Datasheet TDA8942P Datasheet (Philips)

Page 1
TDA8942P
2 x 1.5 W stereo Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 14 March 2000 Product specification

1. General description

The TDA8942P is a dual-channel audio power amplifier for an output power of 2 × 1.5 W at a 16 load and a 9 V supply.The circuit contains two Bridge Tied Load (BTL) amplifiers with an all-NPN output stage and standby/mute logic. The TDA8942P comes in a 16-pin dual in-line (DIP) package.The TDA8942P is printed-circuit board (PCB) compatible with all other types in the TDA894x family. One PCB footprint accommodates both the mono and the stereo products.

2. Features

Few external components
Fixed gain
Standby and mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
c
c
Thermally protected
Printed-circuit board compatible.

3. Applications

Mains fed applications (e.g. TV sound)
PC audio
Portable audio.

4. Quick reference data

Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
CC
I
q
I
stb
supply voltage 6 9 18 V quiescent supply current VCC=12V; RL= - 2232mA standby supply current - - 10 µA
Page 2
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
P
o
THD total harmonic distortion P G
v
SVRR supply voltage ripple

5. Ordering information

Table 2: Ordering information
Type number Package
TDA8942P DIP16 plastic dual in-line package; 16 leads (300 mil);

6. Block diagram

dth
…continued
output power THD = 10%;RL=16Ω;
=9V
V
CC
= 0.5 W - 0.03 0.3 %
o
1.2 1.5 - W
voltage gain 31 32 33 dB
50 65 - dB
rejection
Name Description Version
SOT38-1
long body
CC1
V
CC2
V
IN1 IN1+
IN2 IN2+
MODE
SVR
Fig 1. Block diagram.
13 3
12 11
4
STANDBY/
MUTE LOGIC
14
1
TDA8942P
9
V
CC
20
k
SHORT CIRCUIT
TEMPERATURE
20
k
GND18GND2
PROTECTION
16
AND
15
10
MGL578
OUT1
2
OUT1+
7
OUT2
OUT2+
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Product specification Rev. 02 — 14 March 2000 2 of 23
Page 3
Philips Semiconductors

7. Pinning information

7.1 Pinning

TDA8942P
2 x 1.5 W stereo BTL audio amplifier
handbook, halfpage
V
CC1
OUT1+
IN1+
MODE
n.c. n.c.
OUT2
GND2
1 2 3 4
TDA8942P
5 6 7 8
MGR895
16 15 14 13 12 11 10
9
GND1 OUT1 SVR IN1 IN2 IN2+ OUT2+ V
CC2
Fig 2. Pin configuration.

7.2 Pin description

Table 3: Pin description
Symbol Pin Description
V
CC1
OUT1+ 2 positive loudspeaker terminal 1 IN1+ 3 positive input 1 MODE 4 mode selection input (standby, mute, operating) n.c. 5 not connected n.c. 6 not connected OUT2 7 negative loudspeaker terminal 2 GND2 8 ground channel 2 V
CC2
OUT2+ 10 positive loudspeaker terminal 2 IN2+ 11 positive input 2 IN2 12 negative input 2 IN1 13 negative input 1 SVR 14 half supply voltage decoupling (ripple rejection) OUT1 15 negative loudspeaker terminal 2 GND1 16 ground channel 1
1 supply voltage channel 1
9 supply voltage channel 2
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Philips Semiconductors

8. Functional description

The TDA8942P is a stereo BTL audio power amplifier capable of delivering 2 × 1.5 W output power to a 16 load at THD = 10%, using a 9 V power supply. The voltage gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’ and to ‘operating’ mode.
The TDA8942P outputs are protected by an internal thermal shutdown protection mechanism and a short-circuit protection.
8.1 Input configuration
The TDA8942P inputs can be driven symmetrical (floating) as well as asymmetrical. In the asymmetrical mode one input pin is connected via a capacitor to the signal ground which should be as close as possible to the SVR (electrolytic) capacitor ground. Note that the DC level of the input pins is half of the supply voltage VCC, so coupling capacitors for both pins are necessary.
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
The input cut-off frequency is:
f
i cut off()
For Ri=45kΩ and Ci= 220 nF:
f
i cut off()
As shown in Equation 1 and 2, large capacitor values for the inputs are not necessary; so the switch-on delay during charging of the input capacitors, can be minimized. This results in a good low frequency response and good switch-on behaviour.
Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor of at least 1.5 nF across the input pins close to the device.
=
1
---------------------------- -
2π RiCi×()
---------------------------------------------------------------- -
2π 45 103× 220× 109–×()
1
16 Hz==
(1)
(2)
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Philips Semiconductors
8.2 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output stage, capable of delivering a peak output current of 2 A.
The BTL principle offers the following advantages:

