Datasheet TDA8578T, TDA8578 Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA8578

Dual common-mode rejection differential line receiver

Product speciﬁcation Supersedes data of November 1993 File under Integrated Circuits, IC01

1995 Dec 15

Page 2

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential

TDA8578

line receiver

FEATURES

• Excellent common-mode rejection up to high frequencies

• Elimination of source resistance in the common-mode rejection

• Few external components

• High supply voltage ripple rejection

• Low noise

• Low distortion

• Protected against electrostatic discharge

• AC and DC short circuit safe to ground and V

• Fast DC settling.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

supply voltage 5 8.5 18 V supply current VCC= 8.5 V − 11 14 mA

voltage gain −0.5 0 +0.5 dB SVRR supply voltage ripple rejection −55 −60 − dB V

Z

 input impedance 100 240 − kΩ

noise output voltage − 3.7 5 µV

CMRR common-mode rejection ratio R

APPLICATIONS

• Audio

• Car radio.

GENERAL DESCRIPTION

The TDA8578 is a two-channel differential amplifier in a 16 pin DIL or SO package intended to receive line inputs in audio applications requiring a high-level of common-mode rejection. The amplifier has a gain of 0 dB and a low distortion. The device is primarily developed for those car radio applications where long connections between signal sources and amplifiers (or boosters) are necessary and ground noise has to be eliminated.

=0Ω−80 − dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8578 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

TDA8578T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

BLOCK DIAGRAM

TDA8578

GND

OUTL

SVRR

OUTR

MBD209

INL INL

INR INR

TDA8578

FUNCTIONAL DESCRIPTION

The TDA8578 contains two identical differential amplifiers with a voltage gain of 0 dB. The device is intended to receive line input signals. The device has a very high-level of common-mode rejection and it eliminates ground noise. The common-mode rejection keeps constant up to high frequencies. The gain of the amplifiers is fixed at 0 dB. The inputs have a high-input impedance and the output stage is a class AB stage with a low-output impedance. For a large common-mode rejection also at low frequencies, an electrolytic input capacitor at the negative input pin is advised. The input impedance is relative high, this would result in a large settling time of the DC input voltage. Therefore a quick charge circuit is included that charges the input capacitor within 0.2 s.

All input and output pins are protected against high electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

INL+ 1 positive input left n.c. 2 not connected n.c. 3 not connected n.c. 4 not connected INL− 5 negative input left INR− 6 negative input right INR+ 7 positive input right SVRR 8 half supply voltage GND 9 ground n.c. 10 not connected OUTR 11 output right OUTL 12 output left n.c. 13 not connected n.c. 14 not connected n.c. 15 not connected V

16 supply voltage

INL

n.c.

n.c. INL INR INR

SVRR

TDA8578

5 6 7 8

MBD210

Fig.2 Pin configuration.

n.c. n.c.

14 13

n.c. OUTL

OUTR

n.c.

GND

1995 Dec 15 3

Page 4

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential

TDA8578

line receiver

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ORM

stg

amb

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

th j-a

supply voltage operating − 18 V repetitive peak output current − 40 mA AC and DC short-circuit safe voltage − 18 V storage temperature −55 +150 °C operating ambient temperature −40 +85 °C junction temperature − +150 °C

thermal resistance from junction to ambient in free air

TDA8578 (DIP16) 75 K/W TDA8578T (SO16) 120 K/W

DC CHARACTERISTICS

= 8.5 V; T

=25°C; in accordance with test circuit (see Fig.3); unless otherwise speciﬁed.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

set

supply voltage 5 8.5 18 V supply current − 11 14 mA DC output voltage note 1 − 4.3 − V DC input voltage settling time − 0.2 − s

Note

1. The DC output voltage with respect to ground is approximately 0.5V

1995 Dec 15 4

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential

TDA8578

line receiver

AC CHARACTERISTICS

= 8.5 V; f = 1 kHz; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆G

 channel unbalance −−0.5 dB

Z

 input impedance 100 240 − kΩ

 output impedance −−10 Ω

Z

i(max)

CM(rms)

voltage gain −0.5 0 +0.5 dB channel separation Rs=5kΩ 70 80 − dB

low frequency roll-off −1 dB; note 1 20 −−Hz high frequency roll-off −1dB 20 −−kHz

maximum input voltage THD = 1% − 2 − V noise output voltage Rs=0Ω; note 2 − 3.7 5 µV common-mode input voltage

(RMS value)

CMRR common-mode rejection ratio R

SVRR supply voltage ripple rejection note 4 55 65 − dB

THD total harmonic distortion V

THD

max

total harmonic distortion at maximum output current

=25°C; in accordance with test circuit (see Fig.3); unless otherwise speciﬁed.

amb

−−1V

=5kΩ 66 70 − dB

=0Ω; note 3 − 80 − dB

note 5 − 60 − dB

=1V − 0.02 − %

=1V;

−−0.1 %

f = 20 Hz to 20 kHz Vi=1V; RL= 150 Ω− − 1%

Notes

1. Frequency response externally fixed by the input coupling capacitors.

2. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).

