Datasheet TDA8707H Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8707

Triple RGB 6-bit video
analog-to-digital interface

Product specification
Supersedes dat of March 1995
File under Integrated Circuits, IC02

1996 Feb 01

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

FEATURES

• Triple analog-to-digital converter (ADC)

• 6-bit resolution

• Sampling rate up to 35 MHz

• Power dissipation of 335 mW (typical)

• Internal clamping function

• TTL compatible digital inputs

•−40 to +85 °C operating temperature

• CMOS digital outputs.

APPLICATIONS

• High-speed analog-to-digital conversion for video
signals

• VGA signal treatment.

DESCRIPTION

The TDA8707 is a CMOS triple 6-bit video low-power
analog-to-digital converter (ADC) for RGB signals.

TDA8707

It converts the analog inputs into 6-bit binary coded digital
words at a sampling rate of 35 MHz. All analog signal
inputs are clamped.

Analog-to-digital converter

The TDA8707 implements 3 independent 6-bit
analog-to-digital converters in CMOS process. These
converters use a full-flash approach.

Clamping feature

An internal clamping circuit is provided in each of the
3 analog channels. The analog pins INR, ING and INB are
switched, through series capacitors, to on-chip clamping
levels during an active pulse on the clamp input CLP.
Clamping level in the R, G and B channels is Code 0.

Input buffers

Internal buffers are provided to drive the analog-to-digital
converter inputs. Their ratio can be adjusted externally at

1.5 or 2.0 with select input SLT.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

V

DDD

I

DDA

I

DDD

INL integral non-linearity f

DNL differential non-linearity f

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current − 60 80 mA
digital supply current f

= 35 MHz − 58mA

clk

= 35 MHz; ramp input;

clk

T

=25°C

amb

= 35 MHz; ramp input;

clk

=25°C

T

amb

−±0.35 ±0.6 LSB

−±0.35 ±0.6 LSB

EB effective bits note 1 − 5.3 − bits
f

clk

P

tot

maximum clock conversion rate 35 −−MHz
total power dissipation f

= 35 MHz; note 2 − 335 485 mW

clk

Notes

1. The number of effective bits is measured with a clock frequency of 35 MHz. This value is given for a 4.43 MHz

frequency on the R, G and B channels.

2. The external resistor (value 15 kΩ) between V

and CLREF, fixing internal static currents, influences P

DDA

.

tot

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8707H QFP44 plastic quad flat package; 44 leads; lead length 1.3 mm; body 10× 10 × 1.75 mm SOT307-2

1996 Feb 01 2

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

BLOCK DIAGRAM

handbook, full pagewidth

V
V

V
V

DDA1
SSA1

INR

DDA2
SSA2

ING

33
35

34

30
32

31

BUFFER

BUFFER

CLREF CLP CLK

24 23 10

CLAMPING

CIRCUIT

CLAMPING

CIRCUIT

6-BIT

ADC

6-BIT

ADC

38,

40-44

6

3-8

6

TDA8707

R0 to R5

G0 to G5

V

DDA3

V

SSA3

INB

CREFH
CREFL

27
29

28

26
25

BUFFER

36

SLT

TDA8707

CLAMPING

CIRCUIT

Fig.1 Block diagram.

6-BIT

ADC

V

DDD1VSSD1

14-16,

18-20

6

22
21

911

MGA919

B0 to B5

V

DDD2

V

SSD2

1996 Feb 01 3

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
n.c. 2 not connected
G0 3 GREEN data output; bit 0 (LSB)
G1 4 GREEN data output; bit 1
G2 5 GREEN data output; bit 2
G3 6 GREEN data output; bit 3
G4 7 GREEN data output; bit 4
G5 8 GREEN data output; bit 5 (MSB)
V

SSD1

CLK 10 clock input
V

DDD1

n.c. 12 not connected
n.c. 13 not connected
B0 14 BLUE data output; bit 0 (LSB)
B1 15 BLUE data output; bit 1
B2 16 BLUE data output; bit 2
n.c. 17 not connected
B3 18 BLUE data output; bit 3
B4 19 BLUE data output; bit 4
B5 20 BLUE data output; bit 5 (MSB)
V

SSD2

V

DDD2

9 digital supply ground 1

11 digital supply voltage 1

21 digital supply ground 2
22 digital supply voltage 2

TDA8707

SYMBOL PIN DESCRIPTION

CLP 23 clamping input
CLREF 24 ADCs current reference level input
CREFL 25 converter reference LOW level input
CREFH 26 converter reference HIGH level input
V

