Datasheet tda8741, tda8741h DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8741; TDA8741H

Satellite sound circuit with noise
reduction

Product specification
Supersedes data of November 1992
File under Integrated Circuits, IC02

Philips Semiconductors

October 1994

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

FEATURES

• Demodulation of main audio signal using wide band PLL
(lock range selectable)

• Demodulation of secondary audio signals using wide

APPLICATIONS

• Satellite receivers

• TV sets

• Video recorders.

band PLL

• Noise reduction of the secondary audio signals

GENERAL DESCRIPTION

• Output selection: stereo, language 1, language 2, main
audio and external

• Mute control

• Line outputs (SCART level).

The TDA8741; TDA8741H is a multi-function sound IC for
use in satellite receivers, television sets and video
recorders. The pin numbers given in parenthesis
throughout this document refer to the QFP44 package.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage 8 12 13.2 V

Main channel

V

IN3(rms)

∆f

OM

input sensitivity pin 18 (14) (RMS value) S/N(A) = 40 dB − 1.0 2.0 mV
lock range PLL demodulator

either 5.5 − 7.5 MHz
or 10.0 − 11.5 MHz

V

OM

output voltage pin 23 (19) −9 −6 −4 dBV

S/N(A) signal-to-noise ratio A-weighted 62 70 − dB

Secondary channels

V

IN1,IN2(rms)

∆f

OS1,2

V

OR,OL

input sensitivity pins 8 and 16 (3 and 11) (RMS value) S/N(A) = 40 dB − 0.8 1.5 mV
lock range PLL demodulators 10.0 − 11.5 MHz
output voltage pins 24 and 25 (20 and 21) −8 −6 −4 dBV

S/N(A) signal-to-noise ratio A-weighted 72 80 − dB

Crosstalk

α

S/M

α

M/S

α

S/S

crosstalk from secondary to main channel − 74 − dB
crosstalk from main to secondary channel − 74 − dB
crosstalk between secondary channels − 74 − dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8741 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1

TDA8741H QFP44

plastic quad flat package; 44 leads (lead length 1.3 mm);

SOT307-2

(1)

body 10 × 10 × 1.75 mm

Note

1. When using IR reflow soldering it is recommended that the Drypack instructions in the

“Quality Reference Handbook”

(order number 9398 510 63011) are followed.

October 1994 2

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

BLOCK DIAGRAM

The pin numbers in parenthesis refer to the QFP44 package.

Fig.1 Block diagram.

October 1994 3

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

PINNING

SYMBOL

PIN

SDIP42

PIN

QFP44

DESCRIPTION

n.c. 1 1 not connected
n.c. 2 5 not connected
n.c. 3 7 not connected
n.c. 4 9 not connected
n.c. 5 12 not connected
n.c. 6 39 not connected
MCS 7 2 main channel PLL lock-in range select/disable
IN-1 8 3 intercarrier input for secondary Channel 1 (left)
HFGND 9 4 ground for HF section
n.c. 10 40 not connected
SCD 11 6 secondary channels PLLs disable
n.c. 12 41 not connected
MUTE 13 8 mute switch
n.c. 14 42 not connected
O

sel L

15 10 output select switch bit 1 (left)
IN-2 16 11 intercarrier input for secondary Channel 2 (right)
O

sel R

17 13 output select switch bit 2 (right)
IN-3 18 14 intercarrier input for main channel
V

REF

C

D M

C

C M

V

P

O

M

O

R

O

L

INT 26 22 output switch bit 3 (external/internal)

EXT/
EXT

R

EXT

L

C

ATT/REC R

RECT

R

C

NR D R

C

D R

C

C R

19 15 decoupling capacitor for reference voltage

20 16 de-emphasis capacitor for main channel

21 17 audio pass-through capacitor input for main channel

22 18 positive supply voltage

23 19 main channel output

24 20 right channel output

25 21 left channel output

27 23 external audio input (right)

28 24 external audio input (left)

29 25 attack/recovery capacitor (right)

30 26 rectifier DC decoupling (right)

31 27 noise reduction de-emphasis capacitor (right)

32 28 fixed de-emphasis capacitor (right)

33 29 audio pass-through capacitor input for right channel
AFGND 34 30 ground for AF section
C

C L

C

D L

C

NR D L

RECT
C

ATT/REC L

L

35 31 audio pass-through capacitor input for left channel

36 32 fixed de-emphasis capacitor (left)

37 33 noise reduction de-emphasis capacitor (left)

38 34 rectifier DC decoupling (left)

39 35 attack/recovery capacitor (left)

October 1994 4

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

C
C
C

DC L
DC M
DC R

SYMBOL

PIN

SDIP42

40 36 DC decoupling capacitor (left)

41 37 DC decoupling capacitor (main)

42 38 DC decoupling capacitor (right)

PIN

QFP44

n.c. − 43 not connected
n.c. − 44 not connected

DESCRIPTION

Fig.2 Pin configuration (SDIP42).

