Datasheet TDA8722 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8722

2

I

C-bus programmable modulator
for negative video modulation and
FM sound

Objective specification
File under Integrated Circuits, IC02

Philips Semiconductors

1995 Mar 21

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

FEATURES

• Video amplifier with clamp and white clip circuits

• FM sound modulator

• Asymmetrical and symmetrical RF outputs available

• Symmetrical RF oscillator using only a few external

components

• External adjusting of modulation depth and level of the
sound subcarrier

• I2C-bus receiver for frequency setting and test-mode
selection

2

• One I

• On-chip Phase-Locked Loop (PLL) frequency

• On-chip power supply regulator

• Bus switchable oscillator

• On-chip Test Pattern Signal Generator (TPSG).

C programmable output port

synthesizer

GENERAL DESCRIPTION

The TDA8722 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (PAL B/G, I, D/K
and NTSC).

It is especially suited for satellite receivers, video
recorders and cable converters. The video carrier
frequency is set exactly to the correct channel frequency
by a PLL synthesizer which is programmed in accordance
with the I

2

C-bus format.

TDA8722

APPLICATIONS

• Video recorders

• Cable converters

• Satellite receivers.

ORDERING INFORMATION

TYPE

NUMBER

TDA8722T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
TDA8722M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

NAME DESCRIPTION VERSION

PACKAGE

1995 Mar 21 2

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

QUICK REFERENCE DATA

V

DDA=VDDD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

V

DDD

I

DD

∆m typical modulation depth range video level (pin 19) = 0.5 V (p-p);

∆P/S typical picture-to-sound level

V

RF

δf FM deviation on audio

Notes

1. Value depends on value of resistor R17 (see Fig.7).

2. Value depends on value of capacitor C17 (see Fig.7).

=5V; T

=25°C after the IC has reached thermal equilibrium; unless otherwise specified.

amb

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
total supply current normal mode 41 52 63 mA

65 − 90 %

note 1; see Fig.10
note 2; see Fig.11 −18 −−10 dB

range
RF output voltage level

asymmetrical on a 75 Ω load

subcarrier

frequency between

471.25 and 855.25 MHz
= 400 Hz; V1= 0.5 V (RMS);

f

i

before pre-emphasis filter

77 80 83 dBµV

20 25 30 kHz

1995 Mar 21 3

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

BLOCK DIAGRAM

handbook, full pagewidth

AUDIO
SOSCA
SOSCB

SDA

SCL

1
2
3

13

12

VIDEO

19

CLAMP

VIDEO AMP

CLIP

AUDIO

FM MODULATOR

2

I C-BUS

RECEIVER

TDA8722

ADJUST AGNDVDDA

TPSG

10 bits

TPSG on

12-BIT

DIVIDER

(N)

SWITCH

18 2017

VOLTAGE

REGULATOR

balance test

PRESCALER

(8)

RFA RFB

16 15

ASYMMETRICAL

OUTPUT
BUFFER

MIXER

PC

UHF

OSCILLATOR

TDA8722

6

UOSCA

5

OGND

4

UOSCB

P0

14

enable/

select

LOGIC

11

V

DDD DGND

f

DIV

f

ref

31.25 kHz

10

RF oscillator on

PHASE

DETECTOR

enable

DIVIDER

(M = 128)

CHARGE

PUMP

4 MHz

OSCILLATOR

AMP

MBE401

8

CP

7

AMP

9

XTAL

Fig.1 Block diagram.

1995 Mar 21 4

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

PINNING

SYMBOL PIN DESCRIPTION

AUDIO 1 audio input
SOSCA 2 sound oscillator A
SOSCB 3 sound oscillator B
UOSCB 4 UHF oscillator B
OGND 5 RF oscillator ground
UOSCA 6 UHF oscillator A
AMP 7 tuning amplifier output
CP 8 charge pump output
XTAL 9 crystal oscillator
DGND 10 digital ground
V

DDD

SCL 12 serial clock input (I
SDA 13 serial data input (I
P0 14 NPN open-collector output Port
RFB 15 asymmetrical RF output B
RFA 16 asymmetrical RF output A
ADJUST 17 modulation depth and picture-to-sound

AGND 18 analog ground
VIDEO 19 video input
V

DDA

11 digital supply voltage

2

C-bus)

2

C-bus)

distance adjustment pin

20 analog supply voltage

TDA8722

page

AUDIO 
SOSCA VIDEO
SOSCB AGND
UOSCB ADJUST

UOSCA RFB

1
2
3
4
5

OGND RFA

AMP P0

CP

XTAL SCL

DGND

6
7
8
9

10

TDA8722

20
19
18
17
16
15
14
13
12
11

MBE394

Fig.2 Pin configuration.

