Datasheet TDA8601 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8601
RGB/YUV and fast blanking switch
Product specification Supersedes data of July 1994 File under Integrated Circuits, IC02
1996 Jun 27
Page 2
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
FEATURES
YUV/RGB and fast blanking switch
3-state output
Selectable clamp:
– passive (with diodes) or – active clamp
Bandwidth greater than 22 MHz
Fully ESD protected
Latch-up free.
GENERAL DESCRIPTION
The device is intended for switching between two RGB or YUV video sources. The outputs can be set to a high-impedance state to enable parallel connection of several devices.
A HIGH level on SEL (pin 5) selects the video inputs of Channel 2. The IOCNTR control pin (pin 16) defines the 3-state outputs and clamp inputs:
HIGH = 3-state outputs (also for test; active clamp)
LOW = passive clamp at the video inputs (diode)
Sandcastle: the video signal is clamped with an active
APPLICATIONS
clamp during the sync pulse.
Standard and high definition television sets
Peri-television sets.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
G
v
supply voltage 7.2 8.0 8.8 V voltage gain 0.5 0 +0.5 dB
B bandwidth at 3 dB 22 −−MHz
α
ct
crosstalk attenuation between two
fi= 5 MHz 60 −−dB
video channels
T
amb
operating ambient temperature 0 70 °C
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA8601 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA8601T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
Page 3
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
BLOCK DIAGRAM
Fig.1 Block diagram.
Page 4
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
PINNING
SYMBOL PIN DESCRIPTION
V
P
VIDIa1 2 video input a (channel 1) VIDIb1 3 video input b (channel 1) VIDIc1 4 video input c (channel 1) SEL 5 channel selection VIDIa2 6 video input a (channel 2) VIDIb2 7 video input b (channel 2) VIDIc2 8 video input c (channel 2) GND 9 ground VIDOc 10 video output c VIDOb 11 video output b VIDOa 12 video output a FBO 13 fast blanking output signal FBI2 14 fast blanking input signal
FBI1 15 fast blanking input signal
IOCNTR 16 control of video input or video
1 supply voltage (8 V)
(channel 2)
(channel 1)
Fig.2 Pin configuration.
output
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
P
V
i
T
j
T
stg
supply voltage 0.3 +12 V input voltage (pins 2 to 4 and 6 to 8) referenced to ground 0 8.8 V junction temperature 150 °C IC storage temperature 55 +150 °C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices.
ESD in accordance with
“MIL STD 883C” -“Method 3015”
:
1. Human body model: 1500 , 100 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. Class 2: 2000 to 3999 V.
2. Machine model: 0 , 200 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. The IC withstands 200 V.
Page 5
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
OPERATING CHARACTERISTICS
The operating characteristics are the conditions within the IC when it is functional; these conditions can have any value. For example, condition V
voltage range.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
Video inputs (pins 1 to 3 and 6 to 8)
V
i(p-p)
C
i
Control inputs (pins 5 and 16)
V
IH
V
IL
V
IH
V
IL
V
sc
t
W
thermal resistance from junction to ambient in free air
DIP16 70 K/W SO16 115 K/W
(pin 5) is fixed at 0.5 V. The IC will then operate over the full temperature range and supply
IL
supply voltage 7.2 8.0 8.8 V
input video signal amplitude (peak-to-peak value)
R, G, B signals 0.7 1 V Y signal; active clamp 1 1.4 V
(B Y) signal; active clamp 1.05 1.5 V
(R Y) signal; active clamp 1.33 1.9 V
input clamp capacitor 47 nF
HIGH level input voltage (pin 5) IIH=10µA 0.9 V
P
V LOW level input voltage (pin 5) IIL= 10 µA −−0.5 V HIGH level input voltage (pin 16) IIH=10µA 2.0 V
P
V LOW level input voltage (pin 16) IIL= 10 µA −−0.8 V sandcastle input voltage level
(pin 16)
zero level −−1.1 V blanking level 2.0 3.1 V clamp level 3.9 5.5 V
clamp pulse width SECAM mode 3.6 −µs
PAL mode 2.5 −µs
Fast blanking inputs (pins 14 and 15)
V
IH
V
IL
HIGH level input voltage 0.95 V LOW level input voltage −−0.5 V
Video outputs (pins 10 to 12)
C
L
R
L
output load capacitor 40 100 pF output load resistor note 1 1 −−k
P
V
Page 6
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT
Fast blanking output (pin 13)