October 1994 5

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

Fig.3 Pin configuration (QFP44).

October 1994 6

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

FUNCTIONAL DESCRIPTION
Satellite sound

The baseband signal coming from a satellite tuner
contains the demodulated video signal plus a number of
sound carriers to facilitate reception of a
PAL/NTSC/SECAM satellite signal.

Nearest to the video signal is the main sound carrier which
carries the single channel sound related to the video. This
is an FM modulated carrier with a fixed pre-emphasis. The
carrier frequency can be in the range of 5.8 to 6.8 MHz.

Additionally, a number of optional secondary sound
carriers may be present which can be used for stereo or
multi-language sound related to the video, or for unrelated
radio sound. These carriers are also FM modulated, but for
better sound quality (improved signal-to-noise
performance) broadcast satellites (e.g. ‘ASTRA’) use a
noise reduction system (adaptive pre-emphasis circuit,
combined with a fixed pre-emphasis).

These secondary carrier frequencies can be in the range
of 6.30 to 8.28 MHz. For accurate tuning to the many
sound carriers an external frequency synthesizer and
mixer is used to transpose the sound carriers to
intermediate frequencies of 10.7 and 10.52 MHz.

external mixer and oscillator-frequency synthesizer. In this
event the lock-in range of the PLL should be switched to

10.0 to 11.5 MHz. The IF signal is applied to the main
channel input, pin 18 (14) via a 10.7 MHz ceramic
bandpass filter.

The filtered signal is AC-coupled to a limiter/amplifier and
then to a PLL demodulator. The PLL FM demodulator
ensures that the demodulator is alignment-free. High gain
and DC error signals from the PLL, which are
superimposed on the demodulator output, require DC
decoupling. A buffer amplifier is used to amplify the signal
to the same level as the secondary channels and
decouples DC using an electrolytic capacitor connected to
pin 41 (37). The demodulator output signal is fed to pin 20
(16) via an internal resistor. The output signal can be
de-emphasized by means of this resistor and an external
capacitor connected to ground.

Capacitor value = de-emphasis time constant per 1500
(for 50 µs: 33 nF).

From here the signal is fed to the output selectors. The
signal is amplified to 500 mV(RMS) (i.e. −6 dBV) in the
output amplifiers.

Secondary channels

The TDA8741; H contains all circuitry for processing the
main channel and for two secondary channels, from IF
signal to line (SCART) output drivers. The desired
frequencies can be routed to the TDA8741; H via
bandpass filters.

Main channel (see Fig.1)
The lock-in range of the main channel PLL can be

switched between 5.5 to 7.5 MHz, PLL off and 10.0 to

11.5 MHz using the MCS signal at pin 7 (2) [when pin 7 (2)
is at logic 0, being a voltage from 0 to 1.2 V, the lock-in
range = 5.5 to 7.5 MHz; when pin 7 (2) is at logic 1, being
a voltage from 3.5 V until V

11.5 MHz; when pin 7 (2) is in the mid voltage position,
being a voltage from 1.8 to 2.8 V, the main channel PLL is
switched off]. The voltage is then determined by the
resistor divider at this pin between VP and ground.

If only one fixed carrier frequency for the main channel is
to be demodulated (e.g. 6.5 MHz), the lock-in range of the
PLL should be switched to 5.5 to 7.5 MHz. The baseband
signal is applied to the main channel input, pin 18 (14) via
a 6.5 MHz ceramic bandpass filter. Alternatively, if there is
a requirement to demodulate different main channel
frequencies, these frequencies can be transferred to a
fixed intermediate frequency (e.g. 10.7 MHz) using an

, the lock-in range = 10.0 to

P

An external mixer and oscillator frequency synthesizer
transfers the secondary sound carriers to fixed
intermediate frequencies e.g. 10.7 and 10.52 MHz. Two
secondary channel inputs are available at pins 8 and 16 (3
and 11). The signals are routed to the inputs via external
ceramic bandpass filters which are tuned to the required
intermediate frequencies.

