Datasheet tda8714 DATASHEETS (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA8714

8-bit high-speed analog-to-digital converter

Product speciﬁcation Supersedes data of 1995 Mar 21 File under Integrated Circuits, IC02

1996 Jan 31

Page 2

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter

FEATURES

• 8-bit resolution

• Sampling rate up to 75 MHz

• No missing codes guaranteed

• High signal-to-noise ratio over a large analog input

frequency range (7.7 effective bits at 4.43 MHz full-scale input at f

• Overflow/underflow 3-state TTL output

• TTL compatible digital inputs

• Low-level AC clock input signal allowed

• External reference voltage regulator

• Power dissipation only 340 mW (typical)

• Low analog input capacitance, no buffer amplifier

required

• No sample-and-hold circuit required.

= 75 MHz)

clk

TDA8714

APPLICATIONS

High-speed analog-to-digital conversion for:

• video data digitizing

• radar pulse analysis

• transient signal analysis

• high energy physics research

•Σ∆ modulators

• medical imaging.

GENERAL DESCRIPTION

The TDA8714 is an 8-bit high-speed Analog-to-Digital Converter (ADC) for professional video and other applications. It converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 75 MHz. All digital inputs and outputs are TTL compatible, although a low-level sine wave clock input signal is allowed.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V V V I

CCA

CCD

CCO

CCA CCD CCO

analog supply voltage 4.75 5.0 5.25 V digital supply voltage 4.75 5.0 5.25 V output stages supply voltage 4.75 5.0 5.25 V analog supply current − 25 30 mA digital supply current − 27 33 mA

output stages supply current − 16 20 mA INL DC integral non-linearity −±0.4 ±0.5 LSB DNL DC differential non-linearity −±0.2 ±0.35 LSB AINL AC integral non-linearity note 1 −±0.5 ±1.0 LSB f

clk(max)

maximum clock frequency

TDA8714/7 75 −−MHz TDA8714/6 60 −−MHz TDA8714/4 40 −−MHz

tot

total power dissipation − 340 435 mW

Note

1. Full-scale sine wave (f

= 4.43 MHz; f

= 75 MHz).

clk

1996 Jan 31 2

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA8714T/4 SO24 plastic small outline package; 24 leads; TDA8714T/6 SO24 SOT137-1 60

body width 7.5 mm

PACKAGE

SAMPLING

FREQUENCY (MHz)

SOT137-1 40

TDA8714T/7 SO24 SOT137-1 75 TDA8714M/4 SSOP24 plastic shrink small outline package; 24 leads; TDA8714M/6 SSOP24 SOT340-1 60

body width 5.3 mm

SOT340-1 40

TDA8714M/7 SSOP24 SOT340-1 75

BLOCK DIAGRAM

handbook, full pagewidth

CCA

CLK 16

CLOCK DRIVER

CCD

TDA8714

CE 22

analog

voltage input

output ground

OGND

analog ground digital ground

ANALOG -TO-DIGITAL

CONVERTER

6 AGND

17 DGND

OVERFLOW / UNDERFLOW

LATCH

Fig.1 Block diagram.

TTL OUTPUTSLATCHES

TTL OUTPUT

MSA669

D7 D6

23 24 D2

D0 V

CCO1

CCO2

MSB

data outputs

LSB

overflow / underflow

output

1996 Jan 31 3

Page 4

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

PINNING

SYMBOL PIN DESCRIPTION

D1 1 data output; bit 1 D0 2 data output; bit 0 (LSB) n.c. 3 not connected V

n.c. 5 not connected AGND 6 analog ground V

CCA

n.c. 10 not connected O/UF 11 overﬂow/underﬂow data output D7 12 data output; bit 7 (MSB) D6 13 data output; bit 6 D5 14 data output; bit 5 D4 15 data output; bit 4 CLK 16 clock input DGND 17 digital ground V

CCD

CCO1

OGND 20 output ground V

CCO2

CE 22 chip enable input (TTL level input,

D3 23 data output; bit 3 D2 24 data output; bit 2

4 reference voltage BOTTOM input

7 analog supply voltage (+5 V) 8 analog input voltage 9 reference voltage TOP input

18 digital supply voltage (+5 V) 19 supply voltage for output stages 1

(+5 V)

21 supply voltage for output stages 2

(+5 V)

active LOW)

handbook, halfpage

n.c.

AGND

CCA

O/UF

n.c.

TDA8714

7 8

9 10 11 12

MSA667

Fig.2 Pin configuration.

