Datasheet TDA8566Q-N2, TDA8566Q-N1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1998 Sep 23
File under Integrated Circuits, IC01

2000 Jan 28

INTEGRATED CIRCUITS

TDA8566Q

2 × 40 W/2 Ω stereo BTL car radio
power amplifier with differential
inputs and diagnostic outputs

2000 Jan 28 2

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

FEATURES

• Differential inputs

• Very high Common Mode Rejection Ratio (CMRR)

• High common mode input signal handling

• Requires very few external components

• High output power

• 4 and 2 Ω load driving capability

• Low offset voltage at output

• Fixed gain

• Diagnostic facility (distortion, short-circuit and

temperature pre-warning)

• Good ripple rejection

• Mode select switch (operating, mute and standby)

• Load dump protection

• Short-circuit proof to ground, to VP and across the load

• Low power dissipation in any short-circuit condition

• Thermally protected

• Reverse polarity safe

• Protected against electrostatic discharge

• No switch-on/switch-off plop

• Flexible leads

• Low thermal resistance.

GENERAL DESCRIPTION

The TDA8566Q is an integrated class-B output amplifier
contained in a 17-lead single-in-line (SIL; bent to DIL)
plasticpowerpackage.The devicecontains2 amplifiers in
a Bridge-TiedLoad configuration (BTL).The output power
is 2 × 25Wina4Ωload or 2 × 40 W in a 2 Ω load. It has
a differential input stage and 2 diagnostic outputs. The
device is primarily developed for car radio applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

operating supply voltage 6 14.4 18 V

I

ORM

repetitive peak output current −−7.5 A

I

q(tot)

total quiescent current − 115 − mA

I

stb

standby current − 0.1 100 µA

I

sw

switch-on current −−40 µA

Z

i

input impedance 100 120 − kΩ

P

out

output power RL=4Ω; THD = 10% − 25 − W

R

L

=2Ω; THD = 10% − 40 − W

SVRR supply voltage ripple rejection R

s

=0Ω−60 − dB

α

cs

channel separation Rs=10kΩ−50 − dB
CMRR common mode rejection ratio − 75 − dB
G

v

closed loop voltage gain 25 26 27 dB
V

no

noise output voltage Rs=0Ω−−120 µV
V

os

DC output offset voltage −−100 mV

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8566Q DBS17P plastic DIL-bent-SIL power package;17 leads (lead length 12 mm) SOT243-1

2000 Jan 28 3

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

BLOCK DIAGRAM

handbook, full pagewidth

+

−

+

−

C

M

V

A

(9×)

2.3 kΩ

2.3
kΩ

mute
switch

+

−

+

−

C

M

V

A

V

A

1×

standby

reference

voltage

standby

switch

mute
reference
voltage

V

ref

mute

switch

CLIP

(9×)

2.3 kΩ

2.3
kΩ

60

kΩ

60

kΩ

60

kΩ

60

kΩ

mute
switch

+

−

+

−

C

M

V

A

(9×)

2.3 kΩ

2.3
kΩ

mute
switch

+

−

+

−

C

M

V

A

11 7

12

10

15

4

TDA8566Q

14

8

6

135

1

2

3

16

17

V

P2

V

P1

PGND2 PGND1

OUT2−

OUT2+

OUT1−

OUT1+

IN1−

IN1+

IN2−

IN2+

SGND

n.c.

DIAG

MODE

CLIP

MGD105

(9×)

2.3 kΩ

2.3
kΩ

mute
switch

9

DIAG

Fig.1 Block diagram.

2000 Jan 28 4

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

PINNING

SYMBOL PIN DESCRIPTION

IN1+ 1 channel 1 input positive
IN1− 2 channel 1 input negative
SGND 3 small signal ground
CLIP 4 clip detection
V

P1

5 supply voltage 1
OUT1+ 6 channel 1 speaker output positive
PGND1 7 channel 1 negative power supply

(ground)
OUT1− 8 channel 1 speaker output negative
n.c. 9 not connected
OUT2+ 10 channel 2 speaker output positive
PGND2 11 channel 2 negative power supply

(ground)
OUT2− 12 channel 2 speaker output negative
V

P2

13 supply voltage 2

MODE 14 mode select switch

(standby/mute/operating)
DIAG 15 short-circuit and temperature

pre-warning diagnostic
IN2+ 16 channel 2 input positive
IN2− 17 channel 2 input negative

handbook, halfpage

TDA8566Q

MGD101

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17

IN1+
IN1−

SGND

CLIP

V

P1

OUT1+

PGND1

OUT1−

n.c.

