Datasheet TDA9176 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA9176

Luminance Transient Improvement
(LTI) IC

Preliminary specification
Supersedes data of 1995 Jun 13
File under Integrated Circuits, IC02

1996 Jan 30

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

FEATURES

• Luminance transient improvement

• Line width control

• Can be used in 50 and 100 Hz environments

(1FH and 2FH)

• Compensating chrominance delay

• YUV interface

• Black insertion or clamping are selectable

• Amplitude selection for optimum operation with

450 mV (p-p) and 1 V

luminance signals.

bl-wh

GENERAL DESCRIPTION

The TDA9176 is a Luminance Transient Improvement
(LTI) IC which is suitable for operation in both
50 and 100 Hz environments. The device can be used in
conjunction with both LCD and CRT displays.

The TDA9176 also contains chrominance delay lines to
compensate for the luminance delay. The device can be
used as a low-power, cost effective alternative to (but also
in combination with) Scan Velocity Modulation (SVM).
The device operates at a supply voltage of 8 V. The device
is contained in a 16 pin dual in-line package.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

supply voltage 7.2 8.0 8.8 V
supply current at 1FH − 24 − mA

at 2FH − 30 − mA

V

iY( p-p)

V

iY(bl-wh)

G

Y

V

iU(p-p)

V

iV(p-p)

G

U. V

Y input voltage (peak-to-peak value) low amplitude mode − 0.45 0.63 V
Y input voltage (black-to-white) high amplitude mode − 1.0 1.4 V
Y path gain − 1
U input voltage (peak-to-peak value) − 1.33 1.90 V
V input voltage (peak-to-peak value) − 1.05 1.50 V
U and V path gain − 1 −

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA9176 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

1996 Jan 30 2

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

BLOCK DIAGRAM

handbook, full pagewidth

YIN

BLI/CL

AMPSEL

SC RT LW

8

SANDCASTLE

DETECTOR

BLACK

4

INSERTION

CLAMP

7
9

14 6 11 5 12 16

TDA9176

DELAY

DELAY DELAY

V

CC

CLAMPS

Fig.1 Block diagram.

2315

LTI

CONTROL

MINMAX

PTAT

CURRENT

SOURCE

R

UOUTVOUT UINVINGND

ext

f

SEL

SHAPER

BAND GAP

1

LTI

13

10

MBE775

YOUT

V

ref

1996 Jan 30 3

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

PINNING

SYMBOL PIN DESCRIPTION

f

SEL

LW 2 vertical line width control input
RT 3 rise time control input
YIN 4 luminance signal input
UIN 5 U input (colour difference signal)
VIN 6 V input (colour difference signal)
BLI/CL 7 black level insertion/clamp mode

SC 8 synchronization input signal
AMPSEL 9 high/low amplitude luminance

V

ref

VOUT 11 V output (colour difference signal)
UOUT 12 U output (colour difference signal)
YOUT 13 luminance signal output
GND 14 ground (0 V)
V

CC

R

ext

1 1FH or 2FH mode selection

selection

signal mode selection

10 internally generated reference

voltage for line width control and
rise time control

15 supply voltage (+8 V)
16 external resistor for PTAT current

source

handbook, halfpage

f

1

SEL

2

LW

3

RT

YIN

4

TDA9176

5

UIN UOUT
VIN

6
7

BLI/CL

8

SC AMPSEL

16
15
14
13
12
11
10

9

MBE776

Fig.2 Pin configuration.

R

ext

V

CC

GND
YOUT

VOUT
V

ref

1996 Jan 30 4

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

FUNCTIONAL DESCRIPTION

The TDA9176 is a Luminance Transient Improvement
(LTI) IC which is suitable for operation in both
50 and 100 Hz environments. The IC also contains
chrominance delay lines to compensate for the luminance
delay. A diagram of the LTI processor is illustrated in Fig.3.

The LTI processor contains a delay line which drives a
minimum/maximum (MINMAX) detector and a control
circuit. When the control circuit discovers a transient, the
LTI shaper switches from the minimum to the maximum
signal (or vice-versa, depending on the sign of the
transient). By mixing the original signal with the switched
signal, a variable transient improvement is obtained.
The 50% crossing point of the transient is not affected by
the LTI circuit.

If the rise time improvement is active, the duty cycle of the
output signal can be varied with the line width control input.
This function delays the rising edge and advances the
falling edge (or vice-versa). This can be used for example
aperture correction. Figures 4 and 5 illustrate some
waveforms of the LTI processor.