24 23 22 21 20 19 18 17 16 15 14 13

D2 D3 CE

CCO2

OGND V

CCO1

CCD

DGND CLK D4 D5 D6

1996 Jan 31 4

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

CCA

CCD

CCO

∆V

clk(p-p)

stg

amb

analog supply voltage note 1 −0.3 +7.0 V digital supply voltage note 1 −0.3 +7.0 V output stages supply voltage note 1 −0.3 +7.0 V supply voltage differences between

and V

CCA

CCD

supply voltage differences between V

and V

CCO

CCD

supply voltage differences between V

and V

CCA

CCO

−1.0 +1.0 V

input voltage referenced to AGND −0.3 +7.0 V AC input voltage for switching

referenced to DGND − V

CCD

(peak-to-peak value) output current − 10 mA storage temperature −55 +150 °C operating ambient temperature 0 +70 °C junction temperature − +150 °C

Note

1. The supply voltages V between V

CCA

and V

CCA

is between −1 V and +1 V.

CCD

may have any value between −0.3 V and +7.0 V provided the difference

CCD

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

th j-a

thermal resistance from junction to ambient in free air

SOT137-1 75 K/W SOT340-1 119 K/W

1996 Jan 31 5

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

CHARACTERISTICS

CCA=V7

AGND and DGND shorted together; V V

CCA

CCA=VCCD=VCCO

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply

CCA

CCD

CCO

CCA

CCD

CCO

Inputs

to V6= 4.75 to 5.25 V; V

to V

= −0.25 to +0.25 V; V

CCO

= 5 V and T

CCD=V18

CCA

i(p-p)

=25°C; unless otherwise speciﬁed.

amb

to V17= 4.75 to 5.25 V; V

to V

= 1.75 V; T

= −0.25 to +0.25 V; V

CCD

= 0 to +70 °C; typical values measured at

amb

CCO=V19

to V

CCO

and V21to V20= 4.75 to 5.25 V;

= −0.25 to +0.25 V;

CCD

analog supply voltage 4.75 5.0 5.25 V digital supply voltage 4.75 5.0 5.25 V output stages supply voltage 4.75 5.0 5.25 V analog supply current − 25 30 mA digital supply current − 27 33 mA output stages supply current − 16 20 mA

LOCK INPUT CLK (REFERENCED TO DGND); note 1

LOW level input voltage 0 − 0.8 V HIGH level input voltage 2.0 − V LOW level input current V HIGH level input current V input impedance f

input capacitance f INPUT CE (REFERENCED TO DGND); see Table 2 V

LOW level input voltage 0 − 0.8 V

HIGH level input voltage 2.0 − V

LOW level input current VIL= 0.4 V −400 −−µA

HIGH level input current VIH= 2.7 V −−20 µA VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND) I

LOW level input current VI= 1.2 V − 0 −µA

HIGH level input current VI= 3.5 V 60 130 280 µA

input impedance fi= 4.43 MHz − 10 − kΩ

input capacitance fi= 4.43 MHz − 14 − pF Reference voltages for the resistor ladder; see Table 1 V

V V I

ref

R TC V V V

RB RT diff

LAD

RLAD osB osT i(p-p)

reference voltage BOTTOM 1.2 1.3 1.6 V reference voltage TOP 3.5 3.6 3.9 V differential reference voltage VRT− V

reference current − 11.5 − mA resistor ladder − 200 −Ω temperature coefﬁcient of the resistor ladder − 0.24 − ppm offset voltage BOTTOM note 2 − 285 − mV offset voltage TOP note 2 − 315 − mV analog input voltage (peak-to-peak value) 1.45 1.75 2.15 V

CCD

= 0.4 V −400 −−µA

clk

= 2.7 V −−300 µA

clk

= 75 MHz − 18 − kΩ

clk

= 75 MHz − 1 − pF

clk

CCD

1.9 2.3 2.7 V

1996 Jan 31 6

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Outputs

DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND) V

Switching characteristics

LOCK INPUT CLK (note 1; see Fig.3)

clk(max)

CPH

CPL

Analog signal processing

LOW level output voltage IO= 1 mA 0 − 0.4 V HIGH level output voltage IO= −0.4 mA 2.7 − V

= −1 mA 2.4 - V

output current in 3-state mode 0.4V<VO<V

CCD

−20 − +20 µA

CCD CCD

V V

maximum clock frequency

TDA8714/4 40 −−MHz TDA8714/6 60 −−MHz

TDA8714/7 75 −−MHz clock pulse width HIGH 6 −−ns clock pulse width LOW 6 −−ns

INEARITY

L INL DC integral non-linearity −±0.4 ±0.5 LSB

DNL DC differential non-linearity −±0.2 ±0.35 LSB AINL AC integral non-linearity note 3 −±0.5 ±1.0 LSB

