Datasheet TDA8941P Datasheet (Philips)

TDA8941P

1.5 W mono Bridge Tied Load (BTL) audio amplifier

Rev. 02 — 7 April 2000 Product specification

1. General description

The TDA8941P is a single-channel audio power amplifier with an output power of

1.5 W at an 16 Ω load and a 9 V supply. The circuit contains a Bridge Tied Load
(BTL) amplifier with anall-NPN output stage and standby/mute logic. The TDA8941P
comes in a 8-pin dual in-line (DIP8) package. The TDA8941P is printed-circuit board
(PCB) compatible with all other types in the TDA894x family. One PCB footprint
accommodates both the mono and the stereo products.

2. Features

■ Few external components

■ Fixed gain

■ Standby and mute mode

■ No on/off switching plops

■ Low standby current

■ High supply voltage ripple rejection

■ Outputs short-circuit protected to ground, supply and across the load

c

c

■ Thermally protected

■ Printed-circuit board compatible.

3. Applications

■ Mains fed applications (e.g. TV sound)

■ PC audio

■ Portable audio.

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

supply voltage 6 9 18 V
quiescent supply current VCC=9V; RL= ∞ - 1420mA
standby supply current - - 10 µA

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P
G

v

SVRR supply voltage ripple

5. Ordering information

Table 2: Ordering information

Type number Package

TDA8941P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

6. Block diagram

dth

…continued

output power THD = 10%;RL=16Ω;

=9V

V

CC

= 0.5 W - 0.03 0.3 %

o

1.2 1.5 - W

voltage gain 31 32 33 dB

50 65 - dB

rejection

Name Description Version

V

CC

IN−
IN+

MODE

SVR

Fig 1. Block diagram.

TDA8941P

5
3

4

STANDBY/

MUTE LOGIC

6

kΩ

kΩ

20

20

V

CC

GND

1

SHORT CIRCUIT

TEMPERATURE

PROTECTION

8

AND

MGL579

7

OUT−

2

OUT+

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 2 of 21

Philips Semiconductors

7. Pinning information

7.1 Pinning

TDA8941P

1.5 W mono BTL audio amplifier

handbook, halfpage

V

CC

OUT+

IN+

MODE

1
2

TDA8941P

3
4

MGR892

GND

8

OUT−

7

SVR

6
5

IN−

Fig 2. Pin configuration.

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

V

CC

OUT+ 2 positive loudspeaker terminal
IN+ 3 positive input
MODE 4 mode selection input (standby, mute, operating)
IN− 5 negative input
SVR 6 half supply voltage decoupling (ripple rejection)
OUT− 7 negative loudspeaker terminal
GND 8 ground

1 supply voltage

8. Functional description

The TDA8941P is a mono BTL audio power amplifier capable of delivering 1.5 W
output power to an 16 Ω load at THD = 10%, using a 9 V power supply. The voltage
gain is fixed at 32 dB.

With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’
and to ‘operating’ mode.

The TDA8941P outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.

8.1 Input configuration

The TDA8941P inputs can be driven symmetrical (floating) as well as asymmetrical.
In the asymmetrical mode one input pin is connected via a capacitor to the signal
ground which should be as close as possible to the SVR (electrolytic) capacitor
ground. Note that the DC level of the input pins is half of the supply voltage VCC, so
coupling capacitors for both pins are necessary.

9397 750 06864

Product specification Rev. 02 — 7 April 2000 3 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

The input cut-off frequency is:

TDA8941P

1.5 W mono BTL audio amplifier

f

i cut off–()

For Ri=45kΩ and Ci= 220 nF:

f

i cut off–()

As shown in Equation 1 and 2, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.

Remark: To prevent HF oscillations do not leavethe inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.

=

1

---------------------------- -

2π RiCi×()

---------------------------------------------------------------- -

2π 45 103× 220× 109–×()

1

16 Hz==

8.2 Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 2 A.

The BTL principle offers the following advantages:

Lower peak value of the supply current

•

The ripple frequency on the supply voltage is twice the signal frequency

•

No expensive DC-blocking capacitor

•

Good low frequency performance.

•

(1)

(2)

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins
at THD = 10%; see Figure 8. The maximum output power is limited by the maximum
power dissipation in the plastic package.

