Datasheet TDA8714M/4, TDA8714M/6, TDA8714M/7, TDA8714T/4, TDA8714T/6 Datasheet (Philips) [ru]

INTEGRATED CIRCUITS

DATA SH EET

TDA8714

8-bit high-speed analog-to-digital
converter

Product specification
Supersedes data of 1996 Jan 31
File under Integrated Circuits, IC02

1997 Oct 29

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

FEATURES

• 8-bit resolution

• Sampling rate up to 80 MHz

• No missing codes guaranteed

• High signal-to-noise ratio over a large analog input

frequency range (7.7 effective bits at 4.43 MHz
full-scale input at f

= 80 MHz)

clk

• Overflow/underflow 3-state TTL output

APPLICATIONS

High-speed analog-to-digital conversion for:

• video data digitizing

• radar pulse analysis

• transient signal analysis

• high energy physics research

•Σ∆ modulators

• medical imaging.

• TTL compatible digital inputs

• Low-level AC clock input signal allowed

GENERAL DESCRIPTION

• External reference voltage regulator

• Power dissipation only 340 mW (typical)

• Low analog input capacitance, no buffer amplifier

required

• No sample-and-hold circuit required.

The TDA8714 is an 8-bit high-speed Analog-to-Digital
Converter (ADC) for professional video and other
applications. It converts the analog input signal into 8-bit
binary-coded digital words at a maximum sampling rate of
80 MHz. All digital inputs and outputs are TTL compatible,
although a low-level sine wave clock input signal is
allowed.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
V
V
I

CCA

I

CCD

I

CCO

CCA
CCD
CCO

analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output stages supply voltage 4.75 5.0 5.25 V
analog supply current − 25 30 mA
digital supply current − 27 33 mA

output stages supply current − 16 20 mA
INL DC integral non-linearity −±0.4 ±0.5 LSB
DNL DC differential non-linearity −±0.2 ±0.35 LSB
AINL AC integral non-linearity note 1 −±0.5 ±1.0 LSB
f

clk(max)

maximum clock frequency

TDA8714/7 80 −−MHz
TDA8714/6 60 −−MHz
TDA8714/4 40 −−MHz

P

tot

total power dissipation − 340 435 mW

Note

1. Full-scale sine wave (f

= 4.43 MHz; f

i

= 80 MHz).

clk

1997 Oct 29 2

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA8714T/4 SO24 plastic small outline package; 24 leads;
TDA8714T/6 SO24 SOT137-1 60

body width 7.5 mm

PACKAGE

SAMPLING

FREQUENCY (MHz)

SOT137-1 40

TDA8714T/7 SO24 SOT137-1 80
TDA8714M/4 SSOP24 plastic shrink small outline package; 24 leads;
TDA8714M/6 SSOP24 SOT340-1 60

body width 5.3 mm

SOT340-1 40

TDA8714M/7 SSOP24 SOT340-1 80

BLOCK DIAGRAM

handbook, full pagewidth

V

CCA

7

V

9

RT

CLK
16

CLOCK DRIVER

V

CCD

18

TDA8714

CE
22

analog

voltage input

output ground

V

8

I

V

4

RB

OGND

20

analog ground digital ground

ANALOG -TO-DIGITAL

CONVERTER

6
AGND

17
DGND

OVERFLOW / UNDERFLOW

LATCH

Fig.1 Block diagram.

