Datasheet TDA8350Q-N6, TDA8350Q-N4 Datasheet (Philips)

Page 1
DATA SH EET
Preliminary specification Supersedes data of September 1991 File under Integrated Circuits, IC02
January 1995
INTEGRATED CIRCUITS
Philips Semiconductors
TDA8350Q
Page 2
January 1995 2
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
FEATURES
Few external components
Highly efficient fully DC-coupled vertical output bridge
circuit
Vertical flyback switch
Guard circuit
Protection against:
– short-circuit of the output pins – short-circuit of the output pins to V
P
High EMC immunity due to common mode inputs
Temperature (thermal) protection
East-West output stage with one single conversion
resistor.
GENERAL DESCRIPTION
The TDA8350Q is a power circuit for use in 90° and 110° colour deflection systems for field frequencies of 50 to 120 Hz. The circuit provides a DC driven vertical deflection output circuit, operating as a highly efficient class G system and an East-West driver for sinking the diode modulator current.
QUICK REFERENCE DATA
Note
1. A flyback supply voltage of>50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22 resistor (dependent on I
O
and the inductance of the coil) has to be connected between pin 7 and ground. The decoupling capacitor of VFB has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of 33 (see application circuit Fig.5).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC supply
V
P
supply voltage 9 25 V
I
P
quiescent current 30 mA
Vertical circuit
I
O(p-p)
output current (peak-to-peak value) −−3A
I
diff(p-p)
differential input current (peak-to-peak value)
600 −µA
V
diff(p-p)
differential input voltage (peak-to-peak value)
1.5 1.8 V
Flyback switch
I
M
peak output current −−±1.5 A
V
FB
flyback supply voltage −−50 V
note 1 −−60 V
East-West amplifier
I
O(sink)
output current (sink only) −−500 mA
V
O(sink)
peak output voltage I
O(sink)
=10µA −−40 V
I
bias
input bias current −−1µA
Thermal data (in accordance with IEC 747-1)
T
stg
storage temperature 65 150 °C
T
amb
operating ambient temperature 25 +75 °C
T
vj
virtual junction temperature −−150 °C
Page 3
January 1995 3
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA8350Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
Fig.1 Block diagram.
handbook, full pagewidth
MBC229-1
7
13
V
3
9
5
GND
12
I
I(corr)
V
O(sink)
4
V
P
V
FB
8
1
2
I
drive(pos)
I
drive(neg)
TDA8350
I
I(set)
I
I(set)
I
S
I
S
V
P
I
T
I
T
V
P
11
V
O(A)
V
O(B)
V
O(B)
V
O(A)
V
I(fb)
V
P
V
O(guard)
10
CURRENT
SOURCE
Page 4
January 1995 4
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
PINNING
SYMBOL PIN DESCRIPTION
I
drive(pos)
1 input power-stage (positive);
includes I
I(sb)
signal bias
I
drive(neg)
2 input power-stage (negative);
includes I
I(sb)
signal bias
V
I(fb)
3 feedback voltage input
V
P
4 supply voltage
V
O(B)
5 output voltage B n.c. 6 not connected GND 7 ground V
FB
8 flyback supply voltage V
O(A)
9 output voltage A V
O(guard)
10 guard output voltage
V
O(sink)
11 East-West amplifier driver (sink)
output voltage
I
I(corr)
12 East-West amplifier input
correction current (negative)
I
I(set)
13 East-West amplifier set input
current (positive)
Fig.2 Pin configuration.
book, halfpage
TDA8350
I
drive(pos)
V
I(fb)
V
P
V
O(B)
n.c.