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom –
compared to the average power output – for transferring the loudest parts without
distortion. At VCC=9V, RL=16Ω and Po= 1 W at THD = 1% (see Figure 6), the
Average Listening Level (ALL) – music power – without any distortion yields:

P

The power dissipation can be derived from Figure 11 on page 10 for 0 dB
respectively 12 dB headroom.

9397 750 06864

Product specification Rev. 02 — 7 April 2000 4 of 21

= 1 W/15.85 = 63 mW.

o(ALL)

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

Table 4: Power rating as function of headroom

Headroom Power output (THD = 1%) Power dissipation (P)

0 dB P
12 dB P

For the average listening level a power dissipation of 0.6 W can be used for
calculation of the maximum ambient temperature.

8.3 Mode selection

The TDA8941P has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels,
which depend on the supply voltage level. The MODE pin can be driven by a 3-state
logic output stage: e.g. a microcontroller with additional components for DC-level
shifting.

Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when (VCC− 0.5 V) < V
the MODE pin is left floating (high impedance). The power consumption of the
TDA8941P will be reduced to <0.18 mW.

1.5 W mono BTL audio amplifier

= 1 W 1.15 W

o

= 63 mW 0.6 W

o(ALL)

TDA8941P

MODE<VCC

, or when

Mute — In this mode the amplifier is DC-biased but not operational (no audio output);

the DC level of the input and output pins remain on half the supply voltage. This

allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3V<V

<(VCC− 1.5 V).

MODE

Operating — In this mode the amplifier is operating normally. The operating mode is
activated at V

MODE

< 0.5 V.

8.3.1 Switch-on and switch-off

To avoid audible plops during supply voltage switch-on or switch-off, the device is set
to standby mode before the supply voltage is applied (switch-on) or removed
(switch-off).

The switch-on and switch-off time can be influenced by an RC-circuit on the MODE
pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and
pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE
pin.

8.4 Supply Voltage Ripple Rejection (SVRR)

The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a
bandwidth of 10 Hz to 80 kHz. Figure 12 on page 11 illustrates the SVRR as function
of the frequency.A larger capacitor value on the SVR pin improvesthe ripple rejection
behaviour at the lower frequencies.

9397 750 06864

Product specification Rev. 02 — 7 April 2000 5 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

8.5 Built-in protection circuits

The TDA8941P contains two types of protection circuits, i.e. short-circuit and thermal
shutdown.

8.5.1 Short-circuit protection

Short-circuit to ground or supply line — This is detected by a so-called ‘missing

current’ detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.4 A,
switches the power stage to standby mode (high impedance).

Short-circuit across the load — This is detected by an absolute-current
measurement. An absolute-current larger than 2 A, switches the power stage to
standby mode (high impedance).

8.5.2 Thermal shutdown protection

The junction temperature is measured by a temperature sensor; at a junction
temperature of approximately 150 °C this detection circuit switches the power stage
to standby mode (high impedance).

TDA8941P

1.5 W mono BTL audio amplifier

9. Limiting values

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC

V

I

I

ORM

T

stg

T

amb

P

tot

V

CC(sc)

supply voltage no signal −0.3 +25 V

input voltage −0.3 VCC+ 0.3 V
repetitive peak output current - 2 A
storage temperature non-operating −55 +150 °C
operating ambient

temperature
total power dissipation - 1.25 W
supply voltage to guarantee

short-circuit protection

10. Thermal characteristics

Table 6: Thermal characteristics

Symbol Parameter Conditions Value Unit

R

th(j-a)

thermal resistance from junction to ambient in free air 100 K/W

operating −0.3 +18 V

−40 +85 °C

-12V

9397 750 06864

Product specification Rev. 02 — 7 April 2000 6 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

11. Static characteristics

Table 7: Static characteristics

VCC=9V; T

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

V

O

[3]

∆V

OUT

V

MODE

I

MODE

[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential

output voltage offset (∆V
[2] The DC output voltage with respect to ground is approximately 0.5VCC.
[3] ∆V

OUT

=25°C; RL=16Ω; V

amb

supply voltage operating 6 9 18 V
quiescent supply current RL= ∞
standby supply current V
DC output voltage
differential output voltage offset - - 200 mV
mode selection input voltage operating mode 0 - 0.5 V

mode selection input current 0 < V

= | V

OUT+

− V

OUT−

=0V; Vi= 0 V; measured in test circuit Figure 13; unless otherwise specified.

