Datasheet TDA8722T-C2, TDA8722T-C3, TDA8722T-C1, TDA8722M-C2, TDA8722M-C3 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1995 Mar 21
File under Integrated Circuits, IC02

1998 Jun 23

INTEGRATED CIRCUITS

TDA8722

I

2

C-bus programmable modulator
for negative video modulation and
FM sound

1998 Jun 23 2

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

FEATURES

• Video amplifier with clamp and white clip circuits

• FM sound modulator

• Asymmetrical and symmetrical RF outputs available

• Symmetrical RF oscillator using only a few external

components

• External adjusting of modulation depth and level of the
sound subcarrier

• I2C-bus receiver for frequency setting and test-mode
selection

• One I

2

C programmable output port

• On-chip Phase-Locked Loop (PLL) frequency
synthesizer

• On-chip power supply regulator

• Bus switchable oscillator

• On-chip Test Pattern Signal Generator (TPSG).

APPLICATIONS

• Video recorders

• Cable converters

• Satellite receivers.

GENERAL DESCRIPTION

The TDA8722 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (PAL B/G, I, D/K
and NTSC).

It is especially suited for satellite receivers, video
recorders and cable converters. The video carrier
frequency is set exactly to the correct channel frequency
by a PLL synthesizer which is programmed in accordance
with the I2C-bus format.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8722T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
TDA8722M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

1998 Jun 23 3

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

QUICK REFERENCE DATA

V

DDA=VDDD

=5V; T

amb

=25°C after the IC has reached thermal equilibrium; unless otherwise specified.

Notes

1. Value depends on value of resistor R17 (see Fig.7).

2. Value depends on value of capacitor C17 (see Fig.7).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

analog supply voltage 4.5 5.0 5.5 V

V

DDD

digital supply voltage 4.5 5.0 5.5 V

I

DD

total supply current normal mode 41 52 63 mA

∆m typical modulation depth range video level (pin 19) = 0.5 V (p-p);

note 1; see Fig.10

65 − 90 %

∆P/S typical picture-to-sound level

range

note 2; see Fig.11 −18 −−10 dB

V

RF

RF output voltage level
asymmetrical on a 75 Ω load

frequency between

471.25 and 855.25 MHz

77 80 83 dBµV

δf FM deviation on audio

subcarrier

f

i

= 400 Hz; V1= 0.5 V (RMS);

before pre-emphasis filter

20 25 30 kHz

1998 Jun 23 4

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MBE401

LOGIC

enable/

select

f

DIV

f

ref

14

10 bits

I C-BUS

2

RECEIVER

12-BIT

DIVIDER

(N)

PHASE

DETECTOR

enable

CHARGE

PUMP

AMP

7

DIVIDER

(M = 128)

31.25 kHz

4 MHz

OSCILLATOR

9

XTAL

11

V

DDD DGND

10

8

AMP

CP

PRESCALER

(8)

ASYMMETRICAL

OUTPUT
BUFFER

UHF

OSCILLATOR

TDA8722

4

5

6

UOSCB

OGND

UOSCA

RF oscillator on

PC

AUDIO

FM MODULATOR

12

13

SDA

SCL

P0

SOSCB

SOSCA

AUDIO

3

2

1

SWITCH

TPSG

balance test

TPSG on

MIXER

16 15

VOLTAGE

REGULATOR

18 2017

ADJUST AGNDVDDA

RFA RFB

CLIP

CLAMP

19

VIDEO

VIDEO AMP

1998 Jun 23 5

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

PINNING

SYMBOL PIN DESCRIPTION

AUDIO 1 audio input
SOSCA 2 sound oscillator A
SOSCB 3 sound oscillator B
UOSCB 4 UHF oscillator B
OGND 5 RF oscillator ground
UOSCA 6 UHF oscillator A
AMP 7 tuning amplifier output
CP 8 charge pump output
XTAL 9 crystal oscillator
DGND 10 digital ground
V

DDD

11 digital supply voltage

SCL 12 serial clock input (I

2

C-bus)

