Datasheet TDA8001T-C1, TDA8001AT-C1, TDA8001A-C1, TDA8001-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1995 Feb 01
File under Integrated Circuits, IC02

1996 Dec 12

INTEGRATED CIRCUITS

TDA8001

Smart card interface

1996 Dec 12 2

Philips Semiconductors Product specification

Smart card interface TDA8001

FEATURES

• Protected I/O line

• VCC regulation (5 V ±5%, 100 mA max. with controlled

rise and fall times)

• VPP generation (12.5, 15 or 21 V ±2.5%, 50 mA max.,
with controlled rise and fall times) (only at TDA8001 and
TDA8001T)

• Clock generation (up to 10 MHz), with synchronous
frequency doubling

• Overload, thermal and card extraction protections

• Current limitation in case of short-circuit

• Idle mode and special circuitry for spikes killing during

powering on and off

• Two voltage supervisors (digital and analog supplies)

• Automatic activation and deactivation sequences

through an independent internal clock

• Enhanced ESD protections on card side (4 kV min.)

• Easy chaining for multiple card readers

• ISO 7816 compatibility.

APPLICATIONS

• Pay TV (multistandards conditional access system,
videoguard, newscript)

• Multi-application smart card readers (banking, vending
machine, electronic payment identification).

GENERAL DESCRIPTION

The TDA8001 is a complete, low-cost analog interface
which can be positioned between an asynchronous smart
card (ISO 7816) and a microcontroller. It is directly
compatible with the new Datacom chip verifier.

The complete supply, protection and control functions are
realized with only a few external components, making this
product very attractive for consumer applications
(see Chapter “Application information”).

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8001;
TDA8001A

DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1

TDA8001T;
TDA8001AT

SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

1996 Dec 12 3

Philips Semiconductors Product specification

Smart card interface TDA8001

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

supply voltage 6.7 − 18 V

I

DD

supply current idle mode; VDD=12V − 32 − mA

active modes; unloaded − 45 − mA

V

th2

threshold voltage on V

SUP

4.5 − 4.72 V

V

th4

threshold voltage on V

DD

6 − 6.5 V

V

CC

card supply voltage including static and dynamic

loads on 100 nF capacitor

4.75 5.0 5.25 V

I

CC

card supply current operating −−−100 mA

detection −−150 − mA
limitation −−−200 mA

V

H

high voltage supply for
V

PP

−−30 V

V

PP

card programming
voltage (only at TDA8001
and TDA8001T)
(P = 5, 12.5, 15 and 21 V)

including static and dynamic
loads on 100 nF capacitor

P − 2.5% − P + 2.5% V

I

PP

programming current
(read or write mode)

operating −−−50 mA
detection −−75 − mA
limitation −−−100 mA

SR slew rate on V

CC

and V

PP

(rise and fall)

maximum load capacitor 150 nF − 0.38 − V/µs

t

de

deactivation cycle duration 75 100 125 µs

f

clk

clock frequency 0 − 8 MHz

P

tot

continuous total power
dissipation

TDA8001; T

amb

= +70 °C;

see Fig.10

−−0.92 W

TDA8001T; T

amb

= +70 °C;

see Fig.11

−−2W

T

amb

operating ambient
temperature

0 − +70 °C

1996 Dec 12 4

Philips Semiconductors Product specification

Smart card interface TDA8001

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MBH813

PROTECTIONS

AND

ENABLE

MAIN

SUPPLY

VOLTAGE

SUPERVISOR

INTERNAL

CLOCK

LOGIC

V

CC

GENERATOR

CLOCK

ENABLE

CLOCK

CIRCUITRY

23
24

2

20

19

26

28

18

17

15 16 13 12

6
7

111

14

8

9

4

22

3

V

PP

GENERATOR

10

5

OSCILLATOR

PROTECTIONS

XTAL

I/O

RST

CLK

VPP12.5

VPP15

21

VPP21

PRES

PRES

V

PP

V

DD

V

CC

V

H

GND1

I/O(µC)