MODE

) divided by the load resistance (RL).

OUT

|.

[1]

- 1420mA

MODE=VCC

--10µA

[2]

- 4.5 - V

mute mode 3 - V
standby mode V

MODE<VCC

− 0.5 - V

CC

--20µA

− 1.5 V

CC
CC

V

30

handbook, halfpage

I

q

(mA)

25

20

15

10

5

0

0481216

MGU022

VCC (V)

20

Fig 3. Quiescent supply current as function of supply

voltage.

20

handbook, halfpage

I

q

(mA)

16

12

8

4

0

02468

VCC = 11 V

9 V

MGU023

10 12

V

MODE

(V)

Fig 4. Quiescent supply current as function of mode

voltage.

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 7 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

12. Dynamic characteristics

Table 8: Dynamic characteristics

VCC=9V; T

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P
G

v

Z

i(dif)

V

n(o)

SVRR supply voltage ripple rejection f

V

o(mute)

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance

RS=0Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance RS=0Ω at the input. The ripple voltage is a sine

wave with a frequency f
[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.

=25°C; RL=16Ω; f = 1 kHz; V

amb

= 0 V; measured in test circuit Figure 13; unless otherwise specified.

MODE

output power THD = 10% 1.2 1.5 - W

THD = 0.5% 0.8 1 - W

= 0.5 W - 0.03 0.3 %

o

voltage gain 31 32 33 dB
differential input impedance 70 90 110 kΩ
noise output voltage

ripple

f

ripple

= 1 kHz
= 100 Hz

[1]

- 90 120 µV

[2]

50 65 - dB

[2]

-60-dB

to 20 kHz

output voltage mute mode

and an amplitude of 700 mV (RMS), which is applied to the positive supply rail.

ripple

[3]

--50µV

10

handbook, full pagewidth

V

o

(V)

1

−1

10

−2

10

−3

10

−4

10

−5

10

Fig 5. Output voltage as function of mode voltage.

VCC = 11 V

8426100

9 V

V

MODE

MGU025

(V)

12

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 8 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

Po (W)

MGU018

2

10

handbook, halfpage

THD

(%)

10

1

−1

10

−2

10

−2

10110

10

−1

(1)

(2)

Po (W)

2

10

handbook, halfpage

THD

(%)

10

1

−1

10

−2

10

−2

10

(1)

(2)

−1

a. VCC=9V; RL=16Ω; f = 1 kHz. b. VCC=11V; RL=25Ω; f = 1 kHz.

(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Influence of

thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.

(2) Measured with a small heatsink on top of the plastic package body; R

th(h-a)

= 30 K/W.

Fig 6. Total harmonic distortion as function of output power.

MGU019

10110

10

handbook, halfpage

THD

(%)

1

−1

10

−2

10

10 10

(1)

(2)

2

10

3

10

MGU021

10

handbook, halfpage

THD

(%)

1

(1)

−1

10

−2

4

10

5

f (Hz)

10

10 10

2

10

(2)

3

10

4

10

a. VCC=9V; RL=16Ω; Po= 0.1 W. b. VCC=9V; RL=16Ω; Po= 0.5 W.

No bandpass filter applied.
(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Influence of

thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.

(2) Measured with a small heatsink on top of the plastic package body; R

th(h-a)

= 30 K/W.

Fig 7. Total harmonic distortion as function of frequency.

MGU020

5

f (Hz)

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 9 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

handbook, halfpage

3

P

o

(W)

2.5

2

1.5

1

0.5

0

02468

RL = 16 Ω

MGU026

25 Ω

VCC (V)

handbook, halfpage

1410 12

2

P

tot

(W)

1.5

1

0.5

0

02468

RL = 16 Ω

MGU027

25 Ω

1410 12

VCC (V)

THD = 10%; f = 1 kHz. THD = 1%.

Fig 8. Output power as function of supply voltage. Fig 9. Total power dissipation as function of supply

voltage.

