voltage gain−0.50+0.5dB
SVRRsupply voltage ripple rejection−55−60−dB
V
no
Z
input impedance100240−kΩ
i
noise output voltage−3.75µV
CMRRcommon-mode rejection ratioR
APPLICATIONS
• Audio
• Car radio.
GENERAL DESCRIPTION
The TDA8578 is a two-channel differential amplifier in a
16 pin DIL or SO package intended to receive line inputs
in audio applications requiring a high-level of
common-mode rejection. The amplifier has a gain of 0 dB
and a low distortion. The device is primarily developed for
those car radio applications where long connections
between signal sources and amplifiers (or boosters) are
necessary and ground noise has to be eliminated.
=0Ω−80−dB
s
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
PACKAGE
TDA8578DIP16plastic dual in-line package; 16 leads (300 mil); long bodySOT38-1
TDA8578TSO16plastic small outline package; 16 leads; body width 3.9 mmSOT109-1
1995 Dec 152
Page 3
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
BLOCK DIAGRAM
V
CC
TDA8578
GND
16
12
OUTL
V
CC
8
SVRR
11
OUTR
9
MBD209
INL
INL
INR
INR
1
5
6
7
TDA8578
FUNCTIONAL DESCRIPTION
The TDA8578 contains two identical differential amplifiers
with a voltage gain of 0 dB. The device is intended to
receive line input signals. The device has a very high-level
of common-mode rejection and it eliminates ground noise.
The common-mode rejection keeps constant up to high
frequencies. The gain of the amplifiers is fixed at 0 dB. The
inputs have a high-input impedance and the output stage
is a class AB stage with a low-output impedance. For a
large common-mode rejection also at low frequencies, an
electrolytic input capacitor at the negative input pin is
advised. The input impedance is relative high, this would
result in a large settling time of the DC input voltage.
Therefore a quick charge circuit is included that charges
the input capacitor within 0.2 s.
All input and output pins are protected against high
electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).
Fig.1 Block diagram.
PINNING
SYMBOLPINDESCRIPTION
INL+1positive input left
n.c.2not connected
n.c.3not connected
n.c.4not connected
INL−5negative input left
INR−6negative input right
INR+7positive input right
SVRR8half supply voltage
GND9ground
n.c.10not connected
OUTR11output right
OUTL12output left
n.c.13not connected
n.c.14not connected
n.c.15not connected
V
CC
16supply voltage
1
INL
2
n.c.
3
n.c.
4
n.c.
INL
INR
INR
SVRR
TDA8578
5
6
7
8
MBD210
Fig.2 Pin configuration.
V
16
CC
15
n.c.
n.c.
14
13
n.c.
OUTL
12
OUTR
11
n.c.
10
GND
9
1995 Dec 153
Page 4
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
TDA8578
line receiver
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
I
ORM
V
sc
T
stg
T
amb
T
j
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
supply voltageoperating−18V
repetitive peak output current−40mA
AC and DC short-circuit safe voltage−18V
storage temperature−55+150°C
operating ambient temperature−40+85°C
junction temperature−+150°C
thermal resistance from junction to ambient in free air
TDA8578 (DIP16)75K/W
TDA8578T (SO16)120K/W
DC CHARACTERISTICS
V
= 8.5 V; T
CC
=25°C; in accordance with test circuit (see Fig.3); unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC
I
CC
V
O
t
set
supply voltage58.518V
supply current−1114mA
DC output voltagenote 1−4.3−V
DC input voltage settling time−0.2−s
Note
1. The DC output voltage with respect to ground is approximately 0.5V
CC
.
1995 Dec 154
Page 5
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
TDA8578
line receiver
AC CHARACTERISTICS
V
= 8.5 V; f = 1 kHz; T
CC
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
G
v
α
cs
∆G
channel unbalance−−0.5dB
v
f
L
f
H
Z
input impedance100240−kΩ
i
output impedance−−10Ω
Z
o
V
i(max)
V
no
V
CM(rms)
voltage gain−0.50+0.5dB
channel separationRs=5kΩ7080−dB
low frequency roll-off−1 dB; note 120−−Hz
high frequency roll-off−1dB20−−kHz
maximum input voltageTHD = 1%−2−V
noise output voltageRs=0Ω; note 2−3.75µV
common-mode input voltage
(RMS value)
CMRRcommon-mode rejection ratioR
SVRRsupply voltage ripple rejectionnote 45565−dB
THDtotal harmonic distortionV
THD
max
total harmonic distortion at
maximum output current
=25°C; in accordance with test circuit (see Fig.3); unless otherwise specified.
amb
−−1V
=5kΩ6670−dB
s
R
=0Ω; note 3−80−dB
s
note 5−60−dB
=1V−0.02−%
i
V
=1V;
i
−−0.1%
f = 20 Hz to 20 kHz
Vi=1V; RL= 150 Ω−−1%
Notes
1. Frequency response externally fixed by the input coupling capacitors.
2. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
3. The common-mode rejection ratio is measured at the output, with a voltage source of 1 V (RMS), in accordance with
test circuit (see Fig.3), while V
INL
and V
are short-circuited. Frequencies between 100 Hz and 100 kHz.