RSTIN

CMD3.5

GND2

CVNC

27
25

CMDVCC

CLKOUT2

CMD7

DETECT

OFF

ALARM
ALARM

DELAY

V

SUP

TDA8001

1996 Dec 12 5

Philips Semiconductors Product specification

Smart card interface TDA8001

PINNING

SYMBOL

PIN

DESCRIPTION

TDA8001

TDA8001T

TDA8001A

TDA8001AT

XTAL 1 1 crystal connection
DETECT 2 2 card extraction open collector output (active LOW)
I/O 3 3 data line to/from the card
RST 4 4 card reset output
CLK 5 5 clock output to the card
VPP12.5 6 − control input for applying the 12.5 V programming voltage (active LOW)
n.c. − 6 not connected
VPP15 7 − control input for applying the 15 V programming voltage (active LOW)
n.c. − 7 not connected
PRES 8 8 card presence contact input (active LOW)
PRES 9 9 card presence contact input (active HIGH)
V

PP

10 − card programming voltage output
n.c. − 10 not connected
V

H

11 11 HIGH voltage supply for VPP generation
GND1 12 12 ground 1
V

DD

13 13 positive supply voltage
V

CC

14 14 card supply output voltage
V

SUP

15 15 voltage supervisor input
DELAY 16 16 external capacitor connection for delayed reset timing
ALARM 17 17 open-collector reset output for the microcontroller (active HIGH)
ALARM 18 18 open-collector reset output for the microcontroller (active LOW)
OFF 19 19 open-collector interrupt output to the microcontroller (active LOW)
CMDVCC 20 20 control input for applying supply voltage to the card (active LOW)
VPP21 21 − control input for applying the 21 V programming voltage (active LOW)
n.c. − 21 not connected
CVNC 22 22 internally generated 5 V reference, present when V

DD

is on; to be

decoupled externally (100 nF)

CMD3.5
or CDMTC

23 23 control input for having the crystal frequency divided-by-4 at pin CLK

CLKOUT2 24 24 clock output to the microcontroller, or any other R4590

(crystal frequency divided by two)
GND2 25 25 ground 2
RSTIN 26 26 card reset input from the microcontroller (active HIGH)
CMD7

or CDMS

27 27 control input for having the crystal frequency divided by 2 at pin CLK

I/O(µC) 28 28 data line to/from the microcontroller

1996 Dec 12 6

Philips Semiconductors Product specification

Smart card interface TDA8001

Fig.2 Pin configuration.

handbook, halfpage

TDA8001

TDA8001T

MBH811

1
2
3
4
5
6
7
8

9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

XTAL

DETECT

I/O
RST
CLK

VPP12.5

VPP15

PRES
PRES

V

PP

V

DD

V

CC

V

H

GND1

I/O(µC)

CMD7 or CDMS
RSTIN

GND2
CLKOUT2
CMD3.5 or CDMTC
CVNC

VPP21
CMDVCC
OFF
ALARM
ALARM
DELAY

V

SUP

Fig.3 Pin configuration.

handbook, halfpage

TDA8001A

TDA8001AT

MBH812

1
2
3
4
5
6
7
8

9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

XTAL

DETECT

I/O
RST
CLK

n.c.

n.c.
PRES
PRES

n.c.

V

DD

V

CC

V

H

GND1

I/O(µC)

CMD7 or CDMS
RSTIN

GND2
CLKOUT2
CMD3.5 or CDMTC
CVNC

n.c.
CMDVCC
OFF
ALARM
ALARM
DELAY

V

SUP

1996 Dec 12 7

Philips Semiconductors Product specification

Smart card interface TDA8001

FUNCTIONAL DESCRIPTION
Power supply

The circuit operates within a supply voltage range of

6.7 to 18 V. V

DD

and GND are the supply pins. All card

contacts remain inactive during power up or down.

P

OWER UP

The logic part is powered first and is in the reset condition
until VDD reaches V

th1

. The sequencer is blocked until V

DD

reaches V

th4+Vhys4

.

P

OWER DOWN

When VDD falls below V

th4

, an automatic deactivation of

the contacts is performed.

Voltage supervisor

This block surveys the 5 V supply of the microcontroller
(V

SUP

) in order to deliver a defined reset pulse and to avoid
any transients on card contacts during power up or down
of V

SUP

. The voltage supervisor remains active even if V

DD

is powered-down.

P

OWER ON

As long as V

SUP

is below V

th2+Vhys2

the capacitor C

DEL

,

connected to pin DELAY, will be discharged. When V

SUP

rises to the threshold level, C

DEL

will be recharged.
ALARM and ALARM remain active, and the sequencer is
blocked until the voltage on the DELAY line reaches V

th3

.