GND
V
FB
V
O(A)
V
O(guard) V
O(sink)
I
I(corr) I
I(set)
I
drive(neg)
MBC226-1
1 2 3 4 5 6 7 8
9 10 11 12 13
FUNCTIONAL DESCRIPTION
The vertical driver circuit is a bridge configuration. The deflection coil is connected between the output amplifiers, which are driven in phase opposition. An external resistor (RM) connected in series with the deflection coil provides internal feed back information. The differential input circuit is voltage driven. The input circuit has been adapted to enable it to be used with the TDA9150, TDA9151B, TDA9160A, TDA9162, TDA8366 and TDA8367 which deliver symmetrical current signals. An external resistor (R
CON
) connected between the differential input determines the output current through the deflection coil. The relationship between the differential input current and the output current is defined by: I
diff
× R
CON=I(coil)
× RM. The output current is adjustable from 0.5 A (p-p) to 3 A (p-p) by varying RM. The maximum input differential voltage is 1.8 V. In the application it is recommended that V
diff
= 1.5 V (typ). This is recommended because of the spread of input current and the spread in the value of R
CON
.
The flyback voltage is determined by an additional supply voltage VFB. The principle of operating with two supply voltages (class G) makes it possible to fix the supply voltage VP optimum for the scan voltage and the second supply voltage VFB optimum for the flyback voltage. Using this method, very high efficiency is achieved.
The supply voltage VFB is almost totally available as flyback voltage across the coil, this being possible due to the absence of a decoupling capacitor (not necessary, due to the bridge configuration). The output circuit is fully protected against the following:
thermal protection
short-circuit protection of the output pins (pins 5 and 9)
short-circuit of the output pins to V
P.
A guard circuit V
O(guard)
is provided. The guard circuit is
activated at the following conditions:
during flyback
during various short-circuit possibilities at the output
pins
during open loop
when the thermal protection is activated.
This signal can be used for blanking the picture tube screen.
An East-West amplifier is also provided. This amplifier is an inverting amplifier which is current driven with sink current only capabilities.
Page 5
January 1995 5
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. A flyback supply voltage of>50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22 resistor (dependent on I
O
and the inductance of the coil) has to be connected between pin 7 and ground. The decoupling capacitor of VFB has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of 33 (see application circuit Fig.5).
2. IO maximum determined by current protection.
3. The operating area is limited by a straight line between the points V
O(sink)
= 40 V; I
O(sink)
=10µA and V
O(sink)
=2V;
I
O(sink)
= 500 mA.
4. Up to Vp=18V.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
DC supply
V
P
supply voltage non-operating 40 V
25 V
V
FB
flyback supply voltage 50 V
note 1 60 V
Vertical circuit
I
O
output current (peak-to-peak value) note 2 3A
V
O(A)
output voltage (pin 9) 52 V
note 1 62 V
Flyback switch
I
M
peak output current −±1.5 A
East-West amplifier
V
O(sink)
output voltage I
O(sink)
=10µA; note 3 40 V
I
O(sink)
output current V
O(sink)
= 2 V; note 3 500 mA
Thermal data (in accordance with IEC 747-1)
T
stg
storage temperature 65 150 °C
T
amb
operating ambient temperature 25 +75 °C
T
vj
virtual junction temperature 150 °C
R
th vj-c
resistance vj-case 4 K/W
R
th vj-a
resistance vj-ambient in free air 40 K/W
t
sc
short-circuiting time note 4 1hr
Page 6
January 1995 6
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
CHARACTERISTICS
VP= 17.5 V; VFB= 45 V; V
O(sink)
= 20 V; fi= 50 Hz; I
I(sb)
= 400 µA; T
amb
=25°C; measured in test circuit of Fig.3; unless