DDA3

INB 28 BLUE analog input
V

SSA3

V

DDA2

ING 31 GREEN analog input
V

SSA2

V

DDA1

INR 34 RED analog input
V

SSA1

SLT 36 select input buffer ratio
n.c. 37 not connected
R0 38 RED data output; bit 0 (LSB)
n.c. 39 not connected
R1 40 RED data output; bit 1
R2 41 RED data output; bit 2
R3 42 RED data output; bit 3
R4 43 RED data output; bit 4
R5 44 RED data output; bit 5 (MSB)

27 analog supply voltage 3

29 analog supply ground 3
30 analog supply voltage 2

32 analog supply ground 2
33 analog supply voltage 1

35 analog supply ground 1

1996 Feb 01 4

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

R5R4R3R2R1

V

SSD1

V

DDD1

index
corner

n.c.
n.c.

G0
G1
G2

G3
G4

G5

CLK

1
2
3
4
5
6
7
8

9
10
11

44

43

42

41

40

TDA8707

n.c.

39

R0

38

n.c.

37

SLT
36

SSA1

V
35

INR
34

33
32
31
30
29
28
27
26
25
24
23

V

DDA1

V

SSA2
ING
V

DDA2

V

SSA3
INB
V

DDA3

CREFH
CREFL

CLREF
CLP

TDA8707

20

21

B5

SSD2

V

22

DDD2

V

MGA920

12

n.c.

13

n.c.

14
B0

15
B1

16
B2

17

n.c.

B3

18

19
B4

Fig.2 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
∆V
V
V

DDA
DDD

DD
I
i(p-p)

analog supply voltage (pins 27, 30 and 33) −0.3 +6.5 V
digital supply voltage (pins 11 and 22) −0.3 +6.5 V
supply voltage difference between V
input voltage (pins 28, 31 and 34) referenced to V
AC input voltage for switching

DDA

and V

DDD

referenced to V

−0.5 +0.5 V

− V

SSA

− V

SSD

DDA
DDD

V
V

(pins 10 and 23; peak-to-peak value)

T

stg

T

amb

T

j

storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
junction temperature − +125 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 75 K/W

1996 Feb 01 5

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital

TDA8707

interface

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

CHARACTERISTICS (see Tables 1 and 2)
V

DDA=VDDD

T

= −40 to +85 °C; SLT=0V; CREFH = 2 V, CREFL = 0.5 V, CL= 15 pF; typical values measured at

amb

V

DDA=VDDD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDA

V

DDD

I

DDA

I

DDD

Inputs

IGITAL INPUTS (CLK: PIN 10 AND CLP: PIN 23)

D
V

IL

V

IH

I

LI

C

I

CLAMP AND REFERENCES (CLREF: PIN 24, CREFL: PIN 25 AND CREFH: PIN 26)
A

CL

I

CL

C

CL

R

CLREF

V

REFH

V

REFL

∆REF reference voltage difference between

Z

CREF

ANALOG INPUTS (INR: PIN 34, ING: PIN 31 AND INB: PIN 28)
V

I(p-p)

I

I

C

I

= 4.5 to 5.5 V; V

=5V; V

SSA=VSSD

and V

SSA

= 0 V and T

short-circuited together; V

SSD

=25°C; unless otherwise specified.

amb

DDA

− V

= −0.5 to +0.5 V;

DDD

analog supply voltage note 1 4.5 5.0 5.5 V
digital supply voltage note 1 4.5 5.0 5.5 V
analog supply current note 1 − 60 80 mA
digital supply current f

=35MHz − 58mA

clk

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V

DDD

V
input leakage current −10 − +10 µA
input capacitance − 7 − pF

clamping accuracy −±0.5 − LSB
input clamping current −200 − +400 µA
external series clamping capacitor 10 22 − nF
external resistor on CLREF pin for

note 2 12 15 − kΩ

current reference of converter
converter reference voltage HIGH level

referenced to V

SSA

1.5 2.0 2.5 V

applied to CREFH pin
converter reference voltage LOW level

referenced to V

SSA

0.25 0.5 0.75 V

applied to CREFL pin

note 3 − 1.5 − V

V

and V

REFH

internal ladder impedance between

REFL

− 300 −Ω

pins CREFH and CREFL

full-range input voltage (peak-to-peak
value)

SLT = logic 0;
gain = 1.5; note 4

SLT = logic 1;