P

OWER DOWN (see Fig.4)

If V

SUP

falls below V

th2

, C

DEL

will be discharged, ALARM
andALARM become active, and an automatic deactivation
of the contacts is performed.

Clock circuitry (see Fig.5)
The clock signal (CLK) can be applied to the card in two

different methods:

1. Generation by a crystal oscillator: the crystal, or the

ceramic resonator (4 to 16 MHz) is connected to the
XTAL pin.

2. Use of a signal frequency (up to 20 MHz), already

present in the system and connected to the XTAL pin
via a 10 nF capacitor (see Fig.14). In both cases the
frequency is first divided-by-two.

If

CMD7 (respectively CMD3.5) is LOW, the clock signal
(its frequency again divided by two) is enabled and
buffered before being fed to the CLK pin.

CMD3.5 and internal ENRST are sampled in order to give
the first clock pulse the correct width, and to avoid false
pulses during frequency change.

The CLKOUT2 pins may be used to clock a
microcontroller or an other TDA8001. The signal1⁄2f

xtal

is

available when the circuit is powered up.

State diagram

Once activated, the circuit has six possible modes of
operation:

• Idle

• Activation

• Read

• Write

• Deactivation

• Fault.

Figure 6 shows the way these modes are accessible.

I

DLE MODE

After reset, the circuit enters the IDLE state. A minimum
number of circuits are active while waiting for the
microcontroller to start a session.

• All card contacts are inactive

• I/O(µC) is high impedance

• Voltage generators are stopped

• Oscillator or XTAL input is running, delivering CLKOUT2

• Voltage supervisors are active.

The DETECT line is HIGH if a card is present (PRES and
PRES active) and LOW if a card is not present. The OFF
line is HIGH if no hardware problem is detected.

A

CTIVATION SEQUENCE

From the IDLE mode, the circuit enters the ACTIVATION
mode when the microcontroller sets the CMDVCC line
(active LOW). The I/O(µC) signal must not be LOW.
The internal circuitry is activated, the internal clock starts
and the sequence according to ISO7816 is performed:

• VCC rises from 0 to 5 V

• VPP rises from 0 to 5 V and I/O is enabled

• CLK and RST are enabled.

The time interval between steps 1 and 2 is 16 µs, and
64 µs between steps 2 and 3 (see Fig.7).

1996 Dec 12 8

Philips Semiconductors Product specification

Smart card interface TDA8001

READ MODE
When the activation sequence is completed and, after the

card has replied its Answer-to-Reset, the TDA8001 will be
in the READ mode. Data is exchanged between the card
and the microcontroller via the I/O line.

W

RITE MODE

Cards with EPROM memory need a programming voltage
(VPP). When it is required to write to the internal memory
of the card, the microcontroller sets one of the VPP12.5,
VPP15 and VPP21 lines LOW, according to the
programming value given in the Answer-to-Reset.
VPP rises from 5 V to the selected value with a typical slew
rate of 0.38 V/µs. In order to respect the ISO 7816 slopes,
the circuit generates VPP by charging and discharging an
internal capacitor. The voltage on this capacitor is then
amplified by a power stage gain of 5, powered via an
external supply pin VH (30 V max).

D

EACTIVATION SEQUENCE (see Fig.8)

When the session is completed, the microcontroller sets
the CMDVCC line to its HIGH state. The circuit then
executes an automatic deactivation sequence by counting
the sequencer back:

• RST falls to LOW and CLK is stopped

• I/O(µC) becomes high impedance and VPP falls to 0 V

• VCC falls to 0 V.

The circuit returns to the IDLE mode on the next rising
edge of the clock.

P

ROTECTIONS

Main fault conditions are monitored by the circuit:

• Short-circuit or overcurrent on V

CC

• Short-circuit or overcurrent on V

PP

• Card extraction during transaction

• Overheating problem

• V

SUP

drop-out

• VDD drop-out.
When one of these fault conditions is detected, the circuit

pulls the interrupt line

OFF to its active LOW state and
returns to the FAULT mode. The current on I/O is internally
limited to 5 mA.

F

AULT MODE (see Fig.9)

When a fault condition is written to the microcontroller via
the OFF line, the circuit initiates a deactivation sequence.
After the deactivation sequence has been completed, the
OFF line is reset to its HIGH state after the microcontroller
has reset the CMDVCC line HIGH.

