Datasheet TDA9810 Datasheet (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TDA9810

Multistandard VIF-PLL with QSS-IF and AM demodulator

Product speciﬁcation Supersedes data of 1997 Jun 19 File under Integrated Circuits, IC02

1999 May 07

Page 2

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

FEATURES

• 5 V supply voltage

• Gain controlled wide band Video Intermediate

Frequency (VIF)-amplifier (AC-coupled)

• True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics, excellent pulse response)

• Gated phase detector for L/L accent standard; robustness for over-modulation until 105%

• Voltage Controlled Oscillator (VCO) frequency switchable between L and L accent (alignment external) picture carrier frequency

• Separate video amplifier for sound trap buffering with high video bandwidth

• VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector for B/G (optional external AGC) and peak white detector for L; signal controlled reaction time for L

TDA9810

• Tuner AGC with adjustable TakeOver Point (TOP)

• AFC detector without extra reference circuit

• SIF-input for single reference Quasi Split Sound (QSS)

mode (Phase Locked Loop (PLL) controlled); Sound Intermediate Frequency (SIF) AGC detector for gain controlled SIF amplifier; single reference QSS mixer able to operate in high performance single reference QSS mode

• AM demodulator without extra reference circuit

• AM mute (especially for NICAM)

• Stabilizer circuit for ripple rejection and to achieve

constant output signals.

GENERAL DESCRIPTION

The TDA9810 is an integrated circuit for multistandard vision IF signal processing and sound AM demodulation, with single reference QSS-IF in TV and VCR sets.

ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA9810 SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 TDA9810T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

PACKAGE

1999 May 07 2

Page 3

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

i(VIF)(rms)

o(CVBS)(p-p)

−3

S/N

W(video)

IM(1.1)

IM(3.3)

H(sup)

i(SIF)(rms)

o(intercarrier)(rms)

o(AF)(rms)

THD total harmonic distortion 54% modulation − 0.5 1.0 % S/N

supply voltage 4.5 5 5.5 V supply current 77 90 103 mA vision IF input signal voltage sensitivity

−1 dB video at output − 60 100 µV

(RMS value) CVBS output signal voltage

1.7 2.0 2.3 V

(peak-to-peak value)

−3 dB video bandwidth on pin CVBS B/G and L standard;

78−MHz CL< 20 pF; RL> 1kΩ; AC load

weighted signal-to-noise ratio for video 56 60 − dB intermodulation attenuation at ‘blue’ f = 1.1 MHz 58 64 − dB intermodulation attenuation at ‘blue’ f = 3.3 MHz 58 64 − dB suppression of video signal harmonics 35 40 − dB sound IF input signal voltage sensitivity

−3 dB at intercarrier output − 30 70 µV

(RMS value) IF intercarrier level (RMS value) SC1 output signal 100 140 180 mV

output signal 100 140 180 mV

AF output signal voltage (RMS value) L standard;

output signal 14 20 26 mV

NICAM

− 500 − mV

54% modulation

weighted signal-to-noise ratio 54% modulation 47 53 − dB

1999 May 07 3

Page 4

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1999 May 07 4

handbook, full pagewidth

BLOCK DIAGRAM

Multistandard VIF-PLL with QSS-IF and

AM demodulator

Philips Semiconductors Product speciﬁcation

VIF

SAW

SIF

SAW

L/L accent

gating switch

VIF AMPLIFIER

23 24

INTERNAL VOLTAGE

STABILIZER

22 20 8 5

VAGC

TOP

TUNER AND VIF-AGC

SIF

AMPLIFIER

SIF-AGC

TOP

tuner AGC

loop filter

FPLL

SINGLE REFERENCE

MIXER AND

AM DEMODULATOR

2 x f

VCO TWD

AFC DETECTOR

VIDEO DEMODULATOR

AND AMPLIFIER

TDA9810

AFC

1719184162114 315

AMPLIFIER SWITCH

VIDEO

BUFFER

AF AMPLIFIER

video

1 V (p-p)

CVBS

2 V (p-p)

i(vid)

AF/AM

MHA713

VP = +5 V

GND

standards

selection

switch

SAGC

Fig.1 Block diagram.

QSS

intercarrier

output

L/L accent

switch

AM mute

switch

TDA9810

Page 5

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

PINNING

SYMBOL PIN DESCRIPTION

i VIF1

i VIF2

TADJ 3 tuner AGC takeover point adjust T

PLL

SAGC

oAF

LSWI 7 L/L accent switch STD 8 standard switch V

o(vid)

o QSS

MUTE 11 AM mute switch V

o CVBS

1 VIF differential input signal voltage 1 2 VIF differential input signal voltage 2

4 PLL loop ﬁlter 5 SIF AGC capacitor 6 AM audio frequency output voltage

9 composite video output voltage

10 single reference QSS output voltage

12 CVBS output signal voltage

TDA9810

SYMBOL PIN DESCRIPTION

i(vid)