IN2−

IN2+

DIAG

MODE

V

P2

OUT2−

PGND2

OUT2+

Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION

The TDA8566Qcontains 2 identical amplifiersandcan be
used for BTL applications. The gain of each amplifier is
fixed at 26 dB. Special features of this device are:

1. Mode select switch

2. Clip detection

3. Short-circuit diagnostic

4. Temperature pre-warning

5. Open-collector outputs

6. Differential inputs.

Mode select switch (pin 14)

• Standby: low supply current (<100 µA)

• Mute: input signal suppressed

• Operating: normal on condition.

Since this pinhasa very low input current (<40 µA),a low
cost supply switch can be applied. To avoid switch-on
plops,it isadvisable tokeepthe amplifierin themutemode
for a period of ≥150 ms (charging the input capacitors at
pins 1, 2, 16 and 17). This can be realized by
microcontroller controlor by anexternal timing circuit (see
Fig.7).

Clip detection (pin 4)

When clipping occurs at one or more output stages, the
dynamic distortion detector becomes active and pin 4
goes LOW. Thisinformation can be used to drivea sound
processor or a DC volume control to attenuate the input
signal and so limit the level of distortion. The output level
of pin 4 isindependent of the numberof channels that are
being clipped. The clip detection circuit is disabled in a
short-circuit condition, so if a fault condition occurs at the
outputs, pin 4 will remain at a HIGH level. The clip
detection waveforms are illustrated in Fig.3.

2000 Jan 28 5

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

Short-circuit diagnostic (pin 15)

When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device isswitched on again(with a delayof approximately
20 ms after the removal of the short-circuit). During this
short-circuit condition, pin 15 is continuously LOW.

When ashort-circuit occurs across theload of one orboth
channels, the output stages are switched off for
approximately 20 ms. After approximately 50 µs the load
condition is again checked to see iftheshort-circuit is still
present. Dueto thisduty cycleof50 µs/20 ms theaverage
current consumption during this short-circuit condition is
very low (approximately 40 mA). During this short-circuit
condition, pin 15 is LOW for 20 ms and HIGH for 50 µs
(see Fig.4). The power dissipation in any short-circuit
condition is very low.

Temperature pre-warning (pin 15)

When the junction temperature (Tvj) reaches 145 °C,
pin 15 will become continuously LOW.

Open-collector outputs

Pins 4 and 15 are open-collector outputs, therefore more
devices can be tied together. Pins 4 and 15 can also be
tied together. An external pull-up resistor is required.

Differential inputs

The input stage is a high-impedance fully differential
balanced input stagethat is also capable of operatingin a
single-ended mode with one of the inputs capacitively
coupled to an audio ground. It should be noted that if a
source resistance is added (input voltage dividers) the
CMRR degrades to lower values.

handbook, halfpage

V

4

0

V

P

V

out

0

t

MGD103

Fig.3 Clip detection waveforms.

handbook, full pagewidth

MGA707

short-circuit over the load

20 ms

50 µs

t

t

V

P

current

in

output

stage

V

15

Fig.4 Short-circuit diagnostic timing diagram.

2000 Jan 28 6

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

Quality specification in accordance with

“UZW-FQ-611-E”

, if this type is used as an audio amplifier. The number of the

quality specification can be found in the

“Quality Reference Handbook”

. The handbook can be ordered using the code

9397 750 00192.