Fig.4 Alarm and delay as a function of V

SUP

(C

DEL

fixes the pulse width).

handbook, full pagewidth

MGG818

V

SUP

V

th2

+ V

hys2

V

th2

V

th3

t

d

V

DELAY

ALARM

1996 Dec 12 9

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, full pagewidth

MGG827

QB
QC
QD

ENCLK

QF

CLK

D

CK

CMD7 or CDMS = Z Z 1 1 0 0

CMD3.5 or CDMTC = 1 0 1 0 1 0

CLK = 2 4 0 4 2 4

Q

Q

CLK

DCKQ

Q

D

QI

QH

QD

QG

QA

QAA

QF

QB

QBA

QCA

QC

QE

ENCLK

1/2 CLKOUT

XTAL

CKQQ

S

CDMTC

S

S

CDMS

S

Fig.5 Clock circuitry.

1996 Dec 12 10

Philips Semiconductors Product specification

Smart card interface TDA8001

Fig.6 State diagram.

handbook, full pagewidth

MGG820

FAULT READWRITEPDOWN

IDLE

ACTIVATION

DEACTIVATION

Fig.7 Activation sequence.

handbook, full pagewidth

MGG828

t

2

t

act

OFF

01 32

PRES

DETECT

CMDVCC

VEILLE

(INTERNAL)

INTERNAL

CLOCK

V

CC

I/O

V

PP

CMD3.5

CLK

ENRST

(INTERNAL)

RSTIN

RST

1996 Dec 12 11

Philips Semiconductors Product specification

Smart card interface TDA8001

Fig.8 Deactivation sequence.

handbook, full pagewidth

MGG829

t

de

CMDVCC

3012

VEILLE

(INTERNAL)

V

CC

I/O

V

PP

CMD3.5

CLK

ENRST

(INTERNAL)

RSTIN

RST

INTERNAL

CLOCK

Fig.9 Deactivation after a card extraction during write mode.

handbook, full pagewidth

MGG830

t

de

PRES

3012

DETECT

V

CC

V

PP

I/O

VEILLE

(INTERNAL)

ENRST

(INTERNAL)

CLK

RSTIN

RST

CMD3.5

CMDVCC

INTERNAL

CLOCK

1996 Dec 12 12

Philips Semiconductors Product specification

Smart card interface TDA8001

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. P

tot=VDD

× (I

DD(unloaded)

+ ∑I

signals

)+ICC× (VDD− VCC) + max.{(VH− VPP) × I

PP(read)

+(VH−VPP) × I

PP(write)

}

+VH×I

H(unloaded)+VSUP

× I

SUP

+(VDD− CVNC) × I

CVNC

, where ‘signals’ means all signal pins, except supply pins.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage −0.3 18 V

V

x1

voltage on pins VPP21, VPP15, VPP12.5, PRES,
PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN

0VDDV

V

H

voltage on pin V

H

030V

V

PP

voltage on pin V

PP

0V

H

V

V

SUP

voltage on pin V

SUP

012V

V

x2

voltage on pins ALARM and DELAY 0 V

SUP

V

V

x3

voltage on pins XTAL, I/O(µC), CLKOUT2, CMD7,
CMD3.5 and CVNC

0 6.0 V

V

x4

voltage on pins I/O, RST, CLK and V

CC

duration < 1 ms 0 7.0 V

P

tot

continuous total power dissipation TDA8001;

T

amb

= +70 °C; note 1;

see Fig.10

− 2W

TDA8001T;
T

amb

= +70 °C; note 1;

see Fig.11

− 0.92 W

T

stg

storage temperature −55 +150 °C

V

es

electrostatic voltage on pins I/O, VCC, VPP, RST, CLK,
PRES and PRES

−6+6kV

electrostatic voltage on other pins −2+2kV

1996 Dec 12 13

Philips Semiconductors Product specification

Smart card interface TDA8001

Fig.10 Power derating curve (DIP28).

handbook, halfpage

4

3

1

0

2

MBE256

50 0 50 100 150

P

tot

(W)

T ( C)

amb

o

Fig.11 Power derating curve (SO28).

handbook, halfpage

50

3

2

1

0

0

MBE255

50 100 150

P

tot

(W)