V

DDA

SDA

V

DDD

FUNCTIONAL DESCRIPTION

The TDA8722 is a programmable modulator which can be
divided into two main blocks:

• A modulator for negative video modulation and
FM sound TV standards

• A programmable PLL frequency synthesizer.

The video part of the modulator consists of a clamping
circuit which sets the internal reference voltage to the
bottom of the synchronizing pulse, followed by a white clip
which avoids over modulation in case the video signal is
too strong. Typically, the IC starts to clip the video signal
when the voltage at the video input (pin 19) is
>560 mV (p-p) while the normal voltage at the video input
is 500 mV (p-p). This clipping function ensures that the
video modulation depth is not too high. The modulation
depth is adjusted in the application between at least
65 and 90% by changing the resistor value between pin 17
and ground (R17). The value can change between 47 kΩ
and infinite (R17 removed); see Fig.10.

1995 Mar 21 5

The video part also contains a test pattern signal generator
to simplify the adjustment of the receiving channel of the
TV set to the required channel of the modulator. The
pattern consists of a synchronization pulse and two
vertical white bars on screen (see Fig.3).

The audio part of the modulator contains an FM sound
modulator. The frequency of the sound subcarrier is set in
the application by external components (C3, L3 and R3).
The difference between the video carrier level and the
sound subcarrier level is adjusted in the application by
changing the value of the capacitor between pin 17 and
ground (C17). The value can change between
0 and 47 pF. The distance between the video carrier and
the sound subcarrier can be adjusted between at least

−10 and −18 dB (see Fig.11).
To bias the audio input it is necessary to put a resistor in

the application between pin 1 and ground. The resistor has
a typical value of 12 kΩ.

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

The RF part of the oscillator consists of:

• An oscillator which operates at the required video carrier
frequency. The range of the oscillator is determined in
the application by C5, C6, L5 and D5.

• An RF mixer. It first combines the video signal and the
sound subcarrier to build a baseband TV channel. Then
the baseband signal is mixed with the oscillator signal to
get the RF TV channel. The mixer has two outputs
which can be used as two independent asymmetrical
outputs, or as one symmetrical output. In the event of
asymmetrical use, the unused output must be loaded
with a 75 Ω resistor (see Fig.7).

The oscillator frequency is set by a programmable PLL
frequency synthesizer in accordance with equation:

f

=8×N×f

osc

Where:

f

is the local oscillator frequency.

osc

N is a 12-bit dividing number (10 bits are programmable
by the I2C-bus).

f

is the crystal frequency (4 MHz) divided by 128

ref

(31.25 kHz).

ref

TDA8722

The circuit allows a step of 250 kHz but because only
10 bits are programmable, the programming steps are
1 MHz.
When the PLL loop is locked, both inputs of the phase
comparator are equal, which gives equation:

f

f

DIV

osc

===

------------­8N×

During the test mode operation, f
monitored on the output Port pin (pin 14).

Software information

The synthesizer is controlled via a two-wire I
receiver. For programming, the address byte (C8 HEX)
has to be sent first. Then one or two data bytes are used
to set the 10 programmable bits of the dividing number N,
the test bits (see Table 1) and the output Port state. Note
that after power-up of the IC, the two data bytes must be
sent.

f

xtal

--------- ­128

f

ref

DIV

and f

can be

ref

2

C-bus

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010203040 50 60

t (µs)

Fig.3 Test pattern signal.

