Datasheet tda7073a DATASHEETS (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA7073A/AT

Dual BTL power driver

Product speciﬁcation File under Integrated Circuits, IC01

July 1994

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

FEATURES

• No external components

• Very high slew rate

• Single power supply

• Short-circuit proof

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended).

• High output current (0.6 A)

• Wide supply voltage range

• Low output offset voltage

• Suited for handling PWM signals up to 176 kHz

• ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are specially designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

positive supply voltage range 3.0 5.0 18 V internal voltage gain 32.5 33.5 34.5 dB

total quiescent current VP = 5 V; RL = ∞−816mA SR slew rate − 12 − V/µs I I f

O bias co

output current −−0.6 A

input bias current − 100 300 nA

cut-off frequency −3 dB − 1.5 − MHz

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

TDA7073A 16 DIL plastic SOT38 TDA7073AT 16 mini-pack plastic SOT162A

Notes

1. SOT38-1; 1996 August 22.

2. SOT162-1; 1996 August 22.

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PACKAGE

PINS PIN POSITION MATERIAL CODE

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

handbook, full pagewidth

positive input 1

negative input 1

positive input 2

negative input 2

2 1

TDA7073A TDA7073AT

6 7

SHORT - CIRCUIT AND

THERMAL PROTECTION

I – i

ΙΙ

16I + i

13I – i

9I + i

positive output 1

negative output 1

negative output 2

positive output 2

ground 2

ground 1

Fig.1 Block diagram.

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3, 4, 8, 11, 15

MCD382 - 1

n.c.

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

PINNING

SYMBOL PIN DESCRIPTION

IN1− 1 negative input 1 IN1+ 2 positive input 1 n.c. 3 not connected n.c. 4 not connected V

5 positive supply voltage IN2+ 6 positive input 2 IN2− 7 negative input 2 n.c. 8 not connected OUT2+ 9 positive output 2 GND2 10 ground 2 n.c. 11 not connected OUT2− 12 negative output 2 OUT1− 13 negative output 1 GND1 14 ground 1 n.c. 15 not connected OUT1+ 16 positive output 1

FUNCTIONAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are particular designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors.

Because of the BTL configuration, the devices can supply a bi-directional DC current in the load, with only a single supply voltage. The voltage gain is fixed by internal feedback at 33.5 dB and the devices operate in a wide supply voltage range (3 to 18 V). The devices can supply a maximum output current of 0.6 A. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. The differential inputs can handle common mode input voltages from ground level up to (VP−2.2 V with a maximum of 10 V). The devices have a very high slew rate. Due to the large bandwidth, they can handle PWM signals up to 176 kHz.

handbook, halfpage

IN1– IN1+

2 3

n.c.

IN2 + IN2 –

n.c.

TDA7073A

TDA7073AT

5 6 7 8

MCD381

Fig.2 Pin configuration.

16 15 14 13 12 11 10

OUT1+ n.c. GND1 OUT1 – OUT2 – n.c. GND2 OUT2 +

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ORM

OSM

tot

stg

Note to the limiting values

1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.

positive supply voltage range − 18 V repetitive peak output current − 1A non repetitive peak output current − 1.5 A total power dissipation T

amb

<25 °C TDA7073A − 2.5 W TDA7073AT − 1.32 W storage temperature range −55 +150 °C virtual junction temperature −+150 °C short-circuit time see note 1 − 1hr

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE

th j-a

from junction to ambient in free air TDA7073A; note 1 50 K/W TDA7073AT; note 2 95 K/W

Notes to the thermal resistance

1. TDA7073A: V P

=2×0.76 W = 1.52 W; T

tot

= 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and V

amb (max)

= 150 − 1.52 × 50 = 74 °C.