T ( C)

amb

o

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 Ω, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT117-1 30 K/W
SOT136-1 70 K/W

1996 Dec 12 14

Philips Semiconductors Product specification

Smart card interface TDA8001

CHARACTERISTICS

V

DD

=12V; VH= 25 V; V

SUP

=5V; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

supply voltage 6.7 − 18 V

I

DD

supply current idle mode; VDD= 8 V 20 30 38 mA

idle mode; V

DD

= 18V223442mA

active mode; unloaded 35 45 55 mA

V

th1

threshold voltage for power-on
reset

− 3.0 4.0 V

V

th4

threshold voltage on VDD(falling) 6.0 − 6.5 V

V

hys4

hysteresis on V

th4

50 − 200 mV

Voltage supervisor

V

SUP

voltage supply for the supervisor − 5.0 − V

I

SUP

input current at V

SUP

− 1.8 2.4 mA

V

th2

threshold voltage on V

SUP

(falling) 4.5 − 4.72 V

V

hys2

hysteresis on V

th2

10 − 80 mV

V

th3

threshold voltage on DELAY 2.35 − 2.65 V

I

DEL

output current at DELAY pin grounded (charge) −5 −−2 µA

V

DEL

= 4 V (discharge) 6 −− mA

V

DEL

voltage on pin DELAY −−3.5 V

ALARM,

ALARM (open-collector outputs)

I

OH

HIGH level output current on
pin ALARM

VOH= 5V −−25 µA

V

OL

LOW level output voltage on
pin ALARM

IOL= 2mA −−0.4 V

I

OL

LOW level output current on
pin ALARM

VOL= 0V −−−25 µA

V

OH

HIGH level output voltage on
pin ALARM

IOH=−2mA V

SUP

− 1 −− V

t

d

delay between V

SUP

and ALARM C

DEL

= 47 nF; see Fig.4 −−10 µs

t

pulse

ALARM pulse width C

DEL

= 47 nF 15 − 50 ms

Interrupt lines

OFF and DETECT (open-collector)

I

OH

HIGH level output current VOH= 5V −−25 µA

V

OL

LOW level output voltage IOL= 1mA −−0.4 V

Logic inputs (

CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5, PRES, PRES and RSTIN); note 1

V

IL

LOW level input voltage −−0.8 V

V

IH

HIGH level input voltage 1.5 −− V

I

IL

LOW level input current VIL= 0V −−−10 µA

1996 Dec 12 15

Philips Semiconductors Product specification

Smart card interface TDA8001

I

IH

HIGH level input current VIH= 5V −−10 µA

Reset output to the card (RST)

V

IDLE

output voltage in IDLE −−0.4 V

V

OL

LOW level output voltage IOL= 200 µA −−0.45 V

V

OH

HIGH level output voltage IOH=−200 µA 4.3 − V

CC

V

I

OH

=−10 µAV

CC

− 0.7 − V

CC

V

t

RST

delay between RSTIN and RST RST enabled; see Fig.7 −−2µs

Clock output to the card (CLK)

V

IDLE

output voltage in IDLE −−0.4 V

V

OL

LOW level output voltage IOL= 200 µA −−0.4 V

V

OH

HIGH level output voltage IOH=−200 µA 2.4 − V

CC

V

I

OH

=−20 µA 0.7V

CC

− V

CC

V

I

OH

=−10 µAV

CC

− 0.7 − V

CC

V

t

r

rise time CL= 30 pF; note 2 −−14 ns

t

f

fall time CL= 30 pF; note 2 −−14 ns

δ duty factor C

L

= 30 pF; note 2 45 − 55 %

Card programming voltage (V

PP

)

V

PP

output voltage idle mode −−0.4 V

read mode V

CC

− 4% − VCC+ 4% V

write mode; I

PP

<50mA P−2.5%

(3)

− P + 2.5%

(3)

V

∆I

PP

/∆t < 40 mA/100 ns;

note 4

P − 2.5%

(3)

− P + 2.5%

(3)

V

I

PP

output current active; from 0 to P

(3)

−−−50 mA

V

PP

shorted to GND −−−100 mA

SR slew rate up or down 0.3 0.4 0.5 V/µs

High voltage input (V

H

)

