Datasheet TDA8716T-C1, TDA8716-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02

1996 Aug 26

INTEGRATED CIRCUITS

TDA8716

8-bit high-speed analog-to-digital
converter

1996 Aug 26 2

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital
converter

TDA8716

FEATURES

• 8-bit resolution

• Sampling rate up to 120 MHz

• ECL (10 K family) compatible digital inputs and outputs

• Overflow/Underflow output

• Low power dissipation

• Low input capacitance (13 pF typ.).

APPLICATIONS

• High speed analog-to-digital convertion

• Video signal digitizing

• Radar pulse analysis

• Transient signal analysis

• High energy physics research

• Medical systems

• Industrial instrumentation.

GENERAL DESCRIPTION

The TDA8716 is an 8-bit high-speed Analog-to-Digital
Converter (ADC) designed for HDTV and professional
applications. The device converts the analog input signal
into 8-bit binary coded digital words at a sampling rate of
120 MHz. All digital outputs are ECL compatible.

QUICK REFERENCE DATA

Measured over full voltage and temperature ranges, unless otherwise specified.

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

EEA

analog supply voltage −5.45 −5.2 −4.95 V

V

EED

digital supply voltage −5.45 −5.2 −4.95 V

I

EEA

analog supply current − 50 55 mA

I

EED

digital supply current − 100 110 mA

I

EEO

output supply current RL = 2.2 kΩ−20 25 mA

V

RB

reference voltage BOTTOM −−3.130 − V

V

RT

reference voltage TOP −−1.870 − V
ILE DC integral linearity error see Fig.8 −±0.5 ±1 LSB
DLE DC differential linearity error see Fig.9 −±0.25 ±0.45 LSB
EB effective bit f

i

= 20 MHz;

f

CLK

= 100 MHz

− 7 − bits

f

CLK

maximum clock frequency 120 −−MHz
P

tot

total power dissipation excluding load − 780 900 mW

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8716 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1

TDA8716T SO32L plastic small outline package; 32 leads; body width 7.5 mm SOT287-1

1996 Aug 26 3

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

BLOCK DIAGRAM

Fig.1 Block diagram; TDA8716.

handbook, full pagewidth

TDA8716

OUTPUT LATCHES

DIGITAL PROCESSING

LATCHES

CLOCK

BUFFER

MSB ANALOG
PROCESSING

LSB ANALOG
PROCESSING

folding and interpolation

SAMPLE LATCHES

LSB BINARY

ENCODER

MSB BINARY

ENCODER

ECL BUFFERS

63

14 15 16 17 18 20 21 22 23

digital outputs

D0 to D7

IN range

MCD265 - 2

1

2

CLK input

CLKinput

analog input

7
11

5



13
24

3

12

4

19

analog ground

digital ground

analog negative
supply voltage
(– 5.2 V)

output ground
supply voltage
(0 V)

digital negative
supply voltage
(– 5.2 V)

two's complement
output select

10
9
6

8



voltage

reference top

voltage

reference middle

voltage

reference bottom

1996 Aug 26 4

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

PINNING TDA8716

SYMBOL PIN DESCRIPTION

CLK 1 complementary clock input
CLK 2 clock input
V

EED1

3 digital negative supply voltage

(−5.2 V)

C

PLT2

4 two's complement output select

(active HIGH)

V

EEA

5 analog negative supply voltage

(−5.2 V)

V

RB

6 reference voltage BOTTOM
AGND1 7 analog ground 1
V

I

8 analog input
V

RM

9 reference voltage MIDDLE

decoupling

V

RT

10 reference voltage TOP
AGND2 11 analog ground 2
V

EED2

12 digital negative supply voltage

(−5.2 V)
DGND1 13 digital ground 1
D0 14 digital output (LSB)
D1 15 digital output
D2 16 digital output
D3 17 digital output
D4 18 digital output
OGND 19 output ground supply voltage (0 V)
D5 20 digital output
D6 21 digital output
D7 22 digital output (MSB)
IR 23 IN range
DGND2 24 digital ground 2

