Product specification
File under Integrated Circuits, IC02
November 1987
Page 2
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
DESCRIPTION
The TDA8340;Q and TDA8341;Q are integrated IF
amplifier and demodulator circuits for colour or black/white
television receivers, the TDA8340;Q is for application with
n-p-n tuners and the TDA8341;Q for p-n-p tuners.
The TDA8340;Q and TDA8341;Q are pin-compatible
successors with improved performance to types
TDA2540/2541;Q and TDA3540/3541;Q.
TDA8340
TDA8341
Features
• Full range gain-controlled wide-band IF amplifier
• Linear synchronous demodulator with excellent
intermodulation performance
• White spot inverter
• Wide-band video amplifier with noise protection
• AFC circuit with AFC on/off switching and
sample-and-hold function
• Low impedance AFC output
• AGC circuit with noise gating
• Tuner AGC output for n-p-n tuners (TDA8340) or p-n-p
tuners (TDA8341)
• External video switch for switching-off the video output
• Reduced sensitivity for high sound carriers
• Integrated filter to limit second harmonic IF signals
• Wide supply voltage range
• Requires few external components
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage (pin 11)V
Supply current (pin 11)I
CC=V11-13
11
9,41213,2V
304255mA
IF input sensitivity
(r.m.s. value)V
IF gain control rangeG
1-16(rms)
v
204080µV
−67−dB
Video output voltagewhite signal;
(peak-to-peak value)10% top syncV
Signal-to-noise ratioV
= 10 mVS/(S+N)5058−dB
i
12−13(p−p)
2,42,73,0V
AFC output voltage swing
(peak-to-peak value)V
5-13(p-p)
−10−V
PACKAGE OUTLINES
TDA8340; TDA8341:16-lead DIL; plastic (SOT38); SOT38-1; 1996 november 29.
November 19872
Page 3
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
November 19873
Fig.1 Block diagram.
Page 4
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
PINNING
1 and 16Balanced IF inputs
2 and 15IF amplifier decoupling
3Tuner AGC starting point adjustment
4Tuner AGC output
5AFC output
6AFC on/off switch and sample-and-hold capacitor
7 and 10Reference carrier π/2 rad. phase shift
8 and 9IF picture carrier passive regeneration
11Positive supply voltage (V
12Video output
13Ground (V
14IF AGC capacitor and VCR switch
FUNCTIONAL DESCRIPTION
IF amplifier
EE
)
CC
)
TDA8340
TDA8341
This is a 3-stage, gain-controlled IF amplifier with a wide dynamic range. On-chip capacitors in the d.c. feedback loop of
the amplifier maintain stability at maximum gain. Internal stabilization of the supply voltage ensures the desired sensitivity
and gain control range over the whole supply voltage range and also gives very good power supply ripple rejection in this
part of the circuit.
Demodulator
The redesigned IF demodulator is a quasi-synchronous circuit that employs passive carrier regeneration and logarithmic
clamping to give improved signal handling. The demodulator input is a.c. coupled to the IF amplifier to reduce d.c. offsets
and thus minimize residual IF carrier in the output signal.
Video amplifier
The linearity and bandwidth of the video amplifier are sufficient to meet all wide band requirements, e.g. for teletext
transmissions. Second harmonics of the IF carrier are effectively reduced by a Sallen-Key low pass interstage filter
between the demodulator output and the video amplifier input. An integrated filter in the noise inverter reduces the
sensitivity of the video amplifier for high sound carriers.
White spot protection comprises a white spot clamp system combined with a delayed-action inverter which is also highly
resistant to high sound carriers.
Note. To prevent radiated video output at the input pins, connect a 6,8 µH inductor in series with pin 12 and fit as close
as possible to the IC body. Use short leads.
AGC detector
A Bessel low-pass filter between the video output and the AGC detector improves the detector function in the presence
of high sound carriers. No ‘hang-up’ occurs in the detector after pin 14 has been short-circuited to ground (VCR switch
operated). The detector also generates the sample-and-hold pulse for the AFC system.
November 19874
Page 5
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
AGC control circuit
This converts the AGC detector voltage (pin 14) into a current signal which controls the gain of the IF amplifier. It also
provides a tuner AGC control output from pin 4, current limiting is incorporated to prevent internal damage. The AGC
starting point is adjusted via pin 3.