SDA 13 serial data input (I

2

C-bus)
P0 14 NPN open-collector output Port
RFB 15 asymmetrical RF output B
RFA 16 asymmetrical RF output A
ADJUST 17 modulation depth and picture-to-sound

distance adjustment pin
AGND 18 analog ground
VIDEO 19 video input
V

DDA

20 analog supply voltage

Fig.2 Pin configuration.

handbook, halfpage

TDA8722

MBE394

1
2
3
4
5
6
7
8
9

10

20
19
18
17
16
15
14
13
12
11

CP

DGND

XTAL SCL

SDA

AMP P0

UOSCA RFB

OGND RFA

UOSCB ADJUST

SOSCB AGND

SOSCA VIDEO

AUDIO

V

DDD

V

DDA

FUNCTIONAL DESCRIPTION

The TDA8722 is a programmable modulator which can be
divided into two main blocks:

• A modulator for negative video modulation and
FM sound TV standards

• A programmable PLL frequency synthesizer.

The video part of the modulator consists of a clamping
circuit which sets the internal reference voltage to the
bottom of the synchronizing pulse, followed by a white clip
which avoids over modulation in case the video signal is
too strong. Typically, the IC starts to clip the video signal
when the voltage at the video input (pin 19) is
>560 mV (p-p) while the normal voltage at the video input
is 500 mV (p-p). This clipping function ensures that the
video modulation depth is not too high. The modulation
depth is adjusted in the application between at least
65 and 90% by changing the resistor value between pin 17

and ground (R17). The value can change between 47 kΩ
and infinite (R17 removed); see Fig.10.

The video part also contains a test pattern signal generator
to simplify the adjustment of the receiving channel of the
TV set to the required channel of the modulator. The
pattern consists of a synchronization pulse and two
vertical white bars on screen (see Fig.3).

The audio part of the modulator contains an FM sound
modulator. The frequency of the sound subcarrier is set in
the application by external components (C3, L3 and R3).
The difference between the video carrier level and the
sound subcarrier level is adjusted in the application by
changing the value of the capacitor between pin 17 and
ground (C17). The value can change between
0 and 47 pF. The distance between the video carrier and
the sound subcarrier can be adjusted between at least

−10 and −18 dB (see Fig.11).

1998 Jun 23 6

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

To bias the audio input it is necessary to put a resistor in
the application between pin 1 and ground. The resistor
has a typical value of 12 kΩ.

The RF part of the oscillator consists of:

• An oscillator which operates at the required video
carrier frequency. The range of the oscillator is
determined in the application by C5, C6, L5 and D5.

• An RF mixer. It first combines the video signal and the
sound subcarrier to build a baseband TV channel.
Then the baseband signal is mixed with the oscillator
signal to get the RF TV channel. The mixer has two
outputs which can be used as two independent
asymmetrical outputs, or as one symmetrical output. In
the event of asymmetrical use, the unused output must
be loaded with a 75 Ω resistor (see Fig.7).

The oscillator frequency is set by a programmable PLL
frequency synthesizer in accordance with equation:

f

osc

=8×N×f

ref

Where:

f

osc

is the local oscillator frequency.

N is a 12-bit dividing number (10 bits are programmable
by the I2C-bus).

f

ref

is the crystal frequency (4 MHz) divided by 128

(31.25 kHz).

The circuit allows a step of 250 kHz but because only
10 bits are programmable, the programming steps are
1 MHz.
When the PLL loop is locked, both inputs of the phase
comparator are equal, which gives equation:

During the test mode operation, f

DIV

and f

ref

can be

monitored on the output Port pin (pin 14).

Software information

The synthesizer is controlled via a two-wire I

2

C-bus
receiver. For programming, the address byte (C8 HEX)
has to be sent first. Then one or two data bytes are used
to set the 10 programmable bits of the dividing number N,
the test bits (see Table 1) and the output Port state. Note
that after power-up of the IC, the two data bytes must be
sent.

f

DIV

f

osc

8N×

-------------

f

xtal

128

--------- -

f

ref

===

Fig.3 Test pattern signal.

handbook, full pagewidth

010203040 50 60

64

70

MBE395

t (µs)

1998 Jun 23 7

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Table 1 Data format; notes 1 and 2

Notes

1. The 10 programmable bits of N are: b2 to b11.

2. Internal hardware sets: b1 = 0 and b0 = 1.

3. T0, T1 and T2 are bits used for test purposes (see Table 5).

4. P0 is a bit used for controlling the state of the output Port (see Table 6).

Table 2 Structure of the dividing number N

Notes

1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed
internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels.