ANDWIDTH (f

= 40 MHz); note 4

clk

B analog bandwidth full-scale sine wave − 13 − MHz

75% full-scale sine

− 20 − MHz

wave; small signal at

= ±5 LSB, code 128

STLH

analog input settling time LOW-to-HIGH full-scale square

− 2.5 3.5 ns

wave; Fig.6; note 5

STHL

analog input settling time HIGH-to-LOW full-scale square

− 3.0 4.0 ns

wave; Fig.6; note 5 HARMONICS (f h

all

= 40 MHz)

clk

fundamental harmonics (full scale) fi= 4.43 MHz −−0dB harmonics (full scale);

fi= 4.43 MHz

all components

second harmonics −−64 −60 dB third harmonics −−58 −55 dB

THD total harmonic distortion f

= 4.43 MHz −−56 − dB

SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13) S/N signal-to-noise ratio (full scale) without harmonics;

= 40 MHz;

clk

46 48 − dB

fi= 4.43 MHz

1996 Jan 31 7

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

EFFECTIVE BITS (note 6; see Figs 7 and 13) EB effective bits

TDA8714/4 f

effective bits

TDA8714/6 f

effective bits

TDA8714/7 f

TWO-TONE (note 7) TTIR two-tone intermodulation rejection f BIT ERROR RATE BER bit error rate f

DIFFERENTIAL GAIN (note 8) G

diff

differential gain f

DIFFERENTIAL PHASE (note 8)

diff

differential phase f

= 40 MHz

clk

= 4.43 MHz − 7.75 − bits

= 7.5 MHz − 7.6 − bits

= 60 MHz

clk

= 4.43 MHz − 7.7 − bits

= 7.5 MHz − 7.55 − bits

= 10 MHz − 7.4 − bits

= 75 MHz

clk

= 4.43 MHz − 7.7 − bits

= 7.5 MHz − 7.5 − bits

= 10 MHz − 7.2 − bits

= 15 MHz − 6.3 − bits

= 40 MHz −−56 − dB

clk

= 40 MHz;

clk

− 10

−11

− times/

fi= 4.43 MHz;

VI= ±16 LSB at

code 128

= 40 MHz;

clk

− 0.6 − %

fi= 4.43 MHz

= 40 MHz;

clk

− 0.8 − deg

fi= 4.43 MHz

samples

Timing (note 9; see Figs 3 and 5; f t

sampling delay time −−2ns output hold time 5 −−ns

output delay time − 10 11 ns 3-state output delay times (see Fig.4) t

dZH

dZL

dHZ

dLZ

enable HIGH − 610ns

enable LOW − 12 16 ns

disable HIGH − 50 54 ns

disable LOW − 10 14 ns

1996 Jan 31 8

= 75 MHz)

clk

Page 9

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Notes to the characteristics

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 1 ns.

2. Analog input voltages producing code 00 up to and including FF: a) V

b) V

3. Full-scale sine wave (fi= 4.43 MHz; f

4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data.

6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.

7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.

8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a digital-to-analog converter.

9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 75 MHz clock operation, the hardware design must take into account the tdand th limits with respect to the input characteristics of the acquisition circuit.

(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and

osB

the reference voltage BOTTOM (VRB) at T

(voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which

osT

produces data outputs equal to FF at T

= 75 MHz).

clk

amb

=25°C.

amb

=25°C.

1996 Jan 31 9

Page 10

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Table 1 Output coding and input voltage (typical values; referenced to AGND)

STEP V

I(p-p)

O/UF

D7 D6 D5 D4 D3 D2 D1 D0

Underﬂow <1.585 1 0 0000000

0 1.585 0 0 0000000 1 . 000000001

. . .. ......

. . .........

254 . 011111110 255 3.28 0 1 1111111

Overﬂow >3.28 1 1 1111111

Table 2 Mode selection

CE D7 to D0 O/UF

1 high impedance high impedance 0 active; binary active

BINARY OUTPUT BITS

CLK

DATA D0 to D7

sample N

DATA

N - 2

CPH

CPL

sample N + 1

DATA

N - 1

Fig.3 Timing diagram.

1.4 V

sample N + 2

DATA

N + 1

2.4 V

1.4 V

0.4 V

MSA670

1996 Jan 31 10

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Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

CCD

50 %

book, full pagewidth

fCE= 100 kHz.

