

µF

10 nF

5.5 MHz

MHA691

mute

switch

(3)

TDA9817; TDA9818

(1) See Table 3. (2) Not connected for TDA9817, TDA9817T and TDA9817TS. (3) Depends on TV standard.

handbook, full pagewidth

Fig.15 Test circuit.

Page 32

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

2001 Oct 19 32

1 V (p-p)

22 kΩ

AFC

video

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

FM-PLL/AM demodulators

input

100 nF

VIF

AGC

10 nF

2.2 µF

GND

SIF

AGC

2.2 µF

TDA9817 TDA9818

loop filter

SAW

FILTER

K9453

(3)

intercarrier

mode

SAW

FILTER

Ω

K3953

(3)

SIF

VIF

TOP

22 kΩ

2223 1821 20

(2)

2456

standards

selection

switch

(1)

330

Ω

220

L/L accent and adjust

(2)

switch

22 kΩ

kΩ

µH

330

Ω

17 16

8 9 10 11

output

de-emphasis

2.4 kΩ

22 nF

100

(2)

DEC

≈50 µs

tuner AGC

µF

QSS intercarrier output

560 Ω

5.6 kΩ

10 nF

5.5 MHz

MHA692

mute

switch

(3)

TDA9817; TDA9818

(1) See Table 3. (2) Not connected for TDA9817, TDA9817T and TDA9817TS. (3) Depends on TV standard.

handbook, full pagewidth

Fig.16 Application circuit.

Page 33

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

Table 3 Oscillator circuit for the different TV standards

PARAMETER EUROPE USA JAPAN

IF frequency 38.9 MHz 45.75 MHz 58.75 MHz VCO frequency 77.8 MHz 91.5 MHz 117.5 MHz Oscillator circuit

VCO

8.5 pF

e.g. Toko coil 5KM 369SNS-2010Z 5KMC V369SCS-2370Z MC 139 NE545SNAS100108 Philips ceramic

capacitor

C(C9)

8.2 pF

L(F4) 251 nH

MHA693

VCO

8.5 pF

C(C9)

10 pF

L(F4) 163 nH

MHA694

VCO

8.5 pF

C(C9)

15 pF

L(F4) 78 nH

MHA695

2222 632 51828 inside of coil 15 pF SMD; size = 0805

2001 Oct 19 33

Page 34

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

PACKAGE OUTLINES

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

seating plane

TDA9817; TDA9818

SOT234-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT b

max.

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4.7 0.51 3.8

OUTLINE VERSION

SOT234-1

min.

max.

IEC JEDEC EIAJ

1.3

0.8

0.53

0.40

REFERENCES

cEe M

0.32

0.23

(1) (1)

22.3

21.4

9.1

8.7

(1)

3.2

2.8

EUROPEAN

PROJECTION

10.7

10.2

12.2

10.5

0.181.778 10.16

ISSUE DATE

92-11-17 95-02-04

max.

1.6

2001 Oct 19 34

Page 35

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

SO24: plastic small outline package; 24 leads; body width 7.5 mm

TDA9817; TDA9818

SOT137-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

15.6

15.2

0.61

0.60

w M

scale

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

1.4

0.055

detail X

1.1

0.4

0.043

0.016

1.0

0.043

0.039

0.25

0.01

(A )

0.25 0.1

0.01

ywv θ

0.9

0.4

0.035

0.004

0.016

OUTLINE

VERSION

SOT137-1

IEC JEDEC EIAJ

075E05 MS-013

REFERENCES

2001 Oct 19 35

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22

99-12-27

Page 36

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

24 13

TDA9817; TDA9818

SOT340-1

v M

pin 1 index

112

w M

DIMENSIONS (mm are the original dimensions)

max.

2.0

0.21

0.05

1.80

1.65

0.25

0.38

0.20

0.25

0.09

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0 2.5 5 mm

scale

(1)E(1) (1)

8.4

8.0

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

detail X

1.03

0.9

0.63

0.7

(A )

0.13 0.10.2

0.8

0.4

OUTLINE VERSION

SOT340-1 MO-150

IEC JEDEC EIAJ

REFERENCES

2001 Oct 19 36

EUROPEAN

PROJECTION

ISSUE DATE

95-02-04 99-12-27

Page 37

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

SOLDERING Introduction

Thistextgives a very brief insight toacomplextechnology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when through-holeandsurfacemountcomponentsaremixedon one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied tothe printed-circuit board by screenprinting, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

stg(max)

). If the

TDA9817; TDA9818

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.

WAVE SOLDERING Conventional single wave soldering is not recommended

forsurfacemountdevices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswithleads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

MANUAL SOLDERING Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

2001 Oct 19 37

Page 38

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

Suitability of IC packages for wave, reﬂow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

(4)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

, SO, SOJ suitable suitable −

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

not suitable

SOLDERING METHOD

WAVE REFLOW

(2)

(3)

− suitable

suitable −

(4)(5)

suitable −

(6)

suitable −

(1)

DIPPING

2001 Oct 19 38

Page 39

Philips Semiconductors Preliminary speciﬁcation

Single/multistandard VIF/SIF-PLL and

TDA9817; TDA9818

FM-PLL/AM demodulators

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

(1)

STATUS

(2)

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notiﬁcation (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseor at any other conditionsabovethosegiven in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythatsuch applications will be suitable for the specified use without further testing or modification.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personalinjury. Philips Semiconductorscustomersusingorsellingtheseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseofany of these products, conveys no licence ortitle under any patent, copyright, or mask work right to these products,and makes no representations orwarrantiesthat these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2001 Oct 19 39

Page 40

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 753504/02/pp40 Date of release: 2001 Oct 19 Document order number: 9397 750 08403

SCA73

Datasheet TDA9818T, TDA9818, TDA9817TS, TDA9817T, TDA9817 Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

LIMITING VALUES

THERMAL CHARACTERISTICS

CHARACTERISTICS

TEST AND APPLICATION INFORMATION

PACKAGE OUTLINES

SOT234-1

SOT340-1

DATA SHEET STATUS

DEFINITIONS