TTL OUTPUTSLATCHES

TTL OUTPUT

MSA669

12

D7
D6

13

D5

14

D4

15

D3

23
24 D2

1

D1

2

D0
V

19

21

V

11

CCO1

CCO2

MSB

data outputs

LSB

overflow / underflow

output

1997 Oct 29 3

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

PINNING

SYMBOL PIN DESCRIPTION

D1 1 data output; bit 1
D0 2 data output; bit 0 (LSB)
n.c. 3 not connected
V

RB

n.c. 5 not connected
AGND 6 analog ground
V

CCA

V

I

V

RT

n.c. 10 not connected
O/UF 11 overflow/underflow data output
D7 12 data output; bit 7 (MSB)
D6 13 data output; bit 6
D5 14 data output; bit 5
D4 15 data output; bit 4
CLK 16 clock input
DGND 17 digital ground
V

CCD

V

CCO1

OGND 20 output ground
V

CCO2

CE 22 chip enable input (TTL level input,

D3 23 data output; bit 3
D2 24 data output; bit 2

4 reference voltage BOTTOM input

7 analog supply voltage (+5 V)
8 analog input voltage
9 reference voltage TOP input

18 digital supply voltage (+5 V)
19 supply voltage for output stages 1

(+5 V)

21 supply voltage for output stages 2

(+5 V)

active LOW)

handbook, halfpage

1

D1

2

D0

n.c.

3

V

4

RB

n.c.

5

AGND

6

V

CCA

V

O/UF

V

RT

n.c.

D7

TDA8714

7
8

I

9
10
11
12

MSA667

Fig.2 Pin configuration.

D2

24

D3

23
22

CE
V

21

CCO2

OGND

20

V

19

CCO1

V

18

CCD

DGND

17

CLK

16

D4

15

D5

14

D6

13

1997 Oct 29 4

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CCA

V

CCD

V

CCO

∆V

∆V

∆V

V

I

V

clk(p-p)

I

O

T

stg

T

amb

T

j

CC

CC

CC

analog supply voltage note 1 −0.3 +7.0 V
digital supply voltage note 1 −0.3 +7.0 V
output stages supply voltage note 1 −0.3 +7.0 V
supply voltage differences between

V

and V

CCA

CCD

supply voltage differences between
V

and V

CCO

CCD

supply voltage differences between
V

and V

CCA

CCO

−1.0 +1.0 V

−1.0 +1.0 V

−1.0 +1.0 V

input voltage referenced to AGND −0.3 +7.0 V
AC input voltage for switching

referenced to DGND − V

CCD

V

(peak-to-peak value)
output current − 10 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +150 °C

Note

1. The supply voltages V
between V

CCA

and V

and V

CCA

is between −1 V and +1 V.

CCD

may have any value between −0.3 V and +7.0 V provided the difference

CCD

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT137-1 75 K/W
SOT340-1 119 K/W

1997 Oct 29 5

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

CHARACTERISTICS

V

CCA=V7

AGND and DGND shorted together; V
V

CCA

V

CCA=VCCD=VCCO

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

V

CCA

V

CCD

V

CCO

I

CCA

I

CCD

I

CCO

Inputs

to V6= 4.75 to 5.25 V; V

to V

= −0.25 to +0.25 V; V

CCO

= 5 V and T

CCD=V18

CCA

i(p-p)

=25°C; unless otherwise specified.

amb

to V17= 4.75 to 5.25 V; V

to V

= 1.75 V; T

= −0.25 to +0.25 V; V

CCD

= 0 to +70 °C; typical values measured at

amb

CCO=V19

to V

CCO

and V21to V20= 4.75 to 5.25 V;

= −0.25 to +0.25 V;

CCD

analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output stages supply voltage 4.75 5.0 5.25 V
analog supply current − 25 30 mA
digital supply current − 27 33 mA
output stages supply current − 16 20 mA

C

LOCK INPUT CLK (REFERENCED TO DGND); note 1

V

IL

V

IH

I

IL

I

IH

Z

I

C

I

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V
LOW level input current V
HIGH level input current V
input impedance f

input capacitance f
INPUT CE (REFERENCED TO DGND); see Table 2
V

IL

V

IH

I

IL

I

IH

LOW level input voltage 0 − 0.8 V

HIGH level input voltage 2.0 − V

LOW level input current VIL= 0.4 V −400 −−µA

HIGH level input current VIH= 2.7 V −−20 µA
VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND)
I