2. Bits b1 and b0 are not programmable.

3. f

osc

= 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz).

Table 3 Dividing number N for programming channel 21 (471.25 MHz)

Notes

1. Bits b1 and b0 are not programmable.

2. f

osc

=0+256+128+64+0+16+0+4+2+1+0.25 (MHz) = 471.25 MHz.

Table 4 Content of the data bytes to program channel 21 (471.25 MHz)

It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB
(0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to
increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1.

BYTE

BIT 7

MSB

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1

BIT 0

LSB

ACKNOWLEDGE BIT

Address byte C8 1 1 0 0 1 0 0 0 ACK
Data byte 1 0 b11 b10 b9 b8 b7 b6 b5 ACK
Data byte 2 1 T0

(3)

T1

(3)

T2

(3)

P0

(4)

b4 b3 b2 ACK

RESULT

BITS

(1)

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1

(2)

b0

(2)

Frequency (MHz)

(3)

51225612864321684210.50.25

RESULT

BITS

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1

(1)

b0

(1)

Value 011101011101
Frequency (MHz)

(2)

025612864016042100.25

BYTE

BIT 7

MSB

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1

BIT 0

LSB

ACKNOWLEDGE BIT

Address byte C8 1 1 0 0 1 0 0 0 ACK
Data byte 1 0 0 1 1 1 0 1 0 ACK
Data byte 2 1 0 0 0 0 1 1 1 ACK

1998 Jun 23 8

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5.

Table 5 Test modes

Notes

1. In ‘TPSG on’ mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two
vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated
signal to the right frequency.

2. In ‘RF oscillator off’ mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out
of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used.

3. In ‘balance test’, the video carrier is over modulated. This simplifies residual carrier measurements.

4. In ‘f

ref

’ and ‘f

DIV

’ modes, the reference frequency f

ref

in the phase comparator or the divided RF oscillator frequency

f

DIV

is available on the output Port pin. This mode requires that bit P0 = 0.

5. The ‘high-impedance test’ mode may be used to inject an external tuning voltage to the RF tank circuit, to test the
oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is
switched-off. The AMP output (pin 7) is LOW (<200 mV).

6. In the ‘phase detector disabled’ mode, it is possible to measure the leakage current at the input of the tuning amplifier,
on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs
for testing the audio and video parts.

T0 T1 T2 OPERATIONAL MODE

0 0 0 normal operation
0 0 1 Test Pattern Signal Generator (TPSG) on; note 1
0 1 0 RF oscillator off; note 2
0 1 1 balance test; note 3
100f

ref

out (if p0 = 0); note 4
1 0 1 high-impedance test; note 5
110f

DIV

out (if p0 = 0); note 4

1 1 1 phase detector disabled; baseband signals on RF outputs; note 6

The possibilities of bit P0, which controls the output Port
(pin 14) are given in Table 6.

The Port is an NPN open-collector type. For monitoring the
f

ref

or f

DIV

frequency on the output Port, the P0 bit must be

logic 0 to let the output Port free.

Table 6 Output Port programming

P0 OUTPUT PORT STATE

0 off; high impedance
1 on; sinking current

1998 Jun 23 9

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in
accordance with

“MIL-STD-883C category B”

(2000 V). Every pin withstands the ESD test in accordance with Philips

Semiconductors Machine Model (MM) 0 Ω, 200 pF (200 V).

THERMAL RESISTANCE

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA

analog supply voltage −0.3 +6 V

V

DDD

digital supply voltage −0.3 +6 V

V

DD

operating supply voltage 4.5 5.5 V

V

max

maximum voltage on all pins −0.3 V

DD

V

T

stg

IC storage temperature −40 +125 °C

T

amb

operating ambient temperature −20 +85 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SO20; SOT163-1 85 K/W
SSOP20; SOT266-1 120 K/W

1998 Jun 23 10

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

CHARACTERISTICS

V

DDA=VDDD

=5V; T

amb

=25°C; valid over the whole UHF band; measured in circuit of Fig.7;