Fig.2 Pin configuration; TDA8716.

handbook, halfpage

1
2
3
4
5
6
7
8

9
10
11
12

24
23
22
21
20
19
18
17
16
15
14
13

MCD259

CLK

V

EED1

C

PLT2

AGND1

V

I

EEA

V

AGND2

RM

V

RT

V

RB

V

CLK

DGND2
IR
D7

DGND1

D6
D5

D4
D3
D2
D1
D0

TDA8716

EED2

V

OGND

1996 Aug 26 5

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

PINNING TDA8716T

SYMBOL PIN DESCRIPTION

CLK 1 complementary clock input
CLK 2 clock input
V

EED1

3 digital negative supply voltage

(−5.2 V)
n.c. 4 not connected
n.c. 5 not connected
C

PLT2

6 two's complement output select

(active HIGH)
V

EEA

7 analog negative supply voltage

(−5.2 V)
V

RB

8 reference voltage BOTTOM
AGND1 9 analog ground 1
V

I

10 analog input

V

RM

11 reference voltage MIDDLE

decoupling
n.c. 12 not connected
n.c. 13 not connected
V

RT

14 reference voltage TOP
AGND2 15 analog ground 2
V

EED2

16 digital negative supply voltage

(−5.2 V)
DGND1 17 digital ground 1
D0 18 digital output (LSB)
D1 19 digital output
n.c. 20 not connected
n.c. 21 not connected
D2 22 digital output
D3 23 digital output
D4 24 digital output
OGND 25 output ground supply voltage (0 V)
D5 26 digital output
D6 27 digital output
n.c. 28 not connected
n.c. 29 not connected
D7 30 digital output (MSB)
IR 31 IN range
DGND2 32 digital ground 2

Fig.3 Pin configuration; TDA8716T.

handbook, halfpage

1
2
3
4
5
6
7
8

9
10
11
12

13
14
15
16

32
31
30
29
28
27

17

18

19

20

21

22

23

24

25

26

TDA8716T

MBC742 - 2

V

EED2

AGND2

V

RT

n.c.

n.c.

RM

V

V

I

AGND1

V

RB

V

EEA

C

PLT2

n.c.

EED1

V

CLK

CLK

DGND1

D0

D1

n.c.

n.c.

D2

D3

D4

OGND

D5

D6

n.c.

n.c.

D7

IR

DGND2

n.c.

1996 Aug 26 6

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The circuit has two clock inputs: CLK and

CLK. Sampling takes place on the rising edge of the clock input signal:

CLK and CLK are two's complementary ECL signals.

THERMAL CHARACTERISTICS

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

EEA

analog supply voltage −7.0 +0.3 V

V

EED1,VEED2

digital supply voltage −7.0 +0.3 V

V

EEA

− V

EED1

;

V

EEA

− V

EED2

supply voltage differences −1+1V

V

I

input voltage referenced to

AGND

V

EEA

0V

V

CLK; CLK(p-p)

input voltage for differential clock drive
(peak-to-peak value)

note 1 − 2.0 V

I

O

output current (each output stage) − 10 mA

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature 0 +70 °C

T

j

junction temperature − +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th j-a

from junction to ambient in free air

SOT101 35 K/W
SOT287 (see Fig.4) 65 K/W

1996 Aug 26 7

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

CHARACTERISTICS

V

EEA

= −4.95 to −5.45 V; V

EED1

, V

EED2

= −4.95 to −5.45 V; AGND, DGND and OGND shorted together;

T

amb

= 0 to +70 °C; unless otherwise specified. (Typical values taken at V

EEA

= −5.2 V; V

EED1

, V

EED2

= −5.2 V;

