Datasheet TDA8771AH Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8771A

Triple 8-bit video Digital-to-Analog
Converter (DAC)

Product specification
File under Integrated Circuits, IC02

1996 Jan 25

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

FEATURES

• 8-bit resolution

• Sampling rate up to 35 MHz

• Internal reference voltage regulator

• No deglitching circuit required

• Large output voltage range

• 1kΩ output load

• Power dissipation only 200 mW

• Single 5 V power supply

• 44-pin QFP package.

APPLICATIONS

• General purpose high-speed digital-to-analog
conversion

• Digital TV

• Graphic display

• Desktop video processing.

TDA8771A

GENERAL DESCRIPTION

The TDA8771A is a triple 8-bit video Digital-to-Analog
Converter (DAC). It converts the digital input signals into
analog voltage outputs at a maximum conversion rate of
35 MHz.

The DACs are based on resistor-string architecture with
integrated output buffers. The output voltage range is
determined by a built-in reference source.

The device is fabricated in a 5 V, CMOS process that
ensures high functionality with low power dissipation.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

V

DDD

I

DDA

I

DDD

INL integral non-linearity f
DNL differential non-linearity f
f

clk(max)

P

tot

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current RL=1kΩ; note 1 10 33 45 mA
digital supply current f

= 35 MHz − 720mA

clk

= 35 MHz; ramp input −±0.5 ±1 LSB

clk

= 35 MHz; ramp input −±0.25 ±0.5 LSB

clk

maximum clock frequency 35 −−MHz
total power dissipation RL=1kΩ; f

= 35 MHz; note 1 45 200 360 mW

clk

Note

1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for

minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA8771AH QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

P ACKAGE

SOT307-2

body 10 × 10 × 1.75 mm

1996 Jan 25 2

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

BLOCK DIAGRAM

handbook, full pagewidth

(bits R0 to R3)

(bits R4 to R7)

(bits G0 to G3)

RED

digital inputs

RED

digital inputs

GREEN

digital inputs

4

4

4

12 to 9

8
5 to 3

20 to 17

V

TDA8771A

4

DDA DDD

DECODER

MSB

V

7,2732,35,39,43

LSB

DECODER

RESISTOR

STRING

TDA8771A

clock input

31

4

4

1

44

reference

current input

(I )

REF

RED

analog output

GREEN

digital inputs

(bits G4 to G7)

BLUE

digital inputs

(bits B0 to B3)

BLUE

digital inputs

(bits B4 to B7)

4

16 to 13

4

30,29
26,25

4

24 to 21

34, 37, 38,41 33

4

4

MSB

DECODER

MSB

DECODER

LSB

DECODER

RESISTOR

STRING

4

LSB

DECODER

RESISTOR

STRING

BANDGAP

REFERENCE

2,42 6,28

40

36

GREEN

analog output

BLUE

analog output

MBH039

not

connected

reference voltage

decoupling input

Fig.1 Block diagram.

1996 Jan 25 3

(V )

REF

V

V

SSA SSD

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

PINNING

SYMBOL PIN DESCRIPTION

I

REF

V

SSA1

R7 3 RED digital input data; bit 7 (MSB)
R6 4 RED digital input data; bit 6
R5 5 RED digital input data; bit 5
V

SSD1

V

DDD1

R4 8 RED digital input data; bit 4
R3 9 RED digital input data; bit 3
R2 10 RED digital input data; bit 2
R1 11 RED digital input data; bit 1
R0 12 RED digital input data; bit 0 (LSB)
G7 13 GREEN digital input data; bit 7 (MSB)
G6 14 GREEN digital input data; bit 6
G5 15 GREEN digital input data; bit 5
G4 16 GREEN digital input data; bit 4
G3 17 GREEN digital input data; bit 3
G2 18 GREEN digital input data; bit 2
G1 19 GREEN digital input data; bit 1
G0 20 GREEN digital input data; bit 0 (LSB)
B7 21 BLUE digital input data; bit 7 (MSB)
B6 22 BLUE digital input data; bit 6
B5 23 BLUE digital input data; bit 5
B4 24 BLUE digital input data; bit 4
B3 25 BLUE digital input data; bit 3
B2 26 BLUE digital input data; bit 2
V

