Datasheet tda7052b DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA7052B

Mono BTL audio amplifier with DC
volume control

Preliminary specification
Supersedes data of July 1994
File under Integrated Circuits, IC01

1996 May 28

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC

TDA7052B

volume control

FEATURES

• DC volume control

• Few external components

• Mute mode

• Thermal protection

• Short-circuit proof

• No switch-on and switch-off clicks

• Good overall stability

• Low power consumption

• Low HF radiation

• ESD protected on all pins.

QUICK REFERENCE DATA

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT

V

P

P

O

supply voltage 4.5 − 18 V
output power VP=6V

TDA7052B R
TDA7052BT R

G

v(max)

maximum total voltage gain 39.5 40.5 41.5 dB
φ gain control 68 73.5 − dB
I

q(tot)

total quiescent current VP=6V; RL=∞−9.2 13 mA
THD total harmonic distortion

TDA7052B P
TDA7052BT P

GENERAL DESCRIPTION

The TDA7052B and TDA7052BT are 1 W and 0.5 W mono
Bridge-Tied Load (BTL) output amplifiers with DC volume
control.
They have been designed for use in TV and monitors, but
are also suitable for use in battery-fed portable recorders
and radios.

A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).

=8Ω 0.9 1.0 − W

L

=16Ω 0.5 0.55 − W

L

= 0.5 W − 0.3 1 %

O

= 0.25 W − 0.3 1 %

O

ORDERING INFORMATION

TYPE

NUMBER

TDA7052B DIP8
TDA7052BT SO8

NAME DESCRIPTION VERSION

plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width 3.9 mm

1996 May 28 2

PACKAGE

SOT97-1
SOT96-1

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

BLOCK DIAGRAM

handbook, full pagewidth

n.c.

input

DC volume control

7

TDA7052B

TDA7052BT

2

4

V

STABILIZER

ref

TEMPERATURE

PROTECTION

TDA7052B

V

P

1

5I + i

positive output

I – i

8

negative output

PINNING

SYMBOL PIN DESCRIPTION

V

P

1 supply voltage
IN+ 2 input
GND1 3 signal ground
VC 4 DC volume control
OUT+ 5 positive output
GND2 6 power ground
n.c. 7 not connected
OUT− 8 negative output

Fig.1 Block diagram.

handbook, halfpage

V

VC

P

6

power

ground

1
2

TDA7052B

TDA7052BT

3
4

signal

ground

3

IN

GND1

Fig.2 Pin configuration.

MSA704 - 1

MSA705 - 1

8
7
6
5

OUT
n.c.
GND2
OUT

1996 May 28 3

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

FUNCTIONAL DESCRIPTION

The TDA7052B and TDA7052BT are mono BTL output
amplifiers with DC volume control which have been
designed for use in TV and monitors but are also suitable
for use in battery-fed portable recorders and radios.

In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7052B
and TDA7052BT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required. With this configuration, a low
offset voltage is maintained and the minimum supply
voltage remains low.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.

TDA7052B

The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to −33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.

The amplifier is short-circuit proof to ground, V
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.

Power dissipation

Assume for the TDA7052B that V

= 6 V; RL=8Ω.

P

The maximum sine wave dissipation is 0.9 W.
The R
Therefore T

of the package is 100 K/W.

th j-a

amb(max)

= 150 − 100 × 0.9 = 60 °C.

Assume for the TDA7052BT that VP= 6 V; RL=16Ω.
The maximum sine wave dissipation is 0.46 W.
The R
Therefore T

of the package is 155 K/W.

th j-a

amb(max)

= 150 − 155 × 0.46 = 78 °C.

and

P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

2, 4

I

ORM

I

OSM

P

tot

supply voltage − 18 V
input voltage pins 2 and 4 − 5V
repetitive peak output current − 1.25 A
non-repetitive peak output current − 1.5 A
total power dissipation T

amb

≤ 25 °C
TDA7052B − 1.25 W
TDA7052BT − 0.8 W

T

amb

T

stg

T

vj

T

sc

operating ambient temperature −40 +85 °C
storage temperature −55 +150 °C
virtual junction temperature − +150 °C
short-circuit time − 1h

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TDA7052B 100 K/W
TDA7052BT 155 K/W

1996 May 28 4

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume

TDA7052B

control

CHARACTERISTICS

=6V; VDC= 1.4 V; f = 1 kHz; RL=8Ω; T

V

P

SYMBOL P ARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q(tot)

Maximum gain (V

P

O

supply voltage 4.5 − 18 V
total quiescent current note 1; RL= ∞−9.2 13 mA

≥ 1.4 V)

4

output power THD = 10%

TDA7052B 0.9 1.0 − W
TDA7052BT 0.5 0.55 − W

THD total harmonic distortion

TDA7052B P
TDA7052BT P

G

v(max)

V

I

V

no

maximum total voltage gain 39.5 40.5 41.5 dB
input signal handling (RMS value) G

noise output voltage (RMS value) note 2; f = 500 kHz − 210 −µV
B bandwidth at −1dB − 0.02 to 300 − kHz
SVRR supply voltage ripple rejection note 3 34 38 − dB

 DC output offset voltage V8− V5−0 200 mV

∆V

O

Z

I

input impedance (pin 3) 15 20 25 kΩ

Mute position

V

O

output voltage in mute position note 4; V4= 0.4 V ±30 mV;

=25°C; unless otherwise specified (see Fig.13).

amb

= 0.5 W − 0.3 1 %

O

= 0.25 W − 0.3 1 %

O

= 0 dB; THD < 1% 1.0 −−V

v(max)

− 30 40 µV

VI= 1.0 V
DC volume control; note 5
φ gain control 68 73.5 − dB

I

4

control current V4= 0 V 20 25 30 µA

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

.