2. TDA7073AT: VP = 5 V; RL = 16 Ω; typical voltage swing = 5.8 V and V P

=2×0.38 W = 0.76 W; T

tot

amb (max)

= 150 − 0.76 × 95 = 77 °C.

is 2.1 V therefore IO = 0.36 A and

loss

is 2.1 V therefore IO = 0.18 A and

loss

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

CHARACTERISTICS

= 5 V; f = 1 kHz; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ORM

∆V

OUT

THD total harmonic distortion V

no(rms)

B bandwidth −−1.5 MHz SVRR supply voltage ripple rejection note 4 40 55 − dB |∆V V

I(CM)

16-13, 12-9

| DC output offset voltage RS = 500 Ω−−100 mV

CMRR DC common mode rejection ratio note 6 − 100 − dB Z

bias

α channel separation 40 50 − dB |∆GV| channel unbalance −−1dB SR slew rate − 12 − V/µs

= 25 °C; unless otherwise speciﬁed (see Fig.3]). TDA7073A: RL = 8 Ω; TDA7073AT: RL = 16 Ω.

amb

positive supply voltage range 3.0 5.0 18 V repetitive peak output current −−0.6 A total quiescent current RL = ∞; note1 − 816mA output voltage swing note 2 5.2 5.8 − V

= 1 V (RMS)

OUT

TDA7073A − 0.3 − % TDA7073AT − 0.1 − % voltage gain 32.5 33.5 34.5 dB noise output voltage (RMS value) note 3 − 75 150 µV

DC common mode voltage range note 5 0 − 2.8 V

input impedance − 100 − kΩ input bias current − 100 300 nA

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by R

2. The output voltage swing is typically limited to 2 × (VP−2.1 V) (see Fig.4).

3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 Ω.

4. The ripple rejection is measured with RS = 0 Ωand f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.

5. The DC common mode voltage range is limited to (VP −2.2 V with a maximum of 10 V).

6. The common mode rejection ratio is measured at V

= 1.4 V, V

ref

= 200 mV and f = 1 kHz.

I(CM)

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

APPLICATION INFORMATION

handbook, full pagewidth

driver signal 1

SERVO SYSTEM

driver signal 2

ref

(1)

100 nF

I + i

500 Ω

I – i

220 µF

V = 5 V

(2)

TDA7073A TDA7073AT

I – i

500 Ω

ΙΙ

I + i

(2)

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5. (2) RL can be: focus, tracking, sled function or spindle motor.

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Fig.3 Test and application diagram.

3, 4, 8, 11, 15

n.c.

MCD383

ground

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

+ (V – 2.1) V

handbook, full pagewidth

MCD380

0 V

– (V – 2.1) V

Fig.4 Typical output voltage swing over RL.

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil)

seating plane

pin 1 index

SOT38-4

w M

(e )

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

max.

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT38-4

min.

max.

IEC JEDEC EIAJ

1.73

1.30

0.068

0.051

0.53

0.38

0.021

0.015

cD E e M

0.36

1.25

0.23

0.85

0.014

0.049

0.009

0.033

REFERENCES

19.50

18.55

0.77

0.73

July 1994 9

(1) (1)

6.48

6.20

0.26

0.24

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

0.764.2 0.51 3.2

0.010.10 0.30

0.0300.17 0.020 0.13

ISSUE DATE

92-11-17 95-01-14

(1)

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

SO16: plastic small outline package; 16 leads; body width 7.5 mm

pin 1 index

w M

SOT162-1

detail X

(A )

v M

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE

VERSION

SOT162-1

max.

2.65

0.10

0.30

0.10

0.012

0.004

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

July 1994 10

0 5 10 mm

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013AA

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

(1)E(1) (1)

10.5

7.6

10.1

7.4

0.41

0.30

0.40

0.29

REFERENCES

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

EUROPEAN

PROJECTION

ywv θ

0.9

0.4

0.004

ISSUE DATE

0.035

0.016

92-11-17 95-01-24

o o

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WAVE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T

stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

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Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A/AT

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

July 1994 12