Product specification
Supersedes data of July 1994
File under Integrated Circuits, IC02
1996 Jun 27
Page 2
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
FEATURES
• YUV/RGB and fast blanking switch
• 3-state output
• Selectable clamp:
– passive (with diodes) or
– active clamp
• Bandwidth greater than 22 MHz
• Fully ESD protected
• Latch-up free.
GENERAL DESCRIPTION
The device is intended for switching between two RGB or
YUV video sources. The outputs can be set to a
high-impedance state to enable parallel connection of
several devices.
A HIGH level on SEL (pin 5) selects the video inputs of
Channel 2. The IOCNTR control pin (pin 16) defines the
3-state outputs and clamp inputs:
• HIGH = 3-state outputs (also for test; active clamp)
• LOW = passive clamp at the video inputs (diode)
• Sandcastle: the video signal is clamped with an active
APPLICATIONS
clamp during the sync pulse.
• Standard and high definition television sets
• Peri-television sets.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
G
v
supply voltage7.28.08.8V
voltage gain−0.50+0.5dB
Bbandwidthat 3 dB22−−MHz
α
ct
crosstalk attenuation between two
fi= 5 MHz−60−−dB
video channels
T
amb
operating ambient temperature0−70°C
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
PACKAGE
TDA8601DIP16plastic dual in-line package; 16 leads (300 mil); long bodySOT38-1
TDA8601TSO16plastic small outline package; 16 leads; body width 3.9 mmSOT109-1
1996 Jun 272
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Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
BLOCK DIAGRAM
Fig.1 Block diagram.
1996 Jun 273
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Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
PINNING
SYMBOLPINDESCRIPTION
V
P
VIDIa12video input a (channel 1)
VIDIb13video input b (channel 1)
VIDIc14video input c (channel 1)
SEL5channel selection
VIDIa26video input a (channel 2)
VIDIb27video input b (channel 2)
VIDIc28video input c (channel 2)
GND9ground
VIDOc10video output c
VIDOb11video output b
VIDOa12video output a
FBO13fast blanking output signal
FBI214fast blanking input signal
FBI115fast blanking input signal
IOCNTR16control of video input or video
1supply voltage (8 V)
(channel 2)
(channel 1)
Fig.2 Pin configuration.
output
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
P
V
i
T
j
T
stg
supply voltage−0.3+12V
input voltage (pins 2 to 4 and 6 to 8) referenced to ground08.8V
junction temperature−150°C
IC storage temperature−55+150°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
ESD in accordance with
“MIL STD 883C” -“Method 3015”
:
1. Human body model: 1500 Ω, 100 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground.
Class 2: 2000 to 3999 V.
2. Machine model: 0 Ω, 200 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. The IC
withstands 200 V.
1996 Jun 274
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Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUE UNIT
R
th j-a
OPERATING CHARACTERISTICS
The operating characteristics are the conditions within the IC when it is functional; these conditions can have any value.
For example, condition V
voltage range.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
P
Video inputs (pins 1 to 3 and 6 to 8)
V
i(p-p)
C
i
Control inputs (pins 5 and 16)
V
IH
V
IL
V
IH
V
IL
V
sc
t
W
thermal resistance from junction to ambient in free air
DIP1670K/W
SO16115K/W
(pin 5) is fixed at 0.5 V. The IC will then operate over the full temperature range and supply
IL
supply voltage7.28.08.8V
input video signal amplitude
(peak-to-peak value)
R, G, B signals−0.71V
Y signal; active clamp−11.4V
−(B − Y) signal; active clamp −1.051.5V
−(R − Y) signal; active clamp −1.331.9V
input clamp capacitor−47−nF
HIGH level input voltage (pin 5)IIH=10µA0.9−V
P
V
LOW level input voltage (pin 5)IIL= −10 µA−−0.5V
HIGH level input voltage (pin 16)IIH=10µA2.0−V
P
V
LOW level input voltage (pin 16)IIL= −10 µA−−0.8V
sandcastle input voltage level
(pin 16)
zero level−−1.1V
blanking level2.0−3.1V
clamp level3.9−5.5V
clamp pulse widthSECAM mode−3.6−µs
PAL mode−2.5−µs
Fast blanking inputs (pins 14 and 15)
V
IH
V
IL
HIGH level input voltage0.95−V
LOW level input voltage−−0.5V
passive clamp; note 3
matching of output blanking offset
voltage
V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−5mV
active clamp; note 3
V
= 0.7 V (p-p) (white);
i(ch1)
V
= 0 V (p-p) (black);
i(ch2)
−−5mV
passive clamp; note 3
Fast blanking inputs (pins 14 and 15)
Z
i
input impedance10−−kΩ
Fast blanking output (pin 13)
V
OH
V
OL
Z
o
HIGH level output voltage22.353V
LOW level output voltage00.150.3V
output impedance−−50Ω
SEL input (pin 5)
Z
i
input impedance10−−kΩ
1996 Jun 277
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Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Timing
t
dSEL;VID
t
dSEL;FBO
t
SWVID
t
SWFBO
t
dFB
t
dVID
∆t
dVID
∆t
dFB;VID
delay time between SEL input and
video output
delay time between SEL input and
fast blanking output
switching time of video outputnote 4−8.515ns
switching time of fast blanking
output
fast blanking level delay between
input and output
video delay between input and
output
delay difference between two
video signals at the output
delay difference between fast
blanking level and video at the
output
note 4−1220ns
note 5−1540ns
note 5−8.515ns
note 6−1320ns
note 7−420ns
note 7−0.510ns
note 7− 510ns
Notes
1. The supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on
the power supply pin (pin 1); where: VDC= 8 V; Vi= 100 mV (p-p). This additional sine wave on the power supply pin
is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals.