MBE395

64

70

1995 Mar 21 6

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

Table 1 Data format; notes 1 and 2

BYTE

BIT 7

MSB

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1

Address byte C8 1 1001000 ACK
Data byte 1 0 b11 b10 b9 b8 b7 b6 b5 ACK
Data byte 2 1 T0

(3)

T1

(3)

T2

(3)

P0

(4)

b4 b3 b2 ACK

Notes

1. The 10 programmable bits of N are: b2 to b11.

2. Internal hardware sets: b1 = 0 and b0 = 1.

3. T0, T1 and T2 are bits used for test purposes (see Table 5).

4. P0 is a bit used for controlling the state of the output Port (see Table 6).

Table 2 Structure of the dividing number N

(1)

BITS

RESULT

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1

Frequency (MHz)

(3)

512 256 128 64 32 16 8 4 2 1 0.5 0.25

BIT 0

LSB

ACKNOWLEDGE BIT

(2)

b0

(2)

Notes

1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed

internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels.

2. Bits b1 and b0 are not programmable.

3. f

= 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz).

osc

Table 3 Dividing number N for programming channel 21 (471.25 MHz)

BITS

RESULT

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1

(1)

b0

(1)

Value 011101011101

(2)

Frequency (MHz)

025612864016042100.25

Notes

1. Bits b1 and b0 are not programmable.

2. f

=0+256+128+64+0+16+0+4+2+1+0.25 (MHz) = 471.25 MHz.

osc

Table 4 Content of the data bytes to program channel 21 (471.25 MHz)

BYTE

BIT 7

MSB

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1

BIT 0

LSB

ACKNOWLEDGE BIT

Address byte C8 1 1 0 0 1 0 0 0 ACK
Data byte 1 0 0 1 1 1 0 1 0 ACK
Data byte 2 1 0 0 0 0 1 1 1 ACK

1995 Mar 21 7

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB
(0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to
increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1.

The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5.

Table 5 Test modes

T0 T1 T2 OPERATIONAL MODE

0 0 0 normal operation
0 0 1 Test Pattern Signal Generator (TPSG) on; note 1
0 1 0 RF oscillator off; note 2
0 1 1 balance test; note 3
100f
1 0 1 high-impedance test; note 5
110f
1 1 1 phase detector disabled; baseband signals on RF outputs; note 6

Notes

1. In ‘TPSG on’ mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two

vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated
signal to the right frequency.

2. In ‘RF oscillator off’ mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out

of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used.

3. In ‘balance test’, the video carrier is over modulated. This simplifies residual carrier measurements.

4. In ‘f

f

DIV

’ and ‘f

ref

is available on the output Port pin. This mode requires that bit P0 = 0.

’ modes, the reference frequency f

DIV

5. The ‘high-impedance test’ mode may be used to inject an external tuning voltage to the RF tank circuit, to test the

oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is
switched-off. The AMP output (pin 7) is LOW (<200 mV).

6. In the ‘phase detector disabled’ mode, it is possible to measure the leakage current at the input of the tuning amplifier,

on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs
for testing the audio and video parts.

out (if p0 = 0); note 4

ref

out (if p0 = 0); note 4

DIV

ref

in the phase comparator or the divided RF oscillator frequency

The possibilities of bit P0, which controls the output Port
(pin 14) are given in Table 6.

The Port is an NPN open-collector type. For monitoring the
f

or f

ref

frequency on the output Port, the P0 bit must be

DIV

logic 0 to let the output Port free.

1995 Mar 21 8

Table 6 Output Port programming

P0 OUTPUT PORT STATE

0 off; high impedance
1 on; sinking current

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA

V

DDD

V

DD

V

max

T

stg

T

amb

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in
accordance with
Semiconductors Machine Model (MM) 0 Ω, 200 pF (200 V).

THERMAL RESISTANCE

analog supply voltage −0.3 +6 V
digital supply voltage −0.3 +6 V
operating supply voltage 4.5 5.5 V
maximum voltage on all pins −0.3 V

DD

IC storage temperature −40 +125 °C
operating ambient temperature −20 +85 °C

“MIL-STD-883C category B”

(2000 V). Every pin withstands the ESD test in accordance with Philips

V

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SO20; SOT163-1 85 K/W
SSOP20; SOT266-1 120 K/W

1995 Mar 21 9

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

CHARACTERISTICS

V

DDA=VDDD

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

DD

Video characteristics

I

19

z

19

m modulation depth V

∆m modulation depth range V

∆m

APL

V

clip(p-p)

