Datasheet TDA8947J Datasheet (Philips)

TDA8947J

4-channel audio ampliﬁer (SE: 1 W to 25 W; BTL: 4 W to 50 W)

Rev. 01 — 06 February 2004 Preliminary data

1. General description

The TDA8947J contains four identical audio power ampliﬁers. The TDA8947J can be used as: four Single-Ended (SE) channels with a ﬁxed gain of 26 dB, two times Bridge-Tied Load (BTL) channelswith a ﬁxed gain of 32 dB or two times SE channels (26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system.

The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J is pin compatible with the TDA8944AJ and TDA8946AJ.

The TDA8947J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it.

2. Features

3. Applications

■ SE: 1 W to 25 W, BTL: 4 W to 50 W operation possibility (2.1 system)

■ Soft clipping

■ Standby and mute mode

■ No on/off switching plops

■ Low standby current

■ High supply voltage ripple rejection

■ Outputs short-circuit protected to ground, supply and across the load

■ Thermally protected

■ Pin compatible with TDA8944AJ and TDA8946AJ.

■ Television

■ PC speakers

■ Boom box

■ Mini and micro audio receivers.

Philips Semiconductors

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

P

o(SE)

P

o(BTL)

THD total harmonic distortion SE; P

G

v(max)

SVRR supply voltage ripple

TDA8947J

4-channel audio ampliﬁer

supply voltage operating 9 18 26 V

[1]

no (clipping) signal quiescent supply current VCC=18V; RL= ∞ - 100 145 mA standby supply current - - 10 µA SE output power THD = 10 %; RL=4Ω

=18V 7 8.5 - W

V

CC

=22V - 14 - W

V

CC

BTL output power THD = 10 %; RL=8Ω

=18V 16 18 - W

V

CC

=22V - 29 - W

V

CC

= 1 W - 0.1 0.5 %

o

BTL; P

= 1 W - 0.05 0.5 %

o

maximum voltage gain SE 25 26 27 dB

BTL 31 32 33 dB

SE; f = 1 kHz - 60 - dB rejection

BTL; f = 1 kHz - 65 - dB

--28V

[1] The ampliﬁer can deliver output power with non clipping output signals into nominal loads as long as

the ratings of the IC are not exceeded.

5. Ordering information

Table 2: Ordering information

Type number

TDA8947J DBS17P plastic DIL-bent-SIL power package; 17 leads

Package Name Description Version

SOT243-1

(lead length 12 mm)

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6. Block diagram

TDA8947J

4-channel audio ampliﬁer

IN1+

IN2+

IN3+

IN4+

CIV

SVR

SGND

MODE1

MODE2

V

CC1

8

60 kΩ

6

60 kΩ

9

60 kΩ

12

60 kΩ

13

V

CC

11

0.5V

CC

V

ref

7

10

5

STANDBY ALL

MUTE ALL

ON 1+2

MUTE 3+4

ON 3+4

V

CC2

3

16

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

1

OUT1+

4

OUT2−

14

OUT3−

17

OUT4+

TDA8947J

215

GND1 GND2

MDB014

Fig 1. Block diagram.

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7. Pinning information

7.1 Pinning

OUT1

GND1 V

CC1

OUT2

MODE2

IN2

SGND

IN1 IN3

MODE1

SVR IN4

CIV

OUT3

GND2 V

CC2

OUT4

+

−

+

+ +

+

−

+

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17

TDA8947J

4-channel audio ampliﬁer

TDA8947J

MDB015

Fig 2. Pin conﬁguration.

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

OUT1+ 1 non inverted loudspeaker output of channel 1 GND1 2 ground of channels 1 and 2 V

CC1

OUT2− 4 inverted loudspeaker output of channel 2 MODE2 5 mode selection 2 input: mute and on for channels 3 and 4 IN2+ 6 input channel 2 SGND 7 signal ground IN1+ 8 input channel 1 IN3+ 9 input channel 3 MODE1 10 mode selection 1 input: standby, mute and on for all channels SVR 11 half supply voltage decoupling (ripple rejection) IN4+ 12 input channel 4

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Preliminary data Rev. 01 — 06 February 2004 4 of 24

