9 V VHF, hyperband and UHF
mixers- oscillators for TV and VCR
3-band tuners
Product specification
Supersedes data of 1995 Mar 21
File under Integrated Circuits, IC02
1996 Jun 10
Page 2
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
FEATURES
• Balanced mixer with a common emitter input for band A
(single input)
• 2-pin oscillator for bands A and B
• Balanced mixer with a common base input for
bands B and C (balanced input)
• 4-pin oscillator for band C
• Local oscillator buffer output for external prescaler
• SAW filter preamplifier with a low output impedance todrive a 75 Ω load
• Band gap voltage stabilizer for oscillator stability
• Electronic band switch
• External IF filter between the mixer output and the IF
amplifier input
• Pin to pin compatible with TDA5636B; TDA5637B family
(same function with symmetrical IF output).
GENERAL DESCRIPTION
The TDA5636 and TDA5637 are monolithic integrated
circuits that perform the mixer/oscillator functions for
bands A, B and C in TV and VCR tuners. These low-power
mixer/oscillators require a power supply of 9 V and are
available in a very small package.
The devices give the designer the capability to design an
economical and physically small 3-band tuner.
They are suitable for European standards, as illustrated in
Fig.17, with the following RF bands:
• 48.25 to 168.25 MHz
• 175.25 to 447.25 MHz
• 455.25 to 855.25 MHz.
With an appropriate tuned circuit, they are also suitable for
NTSC all-channel tuners (USA and Japan). The tuner
development time can be drastically reduced by using
these devices.
TDA5636; TDA5637
APPLICATIONS
• 3-band all-channel TV and VCR tuners
• Any standard.
These circuits belong to the TDA5636B/TDA5637B family
which has exactly the same function with an IF amplifier
having a symmetrical IF output to drive a SAW filter
directly. It is possible to build tuners with either an
asymmetrical or a symmetrical IF output with one main
tuner lay-out.
1996 Jun 102
Page 3
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixers-
TDA5636; TDA5637
oscillators for TV and VCR 3-band tuners
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
I
P
f
RF
G
v
NFnoise figureband A; R
V
o
supply voltage−9.0−V
supply currentband A−45−mA
band B−41−mA
band C−44−mA
frequency rangeRF input; band A; note 145−180MHz
RF input; band B; note 1160−470MHz
RF input; band C; note 1430−860MHz
voltage gainband A; RL=75Ω−20−dB
=75Ω−31−dB
L
=75Ω−31−dB
L
=75Ω−7.5−dB
L
=75Ω−6−dB
L
=75Ω−7−dB
L
=75Ω−110−dBµV
L
=75Ω−110−dBµV
L
output voltage to get 1% cross
modulation in channel
band B; R
band C; R
band B; R
band C; R
band A; RL=75Ω−110−dBµV
band B; R
band C; R
Note
1. The limits are related to the tank circuits used in Fig.17 and the intermediate frequency.
Frequency bands may be adjusted by the choice of external components.
plastic small outline package; 24 leads; body width 7.5 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT137-1
SOT340-1
SOT137-1
SOT340-1
1996 Jun 103
Page 4
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
BLOCK DIAGRAM
13
output
ground
input
GND2
(12)
(11)
(10)
(9)
(8)
(6)
IF
AMPLIFIER
ELECTRONIC
BAND SWITCH
BAND B
OSCILLATOR
14
15
16
17
19
IF
IF
band switch
tuned circuit
band B oscillator
TDA5636
TDA5637
MIXERMIXERMIXER
LOCAL
AMPLIFIER
OSCILLATOR
DC
STABILIZER
STAGE
BAND B
TDA5636; TDA5637
MBH465
12
(13)
11
(14)
local oscillator
10
(15)
9
(16)
8
(17)
7
(18)
5
(20)
4
(21)
amplifier output
GND1
mixers output
P
band B input
handbook, full pagewidth
tuned circuit
band B oscillator
tuned circuit
band C oscillator
band C
oscillator
tuned circuit
tuned circuit
band C oscillator
tuned circuit
band A oscillator
tuned circuit
band A oscillator
3
(22)
RF
GND
18
(7)
20
(5)
21
(4)
BAND C
23
(2)
22
(3)
24
(1)
OSCILLATOR
BAND A
OSCILLATOR
STAGE
BAND C
STAGE
BAND A
2
(23)
1
(24)
band C input
6
(19)
band A inputV
The numbers given in parenthesis represent the TDA5637.
