Datasheet TDA8735, TDA8735T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8735

PLL frequency synthesizer

Product specification
File under Integrated Circuits, IC01

Philips Semiconductors

September 1994

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

FEATURES

• Complete 30 MHz single-chip tuning system

• Loop amplifier included

• 2-level current amplifier (charge pump) for adjusting the

loop gain

• A powerful digital memory phase detector

• Programmable reference frequencies of 1 kHz, 10 kHz

or 25 kHz

• I2C-bus interface

• Programmable address select input

• Software controlled switch output.

APPLICATIONS

• Satellite sound receiver

• Radio receiver: LW, MW and SW.

GENERAL DESCRIPTION

The TDA8735 is a single-chip PLL synthesizer designed
for satellite receivers. The device can be set to two
different addresses which can be used in applications
where independently tuned VCOs are required.

To adapt to different frequency accuracy, 3 reference
frequencies are selectable via the I2C-bus. The charge
pump current can be set to 2 values with a ratio of 1 : 100
via the I2C-bus.

A programmable switch (open collector) is integrated to
enable mode or normal switching, or other types of
application.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC1

V

CC2

I

CC1

I

CC2

f

i(max)

f

i(min)

V

i(rms)

P

tot

T

amb

supply voltage (pin 3) 4.5 5.0 5.5 V
supply voltage (pin 16) V

CC1

8.5 12 V
supply current (pin 3) outputs unloaded 12 20 28 mA
supply current (pin 16) outputs unloaded 0.2 0.5 1 mA
maximum input frequency 30 −−MHz
minimum input frequency −−512 kHz
input voltage (RMS value) 30 − 500 mV
total power dissipation − 0.14 − W
operating ambient temperature −30 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8735 DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-1

TDA8735T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

September 1994 2

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

BLOCK DIAGRAM

September 1994 3

Fig.1 Block diagram.

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

PINNING

SYMBOL PIN DESCRIPTION

XTAL1 1 reference oscillator output
XTAL2 2 reference oscillator input
V

CC1

V

EE

n.c. 5 not connected
DEC 6 prescaler decoupling
VCOFI 7 VCO input frequency
BS 8 band switch output
n.c. 9 not connected
SDA 10 serial data input (I
SCL 11 serial clock input (I
AS 12 address select input (I
n.c. 13 not connected
LOOP

I

LOOP

O

V

CC2

3 supply voltage 1
4 ground

2

C-bus)

2

C-bus)

2

C-bus)

14 tuning voltage amplifier input
15 external loop filter output
16 supply voltage 2

Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION

The TDA8735 contains the following parts and facilities:

• Input amplifier VCO-signal.

• A prescaler with the divisors 3 : 4 and a 2-bit

programmable swallow counter.

• A 13-bit programmable counter.

• A digital memory phase detector.

• A reference frequency channel comprised of a 4 MHz

crystal oscillator followed by a reference counter; the
reference frequency can be 1 kHz, 10 kHz or 25 kHz
and is applied to the digital memory phase detector.

2

C-bus interface with data latches and control logic;

• An I
the I2C-bus is intended for communication between
microcontrollers and different ICs or modules. Detailed
information on the I2C-bus specification is available on
request.

• A software-controlled switch output.

• A programmable current amplifier (charge pump) which

consists of a 5 µA and a 500 µA current source, this
allows adjustment of loop gain, thus providing
high-current high-speed tuning and low current-stable
tuning. The output at the loop amplifier can deliver a
tuning voltage of up to 10.5 V (V

CC2

− 1.5 V).

Controls

The TDA8735 is controlled via the 2-wire I

2

C-bus. As slave
receiver for programming there is one module address, a
logic 0 (R/W bit), a subaddress byte and four data bytes.
The subaddress determines which one of the four data
bytes is transmitted first. The module address contains a
programmable address bit (D1) which with address select
input AS (pin 12) makes it possible to operate two
TDA8735 in one system.

The auto increment facility of the I2C-bus allows
programming of the TDA8735 within one transmission
(address + subaddress + 4 data bytes).

The TDA8735 can also be partially programmed.
Transmission must then be ended by a stop condition.

The bit organization of the 4 data bytes is illustrated in
Fig.3 and is described below.

The divider number is defined by 15-bit words, bits
S0 to S14. To calculate the lock frequency, the divider
number has to be multiplied by the selected reference
frequency.

September 1994 4

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

Table 1 Divider number setting.

ON DIVIDER NUMBER SETTING INPUT

1

0 (S0 + S1) × 2

Where the minimum divider ratio is: 2

.... + S13 × 213+ S14 × 2

6

=64to215− 1 = 32761.

Table 2 Bit CP (used to control the charge pump;

DB0: D0).

CP CURRENT

0 LOW
1 HIGH

Table 3 Bits REF1 and REF2 (used to set the reference

frequency applied to the phase detector;
DB2: D7 and D6).

14

ON

REF1 REF2

FREQUENCY

(kHz)

00 1
01 10
10 25
11 0

Table 4 Bit OPAMP (used to control the switch in the

tuning voltage amplifier output circuitry;
DB2: D4).

OPAMP SWITCH

1on
0off

Table 5 Bit BS (used to control the open-collector switch

output; DB2: D2).