3 supply voltage channels 1 and 2

Philips Semiconductors

TDA8947J

4-channel audio ampliﬁer

Table 3: Pin description

Symbol Pin Description

CIV 13 common input voltage decoupling OUT3− 14 inverted loudspeaker output of channel 3 GND2 15 ground of channels 3 and 4 V

CC2

OUT4+ 17 non inverted loudspeaker output of channel 4 TAB - back side tab or heats spreader has to be connected to

8. Functional description

8.1 Input conﬁguration

The input cut-off frequency is:

f

i cut off–()

For SE application Ri= 60 kΩ and Ci= 220 nF:

…continued

16 supply voltage channels 3 and 4

ground

=

1

---------------------------- -

2π RiCi×()

(1)

f

i cut off–()

---------------------------------------------------------------- -

2π 60 103220 109–×××()

1

12 Hz==

For BTL application Ri= 30 kΩ and Ci= 470 nF:

f

i cut off–()

---------------------------------------------------------------- -

2π 30 103470 109–×××()

1

11 Hz==

As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior.

8.2 Power ampliﬁer

The power ampliﬁer is a BTL and/or SE ampliﬁer with an all-NPN output stage, capable of delivering a peak output current of 4 A.

Using the TDA8947J as a BTL ampliﬁer offers the following advantages:

• Low peak value of the supply current

• Ripple frequency on the supply voltage is twice the signal frequency

• No expensive DC-blocking capacitor

• Good low frequency performance.

(2)

(3)

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8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 8.

The maximum output power is limited by the supply voltage (VCC= 26 V) and the maximum output current (Io= 4 A repetitive peak current).

For supply voltages VCC> 22 V, a minimum load is required; see Figure 5:

TDA8947J

4-channel audio ampliﬁer

• SE: R

L

• BTL: R

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion.

The Average Listening Level (ALL) music power, without any distortion, yields:

• SE at P

P

oALL()SE

• BTL at P

P

oALL()BTL

The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively.

=3Ω

=6Ω.

L

=5W, VCC=18V, RL=4Ω and THD = 0.2 %:

o(SE)

3

510

⋅

---------------

15.85

o(BTL)

10 103⋅

------------------

15.85

315 mW==

=10W, VCC=18V, RL=8Ω and THD = 0.1 %:

630 mW==

(4)

(5)

Table 4: Power rating as function of headroom

Headroom Power output Power dissipation

SE BTL

0dB P 12 dB P

=5W Po=10W PD=17W

o

= 315 mW P

o(ALL)

= 630 mW PD=9W

o(ALL)

(all channels driven)

For heatsink calculation at the average listening level, a power dissipation of 9 W can be used.

8.3 Mode selection

The TDA8947J has three functional modes which can be selected by applying the proper DC voltage to pin MODE1.

Standby — The current consumption is very low and the outputs are ﬂoating. The device is in the standby mode when V grounded. In the standby mode, the function of pin MODE2 has been disabled.

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< 0.8 V, or when the MODE1 pin is

MODE1

Philips Semiconductors

Mute — The ampliﬁer is DC-biased, but not operational (no audio output). This allows

the input coupling capacitors to be charged to avoid pop-noise. The device is in the mute mode when 4.5V<V

On — The ampliﬁer is operating normally. The on mode is activated at V

MODE1

mode. The output channels 3 and 4 can be switched on/off by applying a proper DC voltage

to pin MODE2, under the condition that the output channels 1 and 2 are in the on mode (see Figure 3).

Table 5: Mode selection

Voltage on pin Channel 1 and 2 Channel 3 and 4 MODE1 MODE2

0 to 0.8 V 0 to V

4.5 to (V (V

TDA8947J

4-channel audio ampliﬁer

<(VCC− 3.5 V).

MODE1

>(VCC− 2.0 V). The output of channels 3 and 4 can be set to mute or on

(sub woofer)

standby standby mute mute

on on

CC

− 2.0 V) to V

CC

− 3.5 V) 0 to V 0 to (VCC− 3.5 V) on mute

CC

(V

CC

CC CC

− 2 V) to V

all standby

0.8 4.5 VCC−3.5

channels 3+4: mute

MDB016

all mute

VCC−3.5 V

channels 1+2: on channels 3+4: on or mute

VCC−2.0

V

CC

V

MODE1

channels 3+4: on

CC

V

MODE2

Fig 3. Mode selection.

