Datasheet TDA8718X-C1, TDA8718K-C1-R1, TDA8718K-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02

June 1994

INTEGRATED CIRCUITS

Philips Semiconductors

TDA8718

8-bit high-speed analog-to-digital
converter

June 1994 2

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

FEATURES

• 8-bit resolution

• Sampling rate up to 600 MHz

• ECL (100K family) compatible for digital inputs and

outputs

• Overflow/Underflow output

• 50 Ω load drive capability

• Low input capacitance (5 pF typ.).

APPLICATIONS

• High speed analog-to-digital conversion

• Industrial instrumentation

• Data communication

• RF communication.

GENERAL DESCRIPTION

The TDA8718 is an 8-bit analog-to-digital converter (ADC)
designed for professional applications. The device
converts the analog input signal into 8-bit binary coded
digital words at a sampling rate of 600 MHz. It has an
effective bandwidth capability up to 150 MHz full-scale
sine wave. All digital outputs are ECL compatible.

QUICK REFERENCE DATA

Measured over full voltage and temperature ranges, unless otherwise specified.

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

EEA

analog supply voltage −4.2 −4.5 −4.8 V

V

EED

digital supply voltage −4.2 −4.5 −4.8 V

I

ref

resistive ladder current R = 48 Ω 30 45 60 mA

I

EEA

analog supply current 30 42 54 mA

I

EED

digital supply current 100 120 150 mA

I

EEO(L)

LOW level output supply current RL = 50 Ω 40 70 90 mA

I

EEO(H)

HIGH level output supply current RL = 50 Ω 155 170 185 mA
ILE DC integral linearity error −±0.7 ±1.0 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB
EB effective bits f

i

= 4.43 MHz; I

ref

= 45 mA;

f

clk

= 100 MHz

− 7.5 − bits

f

i

= 4.43 MHz; I

ref

= 45 mA;

f

clk

= 100 MHz

− 6.5 − bits

f

clk(max)

maximum clock frequency 600 −−MHz
P

tot

total power dissipation − 990 1250 mW

TYPE NUMBER

PACKAGE

PINS PIN POSITION MATERIAL CODE

TDA8718K 28 PLCC28 plastic SOT261-2

June 1994 3

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

1

3

5

V

RB

V

I

21

2389

CLK CLK

V

EED

28

V

EEA

16

15

13

17 D2

D3

D4

D5

D6

19
20

10

D1
D0

D7

ECL OUTPUTS

CLOCK DRIVER

TDA8718

analog

voltage input

clock inputs

underflow

output

data outputs

LSB

MSB

14

ANALOG SIGNAL

PROCESSING

RESISTOR

LADDER

&

INPUT

AND

OUTPUT

LATCHES

&

DIGITAL

DECODING

MBB854 - 2

24
DGND

27
AGND

analog ground digital ground

V

BB

UF

OGND2

OF

overflow

output

output
ground

analog negative

supply voltage

digital negative

supply voltage

32

8

8

V

RT

VRM2

reference

voltage middle

reference

voltage TOP

reference

voltage BOTTOM

11

6

18

Ω

Ω

Ω

12

OGND1

June 1994 4

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

PINNING

SYMB

OL

PIN DESCRIPTION

V

RB

1 reference voltage BOTTOM

V

RM

2 reference voltage MIDDLE decoupling

V

I

3 analog input voltage
n.c. 4 not connected
V

RT

5 reference voltage TOP
OF 6 overflow digital output
n.c. 7 not connected
CLK 8 clock input
CLK 9 complementary clock input
D7 10 digital output; bit 7 (MSB)
V

BB

11 ECL reference voltage
OGND1 12 output ground 1 (0 V)
D6 13 digital output; bit 6
D5 14 digital output; bit 5
D4 15 digital output; bit 4
D3 16 digital output; bit 3
D2 17 digital output; bit 2
OGND2 18 output ground 2 (0 V)
D1 19 digital output; bit 1
D0 20 digital output; bit 0 (LSB)
UF 21 underflow digital output
n.c. 22 not connected
V

EED

23 digital supply voltage (−4.5 V)
DGND 24 digital ground
n.c. 25 not connected
n.c. 26 not connected
AGND 27 analog ground
V

EEA

28 analog supply voltage (−4.5 V)

Fig.2 Pin configuration.

handbook, halfpage

5
6
7
8

9
10
11

25
24
23
22
21
20
19

12

13

14

15

16

17

18

4

3

2

1

28

27

26

TDA8718

V

RT
OF

n.c.

CLK

D7

V

BB

OGND1

D6

D5D4D3

D2

OGND2

D1

D0

UF

n.c.

V

EED

DGND

n.c.

n.c.

AGND

V

EEA

V

RB

RM

V

n.c.