100

handbook, halfpage

η

(%)

80

MGU029

handbook, halfpage

2

P

(W)

1.5

MGU028

60

40

20

0

0 0.5 1 1.5 2

(1) VCC=9V.
(2) VCC=11V.

(1)
(2)

Po (W)

2.5

1

0.5

0

0 0.5 1 1.5 2

(1) VCC=9V; RL=16Ω.
(2) VCC= 11 V; RL=25V.

(1)
(2)

Po (W)

2.5

Fig 10. Efficiency as function of output power. Fig 11. Power dissipation as function of output power.

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 10 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

handbook, full pagewidth

0

SVRR

(dB)

−20

B

−40

−60

A

−80
10

VCC=9V; RS=0Ω; V

2

10

= 700 mV (RMS); no bandpass filter applied.

ripple

3

10

Curve A: inputs short-circuited
Curve B: inputs short-circuited and connected to ground (asymmetrical application)

Fig 12. Supply voltage ripple rejection as function of frequency.

MGU024

4

10

f (Hz)

5

10

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 11 of 21

Philips Semiconductors

13. Internal circuitry

Table 9: Internal circuitry

Pin Symbol Equivalent circuit

3 and 5 IN+ and IN−

TDA8941P

1.5 W mono BTL audio amplifier

V

CC

7 and 2 OUT− and OUT+

4 MODE

2, 7

MGU083

1 kΩ

V

CC

3

MGU082

V

CC

1 kΩ

V

CC

5

40 Ω

1/2 V

V

CC

1.5 kΩ 1.5 kΩ

45 kΩ 45 kΩ

1/2 V

CC

(SVR)

100 Ω

CC

V

CC

20 kΩ

4

OFF

HIGH

MUTE

HIGH

MGU073

6 SVR

V

CC

Standby

20 kΩ

6

20 kΩ

MGU084

9397 750 06864

Product specification Rev. 02 — 7 April 2000 12 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

14. Application information

handbook, full pagewidth

Symmetrical
input

Asymmetrical
input

R

s

R

s

signal

GND

220 nF

C

i

220 nF
220 nF

C

i

220 nF

V

CC

1.5
nF

R

MODE

IN−

IN+

TDA8941P

1.5 W mono BTL audio amplifier

+V

CC

100 nF

1

1/2 V

CC

30 kΩ

−
+

+

−

30 kΩ

7

2

OUT−

OUT+

5

R

i

45 kΩ

1/2 V

R

i

45 kΩ

3

CC

−
+

−

+

TDA8941P

V

CC

4

STANDBY/

MUTE LOGIC

1000 µF

R

L

16 Ω

C1

MICROCONTROLLER

C2

On

C1 C2

0
0
1

0
1
0

MODE

Standby

Mute

Fig 13. Application diagram.

14.1 Printed-circuit board (PCB)

14.1.1 Layout and grounding

R

signal

GND

SVR

10
µF

20 kΩ

1/2 V

6

CC

20 kΩ

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

8

GND

MGU016

For a high system performance level certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals.
The small-signal ground tracks should be physically located as far as possible from
the power ground tracks. Supply and output tracks should be as wide as possible for
delivering maximum output power.

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 7 April 2000 13 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

dth

54 mm

56 mm

OUT+

OUT−

+−

10 µF

1

220 nF

1.5 nF

ON

MUTE

IN−

IN+

V

CC

100 nF

1000 µF

GND

MGU017

Fig 14. Printed-circuit board layout (single-sided); components view.

14.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.

9397 750 06864

Product specification Rev. 02 — 7 April 2000 14 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

14.2 Thermal behaviour and T

The measured maximum thermal resistance of the IC package, R
A calculation for the maximum ambient temperature can be made, with the following
parameters:

VCC= 9 V and RL=16Ω
T

= 150 °C.

j(max)

R

is the total thermal resistance between the junction and the ambient.

th(tot)

At VCC= 9 V and RL=16Ω the measured worst-case sine-wave dissipation is

1.15 W; see Figure 11. For T
T

amb(max)

= 150 – 1.15 × 100=35°C

The calculation above is for an application at worst-case (stereo) sine-wave output
signals. In practice music signals will be applied, which decreases the maximum
power dissipation to approximately half of the sine-wave power dissipation (see

Section 8.2.2). For T

T

amb(max)

= 150 – 0.6 × 100=90°C

j(max)

To increase the lifetime of the IC, T

T

amb(max)

= 125 – 0.6 × 100=65°C

j(max)

= 150 °C the maximum ambient temperature is:

amb(max)

calculation

is 100 K/W.

th(j-a)

= 150 °C the maximum ambient temperature is:

should be reduced to 125 °C. This results in:

j(max)

15. Test information

15.1 Quality information

The
applicable.