INR
4. Ripple rejection is measured at the output, with Rs=2kΩ; f = 1 kHz and a ripple amplitude of 2 V (p-p).
5. Ripple rejection is measured at the output, with Rs=0 Ω up to 2 kΩ and f = 100 Hz to 20 kHz; maximum ripple
amplitude of 2 V (p-p).
1995 Dec 155
Page 6
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
220 nF
R
s
V
INL
5 k
Ω
22 µ
F
V
CM
V
INR
220 nF
R
s
Ω5 k
1
5
6
7
16
TDA8578
SVRR
TDA8578
8.5 V
100 nF
2.2 µ
47 µ
2.2 µ
F
OUTL
F
F
OUTR
R
10 k
MBD218
R
L
L
10 k
Ω
Ω
12
V
CC
8
11
9
10
THD
(%)
10
10
Fig.3 Test circuit.
1
2
3
10
2
10
3
10
4
10
f (Hz)
MBD215
5
10
Fig.4 Total harmonic distortion as a function of frequency; Vi= 1.0 V (RMS).
1995 Dec 156
Page 7
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
0
CMR
(dB)
20
40
60
80
100
10
(1) Rs=5kΩ.
(2) Rs=2kΩ.
(3) Rs=0Ω.
2
10
3
10
TDA8578
MBD216
(1)
(2)
(3)
4
10
f (Hz)
5
10
THD
(%)
10
10
10
Fig.5 Common-mode rejection as function of frequency; VCM= 1.0 V (RMS).
1
1
2
3
2
1010
3
10
V (mV)
i (rms)
MBD213
4
10
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
1995 Dec 157
Page 8
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
40
CMR
(dB)
50
60
70
80
90
100300500700900
1100
V (mV)
CM (rms)
TDA8578
MBD214
1300
Fig.7 Common-mode rejection as a function of common-mode input voltage; f = 1 kHz; Rs=0Ω.
0
CMR
(dB)
20
40
60
80
100
10
(1) C2 = 22 µF.
(2) C2 = 47 µF.
(3) C2 = 100 µF.
MBD211
(1)
(2)
(3)
2
10
3
10
4
10
f (Hz)
5
10
Fig.8 Common-mode rejection as a function of frequency; VCM= 1.0 V.
1995 Dec 158
Page 9
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
30
SVR
(dB)
40
50
60
70
10
2
10
TDA8578
MBD212
3
10
f (Hz)
4
10
V
= 2 V (p-p); Rs=2kΩ.
ripple
Fig.9 Supply voltage ripple rejection as a function of frequency.
APPLICATION INFORMATION
V
INL
V
INR
R
s
5 k
10 µF
10 µF
R
s
Ω
Ω5 k
220 nF
220 nF
1
5
TDA8578
6
7
16
SVRR
8.5 V
100 nF
2.2 µ
47 µ
2.2 µ
F
OUTL
F
F
OUTR
R
10 k
R
L
L
10 k
Ω
Ω
12
V
CC
8
11
9
Fig.10 Application circuit balanced signal source.
1995 Dec 159
MBD217
Page 10
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
1
w M
TDA8578
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
pin 1 index
1
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEeM
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1)(1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.547.62
0.010.100.0200.19
ISSUE DATE
92-10-02
95-01-19
max.
2.2
0.087
1995 Dec 1510
Page 11
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
9
TDA8578
SOT109-1
E
H
E
A
X
v M
A
pin 1 index
1
e
02.55 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.0100
0.019
0.0075
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
10.0
9.8
0.39
0.38
8
b
p
scale
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
w M
6.2
5.8
0.244
0.228
A
2
1.05
0.041
Q
A
1
detail X
1.0
0.7
0.4
0.6
0.028
0.039
0.020
0.016
(A )
L
p
L
0.250.1
0.25
0.01
0.010.004
A
3
θ
0.7
0.3
0.028
0.012
o
8
o
0
OUTLINE
VERSION
SOT109-1
IEC JEDEC EIAJ
076E07S MS-012AC
REFERENCES
1995 Dec 1511
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
Page 12
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
line receiver
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA8578
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Dec 1512
Page 13
Philips SemiconductorsProduct specification
Dual common-mode rejection differential
TDA8578
line receiver
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Dec 1513
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