For stereo applications the TDA8741; TDA8741H contains
two identical secondary sound processing channels.
Secondary Channel 1 will also be referred to as ‘LEFT’ or
‘LANGUAGE 1’ and secondary Channel 2 will also be
referred to as ‘RIGHT’ or ‘LANGUAGE 2’.

From the inputs the signals are coupled to
limiter/amplifiers and then to the PLL demodulators.
Processing is similar to the main channel. The
demodulator output signal is amplified in a buffer amplifier
and DC decoupled using electrolytic capacitors connected
to pins 40 (36) (left) and 42 (38) (right). The output level is
set with a resistor connected in series with the capacitor.

High frequency components in the amplified PLL output
signal are filtered out in the audio LPF block (4th order
Butterworth low-pass filter) to prevent unwanted influence
on the noise reduction.

October 1994 7

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

NOISE REDUCTION (NR)
The noise reduction can be regarded as an input

level-dependent low-pass filter (adaptive de-emphasis
system) followed by a fixed de-emphasis. With maximum
input level (0 dB) the frequency response of the first part
(i.e. without the fixed de-emphasis) is virtually flat. As the
input level is lowered by x-dB, the higher output
frequencies will be reduced an extra x-dB with respect to
the lower frequencies (1 : 2 expansion).

The NR output signal is fed to pin 36 (32) (left) and pin 32
(28) (right) via an internal resistor.

Fixed de-emphasis is achieved by these resistors and
external capacitors connected to ground. The signals are
DC decoupled via pins 36/35 (32/31) and 32/33 (28/29)
and then routed to the output selectors.

UTPUT SELECTION

O
With the output selector (see Table 1) the outputs at

pins 25 and 24 (21 and 20) can be switched to the different
channels. Both outputs can be switched to both secondary
channels, to the main channel and to the external inputs at
pin 28 and 27 (24 and 23) for IC chaining purposes.

Pin 23 (19) is a separate output which delivers the main
channel only, thereby creating the possibility of having
three different output channels simultaneously e.g. for use
in hi-fi VCRs.

ABBREVIATIONS

= modulating frequency.

f

MOD

∆fM = frequency deviation of the main Channel.
∆fS1 = frequency deviation of secondary Channel 1 (left).
∆fS2 = frequency deviation of secondary Channel 2 (right).

fOM = carrier frequency of main Channel.
f

= carrier frequency of secondary Channel 1.

OS1

f

= carrier frequency of secondary Channel 2.

OS2

LPF = Low-Pass Filter.
NR = Noise Reduction.
PLL = Phase-Locked-Loop.

The outputs at pins 25 and 24 (21 and 20) can be muted
by setting the MUTE signal at pin 13 (8) to logic 1 (switch
positions 6 and 7).

The output at pin 23 (19) can be muted by setting the
MUTE signal and the EXT/INT signal at pin 26 (22) both
logic 1 (switch position 7).

All outputs at pins 23, 24 and 25 (19, 20 and 21) are line
drivers with SCART level capability and are short-circuit
protected by 125 Ω output resistors.

Output level of all channels = −6 dBV typical when
frequency deviation of FM signal is 54% of maximum
frequency deviation (i.e. 0.54 × 85 kHz = 46 kHz for the
main channel and 0.54 × 50 kHz = 27 kHz for the
secondary channels) at 1 kHz modulation frequency
(reference level).

October 1994 8

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

I

V

n

V

n

T

stg

T

amb

supply voltage note 1 0 13.2 V
input voltage level on pins 8 and 16

note 2 0 1 V

(3 and 11)
voltage on pins 11, 13, 15, 17, 20, 21,

note 2 0 9 V
23 to 26, 31, 33, 35, 37, 40, 41, and 42
(6, 8, 10, 13, 16, 17, 19, 20 to 22, 27, 29,
31, 33, 36, 37 and 38)

voltage on pins 7, 18, 19, 27 to 30, 32,

note 1 0 V

P

V
36, 38 and 39 (2, 14, 15, 23 to 26, 28,
32, 34 and 35)

storage temperature −55 +150 °C
operating ambient temperature −20 +70 °C

Notes

1. All voltages referenced to ground pins 9 and 34 (4 and 30).

2. All voltages referenced to ground pins 9 and 34 (4 and 30). These voltages must not exceed V

or maximum value

P

at any time.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SDIP42 53 K/W
QFP44 69 K/W