15.2 Test conditions

T

amb

unless otherwise specified.
Remark: In the graphs as function of frequency no bandpass filter was applied;

see Figure 7 and 12.

General Quality Specification for Integrated Circuits, SNW-FQ-611D

is

=25°C; VCC= 9 V; f = 1 kHz; RL=16Ω; audio pass band 22 Hz to 22 kHz;

9397 750 06864

Product specification Rev. 02 — 7 April 2000 15 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

16. Package outline

TDA8941P

1.5 W mono BTL audio amplifier

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

pin 1 index

1

w M

b

1

b

2

5

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

E

1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT97-1

12

min.

max.

050G01 MO-001 SC-504-8

b

1.73

1.14

0.068

0.021

0.045

0.015

IEC JEDEC EIAJ

b

0.53

0.38

4

0 5 10 mm

scale

1

1.07

0.89

0.042

0.035

b

2

0.36

0.23

0.014

0.009

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

95-02-04
99-12-27

1.154.2 0.51 3.2

(1)

Z

Fig 15. DIP8 package outline.

9397 750 06864

Product specification Rev. 02 — 7 April 2000 16 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our

Packages

Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.

1.5 W mono BTL audio amplifier

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

TDA8941P

).

stg(max)

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.

17.4 Package related soldering information

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, SDIP, SIL suitable suitable

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[1]

9397 750 06864

Product specification Rev. 02 — 7 April 2000 17 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

18. Revision history

Table 11: Revision history

Rev Date CPCN Description

02 20000407 - Product specification; second version; supersedes initial version TDA8941P-01 of

14 April 1999 (9397 750 04876). Modifications:

Table 1 on page 1:THD: Max value 0.1% changed to → 0.3%;

•

SVRR: Typ value 65 dB → added
Ordering options removed

•

Section 8 “Functional description”:

•

– Section 8.1 “Input configuration” on page 3 → added.

– Section 8.2 “Power amplifier” on page 4: ........, capable of delivering a peak output

current of 1.5 A → changed to 2 A.

– Section 8.2.1 “Output power measurement” on page 4 → added
– Section 8.2.2 “Headroom” on page 4 → added

Section 8.3 “Mode selection”:

•

– Standby mode: V

power consumption of the

– Mute mode: the DC level of the input and output pins remain on half the supply

voltage → added;

– 2.5 V < V
– Section 8.3.1 “Switch-on and switch-off” on page 5 → added.

Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 5 → added

•

Section 8.5 “Built-in protection circuits” on page 6 → added

•

Table 5 on page 6:

•

– P

value added 1.25 W

tot

– V

Table 7 on page 7: V

•

Table 8 on page 8:

•

– THD: Max value 0.1% changed to → 0.3%
– SVRR; Typ values 65 and 60 dB → added
– R

– Table note [2]: .... 100 mV (RMS).... changed to → ... 700 mV (RMS)....

Figure 3 to 12: figures added

•

Section 13 “Internal circuitry” on page 12: → added

•

Figure 13: figure modified

•

Section 14.1 “Printed-circuit board (PCB)” on page 13: → added

•

Figure 14: figure added

•

Section 14.2 “Thermal behaviour and T

•

Section 15 “Test information” on page 15: Section 15.1 → updated

•

Section 15.2 “Test conditions” on page 15: → added.

•

01 19990414 - Preliminary specification; initial version.

value added 12 V

CC(sc)

changed to → RSin table and associated table notes

source

<(VCC− 1.5 V) → changed to 3 V < V

MODE

>(VCC− 0.5 V) → changed to (VCC− 0.5 V) < V

MODE

TDA8941P will be reduced to <0.18 mW → added.

