Datasheet TDA8754 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8754

Triple high speed ADC for LCD
drive

Objective specification
File under Integrated Circuits, IC02

1998 Sep 30

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

FEATURES

• Triple 8-bit Analog-to-Digital Converter (ADC)

• Sampling rate up to 170 MHz

• IC controllable via a serial interface, which can be either

I2C-bus or 3-wire, selected via a TTL input pin

• IC analog input 0.5 to 1.1 V (peak-to-peak value) to
have full-scale ADC input

• Clamps for programming a clamp level through a
clamping code between −63 and +64 by steps of 1 LSB

• Controllable gain stages: gain controlled independently
on the 3 channels via the serial interface to have a
full-scale resolution to 1%

• Low gain variation at different temperatures

• Analog bandwidth of 400 MHz

• Controllable PLL via the serial interface generates the

ADC clock. It can be locked on line frequencies from
15 kHz up to 280 kHz.

• Integrated PLL divider

• Integrated clamp pulse and H and V LCD control pulses

generation (independently adjustable in position and
duration). Also a data enable signal can be generated,
independently adjustable in position and duration with
respect to HSYNC.

• The pixel clock is available at half the clock frequency

• Programmable phase clock adjustment cells

• Internal voltage regulators

• TTL compatible digital inputs

• 3.3 V CMOS compatible digital outputs

• Outputs: one port output up to 140 MHz or 2-port

demultiplexed outputs on the full speed range.
Operating mode selectable through the serial interface.

• Chip enable: high-impedance ADC output

• Power-down mode.

GENERAL DESCRIPTION

The TDA8754 is a triple 8-bit ADC with controllable gain
and clamps for the digitizing of large bandwidth
R, G, B signals. Clamp level, gain, and all the other
settings are controlled via a serial interface (either I2C-bus
or 3-wire, selected through a logic input). The gain is
optimized for stability versus temperature variations.

The IC also includes a PLL that generates the ADC clock
which can be locked to the horizontal line frequency.
The PLL jitter is minimized for high resolution PC graphics
applications. An external clock can also be used to clock
the ADC.

The clamp pulse is generated on-chip, it can be adjusted
in position (with respect to HSYNC) and duration through
the serial interface.

The horizontal and vertical control pulses for the LCD can
be adjusted in duration through the serial interface. Also a
data enable signal can be generated, independently
adjustable in position (with respect to HSYNC) and
duration through the serial interface.

Outputs: one port output up to 140 MHz or demultiplexed
2-port outputs on the full speed range. Operating mode
selectable through the serial interface.

ORDERING INFORMATION

TYPE

NUMBER

TDA8754H LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm SOT486-1

1998 Sep 30 2

NAME DESCRIPTION VERSION

PACKAGE

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

analog supply voltage for
R, G, B channels

V

DD

logic supply voltage for I2C-bus and
3-wire interface

V

CCD

V

CC(O)

digital supply voltage 4.75 5.0 5.25 V
output stages supply voltage for

R, G, B channels

V

CCA(PLL)

V

CC(O)(PLL)

I

CCA

analog PLL supply voltage 4.75 5.0 5.25 V
output PLL supply voltage 4.75 5.0 5.25 V
analog supply current for

R, G, B channels

I

DD

logic supply current for I2C-bus and
3-wire interface

I

CCD

I

CC(O)

digital supply current − tbf − mA
output stages supply current for

R, G, B channels

I

CCA(PLL)

I

CC(O)(PLL)

analog PLL supply current − tbf − mA

output PLL supply current − tbf − mA
INL DC integral non-linearity −±1±1.5 LSB
DNL DC differential non-linearity −±0.5 ±0.8 LSB
∆G

amp

gain stability versus temperature V

= 2.5 V with

ref

100 ppm/K variation

t

set

setting time of the block ADC + AGC input signal setting time

<1 ns; setting to 1%;
fi= 85 MHz

f

clk(max)

f

ref

f

PLL

j

PLL(rms)

maximum conversion rate 170 −−MHz

PLL reference clock frequency 15 − 120 kHz

output clock frequency 12 − 170 MHz

maximum PLL phase jitter

(RMS value)
D/D
P

tot

PLL

PLL divider ratio 512 − 4095

total power consumption f

= 170 MHz; ramp input − tbf 1.2 W

clk

4.75 5.0 5.25 V

3.0 5.0 5.25 V

3.0 3.3 3.6 V

− tbf − mA

− tbf − mA

− tbf − mA

−−200 ppm/K

− 2.5 3.5 ns

− 0.2 − ns

1998 Sep 30 3

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

BLOCK DIAGRAM

handbook, full pagewidth

RIN

RDEC

V

RGAINC
GGAINC

GIN

GDEC

BGAINC

BIN

BDEC

ref

2

I

SEN

SCL

SDA

C-3W

SERIAL

INTERFACE

2

I

C-BUS

AND 3-WIRE

MUX

RBOT

CLAMP

ADC

GREEN CHANNEL

CLP

BLUE CHANNEL

TDA8754

REGULATOR

RED CHANNEL

OUTPUTS

CLP

PLL

9

8

9
8

9
8

RA0 to RA7
and ROR

RB0 to RB7

GBOT

GA0 to GA7
and GOR

GB0 to GB7

OEN

BCLP
BBOT

BA0 to BA7
and BOR

BB0 to BB7
CKADCO

CKBO
CKAO

DEN

2

I

C:1-bit
(Hlevel) VSYNC
CKEXT

CZ
CP
HSYNCO
VSYNCO

2

C:1-bit

I

(Hlevel)

HSYNC

DEC1

Fig.1 Block diagram.

1998 Sep 30 4

DEC2

PWOFF

CKA/2, CKA/2

FCE045

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

PACKAGE OUTLINE

LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm

c

109

144

y

108

pin 1 index

1

X

A

73

72

Z

E

e

H

E

E

A

2

A

A

1

w M

b

p

37

36

detail X

SOT486-1

(A )

3

L

p

L

θ

w M

b

e

p

D

H

D

Z

D

B

0 5 10 mm

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.6

0.15

0.05

1.45

1.35

0.25

0.27

0.17

0.20

0.09

UNIT A1A2A3bpcE

(1)

(1) (1)(1)

D

20.1

19.9

eH

H

20.1

19.9

0.50

22.15

21.85

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT486-1

1998 Sep 30 5

v M

D

v M

scale

22.15

21.85

A

B

E

LL

p

0.75

0.45

0.10.2 0.11.0

EUROPEAN

PROJECTION

Z

D

1.40

1.10

Zywv θ

E

1.40

1.10

o

7

o

0

ISSUE DATE

97-08-04

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.

Wave soldering

If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

CAUTION

Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.

1998 Sep 30 6

Philips Semiconductors Objective specification

Triple high speed ADC for LCD drive TDA8754

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C components conveys a license under the Philips’ I2C patent to use the

1998 Sep 30 7

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© Philips Electronics N.V. 1998 SCA60
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Printed in The Netherlands 545104/750/01/pp8 Date of release: 1998 Sep 30 Document order number: 9397 750 04134