LGATSWI 14 L/L accent gating switch C

TAGC 16 tuner AGC output AFC 17 AFC output VCO1 18 VCO1 reference circuit for 2f VCO2 19 VCO2 reference circuit for 2f GND 20 ground C

VAGC

i SIF1

i SIF2

13 video buffer input voltage

15 black level detector

21 VIF AGC capacitor 22 supply voltage 23 SIF differential input signal voltage 1 24 SIF differential input signal voltage 2

pc pc

handbook, halfpage

i VIF1

i VIF2

TADJ

PLL

SAGC V

o AF

LSWI

STD

o(vid)

o QSS

MUTE

o CVBS

1 2 3 4 5 6 7 8

9 10 11 12

TDA9810

MHA712

21 20

GND

VCO2

VCO1

AFC

TAGC C

15 14

LGATSWI V

i SIF2 i SIF1

P VAGC

i(vid)

handbook, halfpage

i VIF1

i VIF2

TADJ

PLL

SAGC V

o AF

LSWI

STD

o(vid)

o QSS

MUTE

o CVBS

1 2 3 4 5 6

TDA9810T

7 8

9 10 11 12

MHA722

21 20

GND

VCO2

VCO1

AFC

TAGC C

15 14

LGATSWI V

i SIF2 i SIF1

P VAGC

i(vid)

Fig.2 Pin configuration SDIP24 package.

1999 May 07 5

Fig.3 Pin configuration SO24 package.

Page 6

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

FUNCTIONAL DESCRIPTION Vision IF ampliﬁer

The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration.

Tuner and VIF AGC

The AGC capacitor voltage is transferred to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current (pin TAGC, open-collector output). The tuner AGC takeover point can be adjusted. This allows the tuner and the SWIF filter to be matched to achieve the optimum IF input level.

The AGC detector charges/discharges the AGC capacitor to the required voltage for setting of VIF and tuner gain in order to keep the video signal at a constant level. Therefore for negative video modulation the sync level and for positive video modulation the peak white level of the video signal is detected. In order to reduce the reaction time for positive modulation, where a very large time constant is needed, an additional level detector increases the discharging current of the AGC capacitor (fast mode) in the event of a decreasing VIF amplitude step. The additional level information is given by the black-level detector voltage.

Frequency Phase Locked Loop detector (FPLL)

The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current proportional to the phase difference between the VCO and the input signal. The DC current of either frequency detector or phase detector is converted into a DC voltage via the loop filter, which controls the VCO frequency. In the event of positive modulated signals the phase detector is gated by composite sync in order to avoid signal distortion for overmodulated VIF signals. This mode can be switched off by the L/L accent gating switch.

VCO, Travelling Wave Divider (TWD) and AFC

The VCO operates with a resonance circuit (with L and C in parallel) at double the Picture Carrier (PC) frequency.

TDA9810

The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to actually double the PC frequency is generated by the Frequency-Phase detector and fed via the loop filter to the first variable capacitor (FPLL). This control voltage is amplified and additionally converted into a current which represents the AFC output signal. The VCO centre frequency can be decreased (required for L accent standard) by activating an additional internal capacitor. This is achieved by using the L/L accent gating switch. In this event the second variable capacitor can be controlled by a variable resistor at the L/L accent gating switch for setting the VCO centre frequency to the required L accent value. At centre frequency the AFC output current is equal to zero.

The oscillator signal is divided-by-two with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency.

Video demodulator and ampliﬁer

The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the ‘in phase’ signal of the travelling wave divider output. In the demodulator stage the video signal polarity can be switched in accordance with the TV standard.

The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics for B/G and L standard. The standard dependent level shift in this stage delivers the same sync level for positive and negative modulation. The video output signal is 1 V (p-p) for nominal vision IF modulation.

Video buffer

For an easy adaption of the sound traps an operational amplifier with internal feedback is used in the event of B/G and L standard. This amplifier is featured with a high bandwidth and 7 dB gain. The input impedance is adapted for operating in combination with ceramic sound traps. The output stage delivers a nominal 2 V (p-p) positive video signal. Noise clipping is provided.

1999 May 07 6

Page 7

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

SIF ampliﬁer and AGC

The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration.

The SIF AGC detector is related to the SIF input signals (average level of AM or FM carriers) and controls the SIF amplifier to provide a constant SIF signal to the AM demodulator and single reference QSS mixer. The SIF AGC reaction time is set to ‘slow’ for nominal video conditions. But with a decreasing VIF amplitude step the SIF AGC is set to ‘fast’ mode controlled by the VIF AGC detector. In FM mode this reaction time is also set to ‘fast’ controlled by the standard switch.

Single reference QSS mixer

The single reference QSS mixer is realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass for attenuation of the video signal components to the output pin 10. With this system a high performance hi-fi stereo sound processing can be achieved.