AFC circuit
The AFC circuit provides a voltage output which controls the IF frequency of the tuner. Video information on the AFC
output (pin 5) is eliminated by a sample-and-hold circuit (external capacitor at pin 6). Coupling between the AFC and
reference tuned circuits is via two small capacitors (or parasitic capacitance) between the respective tracks of the printed
circuit board. If the capacitance is less than 1 pF, the steepness of the AFC characteristic is reduced.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERSYMBOLMIN.MAX.UNIT
Supply voltage (pin 11)V
IF AGC voltage/VCR switchV
Tuner AGC voltageV
AFC switch voltageV
Maximum voltage level with
VCR switch activeV
DC current at video outputI
DC current at AFC outputI
Total power dissipationP
Storage temperature rangeT
Operating ambient temperatureT
CC=V11−13
14-13
4-13
6-13
12-13
12
5
tot
stg
amb
9,413,2V
−13,2V
−12V
−13,2V
−5,0V
−10mA
−10mA
−1,2W
−55+150°C
−25+70°C
November 19875
Page 6
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
CHARACTERISTICS
Measured in circuit of Fig.3; V
=12V; T
CC
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage (pin 11)V
Supply currentno input signalI
IF amplifier (note 1)
Input sensitivityat onset of AGCV
Differential input resistanceR
Differential input
capacitanceC
Gain control rangeG
Input signal variationnote 2V
Maximum input signalV
Tuner AGC (note 1)
Tuner AGC starting pointR
(note 3)R
3−11
3−13
Maximum current swing
of tuner AGC outputI
Input signal variationnote 4;
I
= 1 to 9 mAV
4
Output saturation voltageI
Leakage currentV
=7mAV
4
=12VI
4
Video output (note 4)
Zero-signal output levelnote 5V
Top sync output levelV
Video output voltagewhite signal;
(peak-to-peak value)10% top syncV
Internal bias current
of emitter follower
output transistor1,42,23,0mA
Output impedanceZ
Bandwidth of demodulated
1. All input signals are measured r.m.s. at top sync and 38,9 MHz.
2. Measured with 0 dB = 200 µV.
3. Tuner AGC starting point is defined as ‘level of input signal when tuner AGC current = 1 mA’.
4. Measured with pin 3 connected via 39 kΩ resistor to VCC(pin 11), with an r.m.s. voltage of 10 mV top sync input
signal and with pin 12 not loaded.
5. At the ‘projected zero point’, e.g. with switched demodulator.
6. Measured in the circuit of Fig.7:
the differential gain is expressed as a percentage of the difference in peak amplitudes between the largest and
smallest value relative to the subcarrier amplitude at blanking level;
the differential phase is defined as ‘the difference (in degrees) between the largest and smallest phase angles’.
7. Measured according to the test line shown in Fig.9:
the non-linearity is expressed as a percentage of the maximum deviation of a luminance step from the mean step,
with respect to the mean step;
the mean step is (white level − black level) divided by the number of steps.
8. Measured up to 45 dB gain control.
9. Test set-up and input conditions for intermodulation measurements as in Figs 6 and 7.
V
10. Measured with a 75 Ω source:
11. Video output waveform showing white spot and noise inverter threshold levels.
Fig.2 AFC output voltage as a function of frequency.
November 19878
Page 9
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
Fig.3 Typical application circuit diagram; Q of L1 and L2 = 80; fo= 38,9 MHz.
Fig.4 Video output waveform showing white spot and noise inverter threshold levels.
November 19879
Page 10
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
Fig.5 Signal-to-noise ratio as a function of input voltage.
S.C.: sound carrier level; with respect to top sync level
C.C.: chrominance carrier level ; with respect to top sync level
P.C.: picture carrier level; with respect to top sync level
Fig.6 Input conditions for intermodulation measurements; standard colour bar with 75% contrast.
November 198710
Page 11
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
Fig.7 Test set-up for intermodulation measurements.
Fig.8 Video output signal.
November 198711
Page 12
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
Fig.9 E.B.U. test signal waveform (line 330).
November 198712
Page 13
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
1
w M
TDA8340
TDA8341
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
pin 1 index
1
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEeM
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1)(1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.547.62
0.010.100.0200.19
ISSUE DATE
92-10-02
95-01-19
max.
2.2
0.087
November 198713
Page 14
Philips SemiconductorsProduct specification
Television IF amplifier and demodulator
TDA8340
TDA8341
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 198714
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