IL

I

IH

Z

I

C

I

LOW level input current VI= 1.2 V − 0 −µA

HIGH level input current VI= 3.5 V 60 130 280 µA

input impedance fi= 4.43 MHz − 10 − kΩ

input capacitance fi= 4.43 MHz − 14 − pF
Reference voltages for the resistor ladder; see Table 1
V

V
V
I

ref

R
TC
V
V
V

RB
RT
diff

LAD

RLAD
osB
osT
i(p-p)

reference voltage BOTTOM 1.2 1.3 1.6 V
reference voltage TOP 3.5 3.6 3.9 V
differential reference voltage VRT− V

RB

reference current − 11.5 − mA
resistor ladder − 200 −Ω
temperature coefficient of the resistor ladder − 0.24 − ppm
offset voltage BOTTOM note 2 275 285 295 mV
offset voltage TOP note 2 305 315 325 mV
analog input voltage (peak-to-peak value) 1.45 1.75 2.15 V

CCD

= 0.4 V −400 −−µA

clk

= 2.7 V −−300 µA

clk

= 80 MHz − 18 − kΩ

clk

= 80 MHz − 1 − pF

clk

CCD

1.9 2.3 2.7 V

V

V

1997 Oct 29 6

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Outputs

DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND)
V

OL

V

OH

I

OZ

Switching characteristics

C

LOCK INPUT CLK (note 1; see Fig.3)

f

clk(max)

t

CPH

t

CPL

Analog signal processing

LOW level output voltage IO= 1 mA 0 − 0.4 V
HIGH level output voltage IO= −0.4 mA 2.7 − V

= −1 mA 2.4 − V

I

O

output current in 3-state mode 0.4V<VO<V

CCD

−20 − +20 µA

CCD
CCD

V
V

maximum clock frequency

TDA8714/4 40 −−MHz
TDA8714/6 60 −−MHz

TDA8714/7 80 −−MHz
clock pulse width HIGH 6 −−ns
clock pulse width LOW 6 −−ns

L

INEARITY

INL DC integral non-linearity −±0.4 ±0.5 LSB
DNL DC differential non-linearity −±0.2 ±0.35 LSB
AINL AC integral non-linearity note 3 −±0.5 ±1.0 LSB

B

ANDWIDTH (f

= 40 MHz); note 4

clk

B analog bandwidth full-scale sine wave − 13 − MHz

75% full-scale sine

− 20 − MHz
wave; small signal at
Vi= ±5 LSB, code 128

t

STLH

analog input settling time LOW-to-HIGH full-scale square

− 2.5 3.5 ns
wave; Fig.6; note 5

t

STHL

analog input settling time HIGH-to-LOW full-scale square

− 3.0 4.0 ns
wave; Fig.6; note 5

HARMONICS (f
h

1

h

all

= 40 MHz)

clk

fundamental harmonics (full scale) fi= 4.43 MHz −−0dB
harmonics (full scale);

fi= 4.43 MHz

all components

second harmonics −−64 −60 dB
third harmonics −−58 −55 dB

THD total harmonic distortion f

= 4.43 MHz −−56 − dB

i

SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13)
S/N signal-to-noise ratio (full scale) without harmonics;

= 40 MHz;

f

clk

46 48 − dB

fi= 4.43 MHz

1997 Oct 29 7

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

EFFECTIVE BITS (note 6; see Figs 7 and 13)
EB effective bits

TDA8714/4 f

effective bits

TDA8714/6 f

effective bits

TDA8714/7 f

TWO-TONE (note 7)
TTIR two-tone intermodulation rejection f
BIT ERROR RATE
BER bit error rate f

DIFFERENTIAL GAIN (note 8)
G

diff

differential gain f

DIFFERENTIAL PHASE (note 8)