8.4 Supply voltage ripple rejection

The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies.

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8.5 Built-in protection circuits

The TDA8947J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of approximately 185 °C or a global temperature of approximately 150 °C, this detection circuit switches off the power stages for 2 ms. High impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TDA8947J against shorts to ground, to the supply voltage and across the load, and against too high chip temperatures.

The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be ﬂowing through the short, just as much as the power stage can handle without exceeding the critical temperature level.

9. Limiting values

TDA8947J

4-channel audio ampliﬁer

Table 6: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC

V

I

ORM

T

stg

T

amb

P

tot

V

CC(sc)

[1] The ampliﬁer can deliver output power with non clipping output signals into nominal loads as long as

supply voltage operating −0.3 +26 V

input voltage −0.3 VCC+ 0.3 V repetitive peak output

current storage temperature non-operating −55 +150 °C ambient temperature −40 +85 °C total power dissipation - 69 W supply voltage to guarantee

short-circuit protection

the ratings of the IC are not exceeded.

10. Thermal characteristics

Table 7: Thermal characteristics

Symbol Parameter Conditions Value Unit

R

th(j-a)

th(j-c)

thermal resistance from junction to ambient

thermal resistance from junction to case

[1]

no (clipping) signal

in free air 40 K/W

all channels driven 1.3 K/W

−0.3 +28 V

-4 A

-24V

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TDA8947J

4-channel audio ampliﬁer

11. Static characteristics

Table 8: Static characteristics

VCC=18V; T otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supply

V

CC

I

q

I

stb

Output pins

V

O

∆V

OUT

Mode selection pins

V

MODE1

V

MODE2

I

MODE1

I

MODE2

=25°C; RL=8Ω; V

amb

MODE1=VCC

supply voltage operating

quiescent supply current RL= ∞

; V

MODE2=VCC

no (clipping) signal

; Vi= 0 V; measured in test circuit Figure 12; unless

[1]

9 1826V

[2]

--28V

[3]

- 100 145 mA

standby supply current - - 10 µA

DC output voltage differential output voltage offset BTL mode

selection voltage on pin MODE1 on VCC− 2.0 - V

mute 4.5 - V

[4]

-9-V

[5]

- - 170 mV

CC CC

V

− 3.5 V

standby 0 - 0.8 V

selection voltage on pin MODE2 on: channels 3 and 4

mute: channels 3 and 4 0 - V selection current on pin MODE1 0 < V selection current on pin MODE2 0 < V

<(VCC− 3.5 V) - - 20 µA

MODE1

<(VCC− 3.5 V) - - 20 µA

MODE2

[6]

VCC− 2.0 - V

CC

− 3.5 V

CC

V

[1] A minimum load is required at supply voltages of VCC> 22 V: RL=3Ω for SE and RL=6Ω for BTL. [2] The ampliﬁer can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not

exceeded. [3] With a load connected at the outputs the quiescent current will increase. [4] The DC output voltage, with respect to ground, is approximately 0.5VCC. [5] ∆V [6] Channels 3 and 4 can only be set to mute or on by MODE2 when V

OUT

= V

OUT+

− V

OUT−



MODE1>VCC

− 2.0 V.

12. Dynamic characteristics

Table 9: Dynamic characteristics SE

VCC=18V; T otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

P

o(SE)

THD total harmonic distortion P G

v

Z

i

V

n(o)

=25°C; RL=4Ω; f = 1 kHz; V

amb

MODE1=VCC

; V

MODE2=VCC

; measured in test circuit Figure 12; unless

SE output power VCC= 18 V; see Figure 8a

THD = 10 %; R THD = 0.5 %; R

=22V

V

CC

THD = 10 %; R

= 1 W - 0.1 0.5 %

o

=4Ω 7 8.5 - W

L

=4Ω - 6.5 - W

L

=4Ω -14-W

L

voltage gain 25 26 27 dB input impedance 40 60 - kΩ noise output voltage

[1]

- 150 - µV

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Preliminary data Rev. 01 — 06 February 2004 9 of 24

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TDA8947J

4-channel audio ampliﬁer

Table 9: Dynamic characteristics SE

VCC=18V; T

=25°C; RL=4Ω; f = 1 kHz; V

amb

…continued

MODE1=VCC

; V

MODE2=VCC

; measured in test circuit Figure 12; unless

otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

SVRR supply voltage ripple rejection f

V

o(mute)

α

cs

| channel unbalance - - 1 dB

|G

v

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance

[2] Supply voltage ripple rejection is measured at the output, with a source impedance R

[3] Output voltage in mute mode is measured with V

output voltage in mute mode channel separation R

R

=0Ω at the input.

source

from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f

is applied to the positive supply rail.

including noise.