V

H

input voltage −−30 V

I

H

input current at V

H

idle mode; active mode;
unloaded

4 − 6mA

P=5V 5 − 9mA
P = 12.5 V 6.5 − 10.5 mA
P=15V 7 − 11 mA
P=21V 8 − 12 mA

V

H−VPP

voltage drop −−2.2 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Dec 12 16

Philips Semiconductors Product specification

Smart card interface TDA8001

Card supply voltage (VCC)

V

CC

output voltage idle mode; active mode −−0.4 V

I

CC

< 100 mA 4.75 − 5.25 V

∆I

PP

/∆t < 100 mA/100 ns;

note 4

4.75 − 5.25 V

I

CC

output current VCC from 0 to 5 V −−−100 mA

V

CC

shorted to GND −−−200 mA

SR slew rate up or down 0.3 0.4 0.5 V/µs

5 V reference output voltage (CVNC)

V

CVNC

output voltage at pin CVNC 4.5 5.0 5.5 V

I

CVNC

output current at pin CVNC −−−50 mA

Crystal connection (XTAL)

R

xtal(neg)

negative resistance at pin XTAL 2 MHz < fi< 16 MHz;

note 5

−−300 Ω

V

xtal

DC voltage at pin XTAL 3.0 − 4.0 V

f

xtal

resonant frequency 4 − 16 MHz
external frequency 0 − 20 MHz

Clock output (CLKOUT2)

f

CLKOUT2

frequency on CLKOUT2 1 − 8 MHz

V

OL

LOW level output voltage IOL= 2mA −−0.4 V

V

OH

HIGH level output voltage IOH=−200 µA 3.0 −− V

I

OH

=−10 µA 4.0 −− V

t

r

, t

f

rise and fall times CL= 15 pF; note 2 −−25 ns

δ duty factor C

L

= 15 pF; note 2 40 − 60 %

Data line [I/O, I/O(µC)]

V

OH

HIGH level output voltage on
pin I/O

4.5V<V

SUP

< 5.5 V;

4.5V<V

I/O(µC)

< 5.5 V;

IOH=−20 µA

4.0 − VCC+ 0.1 V

4.5V<V

SUP

< 5.5 V;

4.5V<V

I/O(µC)

< 5.5 V;

IOH= −200 µA

2.4 −− V

V

OL

LOW level output voltage on
pin I/O

I

I/O

= 1 mA;

I/O(µC) grounded

−−100 mV

I

IL

LOW level input current on
pin I/O(µC)

I/O(µC) grounded −−−500 µA

V

OH

HIGH level output voltage on
pin I/O(µC)

4.5V<V

I/O

< 5.5 V 4.0 − V

SUP

+ 0.2 V

V

OL

LOW level output voltage on
pin I/O(µC)

I

I/O(µC)

= 1 mA;

I/O grounded

−−70 mV

I

IL

LOW level input current on pin I/O I/O grounded −−−500 µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Dec 12 17

Philips Semiconductors Product specification

Smart card interface TDA8001

Notes

1. Pins CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5 and PRES are active LOW; pins RSTIN and PRES are
active HIGH.

2. The transition time and duty cycle definitions are shown in Fig.12; .

3. P is the card programming voltage set by pin VPP12.5, VPP15 or VPP21.

4. The tests for dynamic response of both VPP and VCC are performed at 1 Hz, 10 kHz, 100 kHz and 1 MHz, with a
capacitive load of 100 nF.

5. This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 Ω.

V

IDLE

voltage on pin I/O outside a
session

−−0.4 V

Z

IDLE

impedance on pin I/O(µC)
outside a session

10 −− MΩ

R

pu

internal pull-up resistance
between pin I/O and V

CC

81012kΩ

t

r

, t

f

rise and fall times Ci=Co=30 pF −−0.5 µs

Protections

T

sd

shut-down local temperature − 135 −°C

I

CC(sd)

shut-down current at V

CC

−−150 − mA

I

PP(sd)

shut-down current at V

PP

−−75 − mA

I

I/O(lim)

current limitation on pin I/O from I/O to I/O(µC) 3 − 5mA

Timing

t

act

activation sequence duration see Fig.7 − 110 −µs

t

de

deactivation sequence duration see Fig.8 − 100 −µs

t

3

start of the window for sending
CLK to the card

−−70 µs

t

5

end of the window for sending
CLK to the card

80 −− µs

t

st

maximum pulse width on
CMDVCC before VCC starts rising

−−30 µs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

δ

t

1

t1t2+

-------------- -

=

Fig.12 Definition of transition times.