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

DD

supply current normal mode 41 52 63 mA

RF off test mode 30 38 46 mA

Video characteristics

I

19

input current (AC) V19= 3.2 V − 0.5 2.0 µA

z

19

video input impedance V19= 3.2 V 30 −−kΩ

m modulation depth V

19

= 500 mV (p-p) EBU
colour bars; R17 = 120 kΩ;
see Fig.7

77 82 87 %

during clipping condition;
note 1

85 − 98 %

TPSG mode;
R17 = 120 kΩ

72 82 92 %

balance test mode;
R17 = 120 kΩ

110 −−%

∆m modulation depth range V

19

= 500 mV (p-p) EBU
colour bars;
47 kΩ≤R17 ≤∞

65 − 90 %

∆m

APL

variation of modulation depth with
change of APL between 10 and 90%

referenced to the value for
APL = 50%;
V19= 500 mV (p-p)

−2 − +2 %

V

clip(p-p)

video input level where clipping starts
(peak-to-peak value)

video level on pin 19;
note 2

− 0.56 − V

S/N video video signal-to-noise ratio f

RF

< 700 MHz; note 3 48 52 − dB

f

RF

> 700 MHz; note 3 46 50 − dB

G

diff

differential gain note 4 −8 − +8 %

φ

diff

differential phase note 4 −8 − +8 deg

V/S video-to-sync ratio V

19

= 500 mV (p-p);
V/S = 7/3

6.9/3.1 7/3 7.1/2.9

f

video

frequency response for the video signal note 5 −1 − +1 dB

Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz)

Z

1

audio input impedance 30 −−kΩ

δm modulation deviation f

1

= 400 Hz;
V1= 0.5 V (RMS) before
pre-emphasis filter

20 25 30 kHz

δm

max

maximum modulation deviation f1= 400 Hz;

V1= 2.0 V (RMS) before
pre-emphasis filter

60 85 − kHz

THD total harmonic distortion f

1

= 1 kHz;
V1= 0.5 V (RMS) before
pre-emphasis filter

− 0.4 1.5 %

1998 Jun 23 11

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

S/N audio audio signal-to-noise ratio note 6 45 50 − dB
f

audio

frequency response of the audio signal note 7 −1 − +1 dB

P/S picture-to-sound ratio no audio signal;

FM = 5.5 MHz;
C17=15pF

−16 −13 −10 dB

∆P/S picture-to-sound ratio range no audio signal;

FM = 5.5 MHz;
0pF≤C17 ≤ 39 pF

−18 −−10 dB

Channel characteristics

f

RF

RF frequency range using tank circuit of Fig.7 471.25 − 855.25 MHz

V

RF

output level on RFA and RFB asymmetrical output

loaded with 75 Ω;
f = 471.25 to 855.25 MHz

77 80 83 dBµV

∆V

RF

difference between the level of
modulated carrier and the level of the
unmodulated carrier

measurement is made
during synchronization
pulse for the modulated
carrier

012dB

SPO spurious outside channel note 8 −−62 − dBc
RF

sh

RF second harmonic level on
asymmetrical output

fRF= 471.25 MHz −−30 −25 dBc
f

RF

= 855.25 MHz −−20 −15 dBc

SC

sh

sound carrier second harmonic level fs= 5.5 MHz;

C17 = 15 pF;
fRF< 700 MHz

−−65 −60 dBc

f

s

= 5.5 MHz;
C17 = 15 pF;
fRF> 700 MHz

−−63 −58 dBc

SC

th

sound carrier third harmonic level fs= 5.5 MHz; C17 = 15 pF −−65 −60 dBc
video signal harmonics note 9 −−60 −55 dBc

f

ref

reference frequency spurious fp+ 31.25 kHz −−65 −60 dBc

IM chrominance beat note 10 −−65 −60 dBc

Charge pump output (CP)

I

8

output current −±100 −µA

V

7

output voltage in lock 1.5 − 2.5 V

I

OZ

OFF-state leakage current VCP= 2 V; T0 = 1; T1 = 1;

T2 = 1

−−10 nA

Amplifier output (AMP)

G amplifier current gain V

CP

=2V; I

AMP

=10µA − 4000 −

V

7sat

output saturation voltage VCP= 0 V; T0 = 1; T1 = 0;

T2 = 1

− 140 200 mV

Crystal oscillator characteristics (XTAL)

Z

9

oscillator input impedance −−−500 Ω

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Jun 23 12

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Notes

1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 kΩ
in the application.