CLK

MBB850 - 2

V

I

June 1994 5

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The circuit has two clock inputs CLK and

CLK. Sampling takes place on the falling edge of the clock input signal;

CLK and CLK are two complementary signals.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

EEA

analog supply voltage (pin 28) −7.0 +0.3 V

V

EED

digital supply voltage (pin 23) −7.0 +0.3 V

∆V

EE

supply voltage difference between V

EEA

and V

EED

−1.00 +1.0 V

V

I

input voltage (pin 3) referenced to AGND V

EEA

0V

∆V

clk(p-p)

clock input voltage difference between
CLK and CLK pin 8 to pin 9
(peak-to-peak value)

referenced to V

EED

;

note 1

− 2.0 V

I

O

output current for each digital output − 30 mA

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature 0 +70 °C

T

j

junction temperature − +150 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 55 K/W

Fig.3 Average effect of air flow on R

th j-a

.

Test conditions: PCB (2.24 ×2.24 ×0.062 inches).
LFPM = Linear Foot Per Minute.

handbook, halfpage

0 1000

0

50

40

MBB851

30

20

10

200 400 600 800

airflow (LFPM)

R

th j-a

(%)

∆

June 1994 6

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

CHARACTERISTICS

V

EEA

= −4.2 to −4.8 V; V

EED

= −4.2 to −4.8 V; V

EEA

to V

EED

= −0.1 to +0.1 V; AGND and DGND shorted together;

T

amb

= 0 to +70 °C; typical values measured at V

EEA

= −4.5 V, V

EED

= −4.5 V and T

amb

= 25 °C;

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

EEA

analog supply voltage (pin 28) −4.2 −4.5 −4.8 V

V

EED

digital supply voltage (pin 23) −4.2 −4.5 −4.8 V

I

EEA

analog supply current (pin 28) 30 42 54 mA

I

EED

digital supply current (pin 23) 100 120 150 mA

I

EEO(L)

LOW level output supply current RL = 50 Ω 40 70 90 mA

I

EEO(H)

HIGH level output supply current RL = 50 Ω 155 170 185 mA

Reference voltages for the resistor ladder (see Table 1)

I

RT

reference current (pin 5) R = 48 Ω 30 45 60 mA

V

RB

reference voltage BOTTOM (pin 1) − 48 Ω× IRT− V

V

RT

reference voltage TOP (pin 5) − 0 − V

R

LAD

resistor ladder − 48 −Ω

TC

RLAD

temperature coefficient of the
resistor ladder

− 175 − MΩ/K

V

osB

voltage offset BOTTOM note 1 − 8 Ω×IRT− mV

V

osT

voltage offset TOP note 1 − 8 Ω×IRT− mV

Inputs

CLK

INPUT (PIN 8); CLK INPUT (PIN 9)

V

IL

LOW level input voltage −−1.8 − V

V

IH

HIGH level input voltage −−0.8 − V

I

IL

LOW level input current V

clk

= −1.8 V − 0 −µA

I

IH

HIGH level input current V

clk

= −0.8 V − 120 −µA

R

I

input resistance f

clk

= 100 MHz − 1.5 − kΩ

C

I

input capacitance f

clk

= 100 MHz − 3.5 − pF

∆V

clk(p-p)

clock input voltage difference
between CLK and CLK pin 8 to
pin 9 (peak-to-peak value)

− 900 − mV

ANALOG INPUT (PIN 3); NOTE 2
I

IL

LOW level input current data output = 00 20 40 80 µA

I

IH

HIGH level input current data output = FF 100 200 400 µA

R

I

input resistance − 10 − kΩ

C

I

input capacitance − 5 − pF

June 1994 7

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

Outputs (RL = 50 Ω)

D

IGITAL 100K ECL OUTPUTS (D0 TO D7; OF; UF)

V

OL

LOW level output voltage Tamb = 25 °C −−1770 −1650 mV

V

OH

HIGH level output voltage Tamb = 25 °C −1300 −1150 − mV

V

ECL

ECL reference voltage −1550 −1450 −1350 mV

I

OL

LOW level output current 4 6 8 mA

I

OH

HIGH level output current 10 20 25 mA

Switching characteristics

f

clk(max)

maximum clock frequency
(pins 8 and 9)

600 −−MHz

t

r

; t

f

rise and fall times fi = 100 MHz −− 750 ps

Analog signal processing (f

clk

= 500 MHz)

H

ARMONICS (FULL SCALE)

h

1

fundamental harmonics fi = 100 MHz − 0 − dB

h

2

second harmonics fi = 100 MHz −−54 − dB

h

3

third harmonics fi = 100 MHz −−50 − dB

Transfer function

ILE DC integral linearity error −±0.7 ±1.0 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB
AILE AC integral linearity error note 3 −±0.9 ±1.5 LSB
EB effective bits f

i

= 4.43 MHz, full scale;

I

ref

= 45 mA; note 4;

f

clk

= 100 MHz; Fig.5

− 7.5 − bits

f

i

= 100 MHz, full scale;

