Datasheet TDA8566TH Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8566TH

2 × 40 W/2 Ω stereo BTL car radio
power amplifier with differential
inputs and diagnostic outputs

Objective specification
File under Integrated Circuits, IC01

2001 Apr 24

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

FEATURES

• Differential inputs

• Very high Common Mode Rejection Ratio (CMRR)

• High common mode input signal handling

• Requires very few external components

• High output power

• 4 and 2 Ω load driving capability

• Low offset voltage at output

• Fixed gain

• Diagnostic facility (distortion, short-circuit and

temperature pre-warning)

• Good ripple rejection

• Mode select switch (operating, mute and standby)

• Load dump protection

• Short-circuit proof to ground, to VP and across the load

• Low power dissipation in any short-circuit condition

• Thermally protected

• Reverse polarity safe

• Protected against electrostatic discharge

• No switch-on/switch-off plops

• Low thermal resistance.

GENERAL DESCRIPTION

The TDA8566TH is an integratedclass-B output amplifier
contained in a 20-lead small outline plastic package. The
device contains 2 amplifiers in a Bridge-Tied Load (BTL)
configuration. The output power is 2 × 25Wina4Ωload
or 2 × 40 W in a 2 Ω load. It has a differential input stage
and 2 diagnostic outputs. The device is primarily
developed for car radio applications.

TDA8566TH

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

ORM

I

q(tot)

I

stb

I

sw

Z

i

P

out

SVRR supply voltage ripple rejection R

α

cs

operating supply voltage 6 14.4 18 V
repetitive peak output current −−7.5 A
total quiescent current − 115 − mA
standby current − 0.1 10 µA
switch-on current −−40 µA
input impedance 100 120 − kΩ
output power RL=4Ω; THD = 10% − 25 − W

=2Ω; THD = 10% − 40 − W

R

L

=0Ω−60 − dB

s

channel separation Rs=10kΩ−50 − dB
CMRR common mode rejection ratio − 75 − dB
G

v

V

n(o)

closed loop voltage gain 25 26 27 dB

noise output voltage Rs=0Ω−−120 µV

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8566TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2

2001 Apr 24 2

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

BLOCK DIAGRAM

handbook, full pagewidth

IN1+

IN1−

n.c.

SGND

IN2+

IN2−

8

9

60

60

kΩ

kΩ

4, 5,
6, 7

V

ref

10

60

60

kΩ

kΩ

2

3

17 14

PGND2 PGND1

2.3

2.3

2.3

2.3

kΩ

kΩ

kΩ

kΩ

standby

switch

V

A

1×

mute
switch

+

−

V

A

+

−

mute
switch

+

−

V

A

+

−

mute
switch

+

−

V

A

+

−

mute
switch

+

−

V

A

+

−

standby

reference

voltage

mute
reference
voltage

C

M

2.3 kΩ
(9×)
C

M

2.3 kΩ
(9×)

C

M

2.3 kΩ
(9×)
C

M

2.3 kΩ
(9×)

TDA8566TH

mute

switch

TDA8566TH

V

V

P2

P1

1912

13

OUT1+

15

OUT1−

20

MODE

11

CLIP

DIAG

MGU358

CLIP

1

DIAG

16

OUT2+

18

OUT2−

Fig.1 Block diagram.

2001 Apr 24 3

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

PINNING

SYMBOL PIN DESCRIPTION

DIAG 1 short-circuit and temperature

pre-warning diagnostic output
IN2+ 2 channel 2 input positive
IN2− 3 channel 2 input negative
n.c. 4 not connected
n.c. 5 not connected
n.c. 6 not connected
n.c. 7 not connected
IN1+ 8 channel 1 input positive
IN1− 9 channel 1 input negative
SGND 10 signal ground
CLIP 11 clip detection output
V

P1

12 supply voltage 1
OUT1+ 13 channel 1 output positive
PGND1 14 power ground 1
OUT1− 15 channel 1 output negative
OUT2+ 16 channel 2 output positive
PGND2 17 power ground 2
OUT2− 18 channel 2 output negative
V

P2

19 supply voltage 2
MODE 20 mode select switch input

(standby/mute/operating)

handbook, halfpage

MODE

20
19

V

P2

18

OUT2−

17

PGND2

16

OUT2+
OUT1−

PGND1

OUT1+

V

CLIP

P1

TDA8566TH

15
14
13
12
11

MGU356

Fig.2 Pin configuration.