T

amb

=25°C).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

EEA

analog supply voltage −5.45 −5.2 −4.95 V

V

EED1,VEED2

digital supply voltage −5.45 −5.2 −4.95 V

I

EEA

analog supply current − 50 55 mA

I

EED1,IEED2

digital supply current − 100 110 mA

I

EE

output supply current RL= 2.2 kΩ−20 25 mA

V

diff

supply voltage differential V

EEA

− V

EED1

; V

EEA

− V

EED2

−0.5 0 +0.5 V

Reference voltages for the resistor ladder

V

RB

reference voltage BOTTOM −3.5 −3.13 − V

V

RT

reference voltage TOP −−1.87 −1.5 V

V

ref

reference voltage differential VRT− V

RB

− 1.26 − V

V

OB

voltage offset BOTTOM note 1 − 130 − mV

V

OT

voltage offset TOP note 1 − 130 − mV

V

I(p-p)

input voltage amplitude
(peak-to-peak value)

0.95 1.0 1.5 V

I

ref

reference current − 15 − mA

R

LAD

resistor ladder − 85 −Ω

TC

RL

temperature coefficient of the
resistor ladder

− 0.18 −Ω/K

Inputs

CLK and

CLK input

V

IL

LOW level input voltage −1850 −1770 −1650 mV

V

IH

HIGH level input voltage −960 −880 −810 mV

I

IL

LOW level input current V

CLK

= −1.77 V − 1 −µA

I

IH

HIGH level input current V

CLK

= −0.88 V − 10 −µA

R

I

input resistance − 20 − kΩ

C

I

input capacitance − 2 − pF

V

CLK(p-p)

differential clock input
V

CLK

− V

CLK

(peak-to-peak value)

− 900 − mV

Analog input; note 2
I

IB

input current BOTTOM VRB= −3.13 V − 0 −µA

I

IT

input current TOP VRT= −1.87 V − 170 −µA

R

I

input resistance − 7 − kΩ

C

I

input capacitance − 13 20 pF

1996 Aug 26 8

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Outputs (RL= 2.2 kΩ)

Digital 10K ECL outputs (D0 to D7; IR)
V

OL

LOW level output voltage −1850 −1770 −1600 mV

V

OH

HIGH level output voltage −960 −880 −810 mV

I

OL

LOW level output current − 1.8 4.0 mA

I

OH

HIGH level output current − 2.0 4.0 mA

Timing (f

CLK

= 100 MHz; RL= 2.2 kΩ; see Fig.5)

t

ds

sampling delay − 13ns

t

HD

output hold time 4 −−ns

t

d

output delay time note 3

C

L

= 3.3 pF −−7.5 ns

C

L

= 7.5 pF −−9ns

t

aj

aperture jitter − 15 − ps

Switching characteristics

f

CLK

; f

CLK

maximum clock frequency 120 −−MHz

Analog signal processing (f

CLK

= 100 MHz)

G

diff

differential gain note 4 − 0.3 − %

φ

diff

differential phase note 4 − 0.4 −°C

Harmonics (full scale); f

i

= 10 MHz; f

CLK

= 100 MHz
f1 fundamental − 0 − dB
f2 even harmonics −−60 − dB
f3 odd harmonics −−50 − dB

Transfer function

ILE DC integral linearity error −±0.5 ±1 LSB
DLE DC differential linearity error −±0.25 ±0.45 LSB
AILE AC integral linearity error note 4 −±1±1.5 LSB
EB effective bits Figs 13 and 14; note 5;

f

CLK

= 100 MHz

f

i

= 4.43 MHz see Fig.10 − 7.7 − bits

f

i

= 10 MHz see Fig.11 − 7.5 − bits

f

i

= 20 MHz see Fig.12 − 7.0 − bits

f

i

= 30 MHz − 6.5 − bits

BER bit error rate f

CLK

= 100 MHz;
fi= 10 MHz; Vi= ±8 LSB at
code 128; 50% clock duty
factor

− 10

−11

− times/

samples

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Aug 26 9

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Notes

1. Voltage offset BOTTOM (VOB) is the difference between the analog input which produces data outputs equal to 00
and the reference voltage BOTTOM (VRB), at T

amb

=25°C. Voltage offset TOP (VOT) is the difference between

reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at T

amb

=25°C.