Fig.1 Block diagram.
The TDA5636 and TDA5637 are pin to pin compatible with the TDA5636B and TDA5637B respectively.
1996 Jun 104
Page 5
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixers-
TDA5636; TDA5637
oscillators for TV and VCR 3-band tuners
PINNING
SYMBOL
CIN1124band C input 1
CIN2223band C input 2
RFGND322ground for RF inputs
BIN1421band B input 1
BIN2520band B input 2
AIN619band A input
V
P
MIXOUT1817mixers output 1
MIXOUT2916mixers output 2
GND11015ground 1 (0 V)
LOOUT11114local oscillator amplifier output 1
LOOUT21213local oscillator amplifier output2
IFOUT1312IF amplifier output
IFGND1411IF amplifier ground
BS1510electronic band switch input
GND2169ground 2 (0 V)
BOSCOC178band B oscillator output collector
COSCIB1187band C oscillator input base 1
BOSCIB196band B oscillator input base
COSCOC1205band C oscillator output collector 1
COSCOC2214band C oscillator output collector 2
AOSCOC223band A oscillator output collector
COSCIB2232band C oscillator input base 2
AOSCIB241band A oscillator input base
TDA5636TDA5637
PIN
DESCRIPTION
718supply voltage
1996 Jun 105
Page 6
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
P
V
SW
I
O
t
sc(max)
T
stg
T
amb
T
j
THERMAL CHARACTERISTICS
SYMBOLPARAMETERTYPICAL VALUEUNIT
R
th j-a
supply voltage−0.3+10.5V
switching voltage010.5V
output current of each pin to ground−−10mA
maximum short-circuit time (all pins)−10s
IC storage temperature−55+150°C
operating ambient temperature−10+80°C
junction temperature−+150°C
thermal resistance from junction to ambient in free air
SSOP120K/W
SO75K/W
HANDLING
Human Body Model
For TDA5636 GND (10, 16), RFGND (3), IFGND (14) and V
(7) are separate.
P
For TDA5637 GND (9, 15), RFGND (22), IFGND (11) and VP(18) are separate.
All pins withstand 2000 V in accordance with the
“UZW-BO/FQ-A302”
specification equivalent to the
category B (2000 V).
Machine Model
All pins withstand 200 V in accordance with the
“UZW-BO/FQ-B302 (issue date: Nov 6th, 1990)”
“MIL-STD-883C”
specification.
1996 Jun 107
Page 8
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixers-
TDA5636; TDA5637
oscillators for TV and VCR 3-band tuners
CHARACTERISTICS
=9V; T
V
P
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
P
I
P
V
SW
I
SW
Band A mixer (including IF amplifier)
f
RF
G
v
NFnoise figureR
V
o
V
i
g
os
Y
i
C
i
Band A oscillator
f
OSC
f
shift
f
drift
=25°C; measured in circuit of Fig.17; unless otherwise specified.
Fig.5 Input circuit for optimum noise figure in band A.
Page 12
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
handbook, full pagewidth
NOISE
SOURCE
BNCRIM
INPUT
CIRCUIT
AIN
GND
IFOUT
D.U.T.
27 Ω
MBH467
TDA5636; TDA5637
NOISE
METER
Input circuit as shown in Fig.5.
NF = NF
handbook, full pagewidth
Wanted output signal at f
We measure the level of the unwanted signal V
f
RFW
f
RFW
Filter characteristics: fc= 38.9 MHz, f
− loss
meas
= 50 MHz, f
= 180 MHz, f
(input circuit)
50 Ω
e
u
50 Ω
e
w
= 55.5 MHz, f
RFU
= 185.5 MHz, f
RFU
dB.
unwanted
signal
source
AM = 30%
wanted
signal
source
; Vow= 100 dBµV.
RFW
OSC
OSC
−3dBBW
Fig.6 Noise figure measurement in band A.
V
IMN
RFAIFOUT
D.U.T.
= 2.64 MHz.
AC
HYBRID
BD
causing 0.3 % AM modulation in the wanted output signal; Vou=V’
ou
= 88.9 MHz.
= 218.9 MHz.
= 1.2 MHz, f
50 Ω
−30dBBW
V
o
V'
27 Ω
meas
attenuator
V
RMS
voltmeter
9 dB
FILTER
38.9 MHz
modulation
analyzer
meas
50 Ω
MBH468
50 27+
×.