DC CHARACTERISTICS

All voltages referenced to ground at pins 9 and 34 (4 and 30). Measured in test circuit Fig.4; V
∆fM= ∆fS1= ∆fS2= 0 kHz (no modulation); fOM= 6.5 MHz; f

= 10.7 MHz; f

OS1

= 10.52 MHz; HF level at pin 18 (14):

OS2

=12V; T

P

amb

=25°C;

40 mV (RMS); HF level at pins 8 and 16 (3 and 11): 20mV (RMS); MCS= logic 0 [V7(V2) = 0 V];
SCD = logic 0 [V11(V6) = 0 V]; unless otherwise specified.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P

P

tot

V

n

supply voltage 8.0 12 13.2 V
supply current − 38 45 mA
total power dissipation −−600 mW
voltage on pins 20, 21, 23, 24, 25, 27, 28, 30, 32, 33, 35, 36

− 3.8 − V

and 38 (16, 17, 19, 20, 21, 23, 24, 26, 28, 29, 31, 32 and 34)

V

REF

V

IN1,IN2

V

CDCL,CDCR

V

CDCM

I

IN3

input reference voltage on pin 19 (15) 3.7 3.8 3.9 V
voltage on pins 8 and 16 (3 and 11) − 0 − V
voltage on pins 40 and 42 (36 and 38) − 3.0 − V
voltage on pin 41 (37) − 2.8 − V
input current at pin 18 (14) −−1µA

October 1994 9

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

AC CHARACTERISTICS

All voltages referenced to ground at pins 9 and 34 (4 and 30). Measured in test circuit Fig.4; VP= 12 V; T
f

= 1 kHz; fOM= 6.5 MHz; ∆fM= 46 kHz; ∆fS1= ∆fS2= 27 kHz (reference levels); f

MOD

f

= 10.52 MHz; HF level at pin 18 (14): 40 mV (RMS); HF level at pins 8 and 16 (3 and 11): 20 mV (RMS);

OS2

= 10.7 MHz;

OS1

MCS = logic 0 [V7(V2) = 0 V]; SCD = logic 0 [V11(V6) = 0 V]; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Main channel - HF input pin 18 (14) and limiter

V

IN3(rms)

V

IN3(rms)

R

IN3

input sensitivity (RMS value) S/N(A) = 40 dB − 1.0 2.0 mV
input signal level (RMS value) −−200 mV
input resistance − 15 − kΩ

Main channel - PLL FM demodulator and DC decoupling amplifier

f

CCO

free-running frequency − 6.5 − MHz

MCS = logic 1 − 10.7 − MHz

∆f

OM

lock range of PLL note 1 5.5 − 7.5 MHz

MCS = logic 1; note 1 10.0 − 11.5 MHz

R

CDM

output resistance for 50 µs

1.24 1.5 1.7 kΩ

de-emphasis pin 20 (16)
V
∆V

CDM

CDM

output voltage pin 20 (16) −18.5 −16.0 −14.5 dBV

spread of PLL output voltage

−−±1dB

over lock range pin 20 (16)
R

CCM

input resistance of output

95 150 200 kΩ

amplifier pin 21 (17)

amb

=25°C;

Main channel - overall performance (output selector in position 4)

V

OM,OR,OL

output voltage pins 23, 24 and

all PLLs locked −9 −6 −4 dBV

25 (19, 20 and 21)
THD total harmonic distortion all PLLs locked − 0.1 0.5 %
S/N(A) signal-to-noise ratio A-weighted;

62 70 − dB

all PLLs locked

V

OM 15 kHz()

------------------------------­V

OM 1 kHz()

R

OM,OR,OL

15 kHz frequency response
with respect to 1 kHz pin 23 (19)

output resistance pins 23, 24

no de-emphasis
connected

−0.5 0 +0.5 dB

92 125 150 Ω

and 25 (19, 20 and 21)

α

S/M

crosstalk attenuation from

note 2 − 74 − dB

secondary channels to main

MUTE

att

mute attenuation output selector in

74 −−dB

position 7

SVRR supply voltage ripple rejection V

= 100 mV; fi=70Hz − 35 − dB

RR

Secondary channels 1 and 2 - HF inputs pins 8 and 16 (3 and 11) and limiters

V

IN1,IN2(rms)

V

i(rms)