L

2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS=0Ω and B = 5 kHz.

3. The ripple rejection is measured with RS=0Ω and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.

4. The noise output voltage (RMS value) is measured with RS=5kΩ unweighted.

5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.

1996 May 28 5

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

40

handbook, halfpage

G

v

(dB)

0

−40

−80

−120

0 2.0

0.4 0.8 1.2 1.6

MBH372

V (V)

DC

V

no

(mV)

10

10

1

−1

−2

0

handbook, halfpage

0.4

TDA7052B

0.8 1.2 1.6

MBH373

VDC (V)

2.0

Fig.3 Gain control as a function of DC volume

control.

25

handbook, halfpage

I

DC

(µA)

15

5

−5

−15

−25

0 2.0

0.4 0.8 1.2 1.6

MBH376

VDC (V)

Measured with RS=5kΩ unweighted.
Frequency range is 22 Hzto 22 kHz.

Fig.4 Noise output voltage as a function of DC

volume control.

20

handbook, halfpage

I

P

(mA)

15

10

5

020

4

81216

MBH367

V

P

(V)

Fig.5 Control current as a function of DC volume

control.

1996 May 28 6

Measured with RL= ∞.

Fig.6 Quiescent current versus supply voltage.

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

(3)

PO (W)

MBH368

10

10

handbook, halfpage

THD

(%)

8

6

4

2

0

−1

10

(1) VP= 5 V; RL=8Ω.
(2) VP= 6 V; RL=8Ω.
(3) VP=12V;RL=25Ω.

(1)

(2)

1

Fig.7 Total harmonic distortion versus output

power.

TDA7052B

10

handbook, halfpage

THD

(%)

8

6

(1)

4

2

0

−2

10

PO= 0.1 W.
(1) G

v(max)

(2) G

v(max)

=40dB.
=30dB.

(2)

−1

10

110

Fig.8 Total harmonic distortion versus frequency.

MBH369

f (kHz)

2

10

2.5

handbook, halfpage

P

O

(W)

2.0

1.5

1.0

0.5

0

020

Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.

=8Ω.

(1) R

L

(2) RL=16Ω.
(3) RL=25Ω.

(1)

4

(3)

(2)

81216

MBH370

V

(V)

P

Fig.9 Output power versus supply voltage.

2.5

handbook, halfpage

P

d

(W)

2.0

1.5

1.0

0.5

0

020

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

(1) (2)

4

(3)

81216

MBH371

V

(V)

P

Fig.10 Total worst case power dissipation versus

supply voltage.

1996 May 28 7

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

−20

handbook, halfpage

SVRR

(dB)

−30

−40

−50

−60

−70

−2

10

Measured with VR= 0.2 V.
(1) VDC= 1.4 V.
(2) VDC= 0.4 V.

(1)

(2)

−1

10

11010

MBH374

f (kHz)

2

2.0

handbook, halfpage

V

I

(V)

1.6

1.2

0.8

0.4

0

020

Measured at a THD of 1% and a voltage gain of 0 dB.

4

81216

TDA7052B

MBH375

V

(V)

P

Fig.11 Supply voltage ripple rejection versus

frequency.

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

, if this type is used as an audio amplifier.

Fig.12 Input signal handling.

1996 May 28 8

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

DC

7

2
4

TDA7052B

TDA7052BT

STABILIZER

TEMPERATURE

PROTECTION

input

5 kΩ

n.c.

0.47 µF

R

S

volume

control

1

I + i

I – i

(1)

100 nF 220 µF

5

8

3

6

TDA7052B

VP = 6 V

RL = 8 Ω

ground

To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.

MSA706 - 2

Fig.13 Test and application diagram.

For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MCL) will be activated.

1996 May 28 9

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

handbook, halfpage

volume

control

1 MΩ1 µF

4

MCD387

handbook, halfpage

volume

control

1 µF

TDA7052B

VP = 6 V

56 kΩ

4

22 kΩ

MBH360

Fig.14 Application with potentiometer as volume

control; maximum gain = 34 dB.

Fig.15 Application with potentiometer as volume

control; maximum gain = 40 dB.

1996 May 28 10

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

A

2

seating plane

L

Z

A

b

e

b

8

1

b

5

A

1

w M

2

TDA7052B

SOT97-1

M

E

c

(e )

1

M

H

pin 1 index

E

1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

12

min.

max.

050G01 MO-001AN

b

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

0.53

0.38

0.021

0.015

b

1

1.07

0.89

0.042

0.035

4

0 5 10 mm

scale

b

2

0.36

0.23

0.014

0.009

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

ISSUE DATE

0.010.10 0.30

92-11-17
95-02-04

1.154.2 0.51 3.2

0.0450.17 0.020 0.13

(1)

Z

1996 May 28 11

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA7052B

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A

1

0.25

0.10

0.0098

0.0039

A2A

1.45

1.25

0.057

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0098

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

6.2

5.8

0.24

0.23

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

A

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE

VERSION

SOT96-1

1996 May 28 12

REFERENCES

IEC JEDEC EIAJ

076E03S MS-012AA

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-04

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume
control

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

DIP

OLDERING BY DIPPING OR BY WA VE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA7052B

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 May 28 13

Philips Semiconductors Preliminary specification

Mono BTL audio amplifier with DC volume

TDA7052B

control

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 May 28 14