= 1 kHz

ripple

= 100 Hz to 20 kHz

f

ripple

=0Ω 50 60 - dB

source

MODE1=VMODE2

= 7 V, and Vi= 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,

[2]

-60-dB

[2]

-60-dB

[3]

- - 150 µV

=0Ω at the input and with a frequency range

source

and an amplitude of 300 mV (RMS), which

ripple

Table 10: Dynamic characteristics BTL

VCC=18V; T

=25°C; RL=8Ω; f = 1 kHz; V

amb

MODE1=VCC

; V

MODE2=VCC

; measured in test circuit Figure 12; unless

otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

P

o(BTL)

THD total harmonic distortion P G

v

Z

i

V

n(o)

SVRR supply voltage ripple rejection f

V

o(mute)

α

cs

| channel unbalance - - 1 dB

|G

v

BTL output power VCC= 18 V; see Figure 8b

THD = 10 %; R THD = 0.5 %; R

=22V

V

CC

THD = 10 %; R

= 1 W - 0.05 0.5 %

o

=8Ω 16 18 - W

L

=8Ω -14-W

L

=8Ω -29-W

L

voltage gain 31 32 33 dB input impedance 20 30 - kΩ noise output voltage

output voltage in mute mode channel separation R

= 1 kHz

ripple

= 100 Hz to 20 kHz

f

ripple

=0Ω 50 65 - dB

source

[1]

- 200 - µV

[2]

-65-dB

[2]

-65-dB

[3]

- - 250 µV

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance

R

=0Ω at the input.

source

[2] Supply voltage ripple rejection is measured at the output, with a source impedance R

from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f

is applied to the positive supply rail. [3] Output voltage in mute mode is measured with V

including noise.

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Preliminary data Rev. 01 — 06 February 2004 10 of 24

MODE1=VMODE2

= 7 V, and Vi= 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,

=0Ω at the input and with a frequency range

source

and an amplitude of 300 mV (RMS), which

ripple

Philips Semiconductors

TDA8947J

4-channel audio ampliﬁer

7

10

V

o

(µV)

6

10

5

10

4

10

3

10

2

10

1

04812

BTL; VCC= 18 V; Vi=50mV.

Fig 4. AC output voltage as function of voltage on pin MODE1.

MCE485

P

(W)

60

o

40

P

(W)

60

o

40

16

V

MODE1

coc005

20

(V)

MCE484

6 Ω4 Ω

8 Ω

3 Ω2 Ω

20

4 Ω

8 Ω

24

V

(V)

CC

0

RL = 1 Ω

8

12 28

16 20

20

0

RL = 2 Ω

8

12 28

16 20

16 Ω

24

V

(V)

CC

THD = 10 %; one channel. THD = 10 %; one channel.

a. SE b. BTL

Fig 5. Output power as function of supply voltage at various loads

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TDA8947J

4-channel audio ampliﬁer

Po (W)

MCE488

2

10

THD+N

(%)

10

1

−1

10

−2

2

10

−1

10

= 18 V; f = 1 kHz; RL=8Ω.

CC

1

2

10

THD+N

(%)

10

1

−1

10

−2

10

−1

10

110

VCC= 18 V; f = 1 kHz; RL=4Ω.V

a. SE b. BTL

Fig 6. Total harmonic distortion-plus-noise as function of output power.

THD+N

(%)

10

MCE489

THD+N

(%)

10

MCE487

10

Po (W)

10

MCE490

2

1

−1

10

−2

10

2

10

3

10

4

10

f (Hz)

5

10

VCC=18V; Po= 1 W; RL=4Ω.V

1

−1

10

−2

10

= 18 V; Po= 1 W; RL=8Ω.