TDA8566TH

DIAG

1

IN2+

2

IN2−

3

n.c.

4

n.c.

5

n.c.

6

n.c.

7
8

IN1+
IN1−

9

SGND

10

2001 Apr 24 4

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

FUNCTIONAL DESCRIPTION

The TDA8566TH contains 2 identical amplifiers and can
be used for BTL applications. The gain of each amplifier is
fixed at 26 dB. Special features of this device are:

1. Mode select switch

2. Clip detection

3. Short-circuit diagnostic

4. Temperature pre-warning

5. Open-collector diagnostic outputs

6. Differential inputs.

Mode select switch (pin MODE)

• Standby: low supply current

• Mute: input signal suppressed

• Operating: normal on condition.

Since this pin has a very low input current (<40 µA), a low
cost supply switch can be applied. To avoid switch-on
plops,itisadvisabletokeeptheamplifier in the mute mode
for a period of ≥150 ms (charging the input capacitors at
pins IN1+, IN1−, IN2+ and IN2−). This can be realized by
using a microcontroller or by using an external timing
circuit as illustrated in Fig.7.

Clip detection (pin CLIP)

When clipping occurs at one or more output stages, the
dynamic distortion detector becomes active and pin CLIP
goes LOW. This information can be used to drive a sound
processor or a DC volume control to attenuate the input
signal and so limit the level of distortion. The output level
of pin CLIP is independent of the number of channels that
are being clipped. The clip detection circuit is disabled in a
short-circuit condition, so if a fault condition occurs at the
outputs, pin CLIP will remain at a HIGH level. The clip
detection waveforms are illustrated in Fig.3.

Short-circuit diagnostic (pin DIAG)

When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again (with a delay of approximately
20 ms after the removal of the short-circuit). During this
short-circuit condition, pin DIAG is continuously LOW.

When a short-circuit occurs across the load of one or both
channels, the output stages are switched off for
approximately 20 ms. After that time the load condition is
checked during approximately 50 µs to see whether the
short-circuit is still present. Due to this duty cycle of
50 µs/20 ms the average current consumption during the
short-circuit condition is very low (approximately 40 mA).
During this condition, pin DIAG is LOW for 20 ms and
HIGH for 50 µs; see Fig.4. The power dissipation in any
short-circuit condition is very low.

Temperature pre-warning (pin DIAG)

When the junction temperature (Tvj) reaches 145 °C,
pin DIAG will become continuously LOW.

Open-collector diagnostic outputs

Pins DIAG and CLIP are open-collector outputs, therefore
more devices can be tied together. Pins DIAG and CLIP
can also be tied together. An external pull-up resistor is
required.

Differential inputs

The input stage is a high-impedance fully differential
balanced input stage that is also capable of operating in
a single-ended mode with one of the inputs capacitively
coupled to an audio ground. It should be noted that if a
source resistance is added (input voltage dividers) the
CMRR degrades to lower values.

TDA8566TH

handbook, halfpage

V

V

O

(V)

CLIP
(V)

0

0

MGU357

t (s)

Fig.3 Clip detection waveforms.

2001 Apr 24 5

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

handbook, full pagewidth

current

in

output

stage

V

DIAG

(V)

short-circuit over the load

20 ms

50 µs

Fig.4 Short-circuit diagnostic timing diagram.

TDA8566TH

MGU360

t (s)

t (s)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 18 V

non-operating − 30 V

I

OSM

I

ORM

T

stg

T

vj

T

amb

V

psc

V

rp

P

tot

load dump protection;
during 50 ms; t

≥ 2.5 ms

r

non-repetitive peak output current − 10 A
repetitive peak output current − 7.5 A
storage temperature −55 +150 °C
virtual junction temperature − 150 °C
ambient temperature −40 +85 °C
short-circuit safe voltage − 18 V
reverse polarity voltage − 6.0 V
total power dissipation − 60 W

− 45 V

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611D”

, if this type is used as an audio amplifier.

