Datasheet tda5634t DATASHEETS (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA5634T

9 V UHF mixer/oscillator for TV and VCR tuners

Product speciﬁcation Supersedes data of 1995 Mar 21 File under Integrated Circuits, IC02

1996 Nov 7

Page 2

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

FEA TURES

• Balanced mixer with a common base input

• 4-pin oscillator

• Local oscillator buffer output for external prescaler

• SAW filter preamplifier with a low output impedance to

drive the SAW filter directly

• Band gap voltage stabilizer for oscillator stability

• External IF filter between the mixer output and the IF

amplifier input.

APPLICATION

• UHF tuners for TV and VCR

• One band tuners.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

NF noise ﬁgure not corrected for image − 9 − dB V

supply voltage − 9.0 − V supply current − 35 − mA RF frequency RF input; note 1 430 − 860 MHz voltage gain − 36 − dB

output voltage causing 1% cross modulation in channel

GENERAL DESCRIPTION

The TDA5634T is an integrated circuit that performs the UHF mixer/oscillator functions in TV and VCR tuners. This low-power mixer/oscillator requires a power supply of 9 V and is available in a very small package.

The device gives the designer the capability to design an economical and physically small tuner.

The tuner development time can be drastically reduced by using this device.

The frequency band is determined by the external tank circuit. It can be adapted to various standards.

− 121 − dBµV

Note

1. The limits are related to the tank circuits used in Fig.7 and the intermediate frequency. Frequency bands may be adjusted by the choice of external components.

ORDERING INFORMATION

TYPE

NUMBER

TDA5634T SO16

NAME DESCRIPTION VERSION

plastic small outline package; 16 leads; body width 3.9 mm

PACKAGE

SOT109-1

1996 Nov 7 2

Page 3

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

BLOCK DIAGRAM

handbook, full pagewidth

UHF oscillator inputs

n.c.

UHF oscillator outputs

15 12 13 14

BCBC

UHF OSCILLATOR

MIXER

STABILIZER IF AMPLIFIER

11 10 916

TDA5634T

IF amplifier outputs

TDA5634T

RF STAGE

123456 78

RF

RF inputs local oscillator

GND

LOCAL

OSCILLATOR

outputs

GND

IF amplifier

inputs

Fig.1 Block diagram.

MBE299

1996 Nov 7 3

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Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

PINNING

SYMBOL PIN DESCRIPTION

CIN1 1 band C input 1 CIN2 2 band C input 2 RFGND 3 ground for RF inputs LOOUT1 4 local oscillator ampliﬁer output 1 LOOUT2 5 local oscillator ampliﬁer output 2 GND 6 ground (0 V) IFIN1 7 IF ampliﬁer input 1 IFIN2 8 IF ampliﬁer input 2 IFOUT1 9 IF ampliﬁer output 1 IFOUT2 10 IF ampliﬁer output 2 V

COSCIB1 12 UHF oscillator input base 1 COSCOC1 13 UHF oscillator output collector 1 COSCOC2 14 UHF oscillator output collector 2 COSCIB2 15 UHF oscillator input base 2 n.c. 16 not connected

11 supply voltage

handbook, halfpage

CIN1

1 2

CIN2

GND IFIN1 IFIN2

3 4

TDA5634T

5 6 7 8

RFGND LOOUT1 LOOUT2

Fig.2 Pin configuration.

MBE298

TDA5634T

n.c

COSCIB2

15 14

COSCOC2

COSCOC1

COSCIB1 V

IFOUT2

IFOUT1

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V I t T T T

P O sc

stg amb j

supply voltage −0.3 +10.5 V output current of each pin referenced to ground −−10 mA maximum short-circuit time (all pins) − 10 s IC storage temperature −55 +150 °C operating ambient temperature −10 +80 °C junction temperature − +150 °C

HANDLING

Human body model: the IC withstands 2000 V in accordance with the “ the

“MIL-STD-883C category B”

(2000 V);

UZW-BO/FQ-A302”

, specification equivalent to

R = 1500 Ω, C = 100 pF. Machine model: the IC withstands 200 V except pin 11 (175 V) in accordance with the “

UZW-BO/FQ-B302”

, specification (date of issue: Nov 6th, 1990); R=0Ω, C = 200 pF.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

th j-a

thermal resistance from junction to ambient in free air 120 K/W

1996 Nov 7 4

Page 5

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

CHARACTERISTICS

=9V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

Mixer (including IF ampliﬁer)

NF noise ﬁgure (not corrected

=25°C; measured in circuit of Fig.7; unless otherwise speciﬁed.

amb

supply voltage 8.1 9.0 9.9 V supply current VP= 8.1 to 9.9 V; T

= −10 to +80 °C − 35 45 mA

amb

RF frequency note 1 430 − 860 MHz voltage gain fRF= 430 MHz; see Fig.3; note 2 33 36 39 dB