TDA9810

AM demodulator

The AM demodulator is realized by a multiplier. The modulated SIF amplifier output signal is multiplied in phase with the limited (AM is removed) SIF amplifier output signal. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the AF amplifier. This AM output signal can be muted by using the AM mute switch.

Internal voltage stabilizer and

The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage.

For all audio output signals the constant reference voltage cannot be used because large output signals are required. Therefore these signals refer to half the supply voltage to achieve a symmetrical headroom, especially for the rail-to-rail output stage. For ripple and noise attenuation

the

⁄2VP voltage has to be filtered via a low-pass filter by

using an external capacitor together with an integrated resistor (f start-up circuit is available.

= 5 Hz). For a fast setting to 1⁄2VP an internal

−3dB

⁄2VP-reference

1999 May 07 7

Page 8

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

supply voltage (pin 22) maximum chip temperature

input voltage at pins 1 to 8, 1 1, 13 to 17 and 20 to 24

sc(max)

TAGC

stg

amb

maximum short-circuit time − 10 s tuner AGC output voltage 0 13.2 V storage temperature −25 +150 °C operating ambient temperature −20 +70 °C electrostatic handling voltage note 2 −300 +300 V

Notes

1. I

= 103 mA; T

=70°C; R

amb

= 69 K/W for SDIP24 and R

th j-a

2. Machine Model class B: L = 2.5 µH.

of 125 °C; note 1

th j-a

= 90 K/W for SO24.

0 5.5 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th j-a

thermal resistance from junction to ambient in free air

SOT234-1 69 K/W SOT137-1 90 K/W

1999 May 07 8

Page 9

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

CHARACTERISTICS

VP=5V; T peak white level for L); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier B/G: 10%; L = 3%; video signal in accordance with speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin 22)

Vision IF ampliﬁer (pins 1 and 2)

i(VIF)(rms)

i(max)(rms)

∆V

o(int)

IFcr

i(diff)

I(1,2)

True synchronous video demodulator; note 3 f

VCO(max)

∆f

/∆T oscillator drift as a function

osc

VCO(rms)

cr(pc)

∆f

pc(fr)

alg(L accent)

acq

i(VIF)(rms)

offset(FPLL)

=25°C; see Table 1 for input frequencies and level; input level V

amb

“CCIR, line 17”

; measurements taken in Fig.14; unless otherwise

supply voltage note 1 4.5 5 5.5 V supply current 77 90 103 mA

input signal voltage sensitivity (RMS value)

maximum input signal voltage (RMS value)

internal IF amplitude difference between picture and sound carrier

B/G standard; −1 dB video at output

B/G standard; +1 dB video at output

within AGC range; B/G standard;

∆f = 5.5 MHz IF gain control range see Fig.4 65 70 − dB differential input resistance note 2 1.7 2.2 2.7 kΩ differential input capacitance note 2 1.2 1.7 2.5 pF DC input voltage note 2 − 3.4 − V

maximum oscillator

f=2f

frequency for carrier regeneration

oscillator is free-running; of temperature

AFC

= 0; note 4

oscillator voltage swing at pins 18 and 19 (RMS value)

picture carrier capture frequency range

B/G and L standard ±1.5 ±2.0 − MHz

L accent standard;

= 33.9 MHz;

R7= 5.6 kΩ picture carrier frequency

(free-running) accuracy

L accent standard;

fpc= 33.9 MHz;

R7= 5.6 kΩ L accent alignment

=0 ±400 ±600 − kHz

AFC

frequency range acquisition time BL = 70 kHz; note 5 −−30 ms VIF input signal voltage

maximum IF gain; note 6 − 30 70 µV sensitivity for PLL to be locked (RMS value; pins 1 and 2)

FPLL offset current at pin 4 note 7 −−±4.5 µA

i(IF)(rms)

= 10 mV (sync-level for B/G,

− 60 100 µV

120 200 − mV

− 0.7 1 dB

125 130 − MHz

−−±20 × 10−6K

70 100 130 mV

±1.0 ±1.3 − MHz

−±200 ±400 kHz

−1

1999 May 07 9

Page 10

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Composite video ampliﬁer (pin 9; sound carrier off)

o(video)(p-p)

output signal voltage (peak-to-peak value)

V/S ratio between video

(black-to-white) and sync level

sync(9)

clu(9)

sync voltage level B/G and L standard − 1.5 − V upper video clipping voltage

level

cll(9)

lower video clipping voltage level

o(9)

bias(9)(int)

output resistance note 2 −−10 Ω internal DC bias current for

emitter-follower

sink(9)(max)

maximum AC and DCoutput sink current

source(9)(max)

maximum AC and DC output source current

−1

−3

H(sup)

−1 dB video bandwidth B/G and L standard;

−3 dB video bandwidth B/G and L standard;

suppression of video signal harmonics

PSRR power supply ripple rejection

at pin 9

see Fig.9 0.88 1.0 1.12 V

1.9 2.33 3.0 −

VP− 1.1 VP− 1 − V

− 0.3 0.4 V

2.2 3.0 − mA

1.6 −− mA

2.9 −− mA

56− MHz CL< 50 pF; RL> 1kΩ; AC load

78− MHz CL< 50 pF; RL> 1kΩ; AC load

CL< 50 pF; RL> 1kΩ;