handbook, full pagewidth

MBH856

10%

90%

10%

V

OH

V

OL

1.5 V

90%

t

f

t

r

t

2

t

1

1996 Dec 12 18

Philips Semiconductors Product specification

Smart card interface TDA8001

INTERNAL PIN CONFIGURATION

Fig.13 Internal pin configuration.

handbook, full pagewidth

MBE257

100

µA

20
µA

20

µA

5310

Ω

4690

Ω

V

SUP

1.25 V

100

µA

2.5 V

V

SUP

2.5
µA

DELAY

ALARM

V

SUP

ALARM

OFF

CMDVCC

VPP21

650

Ω

1350

Ω

DD

V

CMD3.5

CVNC

CLKOUT2

RSTIN

CMD7

GND2

100

µA

100

µA

I/O(µC)

V

SUP

100

µA

V

CC

100

µA

100

µA

V

CC

V

CC

5 kΩ

100 Ω

V

CC

RST

XTAL

I/O

DETECT

V

CC

10 kΩ

50 Ω

V

CC

CLK

20

µA

1.25 V

VPP12.5

TDA8001

2.5 V

V

H

VPP15

PRES
PRES

V

PP

V

H

GND1

V

DD

V

CC

5 V

as VPP12.5
as VPP12.5
as VPP12.5

as VPP12.5

as VPP12.5

as VPP12.5

as VPP12.5

as VPP12.5
as VPP12.5

1996 Dec 12 19

Philips Semiconductors Product specification

Smart card interface TDA8001

APPLICATION INFORMATION

Fig.14 Application in a pay TV decoder.

(1) The capacitor should be placed as close as possible to the IC.
(2) If pin VH is not connected to 25 V, it should be connected to VDD.

handbook, full pagewidth

MGG831


10
µF

10
µF

C1

C2

C3

DETECT

RSTIN

I/O(µC)

CMD7

CLKOUT2

GND2

OFF

V

DD

V

DD

V

SUP

V

H

RST

CVNC

12 V 25 V

ALARM

TDA8001

ALARM

DELAYGND GND1 XTAL

47 nF

14 MHz

C5

C6

C8

CARD

SOCKET

80C52

MICRO-

CONTROLLER

to 8805

micro-

controller

PORT

1

PORT

2

INT0

100 nF

(1)

XTAL1

I/O

CLK

RST

V

CC

PRES

PRES

V

PP

XTAL2

25 V

GND

12 V

+5 V

C7

C4

100 nF

100 nF

47 nF

CMD3.5

CMDVCC
VPP15

VPP21

VPP12.5

1 kΩ

(2)

1996 Dec 12 20

Philips Semiconductors Product specification

Smart card interface TDA8001

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

(1)

(1) (1)

cD E weM

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT117-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

M

E

e

1

1.7

1.3

0.53

0.38

0.32

0.23

36.0

35.0

14.1

13.7

3.9

3.4

0.252.54 15.24

15.80

15.24

17.15

15.90

1.75.1 0.51 4.0

0.066

0.051

0.020

0.014

0.013

0.009

1.41

1.34

0.56

0.54

0.15

0.13

0.010.10 0.60

0.62

0.60

0.68

0.63

0.0670.20 0.020 0.16

051G05 MO-015AH

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

28

1

15

14

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

1996 Dec 12 21

Philips Semiconductors Product specification

Smart card interface TDA8001

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

18.1

17.7

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT136-1

91-08-13

95-01-24

X

14

28

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

c

L

v M

A

e

15

1

(A )

3

A

y

0.25

075E06 MS-013AE

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.71

0.69

0.30

0.29

0.050

1.4

0.055

0.42

0.39

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO28: plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

1996 Dec 12 22

Philips Semiconductors Product specification

Smart card interface TDA8001

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Dec 12 23

Philips Semiconductors Product specification

Smart card interface TDA8001

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Tel. [phone], Fax. [phone]

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Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
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Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
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Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

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Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

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Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

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Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
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Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
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Tel. [phone], Fax. [phone]
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Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

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Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 537021/1200/02/pp24 Date of release: 1996 Dec 12 Document order number: 9397 750 01384