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC supply
V
P
operating supply voltage 9 25 V
V
FB
flyback supply voltage V
p
50 V
note 1 −−60 V
I
P
supply current no signal; no load 30 55 mA
Vertical circuit
V
O
output voltage swing (scan) I
diff
= 0.6 mA (p-p);
V
diff
= 1.8 V (p-p);
IO= 3 A (p-p)
19.8 −−V
LE linearity error I
O
= 3 A (p-p); 12%
I
O
= 50 mA (p-p); note 2 12%
V
O
output voltage swing (flyback) V
O(A)-VO(B)
I
diff
= 0.3 mA;
IO= 1.5 A (M)
39 V
V
DF
forward voltage of the internal efficiency diode (V
O(A)-VFB
)
IO= 1.5 A (M); I
diff
= 0.3 mA
−−1.5 V
|I
os
| output offset current I
diff
=0;
I
I(sb)
=50to500µA
−−30 mA
|V
os
| offset voltage at the input of the
feedback amplifier V
I(fb)-VO(B)
I
diff
=0;
I
I(sb)
=50to500µA
−−18 mV
V
os
T output offset voltage as a function
of temperature
I
diff
=0; −−72 µV/K
V
O(A)
DC output voltage I
diff
= 0; note 3 8 V
G
v
open loop voltage gain (V
9-5/V1-2
) notes 4 and 5 80 dB
open loop voltage gain (V
9-5/V3-5
;
V
1-2
=0)
note 4 80 dB
V
R
voltage ratio V
1-2/V3-5
0 dB
f
res
frequency response (3 dB) note 6 40 Hz
G
I
current gain (IO/I
diff
) 5000
G
I
T current gain drift as a function of
temperature
−−10
4
/K
I
I(sb)
signal bias current 50 400 500 µA
I
FB
flyback supply current during scan −−100 µA PSRR power supply ripple rejection note 7 80 dB V
I(DC)
DC voltage at the input 2.7 V V
I(CM)
common mode input voltage I
I(sb)
=0 0 1.6 V
I
bias
input bias current I
I(sb)
=0 0.1 0.5 µA
I
O(CM)
common mode output current I
I(sb)
= 300 µA (p-p);
fi= 50 Hz; I
diff
=0
0.2 mA
Page 7
January 1995 7
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
Notes
1. A flyback supply voltage of>50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22 resistor (dependent on IO and the inductance of the coil) has to be connected between pin 7 and ground. The decoupling capacitor of VFB has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of 33 (see application circuit Fig.5).
2. The linearity error is measured without S-correction and based on the same measurement principle as performed on the screen. The measuring method is as follows: Divide the output signal I
5-I9(VRM
) into 22 equal parts ranging from 1 to 22 inclusive. Measure the value of two succeeding parts called one block starting with part 2 and 3 (block 1) and ending with part 20 and 21 (block 10). Thus part 1 and 22 are unused. The equations for linearity error for adjacent blocks (LEAB) and not adjacent blocks (NAB) are given below;
;
3. Referenced to V
P
.
4. V values within formulae, relate to voltages at or between relative pin numbers, i.e. V
9-5/V1-2
= voltage value across
pins 9 and 5 divided by voltage value across pins 1 and 2.
5. V
3-5
AC short-circuited.
6. Frequency response V
9-5/V3-5
is equal to frequency response V
9-5/V1-2
.
7. At V
(ripple)
= 500 mV eff; measured across RM; fi= 50 Hz.
8. The output pin 11 requires a capacitor of minimum value 68 nF.
East-West amplifier
V
O(sink)
saturation voltage I
O(sink)
= 500 mA;
I
I(corr)
=0µA; note 8
2.0 2.5 V
G
v
open loop voltage gain (V11/V12) 47 dB
f
res
frequency response (3 dB) 4000 Hz
LE linearity error V
O(sink)
=3V −−1%
V
O(sink)
= 10 V; note 2 −−0.5 %
I
bias
input bias current (pin 12) −−2µA
V
I(DC)
DC input voltage 1 V
I
set
offset voltage set current 1 mA
V
13-7
maximum allowed voltage at pin 13
−−0.3 V
Guard circuit
I
O
output current not active;
V
O(guard)
=0V
−−50 µA
output current active; V
O(guard)
= 4.5 V 1 2.5 mA
V
O(guard)
output voltage IO= 100 µA −−5.5 V allowable voltage on pin 10 maximum leakage
current = 10 µA
−−40 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
LEAB
a
kak1+()
a
avg
----------------------------- -
= NAB
a
maxamin
a
avg
----------------------------- -
=
Page 8
January 1995 8
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
Fig.3 Test circuit.