3. The common-mode rejection ratio is measured at the output, with a voltage source of 1 V (RMS), in accordance with test circuit (see Fig.3), while V

INL

and V

are short-circuited. Frequencies between 100 Hz and 100 kHz.

INR

4. Ripple rejection is measured at the output, with Rs=2kΩ; f = 1 kHz and a ripple amplitude of 2 V (p-p).

5. Ripple rejection is measured at the output, with Rs=0 Ω up to 2 kΩ and f = 100 Hz to 20 kHz; maximum ripple amplitude of 2 V (p-p).

1995 Dec 15 5

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

220 nF

INL

5 k

Ω

22 µ

INR

220 nF

Ω5 k

TDA8578

SVRR

TDA8578

8.5 V

100 nF

2.2 µ

47 µ

2.2 µ

OUTL

OUTR

R 10 k

MBD218

10 k

Ω

THD

(%)

Fig.3 Test circuit.

f (Hz)

MBD215

Fig.4 Total harmonic distortion as a function of frequency; Vi= 1.0 V (RMS).

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

CMR

(dB)

100

(1) Rs=5kΩ. (2) Rs=2kΩ. (3) Rs=0Ω.

TDA8578

MBD216

(1)

(2)

(3)

f (Hz)

THD

(%)

Fig.5 Common-mode rejection as function of frequency; VCM= 1.0 V (RMS).

1010

V (mV)

i (rms)

MBD213

Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.

1995 Dec 15 7

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

CMR

(dB)

100 300 500 700 900

1100

V (mV)

CM (rms)

TDA8578

MBD214

1300

Fig.7 Common-mode rejection as a function of common-mode input voltage; f = 1 kHz; Rs=0Ω.

CMR

(dB)

100

(1) C2 = 22 µF. (2) C2 = 47 µF. (3) C2 = 100 µF.

MBD211

(1) (2) (3)

f (Hz)

Fig.8 Common-mode rejection as a function of frequency; VCM= 1.0 V.

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Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

SVR

(dB)

TDA8578

MBD212

f (Hz)

= 2 V (p-p); Rs=2kΩ.

ripple

Fig.9 Supply voltage ripple rejection as a function of frequency.

APPLICATION INFORMATION

INL

INR

5 k

10 µF

Ω

Ω5 k

220 nF

TDA8578

SVRR

8.5 V

100 nF

2.2 µ

47 µ

2.2 µ

OUTL

OUTR

R 10 k

10 k

Ω

Fig.10 Application circuit balanced signal source.

1995 Dec 15 9

MBD217

Page 10

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

seating plane

w M

TDA8578

SOT38-1

(e )

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

4.7 0.51 3.7

OUTLINE

VERSION

SOT38-1

min.

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

1.40

1.14

0.055

0.045

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

21.8

21.4

0.86

0.84

scale

(1) (1)

6.48

6.20

0.26

0.24

(1)

0.30

0.15

0.13

3.9

3.4

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02 95-01-19

max.

2.2

0.087

1995 Dec 15 10

Page 11

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

SO16: plastic small outline package; 16 leads; body width 3.9 mm

TDA8578

SOT109-1

v M

pin 1 index

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

10.0

9.8

0.39

0.38

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

1.05

0.041

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

0.25 0.1

0.25

0.01

0.01 0.004

0.7

0.3

0.028

0.012

OUTLINE VERSION

SOT109-1

IEC JEDEC EIAJ

076E07S MS-012AC

REFERENCES

1995 Dec 15 11

EUROPEAN

PROJECTION

ISSUE DATE

95-01-23 97-05-22

Page 12

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential line receiver

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WA VE The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA8578

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

1995 Dec 15 12

Page 13

Philips Semiconductors Product speciﬁcation

Dual common-mode rejection differential

TDA8578

line receiver

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1995 Dec 15 13