R

IN1,IN2

input sensitivity (RMS value) S/N(A) = 40 dB − 0.8 1.5 mV
input signal level (RMS value) −−200 mV
input resistance 280 330 380 Ω

October 1994 10

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Secondary channels 1 and 2 - PLL FM demodulators

f

CCO1

f

CCO2

∆f

OS1/2

R

S1,S2

V

CDCL,CDCR(rms)

∆V

CDCL,CDCR

Secondary channels - overall performance of LPF and NR (output selectors in position 1)

R

O

R

i

V

OL,OR

UBS unbalance voltage outputs

THD total harmonic distortion note 4 − 0.1 0.5 %
S/N(A) signal-to-noise ratio A-weighted; note 4 72 80 − dB
R

o

MUTE

att

α

S/S

α

M/S

V

offset(DC)

SVRR supply voltage ripple rejection V

Secondary channels - low-pass filter pins 38 and 30 (34 and 26)

V

RECTL RECTR 50 kHz(),

---------------------------------------------------------- ­V

RECTL RECTR 1 kHz(),

free running frequency PLL1 − 10.7 − MHz
free running frequency PLL2 − 10.52 − MHz
lock range of PLLs note 3 10 − 11.5 MHz
series resistance for optimum

0 0.68 2.2 kΩ

frequency response adjustment
PLL output voltage pins 40 and

pins to be left open-circuit − 9 − mV

42 (36 and 38) (RMS value)
spread of PLL output voltage

−−±1dB

over lock range

output resistance for 75 µs

1.9 2.3 2.6 kΩ
de-emphasis pins 36 and 32 (32
and 28)

input resistance of output

95 150 200 kΩ
amplifiers pins 35 and 33
(31 and 29)

output voltage level pins 25 and

note 4 −8 −6 −4 dBV

24 (21 and 20)

note 4 −1 − +1 dB

pins 25 and 24 (21 and 20)

output resistance pins 25 and 24

note 4 92 125 150 Ω

(21 and 20)
mute attenuation output selector in

74 −−dB

position 6; note 4

crosstalk attenuation between

note 5 − 74 − dB

secondary channels
crosstalk attenuation from main

note 6 − 74 − dB

channel to secondary
DC offset voltage on

all PLLs locked; ∆f = 0 14 16 20 mV
attack/recovery capacitors
pins 29, 39 (25, 35)

= 100 mV; fi=70Hz − 25 − dB

RR

50 kHz frequency response

note 7 −25 −16 −9dB
with respect to 1 kHz

October 1994 11

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Secondary channels - noise reduction pins 25 and 24 (21 and 20); note 4

V

OL,OR

output voltage at 0 dB noise
reduction input level

V

OL OR 15 kHz(),

--------------------------------------­V

OL OR 1 kHz(),

V

OL, OR

15 kHz frequency response
with respect to 1 kHz at 0 dB
noise reduction input level

output voltage at −20 dB noise
reduction input level

V

OL OR 15 kHz(),

--------------------------------------­V

OL OR 1 kHz(),

15 kHz frequency response
with respect to 1 kHz at −20 dB
noise reduction input level

External inputs - pin 28 (24) (left) and pin 27 (23) (right) - overall performance (output selector in position 5)

V

EXTR,EXTL

R

i

V

OL,OR

input signal level −−6 dBV
input resistance 95 150 200 kΩ
output level V

THD total harmonic distortion V

S/N(A) signal-to-noise ratio A-weighted;

α

L/R,αR/L

crosstalk fi= 1 kHz − 80 − dB

Secondary channels PLLs disable [SCD pin 11 (6)]; pin 11 (6) left open-circuit = logic HIGH

V

IL

V

IH

R

i

LOW level input voltage 0 − 1.2 V
HIGH level input voltage 3.5 − 9V
input resistance connected to V

Output selector control circuit (see also T able 1) and main channel PLL lock-in select [MCS pin 7 (2)]; pins 15,
17, 26, 13 and 7 (10, 13, 22, 8 and 2) MOS inputs and should not be left open-circuit

V

IL

V

IM

LOW level input voltage limits 0 − 1.2 V
MID level input voltage limits for

MCS pin only

V

IMF

MID level input voltage on MCS
pin if MCS pin is floating

V

IH

R

IL

HIGH level input voltage limits 3.5 − V
low input resistance MCS pin to

ground

R

IH

I

IL

high input resistance MCS pin to
V

P

LOW level input current
(not MCS pin)