THERMAL CHARACTERISTICS

Thermal characteristics in accordance with (IEC 747-1).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 18 V

non-operating − 30 V
during 50 ms; load dump

protection t

rise

≥ 2.5 ms

− 45 V

I

OSM

non-repetitive peak output current − 10 A

I

ORM

repetitive peak output current − 7.5 A

T

stg

storage temperature −55 +150 °C

T

vj

virtual junction temperature − 150 °C

T

amb

ambient temperature −40 +85 °C

V

psc

short-circuit safe voltage − 18 V

V

pr

reverse polarity − 6.0 V

P

tot

total power dissipation − 60 W

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-c)

thermal resistance from junction to case 1.3 K/W

R

th(j-a)

thermal resistance from junction to ambient in free air 40 K/W

handbook, halfpage

2.2 K/W

0.2 K/W

2.2 K/W

virtual junction

output 1 output 2

case

MEA861 - 1

Fig.5 Equivalent thermal resistance network.

2000 Jan 28 7

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

DC CHARACTERISTICS

VP= 14.4 V; T

amb

=25°C; measured in test circuit of Fig.6; unless otherwise specified.

Notes

1. The circuit is DC adjusted at V

P

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

2. At VP= 18 to 30 V the DC output voltage ≤0.5 VP.

AC CHARACTERISTICS

VP= 14.4 V; T

amb

=25°C; RL=2Ω; fi= 1 kHz; measured in test circuit of Fig.6; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage

V

P

supply voltage note 1 6 14.4 18 V

I

q

quiescent current RL= ∝−115 180 mA

Operating condition

V

ms(op)

mode select switch level 8.5 − V

P

V

I

14

mode select switch current V14= 14.4 V − 15 40 µA

V

o

output voltage note 2 − 7.0 − V

V

os

output offset voltage −− 100 mV

Mute condition

V

ms(mute)

mode select switch level 3.3 − 6.4 V

V

o

output voltage note 2 − 7.0 − V

V

os

output offset voltage −− 100 mV

Standby condition

V

ms(stb)

mode select switch level 0 − 2V

I

stb

standby current − 0.1 100 µA

Diagnostic

V

15

diagnostic output voltage during any fault condition −− 0.6 V

T

vj

temperature pre-warning V15= 0.6 V − 145 −°C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

out

output power THD = 0.5% 25 30 − W

THD = 10% 33 40 − W
THD = 30% 45 55 − W
V

P

= 13.5 V; THD = 0.5% − 25 − W

V

P

= 13.5 V; THD = 10% − 35 − W

THD = 0.5%; R

L

=4Ω 16 19 − W

THD = 10%; R

L

=4Ω 21 25 − W

THD = 30%; R

L

=4Ω 28 35 − W

V

P

= 13.5 V; THD = 0.5%;

RL=4Ω

− 14 − W

V

P

= 13.5 V; THD = 10%;

RL=4Ω

− 22 − W

2000 Jan 28 8

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

Notes

1. Frequency response externally fixed.

2. V

ripple=Vripple(max)

= 2 V (p-p); Rs=0Ω.

3. Dynamic Distortion Detector (DDD) active; pin 4 is LOW.

4. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
V

common

≤ 3.5 V (RMS); f = 100 Hz to 10 kHz; Rs=0Ω.

5. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
V

common

≤ 3.5 V (RMS); f = 1 kHz; Rs=45kΩ. The mismatch of the input coupling capacitors is excluded.

THD total harmonic distortion P

out

=1W − 0.1 − %

note 3; V

4

= 0.6 V − 8 − %

P

out

= 1 W; RL=4Ω− 0.05 − %

B power bandwidth THD = 0.5%; P

out

= −1dB

with respect to 25 W

− 20 to 20000 − Hz

f

l

low frequency roll off −1 dB; note 1 − 25 − Hz

f

h

high frequency roll off −1dB 20 −−kHz

G

v

closed loop voltage gain 25 26 27 dB

SVRR supply voltage ripple

rejection

on; note 2 50 −−dB
mute; note 2 50 −−dB
standby; note 2 80 −−dB

Z

i

input impedance differential 100 120 150 kΩ

single-ended 50 60 75 kΩ
∆Zi input impedance mismatch − 2 − %
V

no

noise output voltage on; B = 20 Hz to 20 kHz;

Rs=0Ω

− 85 120 µV

on; B = 20 Hz to 20 kHz;