35 40 − dB AC load; note 8a

video signal; grey level; see Fig.12

B/G standard 32 35 − dB L standard 26 30 − dB

CVBS buffer ampliﬁer (only) and noise clipper (pins 12 and 13)

i(13)

I(13)

clu(12)

input resistance note 2 2.6 3.3 4.0 kΩ input capacitance note 2 1.4 2 3.0 pF DC input voltage 1.4 1.7 2.0 V voltage gain B/G and L standard; note 9 6.5 7 7.5 dB upper video clipping voltage

level

cll(12)

lower video clipping voltage level

o(12)

bias(12)(int)

output resistance note 2 −−10 Ω DC internal bias current for

emitter-follower

sink(12)(max)

maximum AC and DC output sink current

1999 May 07 10

3.9 4.0 − V

− 1.0 1.1 V

2.0 2.5 − mA

1.4 −− mA

Page 11

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

source(12)(max)

−1

−3

Measurements from IF input to CVBS output (pin 12; 330 Ω between pins 9 and 13, sound carrier off)

o(CVBS)(p-p)

∆V

o(CVBS)

o(CVBS)(sync)

∆V

o(CVBS)

∆V

o(bl)(BG)

∆V

o(bl)(L)

diff

−1

−3

S/N

W(video)

S/N unweighted signal-to-noise

IM(1.1)

IM(3.3)

maximum AC and DC output

2.4 −− mA

source current

−1 dB video bandwidth B/G and L standard;

8.4 11 − MHz CL< 20 pF; RL> 1kΩ; AC load

−3 dB video bandwidth B/G and L standard;

11 14 − MHz CL< 20 pF; RL> 1kΩ; AC load

CVBS output signal voltage

note 9 1.7 2.0 2.3 V

on pin 12 (peak-to-peak value)

output signal voltage difference

difference between B/G and L standard

−−10 %

sync voltage level B/G standard − 1.35 − V

L standard − 1.35 − V

deviation of CVBS output signal voltage at B/G

black level tilt in

50 dB gain control −−0.5 dB 30 dB gain control −−0.1 dB gain variation; note 10 −−1%

B/G standard black level tilt for worst case

in L standard

vision carrier modulated by test line (VITS) only;

−−1.9 %

gain variation; note 10

differential gain differential phase

−1 dB video bandwidth CL< 20 pF; RL> 1kΩ;

“CCIR, line 330” “CCIR, line 330”

− 25 %

− 1 2 deg

56− MHz AC load; B/G and L standard

−3 dB video bandwidth CL< 20 pF; RL> 1kΩ;

78− MHz AC load; B/G and L standard

weighted signal-to-noise

see Fig.6 and note 11 56 60 − dB

ratio for video

see Fig.6 and note 11 49 53 − dB

ratio intermodulation attenuation

at ‘blue’ intermodulation attenuation

at ‘yellow’ intermodulation attenuation

at ‘blue’ intermodulation attenuation

at ‘yellow’

f = 1.1 MHz; see Fig.7 and note 12

f = 3.3 MHz; see Fig.7 and note 12

58 64 − dB

60 66 − dB

58 64 − dB

59 65 − dB

1999 May 07 11

Page 12

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

c(rms)

∆f

unwanted(p-p)

∆ϕ robustness for modulator

H(sup)

H(spur)

PSRR power supply ripple rejection

residual vision carrier (RMS value)

fundamental wave and harmonics;

− 25 mV

B/G and L standard

robustness for unwanted frequency deviation of picture carrier (peak-to-peak value)

imbalance

L standard; residual carrier: 3%; serration pulses: 50%; note 2

L standard; residual carrier: 0%;

−−12 kHz

−−3%

serration pulses: 50%; note 2

suppression of video signal

note 8a 35 40 − dB

harmonics spurious elements note 8b 40 −− dB

video signal; grey level;

at pin 12

see Fig.12

B/G standard 25 28 − dB L standard 20 23 − dB

VIF-AGC detector (pin 21)

ch(21)

charging current B/G and L standard;

additional charging current L standard in event of

discharging current B/G standard 15 20 25 µA

resp(AGC)(r)

AGC response to a rising VIF step

resp(AGC)(f)

AGC response to a falling VIF step

∆IF VIF amplitude step for

activating fast AGC mode

th(15)

threshold voltage level additional charging current

0.75 1 1.25 mA

note 10

1.9 2.5 3.1 µA missing VITS pulses and no white video content

normal mode L standard 225 300 375 nA fast mode L standard 30 40 50 µA B/G and L standard;

− 0.05 0.1 ms/dB note 13

B/G standard − 2.2 3.5 ms/dB fast mode L standard − 1.1 1.8 ms/dB normal mode L standard;