S/N video video signal-to-noise ratio f

G

diff

φ

diff

V/S video-to-sync ratio V

f

video

=5V; T

=25°C; valid over the whole UHF band; measured in circuit of Fig.7;

amb

supply current normal mode 41 52 63 mA

RF off test mode 30 38 46 mA

input current (AC) V19= 3.2 V − 0.5 2.0 µA
video input impedance V19= 3.2 V 30 −−kΩ

= 500 mV (p-p) EBU

19

77 82 87 %
colour bars; R17 = 120 kΩ;
see Fig.7

during clipping condition;

85 − 98 %
note 1

TPSG mode;

72 82 92 %
R17 = 120 kΩ

balance test mode;

110 −−%
R17 = 120 kΩ

= 500 mV (p-p) EBU

19

65 − 90 %
colour bars;
47 kΩ≤R17 ≤∞

variation of modulation depth with
change of APL between 10 and 90%

referenced to the value for
APL = 50%;

−2 − +2 %

V19= 500 mV (p-p)

video input level where clipping starts
(peak-to-peak value)

video level on pin 19;

− 0.56 − V

note 2

< 700 MHz; note 3 48 52 − dB

RF

> 700 MHz; note 3 46 50 − dB

f

RF

differential gain note 4 −8 − +8 %
differential phase note 4 −8 − +8 deg

= 500 mV (p-p);

19

6.9/3.1 7/3 7.1/2.9

V/S = 7/3

frequency response for the video signal note 5 −1 − +1 dB

1995 Mar 21 10

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz)

Z

1

δm modulation deviation f

δm

max

THD total harmonic distortion f

S/N audio audio signal-to-noise ratio note 6 45 50 − dB
f

audio

P/S picture-to-sound ratio no audio signal;

∆P/S picture-to-sound ratio range no audio signal;

audio input impedance 30 −−kΩ

= 400 Hz;

1

20 25 30 kHz
V1= 0.5 V (RMS) before
pre-emphasis filter

maximum modulation deviation f1= 400 Hz;

60 85 − kHz
V1= 2.0 V (RMS) before
pre-emphasis filter

= 1 kHz;

1

− 0.4 1.5 %
V1= 0.5 V (RMS) before
pre-emphasis filter

frequency response of the audio signal note 7 −1 − +1 dB

−16 −13 −10 dB
FM = 5.5 MHz;
C17=15pF

−18 −−10 dB
FM = 5.5 MHz;
0pF≤C17 ≤ 39 pF

Channel characteristics

f

RF

V

RF

RF frequency range using tank circuit of Fig.7 471.25 − 855.25 MHz
output level on RFA and RFB asymmetrical output

77 80 83 dBµV
loaded with 75 Ω;
f = 471.25 to 855.25 MHz

∆V

RF

difference between the level of
modulated carrier and the level of the
unmodulated carrier

measurement is made
during synchronization
pulse for the modulated

012dB

carrier

SPO spurious outside channel note 8 −−62 − dBc
RF

SC

sh

RF second harmonic level on
asymmetrical output

sh

sound carrier second harmonic level fs= 5.5 MHz;

fRF= 471.25 MHz −−30 −25 dBc

= 855.25 MHz −−20 −15 dBc

f

RF

−−65 −60 dBc
C17 = 15 pF;
fRF< 700 MHz

= 5.5 MHz;

f

s

−−63 −58 dBc
C17 = 15 pF;
fRF> 700 MHz

SC

th

sound carrier third harmonic level fs= 5.5 MHz; C17 = 15 pF −−65 −60 dBc
video signal harmonics note 9 −−60 −55 dBc

f

ref

reference frequency spurious fp+ 31.25 kHz −−65 −60 dBc

IM chrominance beat note 10 −−65 −60 dBc

1995 Mar 21 11

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Charge pump output (CP)

I

8

V

7

I

OZ

Amplifier output (AMP)

G amplifier current gain V
V

7sat

Crystal oscillator characteristics (XTAL)

Z

9

Output Port characteristics (P0)

V

OL

I

OZ

I

14(max)

2

C-bus receiver characteristics (SDA and SCL)