CC

2

10

a. SE b. BTL

Fig 7. Total harmonic distortion-plus-noise as function of frequency.

3

10

4

10

f (Hz)

5

10

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TDA8947J

4-channel audio ampliﬁer

50

P

o

(W)

40

30

20

10

0

12

828

16 20 24

MCE491

VCC (V)

50

P

o

(W)

40

30

20

10

0

12

828

THD = 10%; RL=4Ω; f = 1 kHz. THD= 10%; RL=8Ω; f = 1 kHz.

a. SE b. BTL

Fig 8. Output power as function of supply voltage.

P

(W)

20

D

16

MCE493

P

(W)

20

D

16

MCE492

16 20 24

VCC (V)

MCE494

12

8

4

0

020

4

81216 0 20

Po (W)

VCC=18V; RL=4Ω.V

12

8

4

0

= 18 V; RL=8Ω.

CC

4

81216

Po (W)

a. SE b. BTL

Fig 9. Total power dissipation as function of channel output power per channel (worst case, all channels driven).

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TDA8947J

4-channel audio ampliﬁer

0

α

cs

(dB)

−20

−40

−60

−80

−100

10

2

10

3

10

VCC=18V; RL=4Ω.V

MCE495

4

10

f (Hz)

5

10

0

α

cs

(dB)

−20

−40

−60

−80

−100

10

= 18 V; RL=8Ω.

CC

2

10

3

10

a. SE b. BTL

Fig 10. Channel separation as function of frequency (no bandpass ﬁlter applied).

MCE497

SVRR

(dB)

−20

0

SVRR

(dB)

−20

0

MCE496

4

10

f (Hz)

10

MCE498

5

−40

−60

−80

10

VCC=18V; R

source

2

10

=0Ω; V

3

10

= 300 mV (RMS).

ripple

4

10

f (Hz)

10

A bandpass ﬁlter of 20 Hz to 22 kHz has been applied. Inputs short-circuited.

5

−40

−60

−80

10

VCC= 18 V; R

source

2

10

=0Ω; V

3

10

= 300 mV (RMS).

ripple

4

10

f (Hz)

10

A bandpass ﬁlter of 20 Hz to 22 kHz has been applied. Inputs short-circuited.

5

a. SE b. BTL

Fig 11. Supply voltage ripple rejection as function of frequency.

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13. Application information

13.1 Application diagrams

V

i

V

i

470 nF

V

i

220 nF

IN1+

IN2+

IN3+

IN4+

TDA8947J

4-channel audio ampliﬁer

V

CC

R

4 Ω

R 8 Ω

L

1000 µF

+

−

470 µF

R

4 Ω

L

14

17

1

4

100 nF

OUT1+

OUT2−

OUT3−

OUT4+

− +

V

CC1

3

8

60 kΩ

6

60 kΩ

9

60 kΩ

12

V

CC2

16

60 kΩ

13

CIV

V

CC

V

7.5 V

micro-

controller

10kΩ50

1.5 kΩ

kΩ

BC547

100

kΩ

BC547

CC

270 Ω

2.2 µF

47

µF

V

CC

22 µF

SVR

SGND

MODE1

MODE2

11

0.5V

CC

V

ref

7

10

5

STANDBY ALL

MUTE ALL

ON 1 + 2

MUTE 3 + 4

ON 3 + 4

Fig 12. Typical application diagram without on/off switching plops.

Table 11: Ampliﬁer selection by microcontroller

Microcontroller with open-collector output; see Figure 12

Microcontroller Channels 1 and 2 Channels 3 and 4

LOW on on HIGH mute mute

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

TDA8947J

215 GND1 GND2

mdb017

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Preliminary data Rev. 01 — 06 February 2004 15 of 24

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220 nF

V

i

220 nF

V

i

470 nF

V

i

22 µF

IN1+

IN2+

IN3+

IN4+

CIV

TDA8947J

4-channel audio ampliﬁer

V

CC

R 4 Ω

R 8 Ω

L

1000 µF

+

−

450 µF

R

4 Ω

L

14

17

1

4

100 nF

OUT1+

OUT2−

− +

OUT3−

− +

OUT4+

V

CC1

3

8

60 kΩ

6

60 kΩ

9

60 kΩ

12

60 kΩ

13

V

CC

V

CC2

16

SHORT-CIRCUIT

TEMPERATURE

PROTECTION

AND

SVR

11

0.5V

CC

V

ref

STANDBY ALL

MUTE ALL

ON 1+2

MUTE 3+4

ON 3+4

TDA8947J

215

GND1 GND2

MICRO-

CONTROLLER

150 µF

SGND

7

MODE1

10

MODE2

V

CC

5

Fig 13. Application diagram with one pin control and reduction of capacitor.