− 150 240 ms/dB note 13

L standard −2 −6 −10 dB

see Fig.9

L standard − 1.95 − V L standard; fast mode L − 1.65 − V

1999 May 07 12

Page 13

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Tuner AGC (pin 16)

i(rms)

o(16)(max)

sat(16)

∆V

TOP(16)

sink(16)

∆G

IF input signal voltage for minimum starting point of tuner takeover (RMS value)

IF input signal voltage for maximum starting point of tuner takeover (RMS value)

maximum output voltage from external source;

saturation voltage I16= 1.5 mA −−0.2 V

/∆T variation of takeover point by

temperature sink current see Fig.4

IF slip by automatic gain control

input at pins 1 and 2; R

=22kΩ; I16= 0.4 mA

TOP

input at pins 1 and 2;

=0Ω; I16= 0.4 mA

TOP

− 25 mV

50 100 − mV

−−13.2 V note 2

I16= 0.4 mA − 0.03 0.07 dB/K

no tuner gain reduction; V

= 13.2 V

maximum tuner gain

−−1 µA

1.5 2 2.6 mA

reduction

tuner gain current from

− 68 dB 20 to 80%

AFC circuit (pin 17); see Fig.8 and note 14 S control steepness ∆I

∆f

/∆T frequency variation by

/∆f note 15 0.5 0.75 1.0 µA/kHz

temperature

o(17)(max)

o(17)(min)

o(source)(17)

o(sink)(17)

∆I

17(p-p)

output voltage upper limit VP − 0.6 VP − 0.3 − V output voltage lower limit − 0.3 0.6 V output source current 150 200 250 µA output sink current 150 200 250 µA residual video modulation

current (peak-to-peak value)

B/G and L standard; I

= 0; note 4

AFC

−−±20 × 10−6K

B/G and L standard − 20 30 µA

−1

1999 May 07 13

Page 14

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Sound IF ampliﬁer (pins 23 and 24)

i(SIF)(rms)

i(max)(rms)

cr(SIF)

i(diff)

I(23,24)

SIF,VIF

input signal voltage sensitivity (RMS value)

maximum input signal voltage (RMS value)

SIF gain control range FM and AM mode;

differential input resistance note 2 1.7 2.2 2.7 kΩ differential input capacitance note 2 1.2 1.7 2.5 pF DC input voltage − 3.4 − V crosstalk attenuation

between SIF and VIF input

FM mode; −3 dB at intercarrier output pin 10

AM mode; −3 dB at AF output pin 6

FM mode; +1 dB at intercarrier output pin 10

AM mode; +1 dB at AF output pin 6

see Fig.5

between pins 1 and 2 and pins 23 and 24; note 16

− 30 70 µV

− 70 100 µV

50 70 − mV

80 140 − mV

60 67 − dB

50 −− dB

SIF-AGC detector (pin 5)

ch(5)

charging current FM mode 8 12 16 µA

AM mode 0.8 1.2 1.6 µA

dch(5)

discharging current FM mode 8 12 16 µA

normal mode AM 1 1.4 1.8 µA fast mode AM 60 85 110 µA

Single reference QSS intercarrier mixer (pin 10); note 17 V

o(intercarrier)(rms)

IF intercarrier level (RMS value)

B/G standard; SC1; sound carrier 2 off

L standard; without modulation

NICAM 14 20 26 mV

−3

c(rms)

o(10)

O(10)

bias(int)(10)

−3 dB intercarrier bandwidth upper limit 7.5 9 − MHz residual sound carrier

(RMS value)

fundamental wave and harmonics

output resistance note 2 −−25 Ω DC output voltage − 2.0 − V DC internal bias current for

emitter-follower

(sink)(max)10

maximum AC and DC output sink current

(source)(max)10

maximum AC and DC output source current

100 140 180 mV

− 2 − mV

1.5 1.9 − mA

1.1 1.5 − mA

3.0 3.5 − mA

1999 May 07 14

Page 15

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Single reference QSS AF performance for FM operation (B/G standard); notes 18 to 21; see Table 1

S/N

W(SC1)

W(SC2)

weighted signal-to-noise ratio for SC

PC/SC1 ratio at pins 1 and

40 −− dB 2; 27 kHz (54% FM deviation);

“CCIR 468-4”

black picture 53 58 − dB white picture 52 55 − dB 6 kHz sine wave (black to

44 48 − dB

white modulation) 250 kHz square wave

40 45 − dB

(black to white modulation)

sound carrier

45 51 − dB

subharmonics; f = 2.75 MHz ±3 kHz

sound carrier

46 52 − dB

subharmonics; f = 2.87 MHz ±3 kHz

PC/SC2 ratio at pins 1 and

40 −− dB 2; 27 kHz (54% FM deviation);