C
L
R
L
Note
1. For the DIP16 package, the thermal resistance is lower. The minimum value for the output load resistor is 270 .
CHARACTERISTICS
The typical values are given for V Fig.8 over full supply voltage and temperature range; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply
I
P
SVRR supply voltage rejection ratio f
Video inputs (pins 1 to 3 and 4 to 6)
R
i
C
i(max)
V
clamp
I
sink
I
clamp
output load capacitor 40 100 pF output load resistor note 1 1 −−k
=8V; T
P
supply current no resistive load on the
=25°C. CL= 40 pF; no load resistor; measured in application circuit of
amb
33 40 mA
outputs
= 40 Hz to 50 kHz; note 1 −−−36 dB
i
f
= 40 Hz; note 1 −−51 36 dB
i
input resistance for each type of clamp 10 −−k maximum input capacitance 3 pF input clamping voltage level Ii= 50 mA; passive clamp 1.05 1.21 1.35 V
I
= 50 mA; active clamp;
i
V I
i
V
= 3.9 V
IOCNTR
= 50 mA; active clamp;
= 3.9 V
IOCNTR
2.05 2.42 2.70 V
2.05 2.37 2.70 V
input sink current Vi= 2 V; passive clamp 0.5 1.6 3 µA
maximum absolute input clamping
current
Vi=V
clamp
active clamp
+ 0.5 V;
200 −−µA
Page 7
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Video outputs (pins 10 to 12)
R
o
R
oZ
C
oZ(max)
G
v
B bandwidth at ±0.5 dB 5 −−MHz
α
ct
α
off
SR slew rate 100 120 V/µs ∆Gm gain matching between two
V
o(bl)
V
os(bl)
V
os(bl)
output resistance −−50 output resistance 3-state output 0.1 −−M maximum output capacitance 3-state output 3 pF voltage gain fi= 1 MHz 0.5 0 +0.5 dB
at ±1dB 10 −−MHz at ±3dB 22 40 MHz
crosstalk attenuation between two video channels
isolation of the 3-state configuration
fi= 5 MHz; note 2 60 −−dB f
= 10 MHz; note 2 50 −−dB
i
f
= 22 MHz; note 2 40 −−dB
i
fi= 5 MHz; note 2 60 −−dB f
= 10 MHz; note 2 50 −−dB
i
f
= 22 MHz; note 2 40 −−dB
i
fi= 5 MHz −−0.5 dB different signals of the same channel
output blanking level voltage 2.1 2.23 2.7 V output blanking offset voltage V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−5mV
active clamp; note 3
V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−15 mV
passive clamp; note 3 matching of output blanking offset
voltage
V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−5mV
active clamp; note 3
V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−5mV
passive clamp; note 3
Fast blanking inputs (pins 14 and 15)
Z
i
input impedance 10 −−k
Fast blanking output (pin 13)
V
OH
V
OL
Z
o
HIGH level output voltage 2 2.35 3 V LOW level output voltage 0 0.15 0.3 V output impedance −−50
SEL input (pin 5)
Z
i
input impedance 10 −−k
Page 8
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Timing
t
dSEL;VID
t
dSEL;FBO
t
SWVID
t
SWFBO
t
dFB
t
dVID
t
dVID
t
dFB;VID
delay time between SEL input and video output
delay time between SEL input and fast blanking output
switching time of video output note 4 8.5 15 ns switching time of fast blanking
output fast blanking level delay between
input and output video delay between input and
output delay difference between two
video signals at the output delay difference between fast
blanking level and video at the output
note 4 12 20 ns
note 5 15 40 ns
note 5 8.5 15 ns
note 6 13 20 ns
note 7 420ns
note 7 0.5 10 ns
note 7 510ns
Notes
1. The supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on the power supply pin (pin 1); where: VDC= 8 V; Vi= 100 mV (p-p). This additional sine wave on the power supply pin is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals.
2. The 6 video inputs will contain the same signal. The source impedance is 50 .
3. The blanking offset is the level difference between the two channels when they are selected separately and, also, on one video output. This value is measured on each video signal.
4. The delay between the SEL input and the video output together with the switching time of the video output is illustrated in Fig.3. The amplitude of the video signal is 1.9 V (p-p) when the clamp is active and 1.0 V (p-p) when the clamp is passive.
5. The delay between the SEL input and fast blanking output together with the switching time of fast blanking output is illustrated in Fig.4.
6. The fast blanking delay between input and output is illustrated in Fig.5.
7. The video delay between input and output and delay differences are illustrated in Fig.6. Inputs 1 and 2 are either fast blanking input plus a video signal or two video signals. The amplitude of the video signal is 0.5 V (p-p). The video signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. The fast blanking signal levels (i1 and o1) are 0.95 V when the signal rises and 0.5 V when the signal falls.
Page 9
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
Fig.3 Timing definition: SEL and VIDO.
Fig.4 Timing definition: SEL and FBO.
Page 10
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
Fig.5 Timing definition: fast blanking delay.
Fig.6 Timing definition: video delay.
1996 Jun 27 10
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Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
INTERNAL PIN CONFIGURATION
Fig.7 Internal pin configuration.
1996 Jun 27 11
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Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
APPLICATION INFORMATION
Fig.8 Application diagram.
1996 Jun 27 12
Page 13
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
Fig.9 Schematic diagram of two TDA8601s operating four channels.
1996 Jun 27 13
Page 14
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
1
w M
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
E
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
1
0.53
0.38
0.021
0.015
cEe M
0.32
0.23
0.013
0.009
REFERENCES
(1) (1)
D
21.8
21.4
0.86
0.84
1996 Jun 27 14
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.54 7.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02 95-01-19
Z
max.
2.2
0.087
(1)
Page 15
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
pin 1 index
1
e
9
8
w M
b
p
SOT109-1
E
H
E
A
2
A
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE VERSION
SOT109-1
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
3
0.25
0.01
IEC JEDEC EIAJ
076E07S MS-012AC
b
p
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
10.0
4.0
3.8
0.16
0.15
1.27
0.050
9.8
0.39
0.38
REFERENCES
1996 Jun 27 15
eHELLpQZywv θ
1.05
0.041
1.0
0.4
0.039
0.016
0.7
0.25
0.6
0.028
0.01 0.004
0.020
EUROPEAN
PROJECTION
0.25 0.1
0.01
0.7
0.3
0.028
0.012
ISSUE DATE
95-01-23 97-05-22
o
8
o
0
6.2
5.8
0.244
0.228
Page 16
Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WA VE The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
AVE SOLDERING
W Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
1996 Jun 27 16
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Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jun 27 17
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Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
NOTES
1996 Jun 27 18
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Philips Semiconductors Product specification
RGB/YUV and fast blanking switch TDA8601
NOTES
1996 Jun 27 19
Page 20
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© Philips Electronics N.V. 1996 SCA50 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands 537021/25/02/pp20 Date of release: 1996 Jun 27 Document order number: 9397 750 00932
Internet: http://www.semiconductors.philips.com/ps/ (1) TDA8601_2 June 26, 1996 11:51 am
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