2. The 6 video inputs will contain the same signal. The source impedance is 50 Ω.
3. The blanking offset is the level difference between the two channels when they are selected separately and, also, on
one video output. This value is measured on each video signal.
4. The delay between the SEL input and the video output together with the switching time of the video output is
illustrated in Fig.3. The amplitude of the video signal is 1.9 V (p-p) when the clamp is active and 1.0 V (p-p) when the
clamp is passive.
5. The delay between the SEL input and fast blanking output together with the switching time of fast blanking output is
illustrated in Fig.4.
6. The fast blanking delay between input and output is illustrated in Fig.5.
7. The video delay between input and output and delay differences are illustrated in Fig.6. Inputs 1 and 2 are either fast
blanking input plus a video signal or two video signals. The amplitude of the video signal is 0.5 V (p-p). The video
signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. The fast blanking signal levels (i1 and o1) are 0.95 V
when the signal rises and 0.5 V when the signal falls.
1996 Jun 278
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Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
Fig.3 Timing definition: SEL and VIDO.
Fig.4 Timing definition: SEL and FBO.
1996 Jun 279
Page 10
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
Fig.5 Timing definition: fast blanking delay.
Fig.6 Timing definition: video delay.
1996 Jun 2710
Page 11
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
INTERNAL PIN CONFIGURATION
Fig.7 Internal pin configuration.
1996 Jun 2711
Page 12
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
APPLICATION INFORMATION
Fig.8 Application diagram.
1996 Jun 2712
Page 13
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
Fig.9 Schematic diagram of two TDA8601s operating four channels.
1996 Jun 2713
Page 14
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
1
w M
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
E
1
0510 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
1
0.53
0.38
0.021
0.015
cEeM
0.32
0.23
0.013
0.009
REFERENCES
(1)(1)
D
21.8
21.4
0.86
0.84
1996 Jun 2714
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.547.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
(1)
Page 15
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
pin 1 index
1
e
9
8
w M
b
p
SOT109-1
E
H
E
A
2
A
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
02.55 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT109-1
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
3
0.25
0.01
IEC JEDEC EIAJ
076E07S MS-012AC
b
p
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
10.0
4.0
3.8
0.16
0.15
1.27
0.050
9.8
0.39
0.38
REFERENCES
1996 Jun 2715
eHELLpQZywv θ
1.05
0.041
1.0
0.4
0.039
0.016
0.7
0.25
0.6
0.028
0.010.004
0.020
EUROPEAN
PROJECTION
0.250.1
0.01
0.7
0.3
0.028
0.012
ISSUE DATE
95-01-23
97-05-22
o
8
o
0
6.2
5.8
0.244
0.228
Page 16
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Jun 2716
Page 17
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 2717
Page 18
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
NOTES
1996 Jun 2718
Page 19
Philips SemiconductorsProduct specification
RGB/YUV and fast blanking switchTDA8601
NOTES
1996 Jun 2719
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands537021/25/02/pp20 Date of release: 1996 Jun 27Document order number: 9397 750 00932
Internet: http://www.semiconductors.philips.com/ps/
(1)TDA8601_2 June 26, 1996 11:51 am
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