“CCIR 468-4”

black picture 48 55 − dB white picture 46 52 − dB 6 kHz sine wave (black to

42 46 − dB

white modulation) 250 kHz square wave

29 34 − dB

(black to white modulation)

sound carrier

44 50 − dB

subharmonics; f = 2.75 MHz ±3 kHz

sound carrier

45 51 − dB

subharmonics;

f = 2.87 MHz ±3 kHz AM operation (L standard; pin 6); note 22 V

o(AF)(rms)

AF output signal voltage

54% modulation 400 500 600 mV

(RMS value)

THD total harmonic distortion 54% modulation;

− 0.5 1.0 %

see Fig.11

−3

S/N

−3 dB AF bandwidth 100 125 − kHz weighted signal-to-noise

“CCIR 468-4”

; see Fig.10 47 53 − dB

ratio

DC potential voltage tracked with supply voltage − 2.5 − V

PSRR power supply ripple rejection see Fig.12 22 25 − dB

1999 May 07 15

Page 16

Philips Semiconductors Product speciﬁcation



Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AM mute switch (pin 11)

L/L accent gating switch (pin 14)

Notes

1. Values of video and sound parameters are decreased at VP= 4.5 V.

2. This parameter is not tested during production and is only given as application information for designing the television receiver.

3. Loop bandwidth BL = 70 kHz (natural frequency fn= 12 kHz; damping factor d ≈ 3; calculated for peak level). Resonance circuit of VCO: Q0> 50; C

4. Temperature coefficient of external LC-circuit is equal to zero.

5. V

i(IF)(rms)

video modulation.

6. V

signal for nominal video signal.

i(IF)

7. Offset current measured between pin 4 and half of supply voltage (VP= 2.5 V) under the following conditions: no input signal at VIF input (pins 1 and 2) and VIF amplifier gain at minimum (V21=VP). Due to sample-and-hold mode of the FPLL in L standard, the leakage current of the loop filter capacitor (C = 220 nF) should not exceed 500 nA.

8. Measurements taken with SAW filter K6257 (sound carrier suppression: 40 dB); loop bandwidth = 70 kHz. a) Modulation VSB; sound carrier off; f b) Sound carrier on; SIF SAW filter K9453; f

9. The 7 dB buffer gain accounts for 1 dB loss in the sound trap. Buffer output signal is typically 2 V (p-p), in event of CVBS video amplifier output typical 1 V (p-p). If no sound trap is applied a 330 Ω resistor must be connected from output to input (from pin 9 to pin 13).

10. The leakage current of the AGC capacitor should not exceed 1 µA at B/G standard respectively 10 nA current at L standard. Larger currents will increase the tilt.

11. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 12). B = 5 MHz weighted in accordance with

12. The intermodulation figures are defined:

IM 1.1()

IM 3.3()

13. Response speed valid for a VIF input level range of 200 µVupto70mV.

14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.8. The AFC-steepness can be changed by the resistors at pin 17.

DC potential

input voltage for no mute note 23 2.8 − V

input voltage for mute 0 − 0.8 V

LOW level input current V11= 0 V 175 250 325 µA

DC potential voltage for

gating on note 23 2.8 − V

gating off 0 − 2.0 V

LOW level input current V14= 0 V 140 200 260 µA

= 8.2 pF ±0.25 pF; C

ext

≈ 8.5 pF (loop voltage ≈2.7 V).

int

= 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture

> 0.5 MHz.

video

= 10 kHz to 10 MHz.

video

“CCIR 567”

at 4.4 MHz



------------------------------------at 1.1 MHz



at 4.4 MHz



log=

-------------------------------------V

at 3.3 MHz



value at 1.1 MHz referenced to black/white signal;

IM(1.1)

; α

3.6dB+log=

; α

value at 3.3 MHz referenced to colour carrier.

IM(3.3)

1999 May 07 16

Page 17

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

15. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0> 50; see note 3; C0=C

int+Cext

16. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF= 38.9 MHz.

17. For picture to sound carrier ratio see Table 1. The NICAM L subcarrier is 17 dB lower than the AM sound carrier and depends on its AM modulation.

18. The V related to a deviation of ±27 kHz, in accordance with

output (pin 10) is analysed by a test demodulator TDA9820. The S/N ratio of this IC is more than 60 dB,

o QSS

“CCIR 468-4”

19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees. b) QSS AF performance, measured with the television-demodulator AMF2 (audio output, weighted S/N ratio) better

than 60 dB (deviation ±27 kHz) for 6 kHz sine wave black-to-white video modulation.

c) Picture-to-sound carrier ratio; PC/SC1= 13 dB; (transmitter).

20. Measurements taken with SAW filter K6257 (Siemens) for vision IF (suppressed sound carrier) and K9453 (Siemens) for sound IF (suppressed picture carrier). Input level V

i(SIF)(rms)

= 10 mV, 27 kHz (54% FM deviation).

21. The PC/SC ratio at pins 1 and 2 is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values.

22. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier).

