Datasheet TDA8702T, TDA8702 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8702

8-bit video digital-to-analog
converter

Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02

1996 Aug 23

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

FEATURES

• 8-bit resolution

• Conversion rate up to 30 MHz

• TTL input levels

• Internal reference voltage generator

• Two complementary analog voltage outputs

• No deglitching circuit required

• Internal input register

APPLICATIONS

• High-speed digital-to-analog conversion

• Digital TV including:

– field progressive scan
– line progressive scan

• Subscriber TV decoders

• Satellite TV decoders

• Digital VCRs.

• Low power dissipation

• Internal 75 Ω output load (connected to the analog

supply)

• Very few external components required.

GENERAL DESCRIPTION

The TDA8702 is an 8-bit Digital-to-Analog Converter
(DAC) for video and other applications. It converts the
digital input signal into an analog voltage output at a
maximum conversion rate of 30 MHz. No external
reference voltage is required and all digital inputs are TTL
compatible.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
V
I

CCA

I

CCD

V

CCA
CCD

OUT

− V

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current note 1 − 26 32 mA
digital supply current note 1 − 23 30 mA
full-scale analog output voltage

OUT

(peak-to-peak value)

note 2

=10kΩ−1.45 −1.60 −1.75 V

Z

L

=75kΩ−0.72 −0.80 −0.88 V

Z

L

ILE DC integral linearity error −−±1/2 LSB
DLE DC differential linearity error −−±1/2 LSB
f

CLK

B −3 dB analog bandwidth f
P

tot

maximum conversion rate −−30 MHz

= 30 MHz; note 3 − 150 − MHz

CLK

total power dissipation − 250 340 mW

Note

1. D0 to D7 connected to V

2. The analog output voltages (V
between V

and each of these outputs is typically 75 Ω.

CCA

and CLK connected to DGND.

CCD

OUT

and V

) are negative with respect to V

OUT

(see Table 1). The output resistance

CCA

3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input
code transition (code 0 to 255).

1996 Aug 23 2

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8702 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA8702T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

BLOCK DIAGRAM

CLK



1

REFERENCE

6
2

5

CLOCK INPUT

INTERFACE

BAND-GAP

CURRENT

REFERENCE

LOOP

CURRENT

GENERATORS

CURRENT

SWITCHES

16

V

CCA

75

75

Ω

Ω

15

V
V

OUT
OUT

14

handbook, full pagewidth

REF

100 nF

DGND
AGND

TDA8702/

TDA8702T

D1
D2
D3
D4
D5
D6

12
11
3
4
10
9
8
7

(LSB) D0

(MSB) D7

Fig.1 Block diagram.

1996 Aug 23 3

REGISTERS

DATA

INPUT

INTERFACE

13

MSA659

V

CCD

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

PINNING

SYMBOL PIN DESCRIPTION

REF 1 voltage reference (decoupling)
AGND 2 analog ground
D2 3 data input; bit 2
D3 4 data input; bit 3
CLK 5 clock input
DGND 6 digital ground
D7 7 data input; bit 7
D6 8 data input; bit 6
D5 9 data input; bit 5
D4 10 data input; bit 4
D1 11 data input; bit 1
D0 12 data input; bit 0
V

CCD

13 positive supply voltage for digital

circuits (+5 V)
V
V
V

OUT
OUT
CCA

14 analog voltage output
15 complementary analog voltage output
16 positive supply voltage for analog

circuits (+5 V)

handbook, halfpage

1

REF

2

AGND

D2

3
4

D3

CLK

DGND

D7

D6

TDA8702/

TDA8702T

5
6
7
8

MSA658

Fig.2 Pin configuration.

