Datasheet TDA8601 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8601

RGB/YUV and fast blanking switch

Product specification
Supersedes data of July 1994
File under Integrated Circuits, IC02

1996 Jun 27

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

FEATURES

• YUV/RGB and fast blanking switch

• 3-state output

• Selectable clamp:

– passive (with diodes) or
– active clamp

• Bandwidth greater than 22 MHz

• Fully ESD protected

• Latch-up free.

GENERAL DESCRIPTION

The device is intended for switching between two RGB or
YUV video sources. The outputs can be set to a
high-impedance state to enable parallel connection of
several devices.

A HIGH level on SEL (pin 5) selects the video inputs of
Channel 2. The IOCNTR control pin (pin 16) defines the
3-state outputs and clamp inputs:

• HIGH = 3-state outputs (also for test; active clamp)

• LOW = passive clamp at the video inputs (diode)

• Sandcastle: the video signal is clamped with an active

APPLICATIONS

clamp during the sync pulse.

• Standard and high definition television sets

• Peri-television sets.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

G

v

supply voltage 7.2 8.0 8.8 V
voltage gain −0.5 0 +0.5 dB

B bandwidth at 3 dB 22 −−MHz

α

ct

crosstalk attenuation between two

fi= 5 MHz −60 −−dB

video channels

T

amb

operating ambient temperature 0 − 70 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8601 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

TDA8601T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1996 Jun 27 2

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

BLOCK DIAGRAM

Fig.1 Block diagram.

1996 Jun 27 3

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

PINNING

SYMBOL PIN DESCRIPTION

V

P

VIDIa1 2 video input a (channel 1)
VIDIb1 3 video input b (channel 1)
VIDIc1 4 video input c (channel 1)
SEL 5 channel selection
VIDIa2 6 video input a (channel 2)
VIDIb2 7 video input b (channel 2)
VIDIc2 8 video input c (channel 2)
GND 9 ground
VIDOc 10 video output c
VIDOb 11 video output b
VIDOa 12 video output a
FBO 13 fast blanking output signal
FBI2 14 fast blanking input signal

FBI1 15 fast blanking input signal

IOCNTR 16 control of video input or video

1 supply voltage (8 V)

(channel 2)

(channel 1)

Fig.2 Pin configuration.

output

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

V

i

T

j

T

stg

supply voltage −0.3 +12 V
input voltage (pins 2 to 4 and 6 to 8) referenced to ground 0 8.8 V
junction temperature − 150 °C
IC storage temperature −55 +150 °C

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.

ESD in accordance with

“MIL STD 883C” -“Method 3015”

:

1. Human body model: 1500 Ω, 100 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground.
Class 2: 2000 to 3999 V.

2. Machine model: 0 Ω, 200 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. The IC
withstands 200 V.

1996 Jun 27 4

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

OPERATING CHARACTERISTICS

The operating characteristics are the conditions within the IC when it is functional; these conditions can have any value.
For example, condition V

voltage range.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

Video inputs (pins 1 to 3 and 6 to 8)

V

i(p-p)

C

i

Control inputs (pins 5 and 16)

V

IH

V

IL

V

IH

V

IL

V

sc

t

W

thermal resistance from junction to ambient in free air

DIP16 70 K/W
SO16 115 K/W

(pin 5) is fixed at 0.5 V. The IC will then operate over the full temperature range and supply

IL

supply voltage 7.2 8.0 8.8 V

input video signal amplitude
(peak-to-peak value)

R, G, B signals − 0.7 1 V
Y signal; active clamp − 1 1.4 V

−(B − Y) signal; active clamp − 1.05 1.5 V

−(R − Y) signal; active clamp − 1.33 1.9 V

input clamp capacitor − 47 − nF

HIGH level input voltage (pin 5) IIH=10µA 0.9 − V

P

V
LOW level input voltage (pin 5) IIL= −10 µA −−0.5 V
HIGH level input voltage (pin 16) IIH=10µA 2.0 − V

P

V
LOW level input voltage (pin 16) IIL= −10 µA −−0.8 V
sandcastle input voltage level