handbook, full pagewidth
MBC228
713
EAST WEST-AMPLIFIER
V
FEEDBACK
PULSE
3
9
5
68
nF
68 k
GND
I
SET
12
I
I(corr)
V
O(sink)
R = 0.6
M
4
V
P
V
FB
V
O(guard)
10
8
I
diff
3 k
CON
R
1
2
I
drive(pos)
I
drive(neg)
I
I(sb)
signal
bias
I
I(sb)
signal
bias
R = 6.2
36
TDA8350
Page 9
January 1995 9
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
APPLICATION INFORMATION
Fig.4 Application diagram.
VP= 14 V; I
O(p-p)
= 2.14 A; I
I(sb)
= 400 µA; I
diff(p-p)
= 500 µA; VFB= 42 V; tFB= 0.6 ms.
handbook, full pagewidth
MBC227
713
EAST WEST-AMPLIFIER
V
FEEDBACK
PULSE
3
V
100
nF
I(fb)
V
O(A)
V
O(B)
I
(coil)
9
5
68 nF
68 k
GND
I
SET
12
I
I(corr)
V
O(sink)
to line
output stage
R = 0.7
M
deflection coil
AT6005/31
L = 8.63 mH
R = 5.0
4
V
P
V
FB
V
O(guard)
10
8
I
diff
3 k
CON
R
1
2
I
drive(pos)
I
drive(neg)
I
I(sb)
signal
bias
I
I(sb)
signal
bias
TDA8350
Page 10
January 1995 10
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
Fig.5 Application circuit; 50 V VFB≤ 60 V.
VP= 14 V; I
O(p-p)
= 2.14 A; I
I(sb)
= 400 µA; I
diff(p-p)
= 500 µA; VFB= 60 V; tFB= 0.4 ms.
ok, full pagewidth
MGC054
713
EAST WEST-AMPLIFIER
V
FEEDBACK
PULSE
3
V
100
nF
I(fb)
V
O(A)
V
O(B)
I
(coil)
9
5
68 nF
68 k
GND
I
SET
12
I
I(corr)
V
O(sink)
to line
output stage
R = 0.7
M
deflection coil
AT6005/31
L = 8.63 mH
R = 5.0
4
V
P
V
FB
V
O(guard)
10
8
I
diff
3 k
CON
R
1
2
I
drive(pos)
I
drive(neg)
I
I(sb)
signal
bias
I
I(sb)
signal
bias
TDA8350
220
nF
20
Page 11
January 1995 11
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
PACKAGE OUTLINE
Fig.6 Plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm); (DBS13P; SOT141-6).
Dimensions in mm.
handbook, full pagewidth
MBC369
13 11
0.05 convex
20.0
19.6
24.4
23.6
3.4
3.1
12.4
11.6
987654321
2.20
1.45
0.25
M
(13x)
0.75
0.60
1.7
2.1
1.8
6
10
4.7
4.1
(12x)
mounting base
0.55
0.35
0.8
M
4.35.08
A
17.0
15.5
2.4
1.6
(13x)
A
seating plane
3.4
10111213
Page 12
January 1995 12
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
SOLDERING Plastic DIL-bent-SIL packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 13
January 1995 13
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
NOTES
Page 14
January 1995 14
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
NOTES
Page 15
January 1995 15
Philips Semiconductors Preliminary specification
DC-coupled vertical deflection and East-West output circuit
TDA8350Q
NOTES
Page 16
Philips Semiconductors
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For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825
SCD36 © Philips Electronics N.V. 1994
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533061/1500/02/pp16 Date of release: January 1995 Document order number: 9397 744 70011
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