THERMAL CHARACTERISTICS

Thermal characteristics in accordance with IEC 60747-1.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R
R

th(j-c)
th(j-a)

thermal resistance from junction to case see Fig.5 1.9 K/W
thermal resistance from junction to ambient in free air 40 K/W

2001 Apr 24 6

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier

TDA8566TH

with differential inputs and diagnostic outputs

handbook, halfpage

virtual junction

Fig.5 Equivalent thermal resistance network.

DC CHARACTERISTICS

VP= 14.4 V; T

=25°C; measured in test circuit of Fig.6; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q

supply voltage note 1 6 14.4 18 V
quiescent current RL= ∞−115 180 mA

Operating condition

V

MODE

I

MODE

V

O

V

OO

mode select switch level 8.5 − V
mode select switch current V
output voltage note 2 − 7.0 − V
output offset voltage −−100 mV

Mute condition

V

MODE

V

O

V

OO

∆V

OO

mode select switch level 3.3 − 6.4 V
output voltage note 2 − 7.0 − V
output offset voltage −−60 mV
output offset voltage difference with respect to operating

condition

Standby condition

V

MODE

I

stb

mode select switch level 0 − 2V
standby current − 0.1 10 µA

Diagnostic

V

DIAG

diagnostic output voltage during any fault condition −−0.6 V

output 1 output 2

3.2 K/W

0.3 K/W

case

= 14.4 V − 15 40 µA

MODE

3.2 K/W

MGU361

−−60 mV

P

V

Notes

1. The circuit is DC adjusted at V

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

P

2. At VP= 18 to 30 V the DC output voltage is ≤0.5VP.

2001 Apr 24 7

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier

TDA8566TH

with differential inputs and diagnostic outputs

AC CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

THD total harmonic distortion P

B power bandwidth THD = 0.5%; P

f

ro(l)

f

ro(h)

G

v

SVRR supply voltage ripple

Z

i

∆Zi input impedance mismatch − 2 − %
V

n(o)

α

cs

 channel unbalance −− 1dB

∆G

v

=25°C; RL=2Ω; fi= 1 kHz; measured in test circuit of Fig.6; unless otherwise specified.

amb

output power THD = 0.5% 25 30 − W

THD = 10% 33 40 − W
THD = 30% 45 55 − W
V

= 13.5 V; THD = 0.5% − 25 − W

P

V

= 13.5 V; THD = 10% − 35 − W

P

THD = 0.5%; R
THD = 10%; R
THD = 30%; R

= 13.5 V; THD = 0.5%;

V

P

=4Ω

R

L

V

= 13.5 V; THD = 10%;

P

=4Ω 16 19 − W

L

=4Ω 21 25 − W

L

=4Ω 28 35 − W

L

− 14 − W

− 22 − W

RL=4Ω

=1W − 0.1 − %

o

V

= 0.6 V; note 1 − 8 − %

CLIP

P

= 1 W; RL=4Ω−0.05 − %

o

= −1dB

o

− 20 to 20000 − Hz

with respect to 25 W
low frequency roll off −1 dB; note 2 − 25 − Hz
high frequency roll off −1dB 20 −−kHz
closed loop voltage gain 25 26 27 dB

operating; note 3 50 −−dB
rejection

mute; note 3 50 −−dB

standby; note 3 80 −−dB
input impedance differential 100 120 150 kΩ

single-ended 50 60 75 kΩ

noise output voltage operating; Rs=0Ω; note 4 − 85 120 µV

operating; R

=10kΩ;

s

− 100 −µV

note 4

mute; independent of R

;

− 60 −µV

s

note 4
channel separation Po= 25 W; Rs=10kΩ 45 −−dB

2001 Apr 24 8

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier

TDA8566TH

with differential inputs and diagnostic outputs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

o(mute)

CMRR common mode rejection

Notes

1. Dynamic distortion detector active; pin CLIP is LOW.

2. Frequency response externally fixed.

3. V

ripple=Vripple(max)

4. Noise measured in a bandwidth of 20 Hz to 20 kHz.

5. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
V

common

6. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
V

common

output signal voltage in mute Vin=V

R

=0Ω; note 5 60 75 − dB

s

ratio

R

=45kΩ; note 6 40 −−dB

s

= 1 V (RMS) −− 2mV

in(max)

= 2 V (p-p); Rs=0Ω.