ϕ

diff

differential phase f

= 40 MHz

clk

f

= 4.43 MHz − 7.75 − bits

i

= 7.5 MHz − 7.6 − bits

f

i

= 60 MHz

clk

= 4.43 MHz − 7.7 − bits

f

i

f

= 7.5 MHz − 7.55 − bits

i

f

= 10 MHz − 7.4 − bits

i

= 80 MHz

clk

f

= 4.43 MHz − 7.7 − bits

i

= 7.5 MHz − 7.5 − bits

f

i

f

= 10 MHz − 7.2 − bits

i

f

= 15 MHz − 6.3 − bits

i

= 40 MHz −−56 − dB

clk

= 40 MHz;

clk

− 10

−11

− times/

fi= 4.43 MHz;
VI= ±16 LSB at
code 128

= 40 MHz;

clk

− 0.6 − %
fi= 4.43 MHz

= 40 MHz;

clk

− 0.8 − deg
fi= 4.43 MHz

samples

Timing (note 9; see Figs 3 and 5; f
t

ds

t

h

t

d

sampling delay time −−2ns
output hold time 5 −−ns
output delay time − 10 11 ns

= 80 MHz)

clk

3-state output delay times (see Fig.4)
t

dZH

t

dZL

t

dHZ

t

dLZ

enable HIGH − 40 44 ns
enable LOW − 12 16 ns
disable HIGH − 50 54 ns
disable LOW − 10 14 ns

1997 Oct 29 8

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

Notes to the characteristics

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 1 ns.

2. Analog input voltages producing code 00 up to and including FF:
a) V

b) V

3. Full-scale sine wave (fi= 4.43 MHz; f

4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.
No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.

6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.

7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.

8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a
digital-to-analog converter.

9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 80 MHz clock
operation, the hardware design must take into account the tdand th limits with respect to the input characteristics of
the acquisition circuit.

(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and

osB

the reference voltage BOTTOM (VRB) at T

(voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which

osT

produces data outputs equal to FF at T

= 80 MHz).

clk

amb

=25°C.

amb

=25°C.

1997 Oct 29 9

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

Table 1 Output coding and input voltage (typical values; referenced to AGND)

STEP V

I(p-p)

O/UF

D7 D6 D5 D4 D3 D2 D1 D0

Underflow <1.585 1 0 0000000

0 1.585 0 0 0000000
1 . 000000001

. . .. ......

. . .........

254 . 011111110
255 3.28 0 1 1111111

Overflow >3.28 1 1 1111111

Table 2 Mode selection

CE D7 to D0 O/UF

1 high impedance high impedance
0 active; binary active

t

BINARY OUTPUT BITS

handbook, full pagewidth

t

CPH

CPL

CLK

V

l

DATA
D0 to D7

sample N

DATA

N - 2

sample N + 1

t

ds

DATA

N - 1

t

d

Fig.3 Timing diagram.

sample N + 2

t

h

DATA

N

DATA

N + 1

MSA670

50 %

V

DDO

50 %
0 V

1997 Oct 29 10

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

V

CE

CCD

50 %

book, full pagewidth

fCE= 100 kHz.

LOW

V

S1

CCD

t

dZH

50 %

MBD876

output
data

output
data

LOW

t

dLZ

10 %

TDA8714

CE

HIGH

t

dHZ

HIGH

t

dZL

50 %

3.3 kΩ

15 pF

90 %

Fig.4 Timing diagram and test conditions of 3-state output delay time.

TEST S1

t

dLZ

t

dZL

t

dHZ

t

dZH

V
V
DGND
DGND

CCD
CCD

handbook, halfpage

D0 to D7

15 pF

MBB956 - 1

Fig.5 Load circuit for timing measurement.

1997 Oct 29 11

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

handbook, full pagewidth

code 255

code 0

CLK

MGD184

t

STLH

V

I

50 %

2 ns

50 %

0.5 ns

Fig.6 Analog input settling-time diagram.

2 ns

t

STHL

50 %

50 %

0.5 ns

1997 Oct 29 12

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

amplitude

(dB)

100

120

0

20

40

60

80

0 2.50 5.00

Fig.7 Fast Fourier Transform (f

7.50

= 40 MHz; fi= 4.43 MHz).

clk

handbook, full pagewidth

Effective bits: 7.80; THD = −57.82 dB.
Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th= −68.88.