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD = 10%; see Figure 8. The maximum output power is limited by the maximum powerdissipation in the plastic dual in-line (DIP16) package.See also Section 14.2 on
page 16.

8.2.2 Headroom

TDA8942P
2 x 1.5 W stereo BTL audio amplifier
Lower peak value of the supply current The ripple frequency on the supply voltage is twice the signal frequency No expensive DC-blocking capacitor Good low frequency performance.
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom – compared to the average power output – for transferring the loudest parts without distortion. At VCC=9V, RL=16Ω and Po= 1 W at THD = 1% (see Figure 6a), the Average Listening Level (ALL) – music power – without any distortion yields:
P
= 1 W/15.85 = 63 mW.
o(ALL)
The power dissipation can be derived from Figure 11 on page 11 for 0 dB respectively 12 dB headroom.
Table 4: Power rating as function of headroom
Headroom Power output (THD = 0.1%) Power dissipation (P)
0dB P 12 dB P
= 1 W 2.35 W
o
= 63 mW 1.15 W
o(ALL)
For the average listening level a power dissipation of 1.15 W can be used for calculation of the maximum ambient temperature T
amb(max)
(see Section 14.2).

8.3 Mode selection

The TDA8942P has three functional modes, which can be selected by applying the proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels, which depend on the supply voltage level. The MODE pin can be driven by a 3-state logic output stage: e.g. a microcontroller with additional components for DC-level shifting.
Standby — In this mode the current consumption is very low and the outputs are floating. The device is in standby mode when (VCC− 0.5 V) < V
MODE<VCC
, or when the MODE pin is left floating (high impedance). The power consumption of the TDA8942P will be reduced to <0.18 mW.
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Philips Semiconductors
Mute — In this mode the amplifier is DC-biased but not operational (no audio output);
the DC level of the input and output pins remain on half the supply voltage. This allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to be charged to avoid pop-noise. The device is in mute mode when 3V<V
Operating — In this mode the amplifier is operating normally. The operating mode is activated at V

8.3.1 Switch-on and switch-off

To avoid audible plops during supply voltage switch-on or switch-off, the device is set to standby mode before the supply voltage is applied (switch-on) or removed (switch-off).
The switch-on and switch-off time can be influenced by an RC-circuit on the MODE pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE pin.
<(VCC− 1.5 V).
MODE
MODE
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
< 0.5 V.

8.4 Supply Voltage Ripple Rejection (SVRR)

The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a bandwidth of 10 Hz to 80 kHz. Figure 13 on page 12 illustrates the SVRR as function of the frequency.A larger capacitor value on the SVR pin improves the ripple rejection behaviour at the lower frequencies.

8.5 Built-in protection circuits

The TDA8942P contains two types of protection circuits, i.e. short-circuit and thermal shutdown.

8.5.1 Short-circuit protection

Short-circuit to ground or supply line — This is detected by a so-called ‘missing
current’ detection circuit which measures the current in the positive supply line and the current in the ground line. A difference between both currents larger than 0.4 A, switches the power stage to standby mode (high impedance).
Short-circuit across the load — This is detected by an absolute-current measurement. An absolute-current larger than 2 A, switches the power stage to standby mode (high impedance).