For correct operation the LTI circuit requires a number of
fast clamps. To overcome problems where noise is
superimposed on the input signal the device contains an
input clamp that can either clamp to the black level of the
input signal, or, insert a black level. When a black level is
inserted, the internal clamps do not respond to the noise
on the input signal (see Fig.1). When the input signal
already has an inserted black level (e.g. when it is driven
from the TDA9170 picture booster) it is recommended to

set the device to the clamping mode. If no inserted black
level is available on the input signal it is recommended to
select the black insert mode of the input clamp.

The chrominance delay lines compensate for the delay of
the luminance signal in the LTI circuit. This is to safeguard
a correct colour fit.

Two and three level sandcastles can be used as a timing
signal, only the clamp pulse of the sandcastle input is used
in the device.

There are three selection inputs to select the modes of
operation. These selections are as follows:

1. 1FH or 2FH, for the 50 or 100 Hz applications.

2. Amplitude selection, for optimum operation of the
circuit with 450 mV (p-p) or 1 V

luminance signals.

bl-wh

3. Black insertion or clamping of the luminance signal.

The selection inputs must be directly connected to either
ground or the supply rail. The modes are selected as
follows:

Frequency selection: GND = 1FH mode,
VCC= 2FH mode

Amplitude selection: GND = 450 mV (p-p),
VCC=1V

bl-wh

mode

Black insertion/clamp: GND = clamp mode,
VCC= black insert mode.

If the selection pins are left floating, internal 1 MΩ resistors
connected to the pins set the device to, 1FH mode, black
insert mode and 1 V

bl-wh

mode.

handbook, full pagewidth

TDA9176

YIN

4

DELAY

CLAMPS MINMAX

Fig.3 Block diagram of the LTI circuit.

1996 Jan 30 5

LTI

CONTROL

RT LW

LTI

SHAPER

23

13

MBE777

YOUT

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

MBE779

handbook, full pagewidth

rise time = nominal

line width = don't care

rise time = minimal

line width = nominal

0.0 2.0 µs

Fig.4 LTI waveforms for 2T pulse and step (1FH mode, rise time varied).

1996 Jan 30 6

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

MBE780

handbook, full pagewidth

rise time = nominal

line width = don't care

rise time = minimal

line width = nominal

rise time = minimal

line width = maximum
black expansion

rise time = minimal

line width = maximum
white expansion

0.0 1.0 µs

Fig.5 LTI waveforms for 2T pulse and step (2FH mode, line width varied).

1996 Jan 30 7

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

P

tot

T

stg

T

amb

V

es

Notes

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor (all pins).

2. Machine model: equivalent to discharging a 200 pF capacitor through a 0 Ω resistor (all pins).

supply voltage −−9.0 V
supply current −−35 mA
total power dissipation −−0.315 W
storage temperature −55 − +150 °C
operating ambient temperature −10 − +70 °C
electrostatic handling note 1 −3000 − +3000 V

note 2 −300 − +300 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 69 K/W

QUALITY SPECIFICATION

In accordance with SNW-FQ-611 part E. The numbers of the quality specification can be found in the

Handbook”

. The handbook can be ordered using the code 9397 750 00192.

“Quality reference

1996 Jan 30 8

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

CHARACTERISTICS

V

=8V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CC

I

CC

P

dis

Y channel; note 1
V

i(Y p-p)

V

iY(bl-wh)

I

i(Y)

V

BLos

V

o(DC)

G

(Y)

t

d

V

tr

V

LW

t

r(min)

δ

(min)

δ

(max)

B

Y

=25°C; unless otherwise specified.

amb

supply voltage 7.2 8.0 8.8 V
supply current 1FH mode − 24 − mA

2FH mode − 30 − mA

power dissipation 1FH mode − 192 − mW

2FH mode − 240 − mW

input voltage

LOW amplitude mode − 0.45 0.63 V

(peak-to-peak value)
input voltage (black-to-white) HIGH amplitude mode − 1.0 1.4 V
input current − 0 −µA
black offset voltage black insert mode −− 10 mV
DC output voltage level during

clamping

low amplitude mode − 3.7 − V

high amplitude mode − 2.2 − V
gain all modes − 1 −
delay time 1FH mode − 165 − ns