Remark: Because of switching inductive loads, the output voltage can rise beyond

the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground.

MDB018

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Preliminary data Rev. 01 — 06 February 2004 16 of 24

Philips Semiconductors

13.2 Printed-circuit board

13.2.1 Layout and grounding

To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.

TDA8947J

4-channel audio ampliﬁer

BTL1/2

+SE2− +SE1−

220 nF

100 nF

4 Ω

1000 µF

220 nF

4 Ω

1000 µF

+ Vp IN2+ IN1+ IN3+ IN4+

220 nF

TVA

1

4.7 nF

27 Jan. 2003 / FP

AUDIO POWER CS NIJMEGEN

1

CIV

SVF

220 µF

Fig 14. Printed-circuit board layout (single-sided); components view.

13.2.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations.

220 nF

4 Ω

22 µF

1000 µF

10 kΩ

VOL.Sgnd MUTE

150 µF

220 nF

4 Ω

MODE1

10 kΩ

4 Ω

1000 µF

SB ON

MODE2

BTL3/4

BTL4/3 +SE3−

−SE4+

OFF ON

MCE483

For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device.

The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended.

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Preliminary data Rev. 01 — 06 February 2004 17 of 24

Philips Semiconductors

13.3 Thermal behavior and heatsink calculation

TDA8947J

4-channel audio ampliﬁer

The measured maximum thermal resistance of the IC package, R

th(j-mb)

, is 1.3 K/W.

A calculation for the heatsink can be made, with the following parameters:

T

amb(max)

=60°C (example) VCC= 18 V and RL=4Ω (SE) T

= 150 °C (speciﬁcation)

j(max)

R

is the total thermal resistance between the junction and the ambient including

th(tot)

the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation:

R

th(tot)

=(T

j(max)

− T

amb(max)

)/P

D

At VCC=18VandRL=4Ω (4 × SE) the measured worst-case sine-wave dissipation is 17 W; see Figure 9. For T

= 150 °C the temperature raise, caused by the

j(max)

power dissipation, is: 150 − 60=90°C:

P × R R

th(tot)

R

th(h-a)=Rth(tot)

=90°C

th(tot)

= 90/17 = 5.29 K/W

− R

th(j-mb)

= 5.29 − 1.3 = 3.99 K/W

This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation of 9 W (see

Section 8.2.2). This allows for the use of a smaller heatsink:

P × R

th(tot)

R

= 90/9 = 10 K/W

th(tot)

R

th(h-a)=Rth(tot)

=90°C

− R

=10− 1.3 = 8.7 K/W

th(j-mb)

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Preliminary data Rev. 01 — 06 February 2004 18 of 24

Philips Semiconductors

TDA8947J

4-channel audio ampliﬁer

150

T

j

(˚C)

100

50

0

8

12 16 28

T

=25°C; external heatsink of 5 K/W.

amb

(1) RL=1Ω. (2) RL=2Ω. (3) RL=3Ω. (4) RL=4Ω. (5) RL=8Ω.

mce499

(5)(4)(3)(2)(1)

2420

V

(V)

CC

150

T

j

(˚C)

100

50

0

8

12 16 28

T

=25°C; external heatsink of 5 K/W.

amb

(1) RL=2Ω. (2) RL=4Ω. (3) RL=6Ω. (4) RL=8Ω. (5) RL=16Ω.

mce500

(5)(4)(3)(2)(1)

2420

V

(V)

CC

a. 4 times various SE loads with music signals. b. 2 times various BTL loads with music signals.

Fig 15. Junction temperature as function of supply voltage for various loads with music signals.

14. Test information

14.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

is applicable.