I

IH

HIGH level input current
(not MCS pin)

∆fS1= ∆fS2= 50 kHz;

−1 +1 +3 dBV

no fixed de-emphasis
connected

= ∆fS2= 50 kHz;

∆f

S1

−2 0 +2 dB
no fixed de-emphasis
connected

∆fS1= ∆fS2= 5 kHz;

−29 −26 −23 dBV

no fixed de-emphasis
connected

∆f

= ∆fS2= 5 kHz;

S1

−13 −11.5 −10 dB
no fixed de-emphasis
connected

EXTR, EXTL
EXTR, EXTL

= −6 dBV −6.5 −6.0 −5.5 dBV
= −6 dBV;

−−0.1 %
fi= 1 kHz

80 −−dB

V

EXTR, EXTL

= −6 dBV

P

65 100 130 kΩ

1.8 − 2.8 V

VP must be 1.8 to 13.2 V 17 19 21 %V

P

P

V

12 19 26 kΩ

52 80 108 kΩ

VIL=0V −<−1−µA

VIH=5V −<1−µA

October 1994 12

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

Notes to the AC characteristics

1. At pin 20 (16) the demodulated 1 kHz signal should be present with a typical level of 158 mV (RMS) (−16 dBV), and
THD of maximum 0.5%; VP= 8 to 13.2 V; T

2. Modulation of main channel is OFF; modulation of secondary channels is ON.

3. The electrolytic capacitors at pins 40 and 42 (36 and 38) are removed and 1500 pF capacitors between pin 40 (36)
and ground and between pin 42 (38) and ground are connected. At pins 40 and 42 (36 and 38) the demodulated
1 kHz signals should be present with typical levels of 9 mV (RMS) and THD of maximum 0.5%; VP= 8 to 3.2 V;
T

= −20 to +70 °C.

amb

4. All PLLs locked; RS1=RS2= 0.68 kΩ.

5. Modulation of secondary channel being measured and main channel is OFF; modulation of other secondary channel
is ON.

6. Modulation of main channel is ON; modulation of secondary channels is OFF.

7. Measured at pins 38 (34) (left) and 30 (26) (right) and no electrolytic capacitors connected to these pins.

Table 1 Truth table for output selection (note 1)

= −20 to +70 °C.

amb

SWITCH

POSITION

1 stereo 1100
2 left 1000
3 right 0100
4 main 0000
5 external X X 1 0
6 mute secondary X X 0 1
7 mute all X X 1 1

Note

1. X = don’t care.

STATE

PIN 15 (10) PIN 17 (13) PIN 26 (22) PIN 13 (8)

OUTSEL L OUTSEL R EXT/

INT MUTE

October 1994 13

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

Fig.4 Test circuit.

The pin numbers in parenthesis refer to the QFP44 package.

October 1994 14

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

APPLICATION INFORMATION
General

The satellite baseband signal is routed to a mixer to
transfer the various secondary channels to fixed
intermediate frequencies of 10.7 and 10.52 MHz. Tuning
to the required carrier frequencies can be achieved by
varying the oscillator frequency e.g. tuning to 7.02 and

7.20 MHz carrier frequencies requires an oscillator

frequency of 17.72 MHz and tuning to 7.38 and 7.56 MHz
requires an oscillator frequency of 18.08 MHz. The IF
signals are routed to the inputs pin 8 and 16 (3 and 11) via

10.7 and 10.52 MHz ceramic bandpass filters. For the

secondary channels the bandpass filter terminating
resistor is integrated on-chip (330 Ω typical) thus no
external resistors are required.

MCS pin 7 (2) = logic 0; (see Fig.5)
The lock-in range of the main channel PLL is 5.5 to

7.5 MHz. For the main channel a ceramic bandpass filter

(e.g. 6.5 MHz) is used to filter out the main sound carrier
directly from the baseband signal. Simultaneous
demodulation of one main channel and various secondary
channels is now possible with a minimum of external
components. As no bandpass filter terminating resistor for
the main channel pin 18 (14) is integrated on-chip, an
external resistor is required.

MCS pin 7 (2) = logic 1; (see Fig.6)
The lock-in range of the main channel PLL is now 10.0 to

11.5 MHz. The carrier frequency of the main channel is

also transferred to a fixed intermediate frequency. In this
event the main audio output level should be adjusted to

−6 dBV by inserting a 470 Ω resistor in series with the

electrolytic capacitor on pin 41 (37).

