YC 8-bit low-power
analog-to-digital video interface
Product specification
Supersedes data of 1995 Mar 22
File under Integrated Circuits, IC02
1996 Feb 01
Page 2
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital
video interface
FEATURES
• Two 8-bit ADCs:
– one Luminance or CVBS channel
– one Chrominance channel
• Sampling rate up to 32 MHz
• Binary or two's complement 3-state TTL outputs for
each channel
• Internal reference voltage regulator
• TTL-compatible digital inputs and outputs
• Power dissipation of 530 mW (typical)
• Input selector circuit (five selectable video inputs for
CVBS or YC processing)
• Peak white enable input
• Clamp and Automatic Gain Control (AGC) functions for
Y/CVBS channel (clamping on code 64 and Peak White
level control at code 255)
• Clamp function for C channel (code 128)
• No sample-and-hold circuit required.
TDA8758
APPLICATIONS
• Video signal decoding
• Digital picture processing
• Frame grabbing
• Multimedia with the Philips Desktop Video chip set (and
especially SAA7196 multistandard decoder and scaler).
GENERAL DESCRIPTION
The TDA8758 is an 8-bit video high-speed low-power
analog-to-digital conversion (ADC) interface for YC and
CVBS signal processing. It converts 1-of-3 CVBS input
signals or 1-of-2 YC input signals into binary or two’s
complement words at a sampling rate of 32 MHz.
All analog signal inputs are digitally clamped and an ADC
interface is provided on the Y/CVBS channel. A fast
precharge on clamp and AGC is provided for start-up.
All digital inputs and outputs are TTL compatible.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
V
V
I
CCA
I
CCD
I
CCO
CCA
CCD
CCO
analog supply voltage4.755.05.25V
digital supply voltage4.755.05.25V
output stages supply voltage4.755.05.25V
analog supply current−5970mA
digital supply current−2840mA
YC 8-bit low-power analog-to-digital video
interface
BLOCK DIAGRAM
handbook, full pagewidth
CHROM2
CHROM1
CVBS3
2
4
6
SEL2
5
INPUT
SELECTOR
V
CCD
V
CCA
10214132
V
V
CCO1
CLAMP
LEVEL 128
CCO2
C
TDA8758
CLPC
V
CCA
REG2
REG1
SDN
ANOUTC
48458441714615
ADC
COMPARATOR
DEC2
DEC1
TTL
TIMING
GENERATOR
DEC3
TDA8758
8
33
to
40
47
42
C7 to C0
OFC
CLK
Y2/CVBS2
Y1/CVBS1
COMPARATORS
9
11
123143183
SEL1
PWE
AGC &
CLAMP 64
GATE A
GATE B
C
CLPY
713
C
AGC
16141920
ANOUTY
ADCTTL
OGND2
DGND
OGND1
22
23
30
AGND
to
OFY
Y7 to Y0
8
MGB469 - 1
Fig.1 Block diagram.
1996 Feb 013
Page 4
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
interface
PINNING
SYMBOLPINDESCRIPTION
DEC11decoupling input 1
CHROM22chrominance analog voltage input 2
AGND3analog ground
CHROM14chrominance analog voltage input 1
SEL25selection control input 2
CVBS36luminance analog voltage input 3
C
CLPY
SDN8stabilizer decoupling node
Y2/CVBS29luminance analog voltage input 2
V
CCA
Y1/CVBS111luminance analog voltage input 1
SEL112selection control input 1
C
AGC
PWE14peak white enable input (active LOW)
DEC315decoupling input 3
ANOUTY16analog output for Y channel
REG217decoupling input 2 (internal stabilization loop decoupling)
DGND18digital ground
GATE A19AGC control input
GATE B20clamp control input
V
CCD
OFY22Y channel output format/chip enable (3-state input)
Y723Y channel data output; bit 7 (MSB)
Y624Y channel data output; bit 6
Y525Y channel data output; bit 5
Y426Y channel data output; bit 4
Y327Y channel data output; bit 3
Y228Y channel data output; bit 2
Y129Y channel data output; bit 1
Y030Y channel data output; bit 0 (LSB)
OGND231output ground 2
V
CCO2
C733C channel data output; bit 7 (MSB)
C634C channel data output; bit 6
C535C channel data output; bit 5
C436C channel data output; bit 4
C337C channel data output; bit 3
C238C channel data output; bit 2
C139C channel data output; bit 1
C040C channel data output; bit 0 (LSB)