V

16

CCA

V

15

OUT

V

14

OUT

V

13

CCD

D0

12

D1

11

D4

10

D5

9

1996 Aug 23 4

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CCA

V

CCD

− V

V

CCA

CCD

AGND − DGND ground voltage differential −0.1 +0.1 V
V

I

I

OUT/IOUT

T

stg

T

amb

T

j

HANDLING

analog supply voltage −0.3 +7.0 V
digital supply voltage −0.3 +7.0 V
supply voltage differential −0.5 +0.5 V

input voltage (pins 3 to 5 and 7 to 12) −0.3 V

CCD

V
total output current (pins 14 and 15) −5 +26 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +125 °C

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL RESISTANCE

SYMBOL PARAMETER VALUE UNIT

R

th j-a

from junction to ambient in free air

SOT38-1 70 K/W
SOT162-1 90 K/W

1996 Aug 23 5

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

CHARACTERISTICS

V

CCA=V16

AGND by a 100 nF capacitor; T
(typical values measured at V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CCA

V

CCD

I

CCA

I

CCD

AGND − DGND ground voltage differential −0.1 − +0.1 V

Inputs

IGITAL INPUTS (D7 TO D0) AND CLOCK INPUT (CLK)

D
V

IL

V

IH

I

IL

I

IH

f

CLK

Outputs (note 2; referenced to V
V

OUT

V

OS

V

OUT

V

OS

B −3 dB analog bandwidth note 3; f
G

diff

Φ

diff

Z

O

Transfer function (f

ILE DC integral linearity error −−±1/2 LSB
DLE DC differential linearity error −−±1/2 LSB

− V2= 4.5 V to 5.5 V; V

amb

CCA=VCCD

CCD=V13

=0°C to +70 °C; AGND and DGND shorted together; unless otherwise specified

− V6= 4.5 V to 5.5 V; V

= 5 V and T

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current note 1 − 26 32 mA
digital supply current note 1 − 23 30 mA

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V
LOW level input current VI= 0.4 V −−0.3 −0.4 mA
HIGH level input current VI= 2.7 V − 0.01 20 µA
maximum clock frequency −−30 MHz

)

CCA

− V

OUT

full-scale analog output voltages
(peak-to-peak value)

analog offset output voltage code = 0 −−3−25 mV

/TC full-scale analog output voltage

temperature coefficient

/TC analog offset output voltage

temperature coefficient

differential gain − 0.6 − %
differential phase − 1 − deg
output impedance − 75 −Ω

= 30 MHz)

CLK

amb

=25°C).

CCA

− V

= −0.5 V to +0.5 V; V

CCD

REF

ZL=10kΩ−1.45 −1.60 −1.75 V

=75Ω−0.72 −0.80 −0.88 V

Z

L

−−200 µV/K

−−20 µV/K

= 30 MHz − 150 − MHz

CLK

decoupled to

V

CCD

1996 Aug 23 6

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Switching characteristics (f

t

SU;DAT

t

HD;DAT

t

PD

t

S1

data set-up time −0.3 −−ns
data hold time 2.0 −−ns
propagation delay time −−1.0 ns
settling time 10% to 90% full-scale

= 30 MHz); notes 4 and 5; see Figs 3, 4 and 5

CLK

− 1.1 1.5 ns

change to ±1 LSB

t

S2

settling time 10% to 90% full-scale

− 6.5 8.0 ns

change to ±1 LSB

t

d

Output transients (glitches; (f

E

g

input to 50% output delay time − 3.0 5.0 ns

= 30 MHz); note 6; see Fig.6

CLK

glitch energy from code transition 127 to 128 −−30 LSB.ns

Note

1. D0 to D7 are connected to V

2. The analog output voltages (V
between V

and each of these outputs is 75 Ω (typ.).

CCA

, CLK is connected to DGND.

CCD

OUT

and V

are negative with respect to V

OUT

(see Table 1). The output resistance

CCA

3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input
code transition (code 0 to 255).