− 1.0 − V

− 0.75 − V

gain = 2.0; note 4
input current clamp off − 5 100 nA
input capacitance − 715pF

1996 Feb 01 6

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital

TDA8707

interface

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

INPUT ISOLATION

α

ct

Outputs (R0 to R5: pins 38 and 40 to 44; G0 to G5: pins 3 to 8; B0 to B5: pins 14 to 16 and 18 to 20)

V

OL

V

OH

Switching characteristics

C

LOCK INPUT CLK (see Fig.3)

f

clk(max)

t

CPH

t

CPL

Analog signal processing (50% clock duty cycle) f

INEARITY

L
INL integral non-linearity ramp input; T

DNL differential non-linearity ramp input; T
BANDWIDTH (see Fig.5 and note 7)
B −3 dB analog bandwidth − 9 − MHz

t

STLH

t

STHL

HARMONICS; note 6
f

1

f

all

EFFECTIVE BITS
EB effective bits fi= 4.43 MHz − 5.3 − bits
DIFFERENTIAL GAIN; note 5
G

diff

DIFFERENTIAL PHASE; note 5

ϕ

diff

Timing (see Figs 3 and 4)
t

dS

t

h

t

d

t

r

t

f

t

CLP

crosstalk between INR, ING and INB −−−40 dB

LOW level output voltage 0 − 0.5 V
HIGH level output voltage 4.0 − V

DDD

V

maximum clock frequency 35 −−MHz
clock pulse width HIGH 10 −−ns
clock pulse width LOW 12 −−ns

= 35 MHz

clk

=25°C −±0.35 ±0.6 LSB

amb

=25°C −±0.35 ±0.6 LSB

amb

analog input settling time LOW-to-HIGH full scale square wave − 13 16 ns
analog input settling time HIGH-to-LOW full scale square wave − 11 14 ns

fundamental harmonic −−0dB
harmonics, all components −−37 − dB

differential gain PAL modulated ramp − 3 − %

differential phase PAL modulated ramp − 2 − deg

sampling delay time − 3 − ns
output hold time 6 −−ns
output delay time note 8 −−16 ns
clock rise time 3 5 − ns
clock fall time 3 5 − ns
active clamping duration 3 4 −µs

1996 Feb 01 7

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital

TDA8707

interface

Notes to the characteristics

1. V

2. The analog supply current is directly proportional to the series resistance between V

3. CREFH and CREFL are connected respectively to the top and bottom reference ladders of the 3 analog-to-digital

4. V

5. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a

6. V

7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale

8. Output data acquisition: output data is available after the maximum delay time of td.

Table 1 Typical output coding (V

DDA

and V

should be supplied from the same power supply and decoupled separately.

DDD

DDA

converters.

=(V

I(p-p)

active video signal amplitude V

REFL

− V

)/buffer gain factor. See Table for gain factor selection. When clamping at code 0 is used,

REFH

V

–()

REFHVREFL

should be:

ACT

V

ACT

=

---------------------------------------------- ­buffer gain factor

digital-to-analog converter.

= ∆REF with fi= 4.43 MHz.

I(p-p)

input (square-wave signal) in order to sample the signal and obtain correct output data.

T

amb

=25°C)

REFH

=2V; V

= 0.5 V referenced to V

REFL

, SLT = logic 0; buffer ratio = 1.5;

SSA

and CLREF.

STEP V

−

0 0.349 0 0 0 0 0 0
1 0.364 0 0 0 0 0 1

.......

62 1.317 1 1 1 1 1 0
63 1.333 1 1 1 1 1 1

−

Table 2 Mode selection

SLT BUFFER RATIO TYPICAL V

0 1.5

1 2.0

<0.333 =

>1.333 =

I(p-p)

V

REFL

----------------

1.5

V

REFH

-----------------

1.5

BINARY OUTPUT BITS

D5 D4 D3 D2 D1 D0

000000

111111

FULL SCALE

I(p-p)

V

–

REFHVREFL

--------------------------------------- -

1.5

V

–

REFHVREFL

--------------------------------------- -

2.0

1996 Feb 01 8

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

TIMING DIAGRAMS

t

handbook, full pagewidth

CLK

IN R, G, B

DATA
D0 to D5

sample N

t

dS

DATA

N - 2

t

CPH

CPL

sample N + 1

DATA

N - 1

sample N + 2

t

d

DATA

N

TDA8707

1.4 V

t

h

DATA
N + 1

2.4 V

1.4 V

0.4 V

MLB759

handbook, full pagewidth

digital
output

level

Fig.3 Input timing.