I

V

IH

V

IL

I

IH

I

IL

V

o

output current −±100 −µA
output voltage in lock 1.5 − 2.5 V
OFF-state leakage current VCP= 2 V; T0 = 1; T1 = 1;

−−10 nA
T2 = 1

=2V; I

CP

output saturation voltage VCP= 0 V; T0 = 1; T1 = 0;

=10µA − 4000 −

AMP

− 140 200 mV
T2 = 1

oscillator input impedance −−−500 Ω

LOW level output voltage P0 = 1; I14=5mA − 150 400 mV
OFF-state leakage current P0 = 0; VDD= 5.5 V −−10 µA
maximum Port current P0 = 1 −−10 mA

HIGH level input voltage 3 − 5.5 V
LOW level input voltage 0 − 1.5 V
HIGH level input current VIH=5V; VDD=0or5V −−10 µA
LOW level input current VIL=0V; VDD=0or5V −10 −−µA
output voltage on SDA during acknowledge

−−0.4 V
pulse; IIL=3mA

Notes

1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 kΩ
in the application.

2. For application information only.

3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white;
see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz.

4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with
300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V;
see Fig.5.

5. Measured with a spectrum analyzer with ‘peak hold’ function, applying a 500 mV (peak-to-peak value) sine wave at
the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for

1.0 MHz.

6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a
deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19.

7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio
input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz.

1995 Mar 21 12

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (fRF+2fs, 2fRF+fs, etc.). This measurement includes the spurious at
the1⁄4fRF,1⁄2fRF and3⁄4fRF.

9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of
500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF+ 2 MHz, fRF+ 3 MHz, etc.

10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency
of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7.

handbook, full pagewidth

1 V

0.3 V

MBE396

0 V

handbook, full pagewidth

1 V

0.3 V

0 V

010203040 50 60

t (µs)

Fig.4 CCIR insertion line N.17.

010203040 50 60

t (µs)

64

64

70

MBE397

70

Fig.5 CCIR insertion line N.330.

1995 Mar 21 13

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

AUDIO

SOSCA

SOSCB

1

2

3

VOLTAGE

REGULATOR

20

19

18

TDA8722

V

DDA

VIDEO

AGND

AMP

CP

4

5

6

7

8

9

10

UOSCB

OGND

UOSCA

XTAL

DGND

ESD protection components are not shown in the diagram.

17

16

15

14

13

12

11

MBE402

ADJUST

RFA

RFB

P0

SDA

SCL

V

DDD

Fig.6 Pin equivalent circuit for each pin.

1995 Mar 21 14

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

APPLICATION INFORMATION

C3

56 pF

R3

15 kΩ

(3)

L3

15 µH

K2

(4)

RF

75 Ω

15 pF

C17

R15

75 Ω

100 pF

R17

120 kΩ

C16

TDA8722

(2)

L5

33 pF 33 pF

C5 C6

D5

BB215

R5

22 kΩ

10 nF

C7

handbook, full pagewidth

VIDEO

AUDIO

R4

220 Ω

R20

470 Ω

R18

82 Ω

100 nF

C19

R19

470 Ω

100 nF
C20

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

(1)

K1

C1

220 pF

R1

220 kΩ

R2

12 kΩ

R6

22 kΩ

100 pF

C15

R7

12 kΩ

T8

150 nF

C8

R8

12 kΩ

22 kΩ

BC547B

R9

1 kΩ

R14

Q9

10 nF

C11

C30

10 nF 2.2 µF

4 MHz

27 pF
C9

C31

MBE403

TDA8722

PORT

SCL
SDA

33 V
5 V

C21

2.2 µF

GND

(1) K1: switches the pre-emphasis filter on or off.
(2) L5: air coil; 1.5 turns; diameter of 2 mm.
(3) L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G).
(4) K2: Switches the FM sound oscillator on or off.

Fig.7 Reference measuring set-up.