4. The worst case characteristics are obtained at the transition from input code 0 to 255 and if an external load
impedance greater than 75 Ω is connected between V
measured with an active probe between V

and AGND. No further load impedance between V

OUT

OUT

or V

OUT

and V

. The specified values have been

CCA

and AGND has

OUT

been applied. All input data is latched at the rising edge of the clock. The output voltage remains stable (independent
of input data variations) during the HIGH level of the clock (CLK = HIGH). During a LOW-to-HIGH transition of the
clock (CLK = LOW), the DAC operates in the transparent mode (input data will be directly transferred to their
corresponding analog output voltages (see Fig.5).

5. The data set-up (t

) is the minimum period preceding the rising edge of the clock that the input data must be

SU;DAT

stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the rising
edge of the clock and still be recognized. The data hold time (t

) is the minimum period following the rising edge

HD;DAT

of the clock that the input data must be stable in order to be correctly registered. A negative hold time indicates that
the data may be released prior to the rising edge of the clock and still be recognized.

6. The definition of glitch energy and the measurement set-up are shown in Fig.6. The glitch energy is measured at the
input transition between code 127 to 128 and on the falling edge of the clock.

1996 Aug 23 7

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

Table 1 Input coding and output voltages (typical values; referenced to V

, regardless of the offset voltage)

CCA

DAC OUTPUT VOLTAGES

CODE

INPUT DATA

(D7 TO D0)

V

OUT

Z

=10KΩ ZL=75Ω

L

V

OUT

V

OUT

0 000 00 00 0 −1.6 0 −0.8
1 000 000 01 −0.006 −1.594 −0.003 −0.797

. ........

128 100 000 00 −0.8 −0.8 −0.4 −0.4

. ........

254 111 111 10 −1.594 −0.006 −0.797 −0.003
255 111 111 11 −1.6 0 −0.8 0

handbook, full pagewidth

input data

t

SU; DAT

stable

t

HD; DAT

3.0 V

1.3 V
0 V

V

OUT

3.0 V

CLK

MBC912

The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within 0.3 ns after the
first rising edge of the clock (t

is negative; −0.3ns). Data must be held at least 2 ns after the rising edge (t

SU;DAT

HD;DAT

= +2ns).

1.3 V
0 V

Fig.3 Data set-up and hold times.

1996 Aug 23 8

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

handbook, full pagewidth

input data
(example of a
full-scale input
transition)

CLK

code 0

1.3 V

1 LSB

V

CCA

(code 0)

t

d

V

OUT

t

S1

t

PD

t

S2

Fig.4 Switching characteristics.

1.3 V

code 255

1 LSB

MBC913

10 %

50 %

90 %

V

1.6 V

CCA

(code 255)

handbook, full pagewidth

During the transparent mode (CLK =LOW), any change of input data will be seen at the output. During the latched mode (CLK = HIGH), the analog
output remains stable regardless of any change at the input. A change of input data during the latched mode will be seen on the falling edge of the clock
(beginning of the transparent mode).

CLK

input
codes

analog
output
voltage

MBC914 - 1

V

OUT

transparent

mode

transparent

mode

latched

mode

latched mode

(stable output)

1.3 V

beginning of

transparent

mode

Fig.5 Latched and transparent mode.

1996 Aug 23 9

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

handbook, full pagewidth

HP8082A

HP8082A

PULSE

GENERATOR

(SLAVE)

PULSE

GENERATOR

(SLAVE)

DIVIDER

( 10)

V

OUT

f

CLK/10

(2)

f

CLK/10

(1)

f

CLK

(3)

code 128

D7 MSB
D6
D5

D4

TDA8702/

D3

TDA8702T

D2
D1
D0 (LSB)

PULSE

GENERATOR

(MASTER)

MODEL EH107

code 127

f

time

V
V

CLK

OUT
OUT

1 LSB

TEK P6201 TEK7104 and TEK7A26

clock

3

1

2

DYNAMIC

PROBE

R = 100 kΩ
C = 3 pF

timing diagram

OSCILLO-

SCOPE

bandwidth = 20 MHz

MSA660

The value of the glitch energy is the sum of the shaded area measured in LSB.ns.