8.5.2 Thermal shutdown protection

The junction temperature is measured by a temperature sensor; at a junction temperature of approximately 150 °C this detection circuit switches the power stage to standby mode (high impedance).
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Page 7
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier

9. Limiting values

Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CC
supply voltage no signal 0.3 +25 V
operating 0.3 +18 V
V
I
I
ORM
T
stg
T
amb
P
tot
V
CC(sc)
input voltage 0.3 VCC+ 0.3 V repetitive peak output current - 2 A storage temperature non-operating 55 +150 °C operating ambient temperature 40 +85 °C total power dissipation - 2.2 W supplyvoltage to guaranteeshort-circuit
-12V
protection

10. Thermal characteristics

Table 6: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-a)
thermal resistance from junction to ambient in free air 57 K/W

11. Static characteristics

Table 7: Static characteristics
VCC=12V; T
Symbol Parameter Conditions Min Typ Max Unit
V
CC
I
q
I
stb
V
O
[3]
V
OUT
V
MODE
I
MODE
[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential
output voltage offset (∆V [2] The DC output voltage with respect to ground is approximately 0.5VCC. [3] V
OUT
=25°C; RL=8Ω; V
amb
supply voltage operating 6 9 18 V quiescent supply current RL= standby supply current V DC output voltage differential output voltage offset - - 200 mV mode selection input voltage operating mode 0 - 0.5 V
mode selection input current 0 < V
= V
OUT+
V
=0V; Vi= 0 V; measured in test circuit Figure 14; unless otherwise specified.
MODE
) divided by the load resistance (RL).
OUT
OUT
[1]
- 2232mA
MODE=VCC
--10µA
[2]
- 4.5 - V
mute mode 3 - V standby mode V
MODE<VCC
0.5 - V
CC
--20µA
1.5 V
CC CC
V
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Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
50
handbook, halfpage
I
q
(mA)
40
30
20
10
0
0481216
MGL990
VCC (V)
20
Fig 3. Quiescent supply current as function of supply
voltage.
50
handbook, halfpage
I
q
(mA)
40
30
20
10
0
02468
VCC = 11 V
9 V
Fig 4. Quiescent supply current as function of mode
voltage.
MGL991
10 12
V
MODE
(V)

12. Dynamic characteristics

Table 8: Dynamic characteristics
VCC=12V; T 22 Hz to 22 kHz; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
P
o
THD total harmonic distortion P G
v
Z
i(dif)
V
n(o)
SVRR supply voltage ripple rejection f
V
o(mute)
α
cs
=25°C; RL=8Ω; f = 1 kHz; V
amb
= 0 V; measured in test circuit Figure 14; audio pass band
MODE
output power THD = 10% 1.2 1.5 - W
THD = 0.5% 0.8 1 - W
= 0.5 W - 0.03 0.3 %
o
voltage gain 31 32 33 dB differential input impedance 70 90 110 k noise output voltage
ripple
f
ripple
= 1 kHz = 100 Hz
[1]
- 90 120 µV
[2]
50 65 - dB
[2]
-60-dB
to 20 kHz
output voltage mute mode
[3]
--50µV
channel separation RS=0 50 75 - dB
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
RS=0Ω at the input. [2] Supply voltage ripple rejection is measured at the output, with a source impedance RS=0Ω at the input. The ripple voltage is a sine
wave with a frequency f
and an amplitude of 700 mV (RMS), which is applied to the positive supply rail.
ripple
[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
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Product specification Rev. 02 — 14 March 2000 8 of 23
Page 9
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
10
handbook, full pagewidth
V
o
(V)
1
1
10
2
10
3
10
4
10
5
10
Fig 5. Output voltage as function of mode voltage.
2
10
handbook, halfpage
THD
(%)
10
MGL986
2
10
handbook, halfpage
THD
(%)
10
VCC = 11 V
8426100
9 V
V
MODE
MGL993
(V)
MGL987
12
1
1
10
2
10
2
10
CH2
CH1
1
Po (W)
10110
1
1
10
CH2 CH1
2
10
2
10
1
Po (W)
10110
a. VCC=9V; RL=16Ω; f = 1 kHz. b. VCC=11V; RL=25Ω; f = 1 kHz.
Fig 6. Total harmonic distortion as function of output power.
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Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
10
handbook, halfpage
THD
(%)
1
1
10
2
10
10 10
CH2
CH1
2
10
3
10
MGL989
4
10
5
f (Hz)
10
handbook, halfpage
THD
(%)
1
1
10
2
10
10 10
CH2
CH1
2
10
3
10
a. VCC=9V; RL=16Ω; Po= 0.1 W. b. VCC=9V; RL=16Ω; Po= 0.5 W.
No bandpass filter applied.
Fig 7. Total harmonic distortion as function of frequency.
MGL995
P
(W)
3
tot
2.5
handbook, halfpage
P
(W)
3
o
2.5
handbook, halfpage
MGL988
4
10
5
f (Hz)
MGL996
2
1.5
1
0.5
0
02468
RL = 16
25
VCC (V)
2
1.5
1
0.5
1410 12
0
02468
RL = 16
25
1410 12
VCC (V)
THD = 10%; f = 1 kHz. f = 1 kHz.
Fig 8. Output power as function of supply voltage. Fig 9. Total power dissipation as function of supply
voltage.
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Product specification Rev. 02 — 14 March 2000 10 of 23
Page 11
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
100
handbook, halfpage
η
(%)
80
60
40
20
0
0 0.5 1 1.5 2
(1) VCC=9V. (2) V
CC
=11V.
(1) (2)
MGL998
Po (W)
2.5
handbook, halfpage
3
P
(W)
2.5
2
1.5
1
0.5
0
0 0.5 1 1.5 2
(1) V
CC
(2) V
CC
=9V; RL=16Ω. = 11 V; RL=25Ω.
(1) (2)
MGL997
Po (W)
2.5
Fig 10. Efficiency as function of output power. Fig 11. Power dissipation as function of output power.
MGL994
α
(dB)
0
cs
20
handbook, halfpage
40
60
80
100
10 10
2
No bandpass filter applied.
Fig 12. Channel separation as function of frequency.
3
10
4
10
f (Hz)
5
10
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Product specification Rev. 02 — 14 March 2000 11 of 23
Page 12
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
handbook, full pagewidth
0
SVRR
(dB)
20
40
60
80
B
A
10
VCC=9V; RS=0Ω; V
2
10
= 700 mV (RMS); no bandpass filter applied.
ripple
3
10
Curves A: inputs short-circuited Curves B: inputs short-circuited and connected to ground (asymmetrical application)
Fig 13. Supply voltage ripple rejection as function of frequency.
MGL992
CH1
CH2
4
10
f (Hz)
5
10
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Product specification Rev. 02 — 14 March 2000 12 of 23
Page 13
Philips Semiconductors