2. The analog input is not internally biased. It should be externally biased between VRB and VRT levels.

3. The TDA8716 can only withstand one or two 10K or 100K ECL loads in order to work-out timings at the maximum
sampling frequency. It is therefore recommended to minimize the printed-circuit board load by implementing the load
device as close as possible to the TDA8716.

4. Full-scale sinewave; fi= 4.43 MHz; f

CLK

, f

CLK

= 100 MHz.

5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 4 K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to SNR: SNR = EB (dB) × 6.02 + 1.76.

Fig.4 Average effect of air flow on thermal resistance.

handbook, full pagewidth

1000

0

–60

0 200 400 600 800

MEA540

–20

–40

–10

–30

–50

percent
change

(R

th j–a

)

air flow (LFPM)

SOL

1996 Aug 26 10

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Table 1 Output coding (CPLT2 HIGH)

STEP VI (TYP.)

BINARY

OUTPUTS

D7 to D0

IR

Underflow <−3 V 00000000 0

0 −3 V 00000000 1
1 . 00000001 1

. . ...... .

. . ...... .

. . ...... .

254 . 11111110 1
255 −2 V 11111111 1

Overflow >−2 V 11111111 0

Table 2 Two's complement coding

C

PLT2

D7 (MSB)

1 (V

IH

) non inverted

0 (V

IL

) inverted

Fig.5 Timing diagram.

handbook, full pagewidth

d

t

sample N + 1

sample N

CLK

MSA654

sample N + 2

50 %

ANALOG
INPUT
V

l

DATA
OUTPUT
D0 - D7

HD

t

50 %

DATA

N + 1

DATA

N

DATA

N - 1

1996 Aug 26 11

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

APPLICATION INFORMATION

Additional application information will be supplied upon request, please quote reference number FTV/AN 9109.

Fig.6 Application diagram; TDA8716.

handbook, full pagewidth

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

MCD260 - 2

CLK

C

PLT2

AGND1

AGND2

RM

V

CLK

DGND2

D7

DGND1

D6

D5

D4

D3

D2

D1

D0

TDA8716

EED

V

OGND (0 V)

V

EED1

(– 5.2 V)

EEA

V (– 5.2 V)

RB

V

(– 3.13 V)

RT

V (– 1.87 V)

EED2

V

(– 5.2 V)

analog input

100 nF

100 nF

100 nF

IR

Typical value for resistors =2.2 kΩ.
Lower resistor values can be used down to 500 Ω to obtain higher sampling frequencies in the 150 MSPS range (limited by td and tHD timings). In this

configuration a DC shift of the ECL output levels V

OL

and VOH will occur.
VRB, VRT and VM are decoupled to AGND.
Analog, digital and output supplies should be separated and decoupled.
The external voltage regulator must be constructed in such a way that a good supply voltage ripple rejection is achieved with respect to the LSB value.

1996 Aug 26 12

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.7 Internal pin configuration diagram.

handbook, halfpage

1, 2

3

MCD261

DGND

CCD1

V

13, 24

CLK; CLK

handbook, halfpage

8

5

MCD262 - 1

7, 11

AGND

V

I

CCA

V

x 80

handbook, halfpage

4

12

MCD263

C

PLT2

DGND

CCD2

V

13, 24

handbook, halfpage

10

5

MCD264

7, 11

AGND

CCA

V

9

6

resistor

ladder

RM

V

RT

V

RB

V

handbook, halfpage

10

5

MCD264

7, 11

AGND

CCA

V

9

6

resistor

ladder

RM

V

RT

V

RB

V

1996 Aug 26 13

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.8 DC Integral Linearity Error (ILE).

handbook, full pagewidth

0

0.5

1.0

–0.5

–1.0

LSB

0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256

CODE

MEA537

Fig.9 DC Differential Linearity Error (DLE).

handbook, full pagewidth

0

0.5

1.0

–0.5

–1.0

LSB

0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256

CODE

MEA536

1996 Aug 26 14

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.10 Fast fourier transformer (f

CLK

= 100 MHz; fi= 4.43 MHz).