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Preliminary data Rev. 01 — 06 February 2004 19 of 24

Philips Semiconductors

15. Package outline

TDA8947J

4-channel audio ampliﬁer

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

non-concave

D

d

j

x

E

h

view B: mounting base side

B

L

3

SOT243-1

D

h

A

2

E

A

117

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT243-1

A2bpcD

17.0

4.6

4.4

0.75

0.60

15.5

1

e

(1)

deD

0.48

24.0

23.6

20.0

19.6

0.38

IEC JEDEC JEITA

w M

b

p

(1)

E

h

12.2

10 2.54

11.8

REFERENCES

Fig 16. Package outline.

0 5 10 mm

scale

E

e

1

2

h

6

5.08

1.27

L

3.4

3.1

Q

m

LL3m

12.4

2.4

11.0

1.6

c

e

2

Qj

2.1

4.3

1.8

EUROPEAN

PROJECTION

v M

v

0.8

x

0.4w0.03

ISSUE DATE

99-12-17 03-03-12

(1)

Z

2.00

1.45

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Preliminary data Rev. 01 — 06 February 2004 20 of 24

Philips Semiconductors

16. Soldering

16.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our

Packages

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

16.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

TDA8947J

4-channel audio ampliﬁer

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speciﬁed maximum storage temperature (T If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

16.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

16.4 Package related soldering information

Table 12: Suitability of through-hole mount IC packages for dipping and wave

soldering methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[2]

PMFP

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

− not suitable

).

stg(max)

[1]

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Preliminary data Rev. 01 — 06 February 2004 21 of 24

Philips Semiconductors

17. Revision history

Table 13: Revision history

Rev Date CPCN Description

01 20040206 - Preliminary data (9397 750 10779)

TDA8947J

4-channel audio ampliﬁer

9397 750 10779

Preliminary data Rev. 01 — 06 February 2004 22 of 24

Philips Semiconductors

18. Data sheet status

TDA8947J

4-channel audio ampliﬁer

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation Thisdata sheet contains datafrom the preliminary speciﬁcation.Supplementary datawill be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

19. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warrantythat such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2][3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a laterdate. Philips Semiconductors reserves the right tochange the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changesat any time in order to improvethe design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

20. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes norepresentations or warrantiesthat these productsare free frompatent, copyright, or maskwork right infringement, unlessotherwise speciﬁed.

Contact information

For additional information, please visit http://www.semiconductors.philips.com. For sales ofﬁce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825

9397 750 10779

Preliminary data Rev. 01 — 06 February 2004 23 of 24

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Input conﬁguration . . . . . . . . . . . . . . . . . . . . . . 5

8.2 Power ampliﬁer. . . . . . . . . . . . . . . . . . . . . . . . . 5

8.2.1 Output power measurement . . . . . . . . . . . . . . . 6

8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.4 Supply voltage ripple rejection . . . . . . . . . . . . . 7

8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 8

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

13 Application information. . . . . . . . . . . . . . . . . . 15

13.1 Application diagrams . . . . . . . . . . . . . . . . . . . 15

13.2 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17

13.2.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 17

13.2.2 Power supply decoupling . . . . . . . . . . . . . . . . 17

13.3 Thermal behavior and heatsink calculation . . 18

14 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19

14.1 Quality information . . . . . . . . . . . . . . . . . . . . . 19

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

16.1 Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . 21

16.2 Soldering by dipping or by solder wave . . . . . 21

16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21

16.4 Package related soldering information . . . . . . 21

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22

18 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 23

19 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

20 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

TDA8947J

4-channel audio ampliﬁer

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Date of release: 06 February 2004 Document order number: 9397 750 10779

Datasheet TDA8947J Datasheet (Philips) [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

8.3 Mode selection

8.4 Supply voltage ripple rejection

8.5 Built-in protection circuits

9. Limiting values

10. Thermal characteristics

11. Static characteristics

12. Dynamic characteristics

13. Application information

13.1 Application diagrams

13.2 Printed-circuit board

13.3 Thermal behavior and heatsink calculation

14. Test information

14.1 Quality information

15. Package outline

16. Soldering

16.1 Introduction to soldering through-hole mount packages

16.2 Soldering by dipping or by solder wave

16.3 Manual soldering

16.4 Package related soldering information

17. Revision history

18. Data sheet status

20. Disclaimers