LOW

CCD

dZH

50 %

MBD876

output data

LOW

dLZ

10 %

TDA8714

HIGH

dHZ

HIGH

dZL

50 %

3.3 kΩ

15 pF

90 %

Fig.4 Timing diagram and test conditions of 3-state output delay time.

TEST S1

dLZ

dZL

dHZ

dZH

V V DGND DGND

CCD CCD

handbook, halfpage

Fig.5 Load circuit for timing measurement.

1996 Jan 31 11

D0 to D7

15 pF

MBB956 - 1

Page 12

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

handbook, full pagewidth

code 255

code 0

CLK

MGD184

STLH

50 %

2 ns

50 %

0.5 ns

Fig.6 Analog input settling-time diagram.

2 ns

STHL

50 %

0.5 ns

1996 Jan 31 12

Page 13

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

amplitude

(dB)

100

120

0 2.50 5.00

Fig.7 Fast Fourier Transform (f

7.50

= 40 MHz; fi= 4.43 MHz).

clk

handbook, full pagewidth

Effective bits: 7.80; THD = −57.82 dB. Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th = −68.88.

MBD877

17.510.0 12.5 15.0 20.0 f (MHz)

amplitude

(dB)

100

120

0 4.69 9.39

Fig.8 Fast Fourier Transform (f

14.1

= 75 MHz; fi= 10 MHz).

clk

handbook, full pagewidth

Effective bits: 7.27; THD = −49.23 dB. Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th = −65.34.

MBD878

32.918.8 23.5 28.2 37.5 f (MHz)

1996 Jan 31 13

Page 14

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

INTERNAL PIN CONFIGURATIONS

handbook, halfpage

CCO1

CCO2

D7 to D0

O/UF

DGND

MLB036

Fig.9 TTL data and overflow/underflow outputs.

book, halfpage

CCO1

handbook, halfpage

CCA

AGND

(x 90)

MLB037

Fig.10 Analog inputs.

DGND

MLB038

Fig.11 CE (3-state) input.

1996 Jan 31 14

handbook, halfpage

CCA

AGND

Fig.12 VRBand VRT.

LAD

MEA050 - 1

Page 15

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

handbook, full pagewidth

CCD

CLK

DGND

30 kΩ 30 kΩ

Fig.13 CLK input.

MCD189 - 1

ref

1996 Jan 31 15

Page 16

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

APPLICATION INFORMATION

handbook, halfpage

100 nF

AGND

100 nF

AGND

(2)

n.c.

(1)

(2)

n.c.

AGND

CCA

(1)

(2)

n.c.

O/UF

MSA668

CCO2

OGND

CCO1

CCD

DGND

CLK

TDA8714

The analog and digital supplies should be separated and decoupled. The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. (1) VRB and VRT are decoupled to AGND. (2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.

Fig.14 Application diagram.

1996 Jan 31 16

Page 17

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

PACKAGE OUTLINES

SO24: plastic small outline package; 24 leads; body width 7.5 mm

pin 1 index

w M

SOT137-1

detail X

(A )

v M

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT137-1

max.

2.65

0.10

A1A2A

0.30

0.10

0.012

0.004

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1996 Jan 31 17

0 5 10 mm

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.25

0.01

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

(1)E(1) (1)

15.6

7.6

15.2

7.4

0.61

0.30

0.60

0.29

REFERENCES

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

EUROPEAN

PROJECTION

ywv θ

0.9

0.4

0.004

ISSUE DATE

0.035

0.016

92-11-17

95-01-24

o o

Page 18

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

24 13

pin 1 index

SOT340-1

(A )

v M

112

w M

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

max.

0.21

2.0

OUTLINE VERSION

SOT340-1 MO-150AG

0.05

1.80

1.65

IEC JEDEC EIAJ

0.25

0.38

0.25

0.20

8.4

0.09

8.0

REFERENCES

0 2.5 5 mm

scale

(1)E(1) (1)

5.4

0.65 1.25

5.2

1996 Jan 31 18

detail X

eHELLpQZywv θ

7.9

7.6

1.03

0.63

0.9

0.7

EUROPEAN

PROJECTION

0.13 0.10.2

0.8

0.4

ISSUE DATE

93-09-08 95-02-04

Page 19

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Reﬂow soldering

Reflow soldering techniques are suitable for all SO and SSOP packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

Wave soldering

(order code 9398 652 90011).

SSOP Wave soldering isnot recommended for SSOP packages.

This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate solder thieves at the downstream end.

Even with these conditions, only consider wave soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1).

ETHOD (SO AND SSOP)

M During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications. SO Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

1996 Jan 31 19

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

Page 20

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Jan 31 20