2FH mode − 100 − ns
rise time control voltage minimum rise time 3.5 − 4.0 V

nominal rise time 0 − 0.5 V
line width control voltage normal width − 2.0 − V

maximum black expansion 0 − 0.5 V

maximum white expansion 3.5 − 4.0 V
minimum rise time 1FH mode; note 2 − 20 − ns

2FH mode; note 2 − 14 − ns
minimum duty factor fi= 2 MHz; line width

− 33 − %
minimum; maximum black
expansion; note 3

maximum duty factor fi= 2 MHz; line width

− 67 − %
maximum; maximum
white expansion; note 3

bandwidth 1FH mode; nominal rise

7 −−MHz

time; note 4
2FH mode; nominal rise

14 −−MHz

time; note 4

1996 Jan 30 9

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

U and V channels

V

iUV( p-p)

input voltage
(peak-to-peak value)

I

iUV

V

oUV(DC)

input current both channels − 0 −µA
DC output voltage level during

clamping

G

UV

t

d(UV)

B

UV

gain both channels − 1 −
delay time 1FH mode − 165 − ns

bandwidth both channels 5 −−MHz

Sandcastle input

CL
V

th

ripple

clamping threshold − V
allowed ripple on clamping pulse −− 0.4 V

Reference voltage

V

ref(DC)

I

source

DC reference voltage level − 4.0 − V
source current note 5 −− 1mA

Notes

1. All data given is for a 3.0 kΩ external resistor connected to the PTAT current source (pin 16).

2. The test input is a step whose rising edge is the rising half of a sine wave. For the 1FH mode the input rise time is
250 ns (i.e. half of a 2 MHz sine wave). For the 2FH mode the input rise time is 125 ns (i.e. half of a 4 MHz sine
wave). The output rise time is measured between the 10% and 90% points of the output signal.

3. The figures given on duty cycle variation refer to the following conditions: the device should be in 1FH mode (pin 1
at ground level) and the rise time should be at minimum (pin 3 connected to V

4. In the transparent mode, i.e. at normal rise time, the bandwidth of the luminance path for which the group delay time
constant is 7 MHz in the 1FH mode and 14 MHz in the 2FH mode. However, as the circuit uses all-pass filters, ringing
on the output signal may occur if the bandwidth of the input signal is larger than 7 MHz in the 1FH mode or 14 MHz
in the 2FH mode. As the LTI processor adds harmonics to the luminance signal, the bandwidth of the output signal
is much larger than 14 MHz.

5. The maximum DC load on the reference voltage pin (pin 10) should not exceed 1 mA.

V channel − 1.05 1.50 V
U channel − 1.33 1.90 V

both channels − 3.0 − V

2FH mode − 100 − ns

− 0.6 − V

top

, pin 10).

ref

1996 Jan 30 10

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

TEST AND APPLICATION INFORMATION

UOUT

handbook, full pagewidth

8 V

0 V

100

nF

YOUT

100nF100nF100

100 µF

3.0
kΩ

16 15 14 13 12 11 10 9

VOUT

nF

100
nF

TDA9176

4321

MBE778

100nF100nF100

YIN

Fig.6 Application diagram for 50 Hz application with 1 V

8765

nF

UIN

VIN SC

input signal and luminance clamping.

bl-wh

1996 Jan 30 11

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

INPUT PIN CONFIGURATION

handbook, full pagewidth

f

SEL

YIN

UIN

LW

RT

1

1 kΩ

100 Ω

100 Ω

MΩ

1 kΩ

1 kΩ

2 V

2 V

4 V

4 V

1.5

mA

0.5

mA

1

2

3

4

5

100 Ω

100 Ω

100 Ω

16

R

ext

15

V

CC

14

GND

13

YOUT

12

UOUT

100 Ω

6

VIN

1 kΩ

7

BLI/CL

1

MΩ

100 Ω

8

SC

Fig.7 Input pin configuration.

1996 Jan 30 12

4 V

TDA9176

0.5
mA

100 Ω

100 Ω

30

kΩ

1
MΩ

1 kΩ

11

VOUT

10

V

ref

9

AMPSEL

MBE781

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

pin 1 index

e

b

b

1

9

A

w M

SOT38-1

M

E

A

2

A

1

c

(e )

1

M

H

E

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

1996 Jan 30 13

6.48

6.20

0.26

0.24

8

(1)

Z

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

w

H

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02
95-01-19

max.

2.2

0.087

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

(order code 9398 652 90011).

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Jan 30 14

Philips Semiconductors Preliminary specification

Luminance Transient Improvement (LTI) IC TDA9176

NOTES

1996 Jan 30 15

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SCDS47 © Philips Electronics N.V. 1996

All rights are reserved. Reproduction in whole or in part is prohibited without the
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The information presented in this document does not form part of any quotation
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Printed in The Netherlands

537021/1100/02/pp16 Date of release: 1996 Jan 30
Document order number: 9397 750 00598