I

ref

= 45 mA; note 4;

f

clk

= 500 MHz; Fig.6

− 6.5 − bits

BER bit error rate f

clk

= 500 MHz;
fi= 100 MHz;
Vi= ±8 LSB at code
128; 50% clock duty
cycle

− 10

−11

− times/

samples

Timing (f

clk

= 500 MHz; RL = 50 Ω; CL = 5 pF) note 5

t

ds

sampling delay −− 300 ps

t

h

output hold time 400 700 − ps

t

d

output delay time − 1300 1500 ps

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

June 1994 8

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

Notes to the “Characteristics”

1. Voltage offset BOTTOM (V

osB

) is the difference between the analog input which produces data outputs equal to 00

and the reference voltage BOTTOM (VRB) at T

amb

= 25 °C. Voltage offset TOP (V

osT

) is the difference between

reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at T

amb

=25°C.

2. The analog input is not internally biased. It should be externally biased between VRT and VRB levels.

3. Full-scale sine wave; fi = 4.43 MHz; f

clk

= 100 MHz.

4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).

Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.

5. TDA8718 can only withstand one or two 100K ECL loads in order to work out timings at the maximum sampling
frequency. It is recommended to minimize the printed circuit-board load by implementing the load device as close as
possible to the TDA8718.

Table 1 Output coding and input voltage (typical values; referenced to AGND.

STEP V

I

O/UF

BINARY OUTPUT BITS

D5 D4 D3 D2 D1 D0

Underflow <−40 Ω×I

RT

1000000

0 −40 Ω×I

RT

0000000
1 . 0000001

. . .. ....

. . .......

. . .......

254 . 0111110
255 −8 Ω×I

RT

0111111
Overflow >−8Ω×I

RT

1111111

Fig.4 Timing diagram.

handbook, full pagewidth

sample N + 1

sample N

CLK

MSA666

sample N + 2

50 %

DATA
OF/UF

t

ds

t

h

50 %

DATA
N + 1

DATA

N

DATA

N - 1

DATA

N - 2

V

I

June 1994 9

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

Fig.5 Fast Fourier Transform (f

clk

= 100 MHz; fi= 4.43 MHz).

Effective bits: 7.53; THD = −54.56dB.
Harmonic levels (dB): 2nd =−77.28; 3rd = −54.76; 4th = −71.43; 5th = −71.85; 6th = −105.50.

handbook, full pagewidth

18.8

0

120

0 6.27 12.5

MBD879

40

80

43.925.1 31.3 37.6 50.2
f (MHz)

100

20

60

amplitude

(dB)

Fig.6 Fast Fourier Transform (f

clk

= 500 MHz; fi= 100 MHz).

Effective bits: 6.60; THD = −48.60 dB.
Harmonic levels (dB): 2nd = −64.81; 3rd = −51.10; 4th = −65.05; 5th = −58.33; 6th = −54.07.

handbook, full pagewidth

93.5

0

120

0 31.2 62.4

MBD880

40

80

218.0125.0 156.0 187.0 249.0
f (MHz)

100

20

60

amplitude

(dB)

June 1994 10

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

APPLICATION INFORMATION

Fig.7 Application diagram.

handbook, full pagewidth

MBB852 - 2

TDA8718

V

RT

OF

n.c.

CLK

D7

V

BB

OGND1

D6 D5 D4 D3 D2 OGND2

D1

D0

UF

n.c.

V

EED

DGND

n.c.

AGND

V

EEA

V

RB

RM

V

n.c.

CLK

22
nF

22
nF

22
nF

22

nF

4321

28

27 26

11

10

9

8

7

6

5

19

20

21

22

23

24

25

12 13 14 15

16

17 18

–2 V

n.c.

22 nF

22 nF

V

I

June 1994 11

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

PACKAGE OUTLINE

Fig.8 Plastic leaded chip carrier, 28-leads; SOT261-2.

Dimensions in mm.

handbook, full pagewidth

0.81
max

19

25

28

1

A

4

5

11

1826

12

1.22

1.07

0.51
max

(3x)

MBC654

detail A

0.32
max

0.51 min

3.04
max

4.57
max

11.58

11.43

12.57

12.32

seating plane

0.10 S

0.53
max

0.18 M

1.27

(24 x)

S

12.57

12.32

11.58

11.43

2.16
max

1.14

0.64

R

10.92

9.91

45

o

June 1994 12

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

SOLDERING
Plastic leaded chip carriers

B

YWAVE

During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

B

Y SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

R

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between
270 and 320 °C. (Pulse-heated soldering is not
recommended for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

June 1994 13

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

NOTES

June 1994 14

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

NOTES

June 1994 15

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8718

NOTES

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Uruguay: Coronel Mora 433, MONTEVIDEO,

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International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCD31 © Philips Electronics N.V. 1994

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533061/1500/04/pp16 Date of release: June 1994
Document order number: 9397 734 40011