1995 Mar 21 15

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

Application design

handbook, full pagewidth

VIDEO

82 Ω

AUDIO

R20

470 Ω

R18

100 nF

C19

R19

470 Ω

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

C1

220 pF

R1

220 kΩ

R2

12 kΩ

100 nF
C20

RF

75 Ω

C3

56 pF

R3

15 kΩ

L3

15 µH

100 kΩ

RV1

15 pF

C17

R15

75 Ω

82 kΩ

(1)

R17

TDA8722

L5

33 pF 33 pF

C5 C6

D5

BB215

R5

22 kΩ

10 nF

100 pF

C7

C16

R6

22 kΩ

100 pF

C15

R7

12 kΩ

T8

150 nF

C8

R8

12 kΩ

22 kΩ

BC547B

R9

10 nF

C11

C30

10 nF

TDA8722

Q9

4 MHz

27 pF
C9

MBE405

PORT
SCL
SDA

5 V

33 V

GND

(1) RV1 allows fine adjustment of the modulation depth between 70 and 90%.

Fig.8 Application using an asymmetrical output.

1995 Mar 21 16

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

100 nF
C20

RF

75 Ω

C3

56 pF

R3

15 kΩ

L3

15 µH

120 kΩ

C17

15 pF

33 pF 33 pF

C5 C6

22 kΩ

64

1

R17

100 pF

C16

R15

300 Ω

TDA8722

L5

D5

BB215

R5

10 nF

C7

TR1

23

22 kΩ

handbook, full pagewidth

VIDEO

AUDIO

R20

470 Ω

R18
82 Ω

100 nF

C19

R19

470 Ω

20 1819 17 16 15 14 13 12 11

12 3 4 56 78 910

C1

220 pF

R1

220 kΩ

R2

12 kΩ

100 pF

R6

R7

12 kΩ

TOKO - B4F

617DB - 1010

C15

150 nF

T8

C8

R8

12 kΩ

22 kΩ

BC547B

R9

10 nF
C11

C30

10 nF

TDA8722

Q9

4 MHz

27 pF
C9

MBE404

PORT
SCL
SDA
5 V

33 V

GND

Fig.9 Application using a symmetrical output with a balun transformer.

In the design of the application, it is highly recommended
to separate the part of the RF oscillator as much as
possible from the part of the RF outputs in order to avoid
parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid
radiation from and to this part. The pin 5 (OGND) must be
connected to the shielding box and to ground.

RF outputs

For inexpensive applications, it is possible to use the IC
with an asymmetrical output (pins 15 or 16). In this event,
the unused output pin must be loaded with a load as

1995 Mar 21 17

similar as possible to the load connected to the used pin,
see Fig.8.

A good improvement in performance is obtained using a
1 : 4 symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the two
outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced (see Fig.9).

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

Modulation depth

With 500 mV (peak-to-peak value) video input signal, the
wanted modulation depth must be set by the value of R17
(resistor between pin 17 and ground) as shown Fig.10. For
a good accuracy, it is recommended to use a 1% type
resistor.

It is also possible to use an adjustable resistor, see Fig.8.
Depending on the layout of the PCB, it may be necessary

to slightly change the value of R17 from the one given in
Fig.10 to get the wanted modulation depth.

Sound oscillator design

The frequency of the sound subcarrier is fixed by the tank
circuit connected between pins 2 and 3. This frequency
can be adjusted between 4.5 and 6.5 MHz covering all
existing standards in the world.

The damping resistor R3 between pins 2 and 3 is
necessary to decrease the quality factor of the tank circuit
allowing the frequency to be modulated by the audio
signal. The value of this resistor is calculated for several
Q factor ranges of the coil for a sound frequency of

5.5 MHz (see Table 7).

TDA8722

Table 7 Value of resistor for several Q factor ranges

COIL QUALITY

FACTOR

30 to 40 82 to 33
40 to 50 33 to 27
50 to 60 27 to 22
60 to 80 22 to 18

80 to >100 18 to 15

The use of a coil with a quality factor <30 may result in a
non operating oscillator. For safety, it is recommended to
use a coil with a quality factor ≥50.

Picture-to-sound ratio

The picture-to-sound ratio can be adjusted in the
application by changing the value of C17 (capacitor
between pin 17 and ground); see Fig.11.

Figure 11 shows us that the picture-to-sound ratio will
change for a constant value of C17 when the sound
subcarrier frequency will change.

RF harmonics

PROPOSED VALUE FOR R3

(kΩ)

100

handbook, halfpage

modulation

depth

(%)

90

80

70

60

10

2

10

R17 (kΩ)

MBE398

10

Fig.10 Typical modulation depth as a function of

the value of R17.