DDD2

V

SSD2

B1 29 BLUE digital input data; bit 1
B0 30 BLUE digital input data; bit 0 (LSB)
CLK 31 clock input
V

DDA1

V

REF

n.c. 34 not connected
V

DDA2

OUTB 36 BLUE analog output
n.c. 37 not connected
n.c. 38 not connected
V

DDA3

OUTG 40 GREEN analog output

1 reference current input for output buffers
2 analog supply ground 1

6 digital supply ground 1
7 digital supply voltage 1

27 digital supply voltage 2
28 digital supply ground 2

32 analog supply voltage 1
33 decoupling input for reference voltage

35 analog supply voltage 2

39 analog supply voltage 3

TDA8771A

1996 Jan 25 4

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

SYMBOL PIN DESCRIPTION

n.c. 41 not connected
V

SSA2

V

DDA4

OUTR 44 RED analog output

handbook, full pagewidth

42 analog supply ground 2
43 analog supply voltage 4

OUTR

I

V

SSA1

V

SSD1

V

DDD1

REF

R7
R6
R5

R4
R3
R2
R1

index
corner

1
2
3
4
5
6
7
8

9
10
11

44

DDA4

V
43

SSA2

V

42

OUTG

n.c.
41

40

TDA8771A

DDA3

V
39

n.c.

38

n.c.

37

OUTB
36

V

DDA2

35

n.c.

34

TDA8771A

V

33

REF

V

32

DDA1

31

CLK

30

B0

29

B1
V

28

SSD2

V

27

DDD2

26

B2
B3

25
24

B4

23

B5

12

13

14

15

16

R0

G7

G4G3G2G1G0

G6

G5

Fig.2 Pin configuration.

1996 Jan 25 5

20

21
B7

22
B6

MBH040

17

18

19

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog

TDA8771A

Converter (DAC)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA

V

DDD

∆V

DD

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

analog supply voltage −0.5 +6.5 V
digital supply voltage −0.5 +6.5 V
supply voltage difference between V

DDA

and V

DDD

−1.0 +1.0 V
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +125 °C

thermal resistance from junction to ambient in free air 75 K/W

1996 Jan 25 6

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog

TDA8771A

Converter (DAC)

CHARACTERISTICS

V

DDA=VDDD

typical values measured at V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDA

V

DDD

I

DDA

I

DDD

Inputs

C

LOCK INPUT (PIN 31)

V

IL

V

IH

R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21)
V

IL

V

IH

I

REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN 1)

REF

I

I

Timing; see Fig.3
f

clk(max)

t

CPH

t

CPL

t

r

t

f

t

SU;DAT

t

HD;DAT

Voltage reference (pin 33, referenced to V

V

REF

Outputs

= 4.5 to 5.5 V; V

and V

SSA

DDA=VDDD

shorted together; V

SSD

= 5 V and T

amb

DDA

− V

= −0.5 to +0.5 V; T

DDD

=25°C; unless otherwise specified.

= 0 to 70 °C;

amb

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current RL=1kΩ; note 1 10 33 45 mA
digital supply current f

= 35 MHz − 720mA

clk

LOW level input voltage 0 − 1.2 V
HIGH level input voltage 2.0 − V

DDD

V

LOW level input voltage 0 − 1.2 V
HIGH level input voltage 2.0 − V

DDD

V

input current − 0.6 0.7 mA

maximum clock frequency 35 −−MHz
clock pulse width HIGH 8 −−ns
clock pulse width LOW 8 −−ns
clock rise time −−5ns
clock fall time −−6ns
input data set-up time 4 −−ns
input data hold time 4 −−ns

)

SSA

output reference voltage 1.180 1.242 1.305 V

OUTB, OUTR, OUTG

ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO V

) FOR 1kΩLOAD; see Table 1

SSA

FSR full-scale output voltage range 2.80 2.95 3.10 V
V
V

os
Omax

offset of analog voltage output − 0.25 − V
maximum output voltage data inputs = logic 1;

