
VERTICALDEFLECTION OUTPUTCIRCUIT
.
POWERAMPLIFIER
.
FLYBACKGENERATOR
.
THERMAL PROTECTION
DESCRIPTION
The TDA9302Hisa monolithicintegratedcircuitin
HEPTAWATT
power boosterfordirect driving of verticalwindings
of TV yokes. It is intendedforuse in Color and B &
W television as well as in monitorsand displays.
PIN CONNECTIONS(top view)
TM
package. It is a high efficiency
TDA9302H
HEPTAWATT
(Plastic Package)
ORDER CODE : TDA9302H
BLOCK DIAGRAM
Tab connectedto Pin4
1
7
TDA9302H
7
6
5
4
3
2
1
Power
Amplifier
NON-INVERTING INPUT
OUTPUT STAGESUPPLY
OUTPUT
GROUND
FLYBACK GENERATOR
SUPPLY VOLTAGE
INVERTING INPUT
9302H-01.EPS
+V
S
362
Flyback
Generator
5
Thermal
Protection
4
YOKE
August 1992
9302H-02.EPS
1/5

TDA9302H
ABSOLUTEMAXIMUM RATINGS AT TA=25oC
Symbol Parameter Value Unit
V
S
V
5,V6
V
3
V1,V7Amplifier Input Voltage + V
I
o
I
3
P
tot
T
stg,Tj
THERMALDATA
Symbol Parameter Value Unit
R
th (j–c)
RECOMMENDED OPERATING CHARACTERISTICS AT TA=25oC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
2M
V
2R
I
5PP
Supply Voltage (pin 2) 35 V
Flyback Peak Voltage 60 V
Voltage at Pin 3 + V
– 0.5
s
s
Deflection Output Current ± 1.8 A
Pin 3 DC Current at V5<V
Total Power Dissipation at T
2
=90°C15W
case
100 mA
Storage and Junction Temperature – 40, +150 °C
Thermal Resistance Junction-case Max. 4 °C/W
Recommended Supply Voltage 25 V
Operating Supply Voltage Range 15 30 V
Deflection Output Current 2 App
V
9302H-01.TBL
9302H-02.TBL
9302H-03.TBL
ELECTRICAL CHARACTERISTICS
(refer to the testcircuits, V
=35V, T
S
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
Pin 2 Quiescent Current I3=0,I5= 0 16 mA 1a
I
2
Pin 6 Quiescent Current I3=0,I5= 0 36 mA 1a
I
6
Amplifier Input Bias Current V1= 1 V, V7= 2 V – 0.1 – 1 µA1a
I
1
V
V
V
V
Pin 3 Saturation Voltage to GND I3= 20 mA 1 1.5 V 1c
3L
Quiescent Output Voltage Vs= 35V, Ra=39kΩ 18 V 1d
5
Output Saturation Voltage to GND I5= 1 A 0.9 1.3 V 1c
5L
Output Saturation Voltage to Supply – I5= 1 A 1.5 2 V 1b
5H
Junction Temperature for Thermal Shut Down 140 °C
T
j
=25oC unlessotherwisespecified)
amb
= 2 V, V7= 1 V – 0.1 – 1 µA1a
V
1
= 0.7 A 0.7 1 V 1c
I
5
= 0.7 A 1.3 1.8 V 1b
–I
5
9302H-04.TBL
2/5

Figure 1 : DC TestCircuits.
TDA9302H
Figure 1 a : Measurementof I1;I2;I
2
7
S1:(a) I2and I6; (b) I
I
2
V
7
1
I
6
6
5
S1
1
4
Figure 1 c : Measurementof V3L;V
3V
2
1
7
V
7
6
3
5
4
V
3L
5L
6
V
10kΩ
a
b
b
1V
S1
S
I
1
I3I5or
a
V
V
5L
Figure1 b : Measurement of V
2
1
1V
7
9302H-03.EPS
Figure1 d : Measurement of V
S
Ω
12k
2V
1
5.6kΩ
5H
V
S
6
V
5H
5
4
I
V
7
5
2
7
V
7
6
5
4
R
a
5
9302H-04.EPS
V
S
V
5
S1:(a) V3L;(b) V
9302H-05.EPS
5L
9302H-06.EPS
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TDA9302H
Figure 2 : AC Test Circuit
V
S
to
GND
25V
7
V
REF
V
i
R1
12kΩ
IN
R2
10k Ω
Recommendedfor V filtering
*
1
C1 C2
680mF
R3 R4
27kΩ 12kΩ
REF
MOUNTINGINSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink.
Thanks to the HEPTAWATT
TM
package attaching
the heatsinkis very simple, a screwor a compression spring(clip)being sufficient.
BY252
D1
4
C6
4.7µF
C3
220µF220µF
632
Iy
5
C4
0.22
R7
Ω
1.5
C5
1000µF
R5
1Ω
µF
R6
330Ω
to
20ms
Ly
10mH
Ry
5.9Ω
R5 Iy
t
fly
to
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is connectedto Pin 4 whichis ground.
=2V
V
7
9302H-07.EPS
Figure 3 : Mounting Examples
9302H-08.EPS/9302H-09.EPS
4/5

PACKAGE MECHANICAL DATA : 9 PINS- PLASTIC HEPTAWATT
TDA9302H
Dimensions
L
L1
A
C
H3
Dia.
L7
D1
L6
D
L2
L3L5
F1
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
E
MM1
G
G1
G2
F
H2
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 08 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.97 0.668
L1 14.92 0.587
L2 21.54 0.848
L3 22.62 0.891
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 2.8 0.110
M1 5.08 0.200
Dia. 3.65 3.85 0.144 0.152
Information furnished is believedto be accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of useof such information norfor any infringement ofpatents or otherrights of third partieswhich may result
from itsuse. No licence isgranted by implicationor otherwise underany patent or patentrights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.SGS-THOMSON Microelectronics products arenot authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
PM-HEPTV.EPS
HEPTV.TBL
1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
2
I
C Patent. Rights to use these components in a I2C system, is granted provided that the systemconforms to
2
the I
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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