63

black-level

clamping

0

CLP

t

CLP

time

MGA922

Fig.4 Clamp timing.

1996 Feb 01 9

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

t

handbook, full pagewidth

code 64

code 0

CLK

MLD208

V

I

STLH

50 %

2 ns

50 %

0.5 ns

2 ns

t

STHL

50 %

50 %

TDA8707

0.5 ns

Fig.5 Analog input settling-time diagram.

1996 Feb 01 10

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

INTERNAL CIRCUITRY

V

DDD

V

SSD

V

DDA

V

SSAVSSA

TDA8707

(a)

V

SSA

V

SSA

(c) (d)

(a) Digital inputs; pins 10, 23 and 36.
(b) Analog inputs; pins 28, 31 and 34.
(c) Current reference; pin 24.
(d) Digital outputs; pins 3 to 8, 14 to 16, 18 to 20 and 40 to 44.

V

V

(b)

DDD

SSD

MGA925

Fig.6 Internal circuitry.

1996 Feb 01 11

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

APPLICATION INFORMATION

handbook, full pagewidth

R5 R4 R3 R2 R1

n.c.

n.c.

G0

G1

G2

G3

G4

1

2

3

4

5

6

7

TDA8707

TDA8707

35363738394041424344

V

SSA1

RED

34

22 nF

INR

100 nF

V

DDA1

33

V

SSA2

32

22 nF

ING

31

V

DDA2

30

V

SSA3

29

INB

28

V

DDA3

27

22 nF

GREEN

BLUE

100 nF

100 nF

SLTn.c.R0n.c.

V

SSD1

V

DDD1

8

9

10

11

n.c. n.c.

B0 B1

B2

n.c.

B3 B4 B5

100

nF

G5

CLK

5 V

Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally; also applicable to grounds.
The internal reference currents are set by the series resistor between pin V

The resistor value should be in the range of 12 kΩ and 15 kΩ.

DDA

It is recommended, if possible, to connect pins 1, 2, 12, 13, 17, 37 and 39 to V

and CLREF.

.

SSD

2221201918171615141312

V

SSD2VDDD2

100

nF

MGA926

CREFH

26

CREFL

25

CLREF

24

23

CLP

15 k

2 V

2.2 nF

0.5 V

Ω

5 V

Fig.7 Application diagram.

1996 Feb 01 12

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

PACKAGE OUTLINE

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

c

y

X

A

33 23

34

22

Z

E

TDA8707

SOT307-2

e

w M

b

p

pin 1 index

44

1

w M

b

0.25

p

D

H

D

cE

p

0.40

0.25

0.20

0.14

D

10.1

9.9

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.10

0.25

0.05

1.85

1.65

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

12

11

Z

D

B

v M

0 2.5 5 mm

scale

(1)

(1) (1)(1)

eH

H

D

10.1

9.9

12.9

0.8 1.3

12.3

v M

H

E

E

A

B

LLpQZywv θ

E

12.9

12.3

0.95

0.55

A

2

A

A

1

detail X

0.85

0.75

0.15 0.10.15

Q

(A )

3

θ

L

p

L

Z

E

D

1.2

0.8

1.2

0.8

o

10

o

0

OUTLINE
VERSION

SOT307-2

IEC JEDEC EIAJ

REFERENCES

1996 Feb 01 13

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-04

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital
interface

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

Reference Handbook”

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

“Quality

(order code 9397 750 00192).

TDA8707

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Feb 01 14

Philips Semiconductors Product specification

Triple RGB 6-bit video analog-to-digital

TDA8707

interface

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Feb 01 15

Philips Semiconductors – a worldwide company

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Tel. [phone], Fax. [phone]

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COPENHAGEN S, Tel. [phone], Fax. [phone]

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Germany: P.O. Box 10 51 40, 20035 HAMBURG,

Tel. [phone], Fax. [phone]

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

India: Philips INDIA Ltd, Shivsagar Estate, A Block,

Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. [phone], Fax. [phone]

th

floor, Suite 51,

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],
Fax. [phone]

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone]

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone]

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,

252148 KIEV, Tel.[phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

United States:811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCDS47 © Philips Electronics N.V. 1996

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537021/1100/03/pp16 Date of release: 1996 Feb 01
Document order number: 9397 750 00605