BS SWITCH OUTPUT

1 sink current
0 floating

The data byte DB3 must be set to 0....0. It is also used for

test purposes (see Fig.3).

September 1994 5

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

Fig.3 Bit organization.

September 1994 6

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC1

V

CC2

P

tot

T

amb

T

stg

HANDLING

supply voltage (pin 3) −0.3 +5.5 V
supply voltage (pin 16) V

CC1

12.5 V
total power dissipation − 0.85 W
operating ambient temperature −30 +85 °C
storage temperature −65 +150 °C

Every pin withstands the ESD test in accordance with

“MIL-STD-883C category B”

(2000 V).

CHARACTERISTICS

V

CC1

=5V; V

CC2

= 8.5 V; T

=25°C; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V
V
I

CC1

I

CC2

CC1
CC2

supply voltage (pin 3) 4.5 5.0 5.5 V
supply voltage (pin 16) V

CC1

8.5 12 V
supply current (pin 3) no outputs loaded 12 20 28 mA
supply current (pin 16) no outputs loaded 0.2 0.5 1 mA

TDA8735T only 0.7 1 1.5 mA

2

C-bus inputs (SDA and SCL)

I

V

IH

V

IL

I

IH

I

IL

HIGH level input voltage 3.0 − 5.0 V
LOW level input voltage −0.3 − +1.5 V
HIGH level input current −−10 µA
LOW level input current −−10 µA

SDA output

V

OL

LOW level output voltage open collector;

−−0.4 V

IOL= 3.0 mA

AS input

V

IH

V

IL

I

IH

I

IL

HIGH level input voltage AS = C6 3.0 − 5.0 V
LOW level input voltage AS = C4 −0.3 − +1.0 V
HIGH level input current −−10 µA
LOW level input current −−10 µA

RF input

f

i(max)

f

i(min)

V

i(rms)

R

i

C

i

maximum input frequency 30 −−MHz
minimum input frequency −−512 kHz
input voltage (RMS value) measured in Fig.4 30 − 500 mV
input resistance − 5.9 − kΩ
input capacitance − 2 − pF

September 1994 7

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Oscillator (XTAL1 and XTAL2)

R

xtal

crystal resonance
resistance (4 MHz)

Programmable charge pump

I

CHP

output current to loop filter bit CP = logic 0 3 5 7 µA

Ripple rejection

RR f

20 log

20 log

∆V

CC1

----------------- ­∆V

O

∆V

CC2

----------------- ­∆V

O

see Fig.5 −−150 Ω

bit CP = logic 1 400 500 600 µA
bit CP = logic 0;

359µA

TDA8735T only

= 100 Hz 40 50 − dB

ripple

f

= 100 Hz 40 50 − dB

ripple

Band switch output (pin 8)

V

OH

V

OL

| output leakage current VOH=12V −−10 µA

|I

LO

HIGH level output voltage −−12 V
LOW level output voltage IOL=3mA −−0.8 V

Tuning voltage amplifier output (pin 15)

V

O(max)

V

O(min)

I

source

I

sink

Z

o(off)

I

bias

maximum output voltage I
minimum output voltage I

= 0.5 mA V

source

=1mA −−0.8 V

sink

− 1.5 −−V

CC2

maximum output source current 0.5 −−mA
maximum output sink current 1.0 −−mA
impedance of switched-off output 5 −−MΩ

 input bias current (absolute value) − 15nA

September 1994 8

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

Fig.4 Prescaler input sensitivity (set-up measurement).

Fig.5 Crystal connection (4 MHz).

September 1994 9

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

APPLICATION INFORMATION

Loop filter depends on VCO parameters.

Fig.6 Application example.

September 1994 10

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

PACKAGE OUTLINES

handbook, full pagewidth

seating plane

3.9

3.4

2.2

max

22.00

21.35

3.7

4.7

max

max

0.51
min

2.54
(7x)

1.4 max

16

1

0.53
max

0.254 M

9

6.48

6.14

8

0.32 max

8.25

7.80

7.62

9.5

8.3

MSA254

Dimensions in mm.

Fig.7 Plastic dual in-line package; 16 leads (300 mil) DIP16; SOT38-1.

September 1994 11

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

handbook, full pagewidth

S

0.7

0.3

pin 1
index

10.0

9.8

0.1 S

0.49

0.36

9

1.45

1.25

8

0.25 M
(16x)

16

1

1.27

0.25

0.10

4.0

3.8

6.2

5.8

detail A

1.0

0.5

0.7

0.6

0.25

0.19

0 to 8

MBC303 - 1

A

1.75

1.35

o

Dimensions in mm.

Fig.8 plastic small outline package; 16 leads; body width 3.9 mm (SO16; SOT109-1).

September 1994 12

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

SOLDERING
Plastic dual in-line packages

Y DIP OR WAVE

B
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron below the seating plane

(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

Plastic small-outline packages

YWAVE

B
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Y SOLDER PASTE REFLOW

B
Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

R

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

September 1994 13

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

September 1994 14

Philips Semiconductors Product specification

PLL frequency synthesizer TDA8735

NOTES

September 1994 15

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budget no./printrun/ed./pp16 Date of release: September 1994
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Philips Semiconductors