If simultaneous demodulation of main- and secondary
sound carriers is not required, a low cost solution as given
in Fig.6 can be considered. One mixer and frequency
synthesizer are used to transfer all sound carriers to
intermediate frequencies of 10.7 and 10.52 MHz. When
the bandwidth of the main channel is larger than the
secondary channel bandwidth, a separate (e.g. 10.7 MHz)
ceramic filter plus resistors are required for the main
channel.

The secondary sound carriers can be demodulated as
described above. If e.g. a 6.65 MHz main sound carrier is
to be demodulated, this frequency is mixed to 10.7 MHz by
tuning the frequency synthesizer to 17.35 MHz. If the
synthesizer is tuned to 17.20 MHz a 6.5 MHz main sound
carrier can be demodulated. When main sound is to be
demodulated and this IF signal is also available on the
secondary Channel 1 input the PLLs of the secondary
channels can be disabled by making SCD pin 11 (6) HIGH.
The output selector should be in position 4 (main sound on
all outputs) if output pins 25 and 24 (21 and 20) are used.

For high-end applications the input level of the NR can be
adjusted to give optimum performance. 0 dB is the
maximum input level which corresponds to the maximum
frequency deviation of the incoming FM signal (50 kHz for
secondary channels). If the NR input signal is too low
(HIGH) the NR will attenuate (favour) the higher audio
frequencies too much due to the expansion character. In
general: 1 dB error in NR input level will give a 1 dB
difference between low (50 Hz) and high (15 kHz) audio
frequencies. With R
frequency response of the NR can be adjusted: at 0dB
input level (which corresponds to a frequency deviation of
50 kHz) the output level of a 15 kHz modulated signal
should be 0.25 dB lower than that of an 50 Hz modulated
signal.

(RS2) the input level and so the

S1

MCS pin 7 (2) = MID position

The main channel PLL is off if the voltage is between 1.8
and 2.8 V on pin 7 (2). This situation can be obtained by a
floating MCS pin if V
forcing this MCS pin to the desired voltage by an external
voltage source. In that event VP can be in the full range of
8 to 13.2 V. This feature can be used to slightly improve
the signal-to-noise ratio of the secondary channels if the
main channel is not used.

October 1994 15

is between 10.8 and 13.2 V or by

P

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

October 1994 16

Fig.5 Application diagram; MCS = logic 0.

The pin numbers in parenthesis refer to the QFP44 package.

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

October 1994 17

Fig.6 Application diagram; MCS = logic 1.

The pin numbers in parenthesis refer to the QFP44 package.

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

PACKAGE OUTLINES

handbook, full pagewidth

seating plane

3.2

2.9

1.73
max

42

1

39.0

38.4

1.778
(40x)

1.3 max

0.53
max

22

21

0.51
min

14.1

13.7

0.18

4.57
max

15.80

15.24

5.08
max

M

0.32 max

15.24

17.15

15.90

MSA268 - 1

Dimensions in mm.

Fig.7 Plastic shrink dual in-line package; 42 leads (600 mil); SDIP42; SOT270-1.

October 1994 18

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

handbook, full pagewidth

seating

plane

0.1 S

12.9

12.3

44

1

pin 1 index

11

12

34

22

S

1.2
(4x)

0.8

33

0.8

0.40

23

0.20

B

10.1

9.9

12.9

12.3

B

0.15 M

1.2

0.25

0.05

0.8

(4x)

A

detail X

0.95

0.55

0.85

0.75

X

0.25

0.14

0 to 10

2.10

1.70

o

Dimensions in mm.

0.8

0.40

0.20

0.15 M A

10.1

9.9

1.85

1.65

MBB944 - 2

Fig.8 Plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm (QFP44; SOT307-2).

October 1994 19

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

SOLDERING
Plastic dual in-line packages

Y DIP OR WAVE

B
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply the soldering iron below the seating plane (or not

more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.

Plastic quad flat packages

YWAVE

B
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Y SOLDER PASTE REFLOW

B
Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

R

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

October 1994 20

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

October 1994 21

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

NOTES

October 1994 22

Philips Semiconductors Product specification

Satellite sound circuit with noise reduction TDA8741; TDA8741H

NOTES

October 1994 23

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SCD35 © Philips Electronics N.V. 1994

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533061/1500/02/pp24 Date of release: October 1994
Document order number: 9397 740 50011

Philips Semiconductors