2. For application information only.

3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white;
see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz.

4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with
300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V;
see Fig.5.

5. Measured with a spectrum analyzer with ‘peak hold’ function, applying a 500 mV (peak-to-peak value) sine wave at
the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for

1.0 MHz.

6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a
deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19.

7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio
input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (f

RF

+2fs, 2fRF+fs, etc.). This measurement includes the spurious at

the1⁄4fRF,1⁄2fRF and3⁄4fRF.

9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of
500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF+ 2 MHz, fRF+ 3 MHz, etc.

10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency
of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7.

Output Port characteristics (P0)

V

OL

LOW level output voltage P0 = 1; I14=5mA − 150 400 mV

I

OZ

OFF-state leakage current P0 = 0; VDD= 5.5 V −−10 µA

I

14(max)

maximum Port current P0 = 1 −−10 mA

I

2

C-bus receiver characteristics (SDA and SCL)

V

IH

HIGH level input voltage 3 − 5.5 V

V

IL

LOW level input voltage 0 − 1.5 V

I

IH

HIGH level input current VIH=5V; VDD=0or5V −−10 µA

I

IL

LOW level input current VIL=0V; VDD=0or5V −10 −−µA

V

o

output voltage on SDA during acknowledge

pulse; IIL=3mA

−−0.4 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Jun 23 13

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Fig.4 CCIR insertion line N.17.

handbook, full pagewidth

010203040 50 60

64

70

MBE396

t (µs)

1 V

0.3 V

0 V

Fig.5 CCIR insertion line N.330.

handbook, full pagewidth

010203040 50 60

64

70

MBE397

t (µs)

1 V

0.3 V

0 V

1998 Jun 23 14

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

INTERNAL PIN CONFIGURATION

Fig.6 Pin equivalent circuit for each pin.

ESD protection components are not shown in the diagram.

handbook, full pagewidth

VOLTAGE

REGULATOR

AUDIO

SOSCA

SOSCB

UOSCB

OGND

UOSCA

XTAL

DGND

V

VIDEO

AGND

ADJUST

RFA

RFB

P0

SDA

SCL

V

DDD

DDA

1

2

3

4

5

6

AMP

CP

7

8

9

10

20

18

19

17

16

15

14

13

12

11

MBE402

1998 Jun 23 15

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

APPLICATION INFORMATION

Fig.7 Reference measuring set-up.

(1) K1: switches the pre-emphasis filter on or off.
(2) L5: air coil; 1.5 turns; diameter of 2 mm.
(3) L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G).
(4) K2: Switches the FM sound oscillator on or off.

handbook, full pagewidth

220 pF

220 kΩ

15 kΩ

220 Ω

C1

C30

C31

10 nF 2.2 µF

C21

2.2 µF

AUDIO

R4

12 kΩ

R18

82 Ω

R19

470 Ω

R17

120 kΩ

R20

470 Ω

RF

75 Ω

1 kΩ

R14

R2

22 kΩ

75 Ω

12 kΩ

R5

22 kΩ

R6

12 kΩ

R7

22 kΩ

R9

C3

C5 C6

C8

56 pF

R1

R3

L3

15 µH

K2

BB215

D5

33 pF 33 pF

150 nF

L5

K1

10 nF

C7

T8

BC547B

R8

10 nF

C11

Q9

C9

4 MHz

27 pF

33 V
5 V

GND

PORT

SCL
SDA

C20

100 nF

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

(3)

(1)

(2)

(4)

VIDEO

100 nF

C19

R15

15 pF

C17

100 pF

C16

100 pF

C15

TDA8722

MBE403

1998 Jun 23 16

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Application design

Fig.8 Application using an asymmetrical output.