2.95 3.20 3.45 V

note 2

V

Omin

minimum output voltage data inputs = logic 0;

0.05 0.25 0.45 V

note 2

THD total harmonic distortion f

Z

L

output load impedance 0.9 1.0 1.1 kΩ

= 4.43 MHz;

i

f

= 35 MHz

clk

−−44 − dB

1996 Jan 25 7

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog

TDA8771A

Converter (DAC)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Transfer function (f

INL integral non-linearity ramp input − 0.5 ±1 LSB
DNL differential non-linearity ramp input − 0.25 ±0.5 LSB

α

ct

crosstalk DAC to DAC −50 −−dB

DAC to DAC matching − 1.0 2.0 %
Switching characteristics (for 1 kΩ output load); see Fig.4
t

d

t

s1

t

s2

input to 50% output delay time full-scale change − 12 − ns

settling time 10% to 90% of

settling time to ±1 LSB − 50 − ns

Output transients (glitches)

V

g

area for 1 LSB change − 1 − LSB⋅ns

Notes

1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.

2. VO is directly proportional to V

= 35 MHz)

clk

REF

− 15 − ns

full-scale change

.

Table 1 Input coding and DAC output voltages (typical values)

BINARY INPUT DATA

(SYNC = BLANK = 0)

CODE

0000 0000 0 0.262
0000 0001 1 0.273

.... .... . .

1000 0000 128 1.731

.... .... . .

1111 1110 254 3.188
1111 1111 255 3.200

DAC OUTPUT VOLTAGES (V)

OUTB, OUTR, OUTG

R

=1kΩ

L

1996 Jan 25 8

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

TIMING

handbook, full pagewidth

data input

clock input

t

CPL

t

SU; DAT

stable

t

HD; DAT

t

CPH

MBB656 - 1

TDA8771A

V

IH

50 %

V

IL

50 %

V

IL

handbook, full pagewidth

clock input

input code
(example of a
full-scale input
data transition)

code 255

Fig.3 Input timing.

50 %

1.83 V

(code 255)

V

o

code 0

1 LSB

10 %

t

d

t

s1

t

s2

50 %

90 %

1 LSB

MBB662 - 2

0.83 V

(code 0)

Fig.4 Switching timing.

1996 Jan 25 9

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

INTERNAL CIRCUITRY

1/1 page = 296 mm (Datasheet)

V

DDD

GND

V

SSD

(a)

V

DDA

V

DD

V

DDA

V

DD

TDA8771A

V

DDA

DACs
resistor
string

V

SSA

(b)

V

DDA

V

DD

V

DD

125 Ω

(typ.)

GND

27 mm

(c)

(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31.
(b) V

; pin 33.

REF

(c) I

; pin 1.

REF

(d) OUTR, G, B; pins 44, 40 and 36.

Fig.5 Internal circuitry.

V

SSA

MBB658 - 1

(d)

1996 Jan 25 10

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

APPLICATION INFORMATION

handbook, full pagewidth

V

SSA

6.8 kΩ

V

SSA1

R7

I

R6

REF

OUTR

1

2

3

4

5 V

V

SSA

V

DDA4

10 nF
V

SSA

V

1
kΩ

44 43 42 41 40 39 38 37 36 35 34

SSA2

OUTG

n.c.

V

SSA

kΩ

TDA8771A

OUTB

V

SSA

kΩ

5 V

1

V

DDA2

10 nF

V

SSA

n.c.

100 nF

V

REF

33

V

DDA1

32

31

30

CLK

B0

10 nF
V

SSA

V

SSA

5 V

5 V

1

V

DDA3

10 nF

V

SSA

n.c. n.c.

5 V

V

SSD

V

SSD1

R5

V

10 nF

R4

R3

R2

R1

DDD1

5

6

7

8

9

10

11

12 13 14 15 16 17 18 19 20 21 22

R0 G7 G6 G5 G4 G3 G2 G1 G0 B7

TDA8771A

Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on application.
See Figs 7 and 9 for example of anti-aliasing filter.