(pin 16)

zero level −−1.1 V
blanking level 2.0 − 3.1 V
clamp level 3.9 − 5.5 V

clamp pulse width SECAM mode − 3.6 −µs

PAL mode − 2.5 −µs

Fast blanking inputs (pins 14 and 15)

V

IH

V

IL

HIGH level input voltage 0.95 − V
LOW level input voltage −−0.5 V

Video outputs (pins 10 to 12)

C

L

R

L

output load capacitor − 40 100 pF
output load resistor note 1 1 −−kΩ

1996 Jun 27 5

P

V

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT

Fast blanking output (pin 13)

C

L

R

L

Note

1. For the DIP16 package, the thermal resistance is lower. The minimum value for the output load resistor is 270 Ω.

CHARACTERISTICS

The typical values are given for V
Fig.8 over full supply voltage and temperature range; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

I

P

SVRR supply voltage rejection ratio f

Video inputs (pins 1 to 3 and 4 to 6)

R

i

C

i(max)

V

clamp

I

sink

I

clamp

output load capacitor − 40 100 pF
output load resistor note 1 1 −−kΩ

=8V; T

P

supply current no resistive load on the

=25°C. CL= 40 pF; no load resistor; measured in application circuit of

amb

− 33 40 mA

outputs

= 40 Hz to 50 kHz; note 1 −−−36 dB

i

f

= 40 Hz; note 1 −−51 −36 dB

i

input resistance for each type of clamp 10 −−kΩ
maximum input capacitance − 3 − pF
input clamping voltage level Ii= −50 mA; passive clamp 1.05 1.21 1.35 V

I

= 50 mA; active clamp;

i

V
I

i

V

= 3.9 V

IOCNTR

= −50 mA; active clamp;

= 3.9 V

IOCNTR

2.05 2.42 2.70 V

2.05 2.37 2.70 V

input sink current Vi= 2 V; passive clamp 0.5 1.6 3 µA

 maximum absolute input clamping

current

Vi=V

clamp

active clamp

+ 0.5 V;

200 −−µA

1996 Jun 27 6

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Video outputs (pins 10 to 12)

R

o

R

oZ

C

oZ(max)

G

v

B bandwidth at ±0.5 dB 5 −−MHz

α

ct

α

off

SR slew rate 100 120 − V/µs
∆Gm gain matching between two

V

o(bl)

V

os(bl)

∆V

os(bl)

output resistance −−50 Ω
output resistance 3-state output 0.1 −−MΩ
maximum output capacitance 3-state output − 3 − pF
voltage gain fi= 1 MHz −0.5 0 +0.5 dB

at ±1dB 10 −−MHz
at ±3dB 22 40 − MHz

crosstalk attenuation between two
video channels

isolation of the 3-state
configuration

fi= 5 MHz; note 2 −60 −−dB
f

= 10 MHz; note 2 −50 −−dB

i

f

= 22 MHz; note 2 −40 −−dB

i

fi= 5 MHz; note 2 −60 −−dB
f

= 10 MHz; note 2 −50 −−dB

i

f

= 22 MHz; note 2 −40 −−dB

i

fi= 5 MHz −−0.5 dB
different signals of the same
channel

output blanking level voltage 2.1 2.23 2.7 V
output blanking offset voltage V

= 0.7 V (p-p) (white);

i(ch1)

V

= 0 V (p-p) (black);

i(ch2)

−−5mV

active clamp; note 3

V

= 0.7 V (p-p) (white);

i(ch1)

V

= 0 V (p-p) (black);

i(ch2)

−−15 mV

passive clamp; note 3
matching of output blanking offset

voltage

V

= 0.7 V (p-p) (white);

i(ch1)

V

= 0 V (p-p) (black);

i(ch2)

−−5mV

active clamp; note 3

V

= 0.7 V (p-p) (white);

i(ch1)

V

= 0 V (p-p) (black);

i(ch2)

−−5mV

passive clamp; note 3

Fast blanking inputs (pins 14 and 15)