7Y channel clamping capacitor
10analog supply voltage (+5 V)
13AGC capacitor
21digital supply voltage (+5 V)
32output supply voltage 2 (+5 V)
TDA8758
1996 Feb 014
Page 5
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
interface
SYMBOLPINDESCRIPTION
V
CCO1
CLK42clock input
OGND143output ground 1
REG144decoupling input 1 (internal stabilization loop decoupling)
ANOUTC45analog output for C channel
DEC246decoupling input 2
OFC47C channel output format/chip enable (3-state input)
C
CLPC
41output supply voltage 1 (+5 V)
48C channel clamping capacitor
TDA8758
handbook, full pagewidth
pin 1
index
corner
DEC1
CHROM2
AGND
CHROM1
SEL2
CVBS3
C
CLPY
SDN
Y2/CVBS2
V
CCA
Y1/CVBS1
SEL1
CLPC
OFC
DEC2
ANOUTC
REG1
45
44
TDA8758
16
17
REG2
ANOUTY
OGND1
DGND
C
48
47
46
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
AGC
PWE
DEC3
C
43
18
CCO1
CLK
V
42
41
19
20
GATE A
GATE B
C0C1C2
40
39
38
21
22
23
Y7
OFY
CCD
V
C3
2437
Y6
36
35
34
33
32
31
30
29
28
27
26
25
MGB470
C4
C5
C6
C7
V
CCO2
OGND2
Y0
Y1
Y2
Y3
Y4
Y5
1996 Feb 015
Fig.2 Pin configuration.
Page 6
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
interface
FUNCTIONAL DESCRIPTION
The TDA8758 provides a simple interface between CVBS
or Y/C analog signals and a digital colour decoder.
Video inputs selection
The input selector allows a choice from different video
sources, and has one of the following configurations:
A: Two Y/C and one CVBS signals
B: One Y/C and two CVBS signals
C: Three CVBS signals (only the Y channel is used).
The wiring of the five video inputs (pins 2, 4, 6, 9 and 11)
and the control of the two selection inputs (pins 5 and 12)
will depend on the available video sources.
• In configuration A, connect as follows:
– Y1 to pin 11
– C1 to pin 4
– Y2 to pin 9
– C2 to pin 2
– CVBS3 to pin 6.
Keep SEL2 (pin 5) LOW and select Y1/C1 or Y2/C2 by
switching SEL1 (pin 12).
CVBS3 is selected with SEL1 and SEL2 HIGH.
• In configuration B, replace Y1 (or Y2) by a CVBS input
(no more C1 or C2). The selection mode is the same.
• In configuration C, connect as follows:
– CVBS1 to pin 11
– CVBS2 to pin 9
– CVBS3 to pin 6.
Use both SEL1 and SEL2 to select inputs.
TDA8758
Synchronization pulses
GATE A and GATE B pulses are synchronization pulses
occurring during the sync period and rear porch
respectively. They should be distinct.
On the Y channel, the digital output of the ADC is
compared to internal digital reference levels. The resultant
outputs control the charge or discharge current of a
capacitor connected to the C
this capacitor controls the gain of the video amplifier.
This is the control loop.
The sync level comparator is active during a positive-going
pulse at the GATE A input. This means that sync pulse of
the composite video signal is used as an amplitude
reference. The bottom of the sync pulse is adjusted to
obtain a digital output of logic 1 at the converter Y output.
As the black level is digital level 64, the sync pulse will
have a digital amplitude of 64 LSBs.
The Peak White control loop is active when the selection
PWE is LOW. Then, if the Y video signal exceeds the
pin
digital code of 255, it will be limited to avoid any over-range
of the converter.
The clamp level control is accomplished by using the same
techniques as used for the gain control. On both Y and C
channels, the black level digital comparators are active
during a positive-going pulse at the GATE B input. On the
Y channel, the clamping capacitor connected to the C
pin will be charged or discharged to adjust the digital
output to code 64. On the C channel, the clamping
capacitor connected to the C
discharged to adjust the digital output to code 128.
pin. The voltage across
AGC
pin will be charged or
CLPC
CLPY
Remark: the video inputs selection is a static selection.