= 860 MHz; see Fig.3; note 2 33 36 39 dB

= 430 MHz; see Fig.4 − 911dB

for image) output voltage causing 1%

cross modulation in channel input voltage causing 10 kHz

= 860 MHz; see Fig.4 − 911dB

fRF= 430 MHz; see Fig.5 115 118 − dBµV

= 860 MHz; see Fig.5 118 121 − dBµV

fRF= 860 MHz; note 3 − 87 − dBµV

pulling in channel input voltage causing

= 820 MHz; see Fig.6 65 72 − dBµV

N+5−1 MHz pulling input impedance (RS+jLSω)RS at fRF= 430 MHz; see Fig.8; note 4 − 28 −Ω

at fRF= 860 MHz; see Fig.8; note 4 − 33 −Ω

at fRF= 430 to 860 MHz; see Fig.8;

− 8 − nH

note 4

IF ampliﬁer

input reﬂection coefﬁcient magnitude; see Fig.10; note 4 −−0.6 − dB

phase; see Fig.10; note 4 −−2.5 − deg

reverse transmission coefﬁcient

forward transmission coefﬁcient

magnitude; see Fig.11; note 4 −−56 − dB phase; see Fig.11; note 4 − 30 − deg magnitude; note 4 −−9.5 − dB phase; note 4 − 165 − deg

output reﬂection coefﬁcient magnitude; see Fig.11; note 4 −−7−dB

phase; see Fig.11; note 4 − 6 − deg

output impedance (RS+jLSω)

RS; see Fig.11; note 4 − 100 −Ω

; see Fig.11; note 4 − 32 − nH

input admittance (GP+jCPω)GP; see Fig.10; note 4 − 0.8 − mS

; see Fig.10; note 4 − 2.5 − pF

1996 Nov 7 5

Page 6

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

LO output; R

SRF spurious signal on LO output

SHD LO signal harmonics with

Band C oscillator

OSC

shift

drift

= 100 Ω

output admittance (GP+jCPω)

= 470 MHz; see Fig.9; note 4 − 3 − mS

OSC

− 0.5 − pF

= 900 MHz; see Fig.9; note 4 − 3.5 − mS

OSC

− 0.5 − pF

output voltage RL=50Ω; VP= 8.1 to 9.9 V;

= −10 to +80 °C

amb

=50Ω; note 5 −−−10 dBc

83 91 100 dBµV

with respect to LO output signal

=50Ω −−−10 dBc

respect to LO signal

oscillator frequency Vt= 0.45 to 28 V; VP= 8.1 to 9.9 V;

= −10 to +80 °C; note 6

amb

470 − 900 MHz

frequency shift ∆VP= 10%; note 7 −−400 kHz frequency drift ∆T=25°C without compensation;

−−2.5 MHz

NP0 capacitors; note 8 ∆T=25°C with compensation; note 9 −−800 kHz 5 s to 15 minutes after switch on;

−−600 kHz

without compensation; note 10

Notes

1. The RF frequency range is defined by the oscillator frequency range and the intermediate frequency.

2. The gain is defined as the transducer gain (measured in Fig.7) plus the voltage transformation ratio of L3 to L2

(10 : 2, 15.4 dB including transformer loss).

3. The input level causing 10 kHz frequency detuning at the LO output; f

osc=fRF

+ 33.4 MHz.

4. All S-parameters are referred to a 50 Ω system.

5. Measured with RF input voltage of 97 dBµV at 430 MHz < fRF< 860 MHz.

6. Limits are related to the tank circuits used in Fig.7. Frequency bands may be adjusted by the choice of external

components.

7. The frequency shift is defined as the change in oscillator frequency when the supply voltage varies from

VP= 9 to 8.1 V or from VP= 9 to 9.9 V.

8. The frequency drift is defined as the change in oscillator frequency when the ambient temperature varies from

=25°C to 0 °C or from T

amb

=25°Cto50°C. Without compensation, the capacitors C11 to C15 are NP0.

amb

9. The frequency drift is defined as the change in oscillator frequency when the ambient temperature varies from

=25°C to 0 °C or from T

amb

=25°Cto50°C. With compensation, the capacitors C11 to C14 are N750 and

amb

C15 is N470.

10. Switch on drift is defined as the change in oscillator frequency between 5 s and 15 min after switch on.

1996 Nov 7 6

Page 7

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

handbook, full pagewidth

Loss of the hybrid: 1 dB. Vi=V Vo=V’

− loss of the hybrid.

meas

+ 15.4dB (transformer ratio N1/N2 = 5 and transformer loss).

meas

= 20 log = 20 log + 15.4 dB + loss of the hybrid.

-----V

50 Ω

signal source

meas

----------------V

voltmeter

meas meas

RMS

50 Ω

HYBRID

CIN1

CIN2

IFOUT1

D.U.T.

IFOUT2

TDA5634T

2 x 5 turns

2 turns

N1/N2 = 5

meas

spectrum

analyzer

50 Ω

MBH048

handbook, full pagewidth

Loss of the hybrid: 1 dB. NF = NF

− loss of the hybrid.

meas

NOISE

SOURCE

50 Ω

Fig.3 Gain measurement in band C.

HYBRID

CIN1

CIN2

IFOUT1

D.U.T.