23. The input voltage has to be Vi> 2.8 V, or open-circuit.

Table 1 Input frequencies and carrier ratios

DESCRIPTION SYMBOL B/G STANDARD L STANDARD

Picture carrier f Sound carrier f

sc2/NICAM

Picture to sound carrier ratio

PC/SC

sc1

2/NICAM

38.9 38.9 33.9 38.9 MHz

33.4 32.4 40.4 32.4 MHz

33.158 −−32.05 MHz 13 10 10 10 dB 20 −−27 dB

L ACCENT

STANDARD

NICAM L UNIT

Table 2 Switch logic

STANDARD SWITCH

(PIN 8)

2.8VtoV

SELECTED STANDARD VIDEO POLARITY

B/G negative on on FM FM

FM-PLL AF-AMPLIFIER

1212

1.3 to 2.3 V B/G, with external VIF AGC negative on on FM FM 0 to 0.8 V L positive off off AM mute

1999 May 07 17

Page 18

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

; R

70 gain (dB)

600.06

206

060

−10 1 2.521.5 3 3.5 4

TOP

=22kΩ.

(3) I (4) I

tuner tuner

; R ; R

TOP TOP

=11kΩ. =0Ω.

ndbook, full pagewidth

i(VIF)(rms)

(mV)

0.6

(1) I

tuner

(2) Gain.

(1) (2) (3) (4)

TDA9810

MHA714

V21 (V)

4.5

tuner (mA)

handbook, full pagewidth

(1) AM mode. (2) FM mode.

100

i(SIF)(rms)

(mV)

0.1

0.01

(dBµV)

Fig.4 Typical VIF and tuner AGC characteristic.

110

100

1 2.521.5 3 3.5 4

(1)

(2)

V5 (V)

MHA715

4.5

Fig.5 Typical SIF AGC characteristic.

1999 May 07 18

Page 19

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

i (VIF)(rms)

MED684

(dB)

(mV)

handbook, halfpage

S/N

(dB)

−60 −40 −20 20

0.06 0.6 6 60060

Fig.6 Typical signal-to-noise ratio as a function of

IF input voltage.

handbook, halfpage

13.2 dB

27 dB

SC CC PC SC CC PC

3.2 dB

13.2 dB

27 dB

BLUE YELLOW

SC = sound carrier, with respect to sync level. CC = chrominance carrier, with respect to sync level. PC = picture carrier, with respect to sync level. The sound carrier levels are taking into account

a sound shelf attenuation of 20 dB (SAW filter G1962).

Fig.7 Input signal conditions.

TDA9810

10 dB

MED685 - 1

handbook, full pagewidth

TDA9810

V = 5 V

22 kΩ

AFC

22 kΩ

Fig.8 Measurement conditions and typical AFC characteristic.

1999 May 07 19

AFC (V)

2.5

(µA)

200

100

200

38.5 38.9 39.3

MHA716

(source current)

(sink current)

f (MHz)

Page 20

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

handbook, halfpage

2.5 V

1.8 V

1.5 V

B/G standard

2.5 V

1.95 V

1.8 V

1.65 V

1.5 V

TDA9810

white level

black level

sync level

white level

threshold level black level threshold level sync level

handbook, full pagewidth

CCIR-468

(dB)

30 50 60 7040 80 90

(1) Signal. (2) Noise.

L standard

MED864

Fig.9 Typical video signal levels on output pin 9 (sound carrier off).

(1)

(2)

input voltage (dBµV)

MED688

100

Fig.10 Typical audio signal-to-noise ratio as a function of input signal at AM standard (m = 54%).

1999 May 07 20

Page 21

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

1.25

handbook, full pagewidth

THD

(%)

1.0

0.75

0.5

0.25

TDA9810

MED689

10110

f (kHz)

= 2.2 µF.

AGC

Fig.11 Typical total harmonic distortion as a function of audio frequency at AM standard (m = 54%).

handbook, full pagewidth

VP = 5 V

TDA9810

MHA717

VP = 5 V

100 mV

(f = 70 Hz)

ripple

Fig.12 Ripple rejection condition.

1999 May 07 21

Page 22

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1999 May 07 22

INTERNAL PIN CONFIGURATION

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

AM demodulator

1.1 kΩ

1 mA

1.1 kΩ

0.6 µA

25 µA

3.6 V

2.5 µA

GND

3.6 V

20 kΩ

9 kΩ

2122

3.6 V

19 18 17 13

+++

1 mA

+ +

420

Ω

2.8 V

10 kΩ 10 kΩ

420

Ω

200 µA

kΩ

3.3kΩ2.2

2 kΩ

kΩ

TDA9810

3.6 V

16 kΩ

VCO

67 µA

23 µA

+ +

+++

24 kΩ

kΩ

2.5 mA

kΩ

3.0 mA

13 kΩ

3.6 V 16 kΩ

3.6 V

kΩ

9 kΩ

1.7 pF

1.9 mA

24 kΩ

2.3 mA 24

kΩ

14.7 kΩ

25 pF

120

Ω

0.5 pF

10 kΩ

1.6 kΩ

2.5 mA

3.6 V

16 kΩ

kΩ

15 3 4

Fig.13 Internal pin configuration.