Z

i

input impedance 10 −−kΩ

Fast blanking output (pin 13)

V

OH

V

OL

Z

o

HIGH level output voltage 2 2.35 3 V
LOW level output voltage 0 0.15 0.3 V
output impedance −−50 Ω

SEL input (pin 5)

Z

i

input impedance 10 −−kΩ

1996 Jun 27 7

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Timing

t

dSEL;VID

t

dSEL;FBO

t

SWVID

t

SWFBO

t

dFB

t

dVID

∆t

dVID

∆t

dFB;VID

delay time between SEL input and
video output

delay time between SEL input and
fast blanking output

switching time of video output note 4 − 8.5 15 ns
switching time of fast blanking

output
fast blanking level delay between

input and output
video delay between input and

output
delay difference between two

video signals at the output
delay difference between fast

blanking level and video at the
output

note 4 − 12 20 ns

note 5 − 15 40 ns

note 5 − 8.5 15 ns

note 6 − 13 20 ns

note 7 − 420ns

note 7 − 0.5 10 ns

note 7 − 510ns

Notes

1. The supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on
the power supply pin (pin 1); where: VDC= 8 V; Vi= 100 mV (p-p). This additional sine wave on the power supply pin
is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals.

2. The 6 video inputs will contain the same signal. The source impedance is 50 Ω.

3. The blanking offset is the level difference between the two channels when they are selected separately and, also, on
one video output. This value is measured on each video signal.

4. The delay between the SEL input and the video output together with the switching time of the video output is
illustrated in Fig.3. The amplitude of the video signal is 1.9 V (p-p) when the clamp is active and 1.0 V (p-p) when the
clamp is passive.

5. The delay between the SEL input and fast blanking output together with the switching time of fast blanking output is
illustrated in Fig.4.

6. The fast blanking delay between input and output is illustrated in Fig.5.

7. The video delay between input and output and delay differences are illustrated in Fig.6. Inputs 1 and 2 are either fast
blanking input plus a video signal or two video signals. The amplitude of the video signal is 0.5 V (p-p). The video
signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. The fast blanking signal levels (i1 and o1) are 0.95 V
when the signal rises and 0.5 V when the signal falls.

1996 Jun 27 8

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

Fig.3 Timing definition: SEL and VIDO.

Fig.4 Timing definition: SEL and FBO.

1996 Jun 27 9

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

Fig.5 Timing definition: fast blanking delay.

Fig.6 Timing definition: video delay.

1996 Jun 27 10

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

INTERNAL PIN CONFIGURATION

Fig.7 Internal pin configuration.

1996 Jun 27 11

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

APPLICATION INFORMATION

Fig.8 Application diagram.

1996 Jun 27 12

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

Fig.9 Schematic diagram of two TDA8601s operating four channels.

1996 Jun 27 13

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

pin 1 index

e

b

b

1

9

A

1

w M

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

E

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

1

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

1996 Jun 27 14

8

6.48

6.20

0.26

0.24

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

(1)

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

pin 1 index

1

e

9

8

w M

b

p

SOT109-1

E

H

E

A

2

A

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT109-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

3

0.25

0.01

IEC JEDEC EIAJ

076E07S MS-012AC

b

p

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

4.0

3.8

0.16

0.15

1.27

0.050

9.8

0.39

0.38

REFERENCES

1996 Jun 27 15

eHELLpQZywv θ

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.020

EUROPEAN

PROJECTION

0.25 0.1

0.01

0.7

0.3

0.028

0.012

ISSUE DATE

95-01-23
97-05-22

o

8

o

0

6.2

5.8

0.244

0.228

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Jun 27 16

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Jun 27 17

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

NOTES

1996 Jun 27 18

Philips Semiconductors Product specification

RGB/YUV and fast blanking switch TDA8601

NOTES

1996 Jun 27 19

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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 537021/25/02/pp20 Date of release: 1996 Jun 27 Document order number: 9397 750 00932

Internet: http://www.semiconductors.philips.com/ps/
(1) TDA8601_2 June 26, 1996 11:51 am