≤ 3.5 V (RMS); fi= 100 Hz to 10 kHz; Rs=0Ω.

≤ 3.5 V (RMS); fi= 1 kHz; Rs=45kΩ. The mismatch of the input coupling capacitors is excluded.

2001 Apr 24 9

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

V

in1

V

in2

V

Rs/2

Rs/2

Rs/2

Rs/2

mode

220 nF

220 nF

220 nF

220 nF

+
_

8

+

20 1912

60

kΩ

+

−

TDA8566TH

60

kΩ

_

9

V

ref

+

−

10

2

+

60

kΩ

60

kΩ

_

3

−
+

+

−

−
+

CLIP

DETECTOR

DIAGNOSTIC

INTERFACE

14 17

TDA8566TH

+

V

100

nF

13

+

_

15

11

1

16

+

_

18

2200

µF/16V

R

L1

V

V

P

P

10

10

kΩ

kΩ

CLIP

DIAG

R

L2

_

P =

14.4 V

Fig.6 Stereo BTL test diagram.

Application information

DIAGNOSTIC OUTPUT
Special care must be taken in the PCB layout to separate

pin CLIPfrom pins IN1+, IN1−, IN2+ and IN2− to minimize
the crosstalk between the CLIP output and the inputs.

MODE SELECT SWITCH
To avoid switch-on plops, it is advisable to keep the

amplifier in the mute mode during ≥150 ms (charging of
the input capacitors at pins IN1+, IN1−, IN2+ and IN2−).
The circuit in Fig.7 slowly ramps-up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.

handbook, halfpage

MGU359

+V

supply

S

10 kΩ

47 µF

100 Ω

100 kΩ

mode
select

switch

MGD102

Fig.7 Mode select switch circuit.

2001 Apr 24 10

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

PACKAGE OUTLINE

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

D

c

y

D

1

1

pin 1 index

10

D

2

x

E

E

2

H

E

TDA8566TH

SOT418-2

A

X

v M

A

E

1

20

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

2

max.

3.5

3.5 0.35

3.2

e

(1)

bpc

A

A

4

3

+0.12

0.53

−0.02

0.40

0.32

0.23

D

16.0

15.8

11

w M

b

p

0 5 10 mm

scale

(2)

D

1

13.0

12.6

D

1.1

0.9

(2)

E

E

2

11.1

10.9

1

6.2

5.8

E

2.9

2.5

Q

A

2

A

4

detail X

H

L

Q

1.7

1.5

v

0.25w0.25

e

E

14.5

13.9

p

1.1

0.8

2

1.27

L

x

0.03

(A3)

p

0.07

A

θ

yZ

2.5

2.0

θ

8°
0°

OUTLINE
VERSION

SOT418-2

IEC JEDEC EIAJ

REFERENCES

2001 Apr 24 11

EUROPEAN

PROJECTION

ISSUE DATE

98-02-25
99-11-12

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a very brief insighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mount ICs, but itisnot suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on foursides,the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

TDA8566TH

2001 Apr 24 12

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier

TDA8566TH

with differential inputs and diagnostic outputs

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

2001 Apr 24 13

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier

TDA8566TH

with differential inputs and diagnostic outputs

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

(1)

STATUS

(2)

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at any other conditions above thosegivenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warranty thatsuch applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers using or sellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any of theseproducts,conveys no licence or title
under any patent, copyright, or mask work right to these
products,and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2001 Apr 24 14

Philips Semiconductors Objective specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

NOTES

TDA8566TH

2001 Apr 24 15

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,

Tel: [phone], Fax: [phone]
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

72

Printed in The Netherlands 753503/01/pp16 Date of release: 2001 Apr 24 Document order number: 9397 750 08125