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

The level of the second and third RF harmonic is shown in
Fig.12 for an asymmetrical application. This chart gives a
typical value while the level of these harmonics can vary
depending on the design of the application.

It is possible to reduce the level of the second harmonic by
using a wide band transformer at the output of the IC and
create a symmetrical application (see Fig.9).

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

3

1995 Mar 21 18

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

30

MBE399

C17 (pF)

handbook, halfpage

8

P/S
(dB)

12

16

20

01020 40

R17 = 120 kΩ.
(1) 4.5 MHz.
(2) 5.5 MHz.
(3) 6.0 MHz.
(4) 6.5 MHz.

(1)
(2)
(3)
(4)

14

handbook, halfpage

RF

harmonics

(dBc)

18

22

26

30

450 550

third harmonic

second harmonic

650 750 850

TDA8722

MBE400

RF (MHz)

Fig.11 Typical picture-to-sound ratio as a function

of the value of C17.

VHF operation

This IC can operate on frequencies as low as 200 MHz
(and especially for VHF 3 band) provided the impedance
of the tuned circuit between pins 4 and 6 is >1 kΩ.

NICAM and stereo

Because of the fact that the ADJUST pin (pin 17) is an
access point to the RF mixer, it is possible to use this pin
to inject an external modulated subcarrier into the IC.

This is especially interesting when it is necessary to
transmit a second frequency modulated audio subcarrier
for stereo sound (f = 5.72 MHz) or a NICAM QPSK
modulated carrier for digital audio transmission
(f = 5.85 or 6.552 MHz).

The incoming signal must be externally modulated either
in FM with the desired signal corresponding to PAL B/G
specification for stereo sound transmission, or in QPSK in
accordance with the NICAM transmission system.

Fig.12 Typical level of RF harmonics for an

asymmetrical application.

The input impedance on pin 17 is approximately 3500 Ω,
the incoming signal must be capacitive coupled, the
resistor R17 between pin 17 and ground must remain to
adjust the modulation depth, the capacitor C17 between
pin 17 and ground may be changed depending on the
capacitance brought on by the incoming network. If this
capacitance is large, it is possible to remove C17.
Figure 13 shows a possible application for injecting such
kind of signal into the modulator IC.

Following this application, to get a picture-to-second
sound carrier ratio of −20 dB, it is necessary to apply a
level of approximately 800 mV (peak-to-peak value) at the
second carrier input, when the picture-to-first sound carrier
ratio is approximately −13 dB.

In addition, the internal FM sound modulator can be
switched off by short-circuiting pins 2 and 3.

1995 Mar 21 19

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

RF 75 Ω

handbook, full pagewidth

SECOND

CARRIER

VIDEO

R21

10 kΩ

R20

470 Ω

R18

82 Ω

10 pF

C21

100 nF

C19

R19

470 Ω

100 nF

C20

20 1819 17 16 15 14

R15

75 Ω

R17

120 kΩ

C17

100 pF

C16

TDA8722

TDA8722

100 pF

C15

PORT

MGC419

Fig.13 Possible application for a second sound subcarrier.

1995 Mar 21 20

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

PACKAGE OUTLINES

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

11

TDA8722

SOT163-1

E

H

E

A

X

v

M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

0.49

0.36

p

cD

0.32

0.23

0.013

0.009

3

0.019

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

10

w

b

p

13.0

12.6

0.51

0.49

M

scale

(1)E(1) (1)

0.30

0.29

eHELLpQ

7.6

1.27

7.4

0.050

10.65

10.00

0.42

0.39

Q

A

2

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

1.1

1.0

0.043

0.039

(A )

L

p

L

0.25

0.01

A

3

θ

0.25 0.1

0.01

ywv θ

Z

0.9

0.4

8

0.004

0.035

0.016

0

o
o

OUTLINE
VERSION

SOT163-1

IEC JEDEC EIAJ

075E04 MS-013AC

REFERENCES

1995 Mar 21 21

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-01-24

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

20

D

c

y

Z

11

E

H

E

TDA8722

SOT266-1

A

X

v

M

A

pin 1 index

110

w

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.5

0.1501.4

1.2

0.25

b

3

p

0.32

0.20

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

0.13

M

0 2.5 5 mm

scale

(1)E(1)