B6

V

DDD2

B2

B3

B4

B5

MBH041

B1

V

SSD2

10 nF
V

SSD

5 V

29

28

27

26

25

24

23

Fig.6 Application diagram.

1996 Jan 25 11

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

handbook, full pagewidth

TDA8771A

Ω125

OUTR (pin 44)

and OUTG (pin 40)

and OUTB (pin 36)

Fig.7 Example of anti-aliasing filter for 2.4 V output swing.

12 µH 12 µH

18 pF 18 pF

Ω180

56 pF 150 pF 56 pF

analog ground

820 Ω

MBH042

analog video output

(R,G or B)

2.4 V (p-p)

TDA8771A

30

MSA693

f (MHz)

0

1/2 page (Datasheet)

α

(dB)

40

80

120

160

01020 40

Fig.8 Frequency response for filter shown in Fig.7.

22 mm

Characteristics of Fig.8

• Order 5; adapted CHEBYSHEV

• Ripple ρ≥0.7 dB

• fat−3 dB = 6.2 MHz

• f

NOTCH

= 10.8 MHz.

1996 Jan 25 12

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

handbook, full pagewidth

TDA8771A

Ω125

OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)

Fig.9 Example of anti-aliasing filter for 1.5 V output swing.

Ω500

27 µH 27 µH

6.8 pF 6.8 pF

27 pF 68 pF 27 pF

analog ground

500 Ω

MBH043

analog video output

(R,G or B)

1.5 V (p-p)

TDA8771A

30

MSA694

f (MHz)

i

0

1/2 page (Datasheet)

α

(dB)

40

80

120

160

01020 40

Fig.10 Frequency response for filter shown in Fig.9.

22 mm

Characteristics of Fig.10

• Order 5; adapted CHEBYSHEV

• Ripple ρ≥0.25 dB

• fat−3 dB = 5.6 MHz

• f

NOTCH

= 11.7 MHz.

1996 Jan 25 13

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

PACKAGE OUTLINE

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

c

y

X

A

33 23

34

22

Z

E

TDA8771A

SOT307-2

e

w M

b

p

pin 1 index

44

1

w M

b

0.25

p

D

H

D

cE

p

0.40

0.25

0.20

0.14

D

10.1

9.9

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.10

0.25

0.05

1.85

1.65

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

12

11

Z

D

B

v M

0 2.5 5 mm

scale

(1)

(1) (1)(1)

eH

H

D

10.1

9.9

12.9

0.8 1.3

12.3

v M

H

E

E

A

B

LLpQZywv θ

E

12.9

12.3

0.95

0.55

A

2

A

A

1

detail X

0.85

0.75

0.15 0.10.15

Q

(A )

3

θ

L

p

L

Z

E

D

1.2

0.8

1.2

0.8

o

10

o

0

OUTLINE
VERSION

SOT307-2

IEC JEDEC EIAJ

REFERENCES

1996 Jan 25 14

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-04

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

Reference Handbook”

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

“Quality

(order code 9397 750 00192).

TDA8771A

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Jan 25 15

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog

TDA8771A

Converter (DAC)

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Jan 25 16

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

TDA8771A

NOTES

1996 Jan 25 17

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

TDA8771A

NOTES

1996 Jan 25 18

Philips Semiconductors Product specification

Triple 8-bit video Digital-to-Analog
Converter (DAC)

TDA8771A

NOTES

1996 Jan 25 19

Philips Semiconductors – a worldwide company

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BUENOS AIRES, Tel. [phone], Fax. [phone]

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Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Germany: P.O. Box 10 51 40, 20035 HAMBURG,

Tel. [phone], Fax. [phone]

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

India: Philips INDIA Ltd, Shivsagar Estate, A Block,

Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. [phone], Fax. [phone]

th

floor, Suite 51,

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],
Fax. [phone]

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone]

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone]

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,

252148 KIEV, Tel.[phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

United States:811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCDS47 © Philips Electronics N.V. 1996

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537021/1100/01/pp20 Date of release: 1996 Jan 25
Document order number: 9397 750 00591