(1) RV1 allows fine adjustment of the modulation depth between 70 and 90%.

handbook, full pagewidth

220 pF

220 kΩ

C1

C30

10 nF

AUDIO

12 kΩ

R18

82 Ω

R19

470 Ω

R20

470 Ω

RF

75 Ω

R2

22 kΩ

15 kΩ

75 Ω

12 kΩ

R5

22 kΩ

R6

12 kΩ

R7

22 kΩ

R9

C3

C5 C6

C8

56 pF

R1

R3

L3

15 µH

BB215

D5

33 pF 33 pF

150 nF

L5

10 nF

C7

T8

BC547B

R8

10 nF
C11

Q9

C9

4 MHz

27 pF

33 V

GND

PORT
SCL
SDA

5 V

C20

100 nF

(1)

VIDEO

100 nF

C19

R15

100 pF

C16

100 pF

C15

MBE405

15 pF

C17

82 kΩ

R17

100 kΩ

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

TDA8722

RV1

1998 Jun 23 17

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Fig.9 Application using a symmetrical output with a balun transformer.

handbook, full pagewidth

220 pF

220 kΩ

C1

C30

10 nF

AUDIO

12 kΩ

R18

82 Ω

R19

470 Ω

R17

120 kΩ

R15

300 Ω

R20

470 Ω

RF

75 Ω

R2

22 kΩ

15 kΩ

12 kΩ

R5

22 kΩ

R6

12 kΩ

R7

22 kΩ

R9

C3

C5 C6

C8

56 pF

R1

R3

15 µH

BB215

D5

33 pF 33 pF

150 nF

L5

10 nF

C7

T8

BC547B

R8

10 nF
C11

Q9

C9

4 MHz

27 pF

33 V

GND

PORT
SCL
SDA
5 V

C20

100 nF

VIDEO

100 nF

C19

15 pF

C17

100 pF

C16

100 pF

C15

MBE404

TR1

1

64

23

TOKO - B4F

617DB - 1010

L3

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

TDA8722

In the design of the application, it is highly recommended
to separate the part of the RF oscillator as much as
possible from the part of the RF outputs in order to avoid
parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid
radiation from and to this part. The pin 5 (OGND) must be
connected to the shielding box and to ground.

RF outputs

For inexpensive applications, it is possible to use the IC
with an asymmetrical output (pins 15 or 16). In this event,
the unused output pin must be loaded with a load as

similar as possible to the load connected to the used pin,
see Fig.8.

A good improvement in performance is obtained using a
1 : 4 symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the
two outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced (see Fig.9).

1998 Jun 23 18

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Modulation depth

With 500 mV (peak-to-peak value) video input signal, the
wanted modulation depth must be set by the value of R17
(resistor between pin 17 and ground) as shown Fig.10. For
a good accuracy, it is recommended to use a 1% type
resistor.

It is also possible to use an adjustable resistor, see Fig.8.
Depending on the layout of the PCB, it may be necessary

to slightly change the value of R17 from the one given in
Fig.10 to get the wanted modulation depth.

Sound oscillator design

The frequency of the sound subcarrier is fixed by the tank
circuit connected between pins 2 and 3. This frequency
can be adjusted between 4.5 and 6.5 MHz covering all
existing standards in the world.

The damping resistor R3 between pins 2 and 3 is
necessary to decrease the quality factor of the tank circuit
allowing the frequency to be modulated by the audio
signal. The value of this resistor is calculated for several
Q factor ranges of the coil for a sound frequency of

5.5 MHz (see Table 7).

Fig.10 Typical modulation depth as a function of

the value of R17.

handbook, halfpage

100

80

70

60

10

3

MBE398

10

2

10

90

R17 (kΩ)

modulation

depth

(%)

Table 7 Value of resistor for several Q factor ranges

The use of a coil with a quality factor <30 may result in a
non operating oscillator. For safety, it is recommended to
use a coil with a quality factor ≥50.

Picture-to-sound ratio

The picture-to-sound ratio can be adjusted in the
application by changing the value of C17 (capacitor
between pin 17 and ground); see Fig.11.

Figure 11 shows us that the picture-to-sound ratio will
change for a constant value of C17 when the sound
subcarrier frequency will change.

RF harmonics

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

The level of the second and third RF harmonic is shown in
Fig.12 for an asymmetrical application. This chart gives a
typical value while the level of these harmonics can vary
depending on the design of the application.