1996 Feb 016
Page 7
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
TDA8758
interface
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CCA
V
CCD
V
CCO
∆V
V
I
V
clk(p-p)
I
O
T
stg
T
amb
T
j
CC
analog supply voltage−0.3+7.0V
digital supply voltage−0.3+7.0V
output supply voltage−0.3+7.0V
supply voltage difference between V
supply voltage difference between V
supply voltage difference between V
CCA
CCO
CCA
and V
and V
and V
CCD
CCD
CCO
−1.0+1.0V
−1.0+1.0V
−1.0+1.0V
input voltagereferenced to AGND−5.0V
AC input voltage for switching (peak-to-peak value) referenced to DGND−V
CCO
V
output current−+6mA
storage temperature−55+150°C
operating ambient temperature0+70°C
junction temperature−+150°C
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
thermal resistance from junction to ambient in free air72K/W
CHARACTERISTICS
V
CCA=V10
V
CC02=V32
V
CCO
at V
CCA=VCCD=VCCO
to V3= 4.75 to 5.25 V; V
to V31= 4.75 to 5.25 V; AGND and DGND shorted together; V
to V
CCD
= −0.25 to +0.25 V; V
= 5 V and T
CCD=V21
to V
CCA
=25°C; unless otherwise specified.
amb
to V18= 4.75 to 5.25 V; V
= −0.25 to +0.25 V; T
CCO
CCO1=V41
CCA
= 0 to +70 °C; typical values measured
amb
to V43= 4.75 to 5.25 V;
to V
= −0.25 to +0.25 V;
CCD
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
CCA
V
CCD
V
CCO
I
CCA
I
CCD
I
CCOtot
analog supply voltage4.755.05.25V
digital supply voltage4.755.05.25V
output stages supply voltage4.755.05.25V
analog supply current−5970mA
digital supply current−2840mA
total output supply currentCL=15pF−1928mA
Video amplifier inputs
Y1/CVBS1, Y2/CVBS2, CVBS3, CHROM1
V
I(p-p)
input voltage (peak-to-peak value)AGC load with external
AND CHROM2 INPUTS
capacitor; note 1
Y channel0.7−1.4V
C channel−1.0−V
|input impedancefi= 6 MHz−25−kΩ
|Z
i
C
I
input capacitancefi= 6 MHz−2−pF
1996 Feb 017
Page 8
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
TDA8758
interface
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
SEL1 AND SEL2 TTL INPUTS; see Table 1
V
IL
V
IH
I
IL
I
IH
GATE A AND GATE B TTL INPUTS; see Figs 5 and 6
V
IL
V
IH
I
IL
I
IH
AGC INPUT (PIN 13); see Fig.8
V
13(min)
V
13(max)
I
12
C-CHANNEL CLAMP INPUT (PIN 48)
V
48
I
48
Y-CHANNEL CLAMP INPUT (PIN 7)
V
7
I
7
Video amplifier dynamic characteristics
α
ct
B−3 dB bandwidth−15−MHz
∆Ggain range−3−+3dB
G
stab
LOW level input voltage0−0.8V
HIGH level input voltage2.0−V
CCD
V
LOW level input currentVI= 0.4 V−400−−µA
HIGH level input currentVI= 2.7 V−−20µA
LOW level input voltage0−0.8V
HIGH level input voltage2.0−V
CCD
V
LOW level input currentVI = 0.4 V−400−−µA
HIGH level input currentVI = 2.7 V−−20µA
AGC voltage for minimum gain at −3dB−3.3−V
AGC voltage for maximum gain at +3 dB−3.75−V
AGC output currentsee Table 2
CLAMP voltage for code 128 output−3.45−V
CLAMP output currentsee Table 3
CLAMP voltage for code 64 output−3.70−V
CLAMP output currentsee Table 3
crosstalk between video inputs
V
= 4.75 to 5.25 V−−63−55dB
CCA
(pins 2, 4, 6, 9 and 11)
gain stability as a function of:
supply voltagef
= 4.43 MHz−−0.5%
i
supply voltage and temperature−−6%
Analog-to-digital converter inputs
INPUT (PIN 42)
CLK
V
IL
V
IH
I
IL
I
IH
C
I
LOW level input voltage0−0.8V
HIGH level input voltage2.0−V
LOW level input currentV
HIGH level input currentV
input capacitancef
1996 Feb 018
CCD
= 0.4 V−400−−µA
clk
= 2.7 V−−20µA
clk
= 32 MHz−2−pF
clk
V
Page 9
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
TDA8758
interface
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
OFY AND OFC INPUTS;3-STATE; see Table 4
V
IL
V
IH
V
I
I
IL
I
IH
Analog-to-digital converter outputs
ANOUTY
V
ANOUT
V
ANOUT
V
ANOUT(p-p)