13. Internal circuitry

Table 9: Internal circuitry
Pin Symbol Equivalent circuit
3 and 13 IN1+ and IN1 11 and 12 IN2+ and IN2
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
V
CC
15 and 2 OUT1and OUT1+ 7 and 10 OUT2and OUT2+
4 MODE
V
CC
13, 12 3, 11
40
V
1/2 V
CC
CC
1.5 k 1.5 k
45 k 45 k
1/2 V
CC
(SVR)
100
MGU071
V
CC
20 k
2, 7, 10, 15
1 k
V
CC
MGU070
V
CC
1 k
4
OFF
HIGH
MUTE
HIGH
MGU073
14 SVR
V
CC
Standby
20 k
14
20 k
MGU072
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Philips Semiconductors

14. Application information

220 nF
R
s
Symmetrical input
R
Asymmetrical input
signal
GND
C
i
1.5
220 nF 220 nF
s
C
i
220 nF
1.5
V
CC
R
IN1
nF
IN1+
IN2
nF
IN2+
MODE
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
+V
CC
100 nF
13
R
i
45 k
1/2 V
R
i
45 k
3
1
CC
TDA8942P
12
R
i
45 k
1/2 V
CC
R
i
45 k
11
4
STANDBY/
MUTE LOGIC
9
30 k
1/2 V
1/2 V
+
CC
+
30 k
− +
CC
+
30 k
− +
+
− +
+
V
CC
15
10
2
7
OUT1
OUT1+
OUT2
OUT2+
1000 µF
R
L
16
R
L
16
C1
MICROCONTROLLER
C2
On
C1 C2
0 0 1
0 1 0
MODE
Standby
Mute
Fig 14. Application diagram.