R

s

=10kΩ

− 100 −µV

mute; B = 20 Hz to 20 kHz;

independent of R

s

− 60 −µV

α

cs

channel separation P

out

= 25 W; Rs=10kΩ 45 −−dB

∆G

v

 channel unbalance −− 1dB

V

o

output signal voltage in
mute

Vi=V

i(max)

= 1 V (RMS) −− 2mV

CMRR common mode rejection

ratio

R

s

=0Ω; note 4 60 75 − dB

R

s

=45kΩ; note 5 40 −−dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2000 Jan 28 9

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

+

−

+

−

Rs/2

V

mode

Rs/2

Rs/2

Rs/2

V

in2

V

in1

10
kΩ

10
kΩ

R

L2

R

L1

220 nF

220 nF

60
kΩ

60
kΩ

+

+

−

−

+

−

220 nF

220 nF

60
kΩ

60
kΩ

CLIP

DETECTOR

DIAGNOSTIC

INTERFACE

V

P

TDA8566Q

V

ref

V

P

100

nF

V

P =

14.4 V

2200

µF/16V

CLIP

DIAG

MGD104

1

+

+

_

+

_

+
_

+

_

_

+

_

6

8

4

15

10

12

711

14 135

2

3

16

17

Fig.6 Stereo BTL test diagram.

Application notes

DIAGNOSTIC OUTPUT
Special care must be taken in thePCB layout to separate

pin 4 from pins 1, 2, 16 and 17 to minimize the crosstalk
between the CLIP output and the inputs.

MODE SELECT SWITCH
To avoid switch-on plops, it is advisable to keep the

amplifier in the mute mode during ≥150 ms (charging of
the input capacitors atpins 1, 2, 16 and 17). The circuit in
Fig.7 slowly ramps-up the voltage at the mode select
switch pin when switching on and results in fast muting
when switching off.

handbook, halfpage

100 kΩ

MGD102

47 µF

10 kΩ

S

100 Ω

mode
select

switch

+V

supply

Fig.7 Mode select switch circuit.

2000 Jan 28 10

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

PACKAGE OUTLINE

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT243-1

0 5 10 mm

scale

D

L

E

A

c

A

2

L

3

Q

w M

b

p

1

d

D

Z

e

e

x

h

117

j

E

h

non-concave

97-12-16
99-12-17

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

SOT243-1

view B: mounting base side

m

2

e

v M

B

UNIT A e

1

A2bpcD

(1)

E

(1)

Z

(1)

deD

h

LL3m

mm

17.0

15.5

4.6

4.4

0.75

0.60

0.48

0.38

24.0

23.6

20.0

19.6

10 2.54

v

0.8

12.2

11.8

1.27

e

2

5.08

2.4

1.6

E

h

6

2.00

1.45

2.1

1.8

3.4

3.1

4.3

12.4

11.0

Qj

0.4w0.03

x

2000 Jan 28 11

Philips Semiconductors Product specification

2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs

TDA8566Q

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.A morein-depth accountof solderingICs canbe
found in our

“Data Handbook IC26; Integrated Circuit

Packages”

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Thetotal contacttime ofsuccessivesolder wavesmust not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the
printed-circuit board has been pre-heated, forced cooling
may benecessary immediately after solderingto keep the
temperature within the permissible limit.

Manual soldering

Apply the solderingiron (24 V or less) tothe lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in suchapplications do so at their ownrisk and agree to fullyindemnify Philips for any damages resultingfrom such
improper use or sale.

PACKAGE

SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable

(1)

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not formpart ofany quotation or contract, is believed to be accurateand reliableand maybe changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

69

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Tel. [phone] Fax.[phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N.Rd., Sec.1,
TAIPEI, Taiwan Tel. [phone], Fax.[phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-BangnaRoad Prakanong, BANGKOK10260,
Tel. [phone], Fax.[phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax.[phone]

Ukraine: PHILIPS UKRAINE, 4 PatriceLumumba str., Building B, Floor7,
252042 KIEV, Tel.[phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB35BX, Tel. [phone], Fax.[phone]

United States: 811 EastArques Avenue, SUNNYVALE, CA94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

Printed in The Netherlands 753503/25/04/pp12 Date of release:2000 Jan 28 Document order number: 9397 750 06608