handbook, full pagewidth

MHA720

TDA9810

Page 23

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1999 May 07 23

TEST AND APPLICATION INFORMATION

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

AM demodulator

SIF

input

VIF

input

kΩ

AFC

L/L accent

gating switch

tuner

AGC

100

330

Ω

22 kΩ

100

10 nF

1:1

Ω

23 22 21 20 19 18 17 16 15 1314

VIF

AGC

2.2 µF

GND

8.2 pF

TDA9810

1 2 3 4 5 6 8 9 10 11 127

1:1

Ω

TOP

22 kΩ

330

Ω

loop filter

220 nF

SIF

AGC

2.2 µF

AFAM

L/L accent switch

22 kΩ

standards

selection

switch

+5 V

kΩ

video

output

QSS intercarrier

output

AM mute

switch

CVBS

MHA718

TDA9810

Fig.14 Test circuit.

handbook, full pagewidth

Page 24

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1999 May 07 24

22 kΩ

AFC

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

AM demodulator

input

50 Ω

SAW

FILTER

K9453

SAW

FILTER

K6257

(1)

100

10 nF

GND

2.2

VIF

µF

AGC

23 22 21 20 19 18 17 16 15 1314

8.2 pF

22 kΩ

tuner AGC

L/L accent

gating switch

100

TDA9810

3 4 5 6 8 9 10 11 127

+5 V

(2)

22 kΩ

output

video

QSS intercarrier

standards

selection

switch

output

AM mute

switch

TOP

22 kΩ

330

Ω

loop filter

SIF

AGC

220 nF

2.2 µF

de-emphasis

depending on

TV standard/stereo

decoder

L/L accent switch

kΩ

330

Ω

CVBS

MHA719

µH

(1) Depends on standard. (2) Only required for external AGC mode.

TDA9810

handbook, full pagewidth

Fig.15 Application circuit.

Page 25

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

PACKAGE OUTLINES

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

seating plane

TDA9810

SOT234-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT234-1

max.

4.7 0.51 3.8

min.

max.

IEC JEDEC EIAJ

1.3

0.8

0.53

0.40

REFERENCES

cEe M

0.32

0.23

(1) (1)

22.3

21.4

9.1

8.7

(1)

3.2

2.8

EUROPEAN

PROJECTION

10.7

10.2

12.2

10.5

0.181.778 10.16

ISSUE DATE

92-11-17 95-02-04

max.

1.6

1999 May 07 25

Page 26

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

SO24: plastic small outline package; 24 leads; body width 7.5 mm

TDA9810

SOT137-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

max.

2.65

0.10

A1A2A

0.30

2.45

0.10

2.25

0.012

0.096

0.004

0.089

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

(1)E(1) (1)

15.6

15.2

0.61

0.60

w M

scale

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

1.4

0.055

detail X

1.1

0.4

0.043

0.016

1.0

0.043

0.039

0.25

0.01

(A )

0.25 0.1

0.01

ywv θ

0.9

0.4

0.035

0.004

0.016

OUTLINE VERSION

SOT137-1

IEC JEDEC EIAJ

075E05 MS-013AD

REFERENCES

1999 May 07 26

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24 97-05-22

Page 27

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

SOLDERING Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“Data Handbook IC26; Integrated Circuit Packages”

our (document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

stg(max)

). If the

TDA9810

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.

AVE SOLDERING

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

1999 May 07 27

Page 28

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and

TDA9810

AM demodulator

Suitability of IC packages for wave, reﬂow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable Surface mount BGA, SQFP not suitable suitable −

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(4)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

, SO, SOJ suitable suitable −

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)

(4)(5) (6)

− suitable

suitable −

suitable − suitable −

(1)

DIPPING

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1999 May 07 28

Page 29

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

NOTES

TDA9810

1999 May 07 29

Page 30

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

NOTES

TDA9810

1999 May 07 30

Page 31

Philips Semiconductors Product speciﬁcation

Multistandard VIF-PLL with QSS-IF and AM demodulator

NOTES

TDA9810

1999 May 07 31

Page 32

Philips Semiconductors – a worldwide company

Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

1999 64

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 545004/750/02/pp32 Date of release: 1999 May 07 Document order number: 9397 750 05317

Datasheet TDA9810 Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

PINNING

Tuner and VIF AGC

Frequency Phase Locked Loop detector (FPLL)

VCO, Travelling Wave Divider (TWD) and AFC

Video buffer

Single reference QSS mixer

AM demodulator

LIMITING VALUES

THERMAL CHARACTERISTICS

CHARACTERISTICS

INTERNAL PIN CONFIGURATION

TEST AND APPLICATION INFORMATION

PACKAGE OUTLINES

SOT234-1

SOT137-1

DEFINITIONS

LIFE SUPPORT APPLICATIONS