MODE

- mute mode - value Min 2.5 → changed to 3 V

MODE

amb(max)

calculation” on page 15: → added

MODE<VCC

<(VCC− 1.5 V)

; The

9397 750 06864

Product specification Rev. 02 — 7 April 2000 18 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

19. Data sheet status

TDA8941P

1.5 W mono BTL audio amplifier

Datasheet status Product status Definition

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may

change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

20. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

[1]

21. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

9397 750 06864

© Philips Electronics N.V. 2000 All rights reserved.

Product specification Rev. 02 — 7 April 2000 19 of 21

Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

Philips Semiconductors - a worldwide company

Argentina: see South America
Australia: Tel. [phone], Fax. [phone]
Austria: Tel. [phone], Fax. [phone]
Belarus: Tel. [phone], Fax. [phone]
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. [phone], Fax. [phone]
Canada: Tel. [phone]
China/Hong Kong: Tel. [phone], Fax. [phone]
Colombia: see South America
Czech Republic: see Austria
Denmark: Tel. [phone], Fax. [phone]
Finland: Tel. [phone], Fax. [phone]
France: Tel. [phone], Fax. [phone]
Germany: Tel. [phone], Fax. [phone]
Hungary: see Austria
India: Tel. [phone], Fax. [phone]
Indonesia: see Singapore
Ireland: Tel. [phone], Fax. [phone]
Israel: Tel. [phone], Fax. [phone]
Italy: Tel. [phone], Fax [phone]
Japan: Tel. [phone], Fax. [phone]
Korea: Tel. [phone], Fax. [phone]
Malaysia: Tel. [phone], Fax. [phone]
Mexico: Tel. [phone]
Middle East: see Italy

Netherlands: Tel. [phone], Fax. [phone]
New Zealand: Tel. [phone], Fax. [phone]
Norway: Tel. [phone], Fax. [phone]
Philippines: Tel. [phone], Fax. [phone]
Poland: Tel. [phone], Fax. [phone]
Portugal: see Spain
Romania: see Italy
Russia: Tel. [phone], Fax. [phone]
Singapore: Tel. [phone], Fax. [phone]
Slovakia: see Austria
Slovenia: see Italy
South Africa: Tel. [phone], Fax. [phone]
South America: Tel. [phone], Fax. [phone]
Spain: Tel. [phone], Fax. [phone]
Sweden: Tel. [phone], Fax. [phone]
Switzerland: Tel. [phone], Fax. [phone]
Taiwan: Tel. [phone], Fax. [phone]
Thailand: Tel. [phone], Fax. [phone]
Turkey: Tel. [phone], Fax. [phone]
Ukraine: Tel. [phone], Fax. [phone]
United Kingdom: Tel. [phone], Fax. [phone]
United States: Tel. [phone]
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

Internet: http://www.semiconductors.philips.com

(SCA69)

9397 750 06864

Product specification Rev. 02 — 7 April 2000 20 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 3

8.1 Input configuration . . . . . . . . . . . . . . . . . . . . . . 3

8.2 Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4

8.2.1 Output power measurement . . . . . . . . . . . . . . . 4

8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3.1 Switch-on and switch-off. . . . . . . . . . . . . . . . . . 5

8.4 Supply Voltage Ripple Rejection (SVRR). . . . . 5

8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6

8.5.1 Short-circuit protection . . . . . . . . . . . . . . . . . . . 6

8.5.2 Thermal shutdown protection . . . . . . . . . . . . . . 6

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

13 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12

14 Application information. . . . . . . . . . . . . . . . . . 13

14.1 Printed-circuit board (PCB). . . . . . . . . . . . . . . 13

14.1.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 13

14.1.2 Power supply decoupling . . . . . . . . . . . . . . . . 14

14.2 Thermal behaviour and T

amb(max)

15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

15.1 Quality information . . . . . . . . . . . . . . . . . . . . . 15

15.2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15

16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17.1 Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . 17

17.2 Soldering by dipping or by solder wave . . . . . 17

17.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17

17.4 Package related soldering information . . . . . . 17

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19

20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

21 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

calculation . 15

TDA8941P

1.5 W mono BTL audio amplifier

© Philips Electronics N.V. 2000. Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 7 April 2000 Document order number: 9397 750 06864