MBD877

17.510.0 12.5 15.0 20.0
f (MHz)

amplitude

(dB)

100

120

0

20

40

60

80

0 4.69 9.39

Fig.8 Fast Fourier Transform (f

14.1

= 80 MHz; fi= 10 MHz).

clk

handbook, full pagewidth

Effective bits: 7.27; THD = −49.23 dB.
Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th= −65.34.

MBD878

32.918.8 23.5 28.2 37.5
f (MHz)

1997 Oct 29 13

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

INTERNAL PIN CONFIGURATIONS

V

handbook, halfpage

CCO1

V

CCO2

D7 to D0

O/UF

DGND

MLB036

Fig.9 TTL data and overflow/underflow outputs.

ook, halfpage

V

CCO1

handbook, halfpage

V

CCA

V

I

AGND

(x 90)

MLB037

Fig.10 Analog inputs.

CE

DGND

MLB038

Fig.11 CE (3-state) input.

1997 Oct 29 14

handbook, halfpage

V

CCA

V

RT

V

RM

V

RB

AGND

Fig.12 VRBand VRT.

R

LAD

MEA050 - 1

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

V

handbook, full pagewidth

CCD

CLK

DGND

30 kΩ 30 kΩ

Fig.13 CLK input.

MCD189 - 1

V

ref

1997 Oct 29 15

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

APPLICATION INFORMATION

handbook, halfpage

100 nF

AGND

100 nF

AGND

D1

D0

(2)

n.c.

(1)

V

RB

(2)

n.c.

AGND

V

CCA

V

(1)

V

RT

(2)

n.c.

O/UF

D7

19

18

17

16

15

14

13

MSA668

24

23

22

21

20

D2

D3

CE

V

CCO2

OGND

V

CCO1

V

CCD

DGND

CLK

D4

D5

D6

1

2

3

4

5

6

TDA8714

7

I

8

9

10

11

12

The analog and digital supplies should be separated and decoupled.
The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value.
(1) VRB and VRT are decoupled to AGND.
(2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.

Fig.14 Application diagram.

1997 Oct 29 16

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

PACKAGE OUTLINES

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

pin 1 index

1

e

13

12

w M

b

p

SOT137-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT137-1

A

A1A2A3b

max.

0.30

2.65

0.10

0.012

0.10

0.004

p

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.25

0.01

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

15.6

7.6

7.4

0.30

0.29

1.27

0.050

15.2

0.61

0.60

REFERENCES

1997 Oct 29 17

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

A

2

A

pin 1 index

1

SOT340-1

E

H

E

Q

L

p

L

(A )

A

X

v M

A

A

3

θ

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

A

max.

0.21

mm

2.0

OUTLINE
VERSION

SOT340-1 MO-150AG

0.05

1.80

0.25

1.65

IEC JEDEC EIAJ

p

0.38

0.25

p

cD

0.20

8.4

0.09

8.0

REFERENCES

0 2.5 5 mm

scale

(1)E(1) (1)

5.4

0.65 1.25

5.2

1997 Oct 29 18

detail X

eHELLpQZywv θ

7.9

7.6

1.03

0.63

0.9

0.7

EUROPEAN

PROJECTION

0.13 0.10.2

0.8

0.4

ISSUE DATE

93-09-08
95-02-04

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Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

(order code 9398 652 90011).

SSOP
Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

METHOD (SO AND SSOP)
During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.
SO
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

1997 Oct 29 19

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

Philips Semiconductors Product specification

8-bit high-speed analog-to-digital converter TDA8714

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Oct 29 20

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
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Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

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Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. [phone], Fax. [phone]

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,

04552-903 São Paulo, SÃO PAULO - SP, Brazil,

Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. [phone]

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/1200/06/pp24 Date of release: 1997 Oct 29 Document order number: 9397 75002956