6.6

6.4

eHELLpQZywv θ

4.5

0.65 1.0 0.2

4.3

6.6

6.2

Q

A

2

A

1

detail X

0.65

0.75

0.45

0.45

(A )

L

p

L

A

3

θ

0.13 0.1

0.48

0.18

(1)

o

10

o

0

OUTLINE

VERSION

SOT266-1

IEC JEDEC EIAJ

REFERENCES

1995 Mar 21 22

EUROPEAN

PROJECTION

ISSUE DATE

90-04-05
95-02-25

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

SOLDERING
Plastic small outline packages

YWAVE

B
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

Y SOLDER PASTE REFLOW

B

TDA8722

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

R

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

-HEATED SOLDER TOOL)

Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

1995 Mar 21 23

Philips Semiconductors Objective specification

I2C-bus programmable modulator for

TDA8722

negative video modulation and FM sound

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1995 Mar 21 24

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

NOTES

TDA8722

1995 Mar 21 25

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

NOTES

TDA8722

1995 Mar 21 26

Philips Semiconductors Objective specification

I2C-bus programmable modulator for
negative video modulation and FM sound

NOTES

TDA8722

1995 Mar 21 27

Philips Semiconductors – a worldwide company

Philips Semiconductors – a worldwide company

Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)

Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)

BUENOS AIRES, Tel. [phone], Fax. [phone]

BUENOS AIRES, Tel. [phone], Fax. [phone]

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,

Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,

Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Brazil: Rua do Rocio 220 - 5

Brazil: Rua do Rocio 220 - 5

CEP: 04552-903-SÃO PAULO-SP, Brazil.

CEP: 04552-903-SÃO PAULO-SP, Brazil.
P.O. Box 7383 (01064-970).

P.O. Box 7383 (01064-970).
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Chile: Av. Santa Maria 0760, SANTIAGO,

Chile: Av. Santa Maria 0760, SANTIAGO,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,

Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,

77621 BOGOTA, Tel. [phone],

77621 BOGOTA, Tel. [phone],
Fax. [phone]

Fax. [phone]

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Germany: P.O. Box 10 63 23, 20043 HAMBURG,

Germany: P.O. Box 10 63 23, 20043 HAMBURG,

Tel. [phone], Fax. [phone].

Tel. [phone], Fax. [phone].

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

Tel. [phone] 911, Fax. [phone]

Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg.,

Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg.,

24-28 Kung Yip St., KWAI CHUNG, N.T.,

24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. [phone], Fax. [phone] 6009

Tel. [phone], Fax. [phone] 6009

India: Philips INDIA Ltd, Shivsagar Estate, A Block ,

India: Philips INDIA Ltd, Shivsagar Estate, A Block ,

Dr. Annie Besant Rd. Worli, Bombay 400 018

Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Piazza IV Novembre 3, 20124 MILANO,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Korea: (Republic of) Philips House, 260-199 Itaewon-dong,

Korea: (Republic of) Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

th

th

floor, Suite 51,

floor, Suite 51,

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],

KARACHI 75600, Tel. [phone],
Fax. [phone].

Fax. [phone].

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,

Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone].

Tel. [phone], Fax. [phone].

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd.,

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,

P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone].

Tel. [phone], Fax. [phone].

Spain: Balmes 22, 08007 BARCELONA,

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone].

TAIPEI 100, Tel. [phone], Fax. [phone].

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,

Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone].

Tel. [phone], Fax. [phone].

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

United States:811 East Arques Avenue, SUNNYVALE,

United States:811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,

International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,

P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

Telex 35000 phtcnl, Fax. [phone]
SCD38 © Philips Electronics N.V. 1995

SCD38 © Philips Electronics N.V. 1995

All rights are reserved. Reproduction in whole or in part is prohibited without the

All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.

prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation

The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without

or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its

notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or

use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.

other industrial or intellectual property rights.

Printed in The Netherlands

533061/1500/01/pp28 Date of release: 1995 Mar 21
Document order number: 9397 750 00046

Philips Semiconductors

Philips Semiconductors