Effective bits: 7.74; Harmonic levels (in dB): 2nd = −69.34; 3rd = −58.85; 4th = −82.55; 5th = −68.16 and 6th = −63.01.

0

–20

–40

–60

–80

–100

–120

0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 50.0

frequency (MHz)

MEA535

amplitude

(dB)

1996 Aug 26 15

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.11 Fast fourier transformer (f

CLK

= 100 MHz; fi= 10 MHz).

Effective bits: 7.57; Harmonic levels (in dB): 2nd = −82.07; 3rd = −61.90; 4th = −75.70; 5th = −65.61 and 6th = −72.50.

0

–20

–40

–60

–80

–100

–120

0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 50.0

frequency 

(MHz)

amplitude

(dB)

MEA534

1996 Aug 26 16

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.12 Fast fourier transformer (f

CLK

= 100 MHz; fi= 20 MHz).

Effective bits: 7.04; Harmonic levels (in dB): 2nd = −61.36; 3rd = −56.66; 4th = −61.97; 5th = −62.79 and 6th = −61.52.

0

–20

–40

–60

–80

–100

–120

0 6.43 12.9 19.3 25.7 32.2 38.6 45.0 51.5

frequency (MHz)

amplitude

(dB)

MEA533

Fig.13 Typical effective bit as a function of input signal at f

CLK

= 100 MHz.

handbook, full pagewidth

MEA539

4

5

6

7

8

5101520253035400

f (MHz)

i

4.43 MHz

effective

bits

1996 Aug 26 17

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

Fig.14 Typical effective bits as a function of clock frequency at fi= 10 MHz.

handbook, full pagewidth

clock

7

7.5

8

6.5

6.0

effective

bits

0 10 20 30 40 50 60 70 80 90 100 110 120

f (MHz)

MEA538

1996 Aug 26 18

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cD E e M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT101-1

92-11-17
95-01-23

A

min.

A

max.

b

w

M

E

e

1

1.7

1.3

0.53

0.38

0.32

0.23

32.0

31.4

14.1

13.7

3.9

3.4

0.252.54 15.24

15.80

15.24

17.15

15.90

2.25.1 0.51 4.0

0.066

0.051

0.021

0.015

0.013

0.009

1.26

1.24

0.56

0.54

0.15

0.13

0.010.10 0.60

0.62

0.60

0.68

0.63

0.0870.20 0.020 0.16

051G02 MO-015AD

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

24

1

13

12

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

Z

max.

(1)

(1)(1)

DIP24: plastic dual in-line package; 24 leads (600 mil)

SOT101-1

1996 Aug 26 19

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

UNIT

A

max.

A

1

A2A3b

p

cD

(1)E(1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.10

0.25

0.01

1.4

0.055

0.3

0.1

2.45

2.25

0.49

0.36

0.27

0.18

20.7

20.3

7.6

7.4

1.27

10.65

10.00

1.2

1.0

0.95

0.55

8
0

o
o

0.25 0.1

0.004

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT287-1

92-11-17
95-01-25

(1)

0.012

0.004

0.096

0.086

0.02

0.01

0.050

0.047

0.039

0.42

0.39

0.30

0.29

0.81

0.80

0.011

0.007

0.037

0.022

0.010.01

0.043

0.016

w M

b

p

D

H

E

Z

e

c

v M

A

X

A

y

32

17

16

1

θ

A

A

1

A

2

L

p

Q

detail X

L

(A )

3

E

pin 1 index

0 5 10 mm

scale

SO32: plastic small outline package; 32 leads; body width 7.5 mm

SOT287-1

1996 Aug 26 20

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Aug 26 21

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8716

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.