It is possible to reduce the level of the second harmonic by
using a wide band transformer at the output of the IC and
create a symmetrical application (see Fig.9).

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

COIL QUALITY

FACTOR

PROPOSED VALUE FOR R3

(kΩ)

30 to 40 82 to 33
40 to 50 33 to 27
50 to 60 27 to 22
60 to 80 22 to 18

80 to >100 18 to 15

1998 Jun 23 19

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

Fig.11 Typical picture-to-sound ratio as a function

of the value of C17.

R17 = 120 kΩ.
(1) 4.5 MHz.
(2) 5.5 MHz.
(3) 6.0 MHz.
(4) 6.5 MHz.

handbook, halfpage

01020 40

8

20

16

12

MBE399

30

C17 (pF)

P/S
(dB)

(1)

(4)

(3)

(2)

Fig.12 Typical level of RF harmonics for an

asymmetrical application.

handbook, halfpage

450 550

14

18

26

30

22

MBE400

650 750 850

RF (MHz)

RF

harmonics

(dBc)

third harmonic

second harmonic

VHF operation

This IC can operate on frequencies as low as 200 MHz
(and especially for VHF 3 band) provided the impedance
of the tuned circuit between pins 4 and 6 is >1 kΩ.

NICAM and stereo

Because of the fact that the ADJUST pin (pin 17) is an
access point to the RF mixer, it is possible to use this pin
to inject an external modulated subcarrier into the IC.

This is especially interesting when it is necessary to
transmit a second frequency modulated audio subcarrier
for stereo sound (f = 5.72 MHz) or a NICAM QPSK
modulated carrier for digital audio transmission
(f = 5.85 or 6.552 MHz).

The incoming signal must be externally modulated either
in FM with the desired signal corresponding to PAL B/G
specification for stereo sound transmission, or in QPSK in
accordance with the NICAM transmission system.

The input impedance on pin 17 is approximately 3500 Ω,
the incoming signal must be capacitive coupled, the
resistor R17 between pin 17 and ground must remain to
adjust the modulation depth, the capacitor C17 between
pin 17 and ground may be changed depending on the
capacitance brought on by the incoming network. If this
capacitance is large, it is possible to remove C17.
Figure 13 shows a possible application for injecting such
kind of signal into the modulator IC.

Following this application, to get a picture-to-second
sound carrier ratio of −20 dB, it is necessary to apply a
level of approximately 800 mV (peak-to-peak value) at
the second carrier input, when the picture-to-first sound
carrier ratio is approximately −13 dB.

In addition, the internal FM sound modulator can be
switched off by short-circuiting pins 2 and 3.

1998 Jun 23 20

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

handbook, full pagewidth

R18

82 Ω

R19

470 Ω

R17

120 kΩ

R21

10 kΩ

R15
75 Ω

R20

470 Ω

RF 75 Ω

PORT

100 nF

C20

VIDEO

SECOND

CARRIER

100 nF

C19

10 pF

C21

C17

100 pF

C16

100 pF

C15

MGC419

20 1819 17 16 15 14

TDA8722

Fig.13 Possible application for a second sound subcarrier.

1998 Jun 23 21

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

PACKAGE OUTLINES

UNIT

A

max.

A

1

A

2

A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1998 Jun 23 22

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

UNIT A1A2A

3

b

p

cD

(1)E(1)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.1501.4

1.2

0.32

0.20

0.20

0.13

6.6

6.4

4.5

4.3

0.65 1.0 0.2

6.6

6.2

0.65

0.45

0.48

0.18

10

0

o

o

0.13 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0.75

0.45

SOT266-1

90-04-05
95-02-25

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

X

(A )

3

A

y

0.25

110

20

11

pin 1 index

0 2.5 5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

A

max.

1.5

1998 Jun 23 23

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

SO
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

SSOP
Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

METHOD (SO AND SSOP)
During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Jun 23 24

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Jun 23 25

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

NOTES

1998 Jun 23 26

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

NOTES

1998 Jun 23 27

Philips Semiconductors Product specification

I2C-bus programmable modulator for
negative video modulation and FM sound

TDA8722

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Printed in The Netherlands 545104/1200/02/pp28 Date of release: 1998 Jun 23 Document order number: 9397 750 03431