DIGITAL OUTPUTS Y0 TO Y7, C0 TO C7
V
OL
V
OH
Switching characteristics; see Fig.9
f
clk(max)
t
CPH
t
CPL
Analog signal processing from video input to digital output on both channels; 0 dB gain (f
INLDC integral non-linearity−±0.75±1.5LSB
DNLDC differential non-linearity−±0.4±1.0LSB
AINLAC integral non linearityf
ADNLAC differential non-linearityf
THDtotal harmonic distortionnote 3−−52−dB
EBeffective bitsf
G
diff
ϕ
diff
SVRR2supply voltage ripple rejectionnote 6−−5%/V
LOW level input voltage0−0.2V
HIGH level input voltage2.6−V
CCD
V
input voltage in high impedance state−1.15−V
LOW level input current−370−300−µA
HIGH level input current−500700µA
LOW level output voltageIOL=2mA0−0.6V
HIGH level output voltageIOL= −0.4 mA2.4−V
CCD
V
CLK input maximum frequencynote 23032−MHz
clock pulse width HIGH12−−ns
clock pulse with LOW12−−ns
= 32 MHz)
clk
= 4.43 MHz−±1.5−LSB
i
= 4.43 MHz−±0.5−LSB
i
= 4.43 MHz; note 4−7.1−bits
i
differential gainV
= 1.0 V (p-p);
16,45
−1.53.0%
see Fig.4; PAL
modulated ramp; note 5
differential phasesee Fig.5; PAL
−0.61.5deg
modulated ramp; note 5
1996 Feb 019
Page 10
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
TDA8758
interface
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Timing (f
D
IGITAL OUTPUTS (C
t
ds
t
h
t
d
t
W
3-state output delay times; see Fig.10
t
dZH
t
dZL
t
dHZ
t
dLZ
Notes
1. 0 dB is obtained at the AGC amplifier when applying V
2. It is recommended that the rise and fall times of the clock are ≥1 ns. In addition, a ‘good layout’ for the digital and
analog grounds is recommended.
3. THD (total harmonic distortion) is obtained with the addition of the first five harmonics:
THD20 log
a) F being the fundamental harmonic referenced at 0 dB for a full-scale sine wave input.
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8 K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
5. Measurement carried out using video analyser VM700A, where video analog signal is reconstructed through a
digital-to-analog converter.
6. The supply voltage ripple rejection is the relative variation of the analog signal (full-scale signal at input) for 0.5 V of
supply variation:
SVRR2
= 32 MHz); see Fig.9
clk
= 15 pF)
L
sampling delay time−2−ns
output hold time10−−ns
output delay time−1518ns
clamp pulse widthsee Figs 6 and 723−µs
Fig.12 Example of system application (DPC71 evaluation board).
Page 19
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
interface
PACKAGE OUTLINE
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
c
y
X
36
37
25
Z
24
E
A
TDA8758
SOT313-2
e
w
M
pin 1 index
48
1
e
DIMENSIONS (mm are the original dimensions)
mm
A
A1A2A3b
max.
0.20
1.60
0.05
1.45
1.35
UNIT
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
b
p
0.25
w
D
H
D
p
0.27
0.17
12
Z
M
D
(1)(1)(1)
cE
D
0.18
7.1
0.12
6.9
b
p
13
v
B
v
02.55 mm
scale
(1)
eH
7.1
6.9
0.5
9.15
8.85
H
E
E
M
A
M
B
H
D
LLpQZywv θ
E
9.15
8.85
0.75
0.45
A
2
A
A
1
detail X
0.69
0.59
0.120.10.21.0
Q
(A )
3
θ
L
p
L
Z
E
D
0.95
0.55
0.95
0.55
o
7
o
0
OUTLINE
VERSION
SOT313-2
1996 Feb 0119
REFERENCES
IEC JEDEC EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-06-15
94-12-19
Page 20
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
interface
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all LQFP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
(order code 9398 652 90011).
TDA8758
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Feb 0120
Page 21
Philips SemiconductorsProduct specification
YC 8-bit low-power analog-to-digital video
TDA8758
interface
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 0121
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