-------------------
50
1996 Jun 1012
Fig.7 Cross modulation measurement in band A.
Page 13
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
handbook, full pagewidth
loss
(hybrid)
Vi=V
meas
V
= V’
o
meas
Voltage gain for band B and C = 20 log.
signal
source
e
= 1 dB.
− loss
(hybrid)
50 27+
×.
-------------------
50
50 Ω
.
V
meas
V
RMS
voltmeter
V
o
-----V
i
50 Ω
AC
HYBRID
BD
50 Ω
V
i
BIN1
(CIN1)
BIN2
(CIN2)
D.U.T.
IFOUT
MBH469
TDA5636; TDA5637
27 Ω
V
o
V'
meas
50 Ω
spectrum
analyzer
handbook, full pagewidth
loss
NF = NF
(hybrid)
= 1 dB.
meas
− loss
(hybrid)
SOURCE
dB.
NOISE
Fig.8 Gain measurement in bands B and C.
AC
HYBRID
BD
50 Ω
BIN1
(CIN1)
D.U.T.
BIN2
(CIN2)
IFOUT
27 Ω
NOISE
METER
MBH470
1996 Jun 1013
Fig.9 Noise figure measurement in bands B and C.
Page 14
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixers-
TDA5636; TDA5637
oscillators for TV and VCR 3-band tuners
handbook, full pagewidth
wanted
input signal
50 Ω
source
e
w
unwanted
input signal
50 Ω
source
e
u
Wanted input signal = 70 dBµV; unwanted input signal modulated with 30% AM at 100 kHz; Vou= unwanted output signal V
output signal is modulated with 0.3% AM.
f
UNWANTED=fWANTED
+ 5.5 MHz; f
AC
HYBRID
BD
OSC=fWANTED
+ 38.9 MHz.
50 Ω
wanted
input
signal
50 Ω
V
AC
HYBRID
BD
50 Ω
RMS
voltmeter
BIN1
(CIN1)
BIN2
(CIN2)
IFOUT
D.U.T.
MBH471
27 Ω
V
o
50 Ω
modulation analyzer
(unwanted AM on
the output wanted
frequency)
when the wanted
out
Fig.10 Cross modulation measurement in bands B and C.
handbook, full pagewidth
loss
In band B: f
In band B: f
In band B: f
We measure the level of the unwanted signal Viu causing fm sidebands 30 dB below the oscillator carrier at the LO output.
Viu=V
(hybrid)
meas
= 1 dB.
RFW
OSC
RFU
− loss
unwanted
signal
50 Ω
source
e
u
V
meas
= 391 MHz (in band C: f
= 429.9 MHz (in band C: f
= 430 MHz = f
.
(hybrid)
+5×8 MHz − 1 MHz. (in band C: f
RFW
AC
V
50 Ω
50 Ω
= 781 MHz). These wanted signals are not used during the measurement.
RFW
= 819.9 MHz).
OSC
HYBRID
BD
RFU
BIN1
(CIN1)
V
i
BIN2
(CIN2)
= 820 MHz = f
IFOUT
D.U.T.
+5×8 MHz − 1 MHz).
RFW
V
o
modulation analyzer
(unwanted AM on
the output wanted
frequency)
27 Ω
50 Ω
MBH472
1996 Jun 1014
Fig.11 N + 5 −1 MHz pulling measurement in bands B and C.
Page 15
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
handbook, full pagewidth
2
5
10
∞
10
5
2
TDA5636; TDA5637
1
0.5
0.2
0.20.512510
200 MHz
0.5
40 MHz
– j
0
+ j
0.2
handbook, full pagewidth
1
MBH055
Fig.12 Input admittance (S11) of the band A mixer input (40 to 200 MHz); Yo= 20 mS.
1
0.5
0.2
+ j
0
– j
0.2
480 MHz
150 MHz
0.510.21052
2
5
10
∞
10
5
Fig.13 Input impedance (S11) of the band B mixer input (150 to 480 MHz); Zo= 100 Ω.
1996 Jun 1015
0.5
2
1
MBH473
Page 16
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
handbook, full pagewidth
0.5
0.2
420 MHz
+ j
0
– j
0.2
0.5
880 MHz
0.510.21052
TDA5636; TDA5637
1
2
5
10
∞
10
5
2
handbook, full pagewidth
1
MBH499
Fig.14 Input impedance (S11) of the band C mixer input (420 to 880 MHz); Zo= 100 Ω.