14.1 Printed-circuit board (PCB)

14.1.1 Layout and grounding

R
signal
GND
SVR
10 µF
20 k
1/2 V
14
gewidth
CC
20 k
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
816
GND
MGL999
For a high system performance level certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.
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Product specification Rev. 02 — 14 March 2000 14 of 23
Page 15
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
dth
54 mm
56 mm
OUT1+
OUT1
+−
10 µF
1
220 nF
1.5 nF
ON
MUTE
IN1
IN1+
IN2
220 nF
OUT2+
100 nF
OUT2
IN2+
1000 µF
V
CC
GND
MGU067
Fig 15. Printed-circuit board layout (single-sided); components view.

14.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR – typical 100 nF – has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor – e.g. 1000 µF or greater – must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail voltage. For good THD and noise performance a low ESR capacitor is recommended.
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Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
14.2 Thermal behaviour and T
The measured maximum thermal resistance of the IC package, R A calculation for the maximum ambient temperature can be made, with the following parameters:
VCC= 9 V and RL=16 T
= 150 °C.
j(max)
R
is the total thermal resistance between the junction and the ambient.
th(tot)
At VCC= 9 V and RL=16Ω the measured worst-case sine-wave dissipation is
2.35 W; see Figure 11. For T T
amb(max)
= 150 – 2.35 × 57=16°C
The calculation above is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2). For T
T
amb(max)
= 150 – 1.15 × 57 = 84.5 °C
j(max)
To increase the lifetime of the IC, T
T
amb(max)
= 125 – 1.15 × 57 = 59.5 °C
j(max)
= 150 °C the maximum ambient temperature is:
amb(max)
calculation
is 57 K/W.
th(j-a)
= 150 °C the maximum ambient temperature is:
should be reduced to 125 °C. This results in:
j(max)

15. Test information

15.1 Quality information

The applicable.

15.2 Test conditions

T
amb
unless otherwise specified. Remark: In the graphs as function of frequency no bandpass filter was applied; see
Figure 7, 12 and 13.
General Quality Specification for Integrated Circuits, SNW-FQ-611D
is
=25°C; VCC= 9 V; f = 1 kHz; RL=16Ω; audio pass band 22 Hz to 22 kHz;
9397 750 06862
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Philips Semiconductors

16. Package outline

TDA8942P
2 x 1.5 W stereo BTL audio amplifier
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
w M

SOT38-1

M
E
A
2
A
1
c
(e )
1
M
H
E
1
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
OUTLINE VERSION
SOT38-1
max.
4.7 0.51 3.7
1 2
min.
max.
1.40
1.14
0.055
0.15
0.045
IEC JEDEC EIAJ
050G09 MO-001 SC-503-16
b
b
0.53
0.38
0.021
0.015
cEe M
1
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1) (1)
6.48
6.20
0.26
0.24
e
0.30
1
3.9
3.4
0.15
0.13
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
M
L
H
w
max.
0.2542.54 7.62
0.087
0.010.100.0200.19
ISSUE DATE
95-01-19 99-12-27
2.2
(1)
Z
Fig 16. DIP16 package outline.
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Product specification Rev. 02 — 14 March 2000 17 of 23
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Page 18
Philips Semiconductors

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our
Packages
Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
2 x 1.5 W stereo BTL audio amplifier
Data Handbook IC26; Integrated Circuit
(document order number 9398 652 90011).
TDA8942P
).
stg(max)

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the solderingiron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

17.4 Package related soldering information

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package Soldering method
Dipping Wave
DBS, DIP, HDIP, SDIP, SIL suitable suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[1]
9397 750 06862
Product specification Rev. 02 — 14 March 2000 18 of 23
© Philips Electronics N.V. 2000. All rights reserved.
Page 19
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier

18. Revision history

Table 11: Revision history
Rev Date CPCN Description
02 20000314 - Product specification; second version; supersedes initial version TDA8942P-01 of
14 April 1999 (9397 750 04879). Modifications:
Table 1 on page 1:THD: Max value 0.1% changed to 0.3%;
SVRR: Typ value 65 dB added Ordering options removed
Figure 1 on page 2: Block diagram; pin numbers changed OUT2−→ 7 and OUT2+ 10
Figure 2 on page 3: Pin configuration; pin numbers changed OUT2−→ 7 and OUT2+ 10
Table 3 on page 3: Pin description; pin numbers changed OUT2−→ 7 and OUT2+ 10
Section 8 “Functional description”:
Section 8.1 “Input configuration” on page 4 added.
Section 8.2 “Power amplifier” on page 5: ........, capable of delivering a peak output
current of 1.5 A changed to 2 A.
Section 8.2.1 “Output power measurement” on page 5 addedSection 8.2.2 “Headroom” on page 5 added
Section 8.3 “Mode selection”:
Standby mode: V
power consumption of the TDA8942P will be reduced to <0.18 mW added.
– Mute mode: the DC level of the input and output pins remain on half the supply
voltage added;
2.5 V < VSection 8.3.1 “Switch-on and switch-off” on page 6 added.
Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added
Section 8.5 “Built-in protection circuits” on page 6 → added
Table 5 on page 7:
P
value added 2.2 W
tot
– V
Table 6 on page 7: R
Table 7 on page 7: V
Table 8 on page 8:
THD: Max value 0.1% changed to 0.3%SVRR; Typ values 65 and 60 dB addedαR
Table note [2]: .... 100 mV (RMS).... changed to ... 700 mV (RMS)....
Figure 3 to 13: figures added
Section 13 “Internal circuitry” on page 13: added
Figure 14: figure modified
value added 12 V
CC(sc)
; Typ value 75 dB added
cs
changed to RSin table and associated table notes; Value added RS=0Ω;
source
<(VCC− 1.5 V) → changed to 3 V < V
MODE
>(VCC− 0.5 V) → changed to (VCC− 0.5 V) < V
MODE
MODE
value 55 K/W changed to 57 K/W
th(j-a)
- mute mode - value Min 2.5 changed to 3 V
MODE
MODE<VCC
<(VCC− 1.5 V)
; The
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Product specification Rev. 02 — 14 March 2000 19 of 23
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Page 20
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
Table 11: Revision history
Rev Date CPCN Description
02 20000314 - Modifications:
01 19990414 - Preliminary specification; initial version.
…continued
Section 14.1 “Printed-circuit board (PCB)” on page 14: added
Figure 15: figure added
Section 14.2 “Thermal behaviour and T
Section 15 “Test information” on page 16: Section 15.1 updated
Section 15.2 “Test conditions” on page 16: added.
amb(max)
calculation” on page 16: added
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Product specification Rev. 02 — 14 March 2000 20 of 23
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Page 21
Philips Semiconductors

19. Data sheet status

TDA8942P
2 x 1.5 W stereo BTL audio amplifier
Datasheet status Product status Definition
Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued data sheet before initiating or completing a design.
20. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
[1]

21. Disclaimers

Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
9397 750 06862
© Philips Electronics N.V. 2000 All rights reserved.
Product specification Rev. 02 — 14 March 2000 21 of 23
Page 22
Philips Semiconductors
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors,
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Internet: http://www.semiconductors.philips.com
(SCA69)
9397 750 06862
Product specification Rev. 02 — 14 March 2000 22 of 23
© Philips Electronics N.V. 2000. All rights reserved.
Page 23
Philips Semiconductors
Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Functional description . . . . . . . . . . . . . . . . . . . 4
8.1 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
8.2 Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2.1 Output power measurement . . . . . . . . . . . . . . . 5
8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3.1 Switch-on and switch-off. . . . . . . . . . . . . . . . . . 6
8.4 Supply Voltage Ripple Rejection (SVRR). . . . . 6
8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6
8.5.1 Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
8.5.2 Thermal shutdown protection . . . . . . . . . . . . . . 6
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
13 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13
14 Application information. . . . . . . . . . . . . . . . . . 14
14.1 Printed-circuit board (PCB). . . . . . . . . . . . . . . 14
14.1.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 14
14.1.2 Power supply decoupling . . . . . . . . . . . . . . . . 15
14.2 Thermal behaviour and T
amb(max)
15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 16
15.1 Quality information . . . . . . . . . . . . . . . . . . . . . 16
15.2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 16
16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17.1 Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 18
17.2 Soldering by dipping or by solder wave . . . . . 18
17.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18
17.4 Package related soldering information . . . . . . 18
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21
20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
21 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
calculation . 16
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
© Philips Electronics N.V. 2000. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 14 March 2000 Document order number: 9397 750 06862
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