Fig.6 Glitch energy measurement.

1996 Aug 23 10

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

INTERNAL PIN CONFIGURATIONS

handbook, full pagewidth

V

CCA

REF

AGND

V

REF

regulation loop

MBC911 - 1

Fig.7 Reference voltage generator decoupling.

output current
generators

handbook, halfpage

DGND

AGND

substrate

MBC908

Fig.8 AGND and DGND.

1996 Aug 23 11

handbook, halfpage

V

CCA

D0 to D7,
CLK

AGND

Fig.9 D7 to D0 and CLK.

MBC910

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

handbook, halfpage

V

CCA

75 Ω75 Ω

V

handbook, halfpage

V

CCD

V

OUT

OUT

handbook, halfpage

DGND

MBC907

Fig.10 Digital supply.

V

CCA

AGND

MBC909 - 1

bit

n

switches and

current generators

Fig.11 Analog outputs.

bit
n

AGND

MBC906

Fig.12 Analog supply.

1996 Aug 23 12

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

APPLICATION INFORMATION

Additional application information will be supplied upon request (please quote number FTV/8901).

handbook, halfpage

(1) This is a recommended value for decoupling pin 1.

100 nF

AGND

Fig.13 Analog output voltage without external load (VO= −V

(1)

REF

TDA8702/

TDA8702T

V

V

V

CCA

OUT

OUT

MSA661

V

O

; see Table 1, ZL=10kΩ).

OUT

handbook, full pagewidth

AGND

(1) This is a recommended value for decoupling pin 1.

100 nF

(1)

REF

TDA8702/

TDA8702T

V

V

CCA

OUT

Fig.14 Analog output voltage with external load (external load ZL=75Ωto ∞).

1996 Aug 23 13

MSA662

()

VOZL/

Z

L

75Z

L

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

handbook, halfpage

(1) This is a recommended value for decoupling pin 1.

100 nF

AGND

MSA663

Fig.15 Analog output with AGND as reference.

(1)

REF

TDA8702/

TDA8702

V

OUT

100 µF

75 Ω

V

CCA

AGND

V

O

2

handbook, full pagewidth

TDA8702

V

OUT

(pin 15)

or

V

OUT

(pin 14)

100 µF

390 Ω

Fig.16 Example of anti-aliasing filter (analog output referenced to AGND).

1996 Aug 23 14

10 µH 12 µH

27 pF 12 pF

39 pF 100 pF 56 pF

390 Ω

V

MSA665

o

[390/(780+75)]

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

Characteristics

Order 5; adapted CHEBYSHEV.
Ripple at ≤0.1 dB.
f

= 6.7 MHz.

(−3 dB)

f

= 9.7 MHz and 13.3 MHz.

(NOTCH)

30

MSA657

f (MHz)

i

handbook, halfpage

0

α

(dB)

20

40

60

80

100

01020 40

Fig.17 Frequency response for filter shown in Fig.16.

handbook, full pagewidth

AGND

(1) This is a recommended value for decoupling pin 1.

100 nF

(1)

REF

TDA8702/

TDA8702T

V

V

100 µF

OUT

OUT

100 µF

Fig.18 Differential mode (improved supply voltage ripple rejection).

1996 Aug 23 15

R1

R1

R2

R2

AGND

2 X V (R2/R1)

O

MSA664

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

pin 1 index

e

b

b

1

9

A

1

w M

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

E

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

1996 Aug 23 16

8

6.48

6.20

0.26

0.24

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

(1)

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

8

w M

b

p

SOT162-1

E

H

E

Q

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT162-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013AA

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

7.4

0.30

0.29

1.27

0.050

10.1

0.41

0.40

REFERENCES

1996 Aug 23 17

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

92-11-17

95-01-24

o

8

o

0

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WA VE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Aug 23 18

Philips Semiconductors Product specification

8-bit video digital-to-analog converter TDA8702

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Aug 23 19