1
0.5
0.2
+ j
0
– j
0.2
0.510.21052
5 MHz
100 MHz
2
5
10
∞
10
5
1996 Jun 1016
0.5
1
2
MBH475
Fig.15 Output impedance (S22) of the IF amplifier (20 to 60 MHz); Zo=50Ω.
Page 17
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
handbook, full pagewidth
2
5
10
∞
10
5
2
TDA5636; TDA5637
1
0.5
0.2
– j
0
+ j
0.2
910 MHz
0.20.512510
0.5
50 MHz
1
MBH474
Fig.16 Output admittance (S22) of the LO amplifier (50 to 910 MHz); Yo=20mS.
1996 Jun 1017
Page 18
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
APPLICATION INFORMATION
handbook, full pagewidth
V
R14
l
R3
C4
C29C28
C3
D1
C1C5C2C6
24
(1)
R2
L1
22
(3)
C11
R6
D3
L2
C10
23
(2)
L3
R4C9
C7
20
21
(5)
(4)
R5
C8
C12
18
(7)
TDA5636; TDA5637
K only open for switch
current measurement
C
15
(10)
K
5 V
BA
R10
spectrum
analyzer
50 Ω
C16R9
R11
C17
14
13
(11)
(12)
C15
R7
C14
D3
C13
19
(6)
17
(8)
R8
L4
16
(9)
BAND A
OSCILLATOR
BAND A
STAGE
BAND C
OSCILLATOR
BAND C
STAGE
(24)
1
C27C26C25C24C23
HYBRID
ANZAC-183-4
50 Ω50 Ω50 Ω
The numbers in parenthesis represent the TDA5637.
(23)
2
(22)
3
BAND B
OSCILLATOR
MIXERMIXERMIXER
BAND B
STAGE
(21)
4
(20)
5
ELECTRONIC
BAND SWITCH
TDA5636
TDA5637
DC
STABILIZER
(19)
(18)
6
7
C21
AMPLIFIER
OSCILLATOR
AMPLIFIER
(17)8(16)9(15)10(14)11(13)
C20
L5
R13
ANZAC-183-4
C22
9 V
spectrum
MBH477
analyzer
IF
LOCAL
12
C19C18
R12
HYBRID
50 Ω
50 Ω
output
1996 Jun 1018
Fig.17 Measurement circuit.
Page 19
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
1. Average DC voltage measured in circuit of Fig.17.
1996 Jun 1022
Page 23
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
PACKAGE OUTLINES
SO24: plastic small outline package; 24 leads; body width 7.5 mm
D
c
y
Z
24
13
TDA5636; TDA5637
SOT137-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
A
max.
2.65
0.10
A1A2A
0.30
2.45
0.10
2.25
0.012
0.096
0.004
0.089
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
(1)E(1)(1)
cD
15.6
15.2
0.61
0.60
12
w M
b
p
scale
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.42
0.39
A
1.4
0.055
Q
2
A
1
detail X
1.1
1.1
0.4
0.043
0.016
1.0
0.043
0.039
0.25
0.01
L
p
L
(A )
0.250.1
0.01
A
3
θ
ywvθ
Z
0.9
0.4
0.035
0.004
0.016
o
8
o
0
OUTLINE
VERSION
SOT137-1
1996 Jun 1023
REFERENCES
IEC JEDEC EIAJ
075E05 MS-013AD
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
Page 24
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
c
y
Z
2413
TDA5636; TDA5637
E
H
E
A
SOT340-1
X
v M
A
pin 1 index
112
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNITA1A2A
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
3
p
0.38
0.25
p
cD
0.20
8.4
0.09
8.0
02.55 mm
scale
(1)E(1)(1)
eHELLpQZywv θ
5.4
0.651.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
0.9
1.03
0.7
0.63
(A )
L
p
L
A
3
θ
0.130.10.2
0.8
0.4
o
8
o
0
OUTLINE
VERSION
SOT340-1 MO-150AG
1996 Jun 1024
REFERENCES
IEC JEDEC EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Page 25
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixersoscillators for TV and VCR 3-band tuners
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
(order code 9398 652 90011).
TDA5636; TDA5637
SSOP
Wave soldering isnot recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
ETHOD (SO AND SSOP)
M
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
SO
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1996 Jun 1025
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Page 26
Philips SemiconductorsProduct specification
9 V VHF, hyperband and UHF mixers-
TDA5636; TDA5637
oscillators for TV and VCR 3-band tuners
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 1026
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