IFOUT2

2 x 5

turns

N1/N2 = 5

NOISE

METER

2 turns

MBH049

1996 Nov 7 7

Fig.4 Noise figure measurement in band C.

Page 8

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

handbook, full pagewidth

meas=Vo

Wanted output signal at f Measuring the level of the unwanted output signal Vou causing 0.3 % AM modulation in the wanted output signal. Vou=V f

RFU=fRFW

Filter characteristics: fc= 38.9 MHz; f

unwanted

signal

source

50 Ω

AM = 30%

1 kHz

50 Ω

wanted

signal

source

−15.4 dB (transformer ratio N1/N2 = 5 and transformer loss).

+ 15.4 dB.

meas

+ 5.5 MHz; f

HYBRID

50

Ω

: Vow= 108 dBµV, V

RFW

+ 38.9 MHz.

osc=fRF

−3dBBW

HYBRID

50

Ω

meas

= 1.2 MHz; f

= 92.6 dBµV.

−30dBBW

IFOUT1

CIN1

D.U.T.

IFOUT2

CIN2

= 2.64 MHz.

2 x 5 turns

2 turns

N1/N2 = 5

attenuator

RMS

voltmeter

18 dB

meas

TDA5634T

FILTER

38.9 MHz

modulation analyzer

50 Ω

MBH050

Fig.5 Cross modulation measurement in band C.

handbook, full pagewidth

Loss of the hybrid: 1 dB. In band C: f In band C: f In band C: f Measuring the level of the unwanted signal Viu causing FM sidebands 30 dB below the oscillator carrier at the LO output. Viu=V

unwanted signal

50 Ω

source

meas

50 Ω

= 781 MHz. These wanted signals are not used during the measurement.

RFW

= 819.9 MHz.

osc

= 820 MHz = f

RFU

− loss of the hybrid.

meas

+5×8 MHz − 1 MHz.

RFW

HYBRID

CIN1

CIN2

D.U.T.

LO1

LO2

HYBRID

50 Ω

spectrum analyzer

50 Ω

MBH051

1996 Nov 7 8

Fig.6 N + 5 − 1 MHz pulling measurement in band C.

Page 9

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

C17

n.c.

UHF OSCILLATOR

C15

C14 C13 C12 C11

15 14 13 12

L6 L5

C16

9 V

11 10 916

STABILIZER IF AMPLIFIER

handbook, full pagewidth

C10

measurement network

C8 C7



IF output

TDA5634T

spectrum analyzer

50 Ω

MIXER

TDA5634T

RF STAGE

123456

C1 C2

HYBRID

ANZAC-183-4

50 Ω 50 Ω 50 Ω

L2, L3 and C9 are only required for measurement purposes; they are not used in a tuner.

LOCAL

OSCILLATOR

HYBRID

ANZAC-183-4

50 Ω output

9 V

MBE300

1996 Nov 7 9

Fig.7 Measurement circuit.

Page 10

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

Component values for measurement circuit Table 1 Capacitors

(all SMD and NP0 except C11 to C15)

COMPONENT VALUE

C1 1 nF C2 1 nF C3 1 nF C4 1 nF C5 18 pF C6 18 pF C7 1 nF C8 1 nF C9 18 pF C10 22 nF C11 1 pF (N750) C12 1 pF (N750) C13 1 pF (N750) C14 1 pF (N750) C15 6 pF (N470) C16 100 pF C17 1 µF (40 V electrolytic

capacitor)

TDA5634T

Table 3 Diodes and IC

COMPONENT VALUE

D1 BB215 IC TDA5634T

Table 4 Coils (wire size 0.4 mm)

COMPONENT VALUE

L5 2.5 turns; diameter 3 mm L6 2.5 turns; diameter 2.5 mm

Table 5 Transformers; note 1

COMPONENT VALUE

L1 2 × 6 turns L2 2 × 5 turns L3 2 turns

Note

1. Coil type: TOKO 7kN; material: 113kN; screw core 03-0093; pot core 04-0026.

Table 2 Resistors (all SMD)

COMPONENT VALUE

R1 100 Ω R2 22 kΩ R3 2.2 kΩ R4 22 kΩ R5 47 kΩ

1996 Nov 7 10

Page 11

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

handbook, full pagewidth

430 MHz

+ j

– j

0.2 0.5 1 2 5 10

TDA5634T

100

860 MHz

250

∞

250

100

handbook, full pagewidth

MBE369

Fig.8 Input impedance (S11) of the mixer input (430 to 860 MHz) (Z chart).

∞

0.5

0.20.512510 470 MHz

900 MHz

0.2

– j

+ j

0.2

1996 Nov 7 11

0.5

MBE370

Fig.9 Output admittance (S22) of the LO output (470 to 900 MHz) (Y chart).

Page 12

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

handbook, full pagewidth

∞

TDA5634T

0.5

0.2

0.20.512510

S11

0.5

– j

+ j

0.2

handbook, full pagewidth

MBE371

Fig.10 Input admittance (S11) of the IF amplifier (25 to 45 MHz) (Y chart).

0.5

0.2

+ j

– j

0.2

0.2 0.5 1 2 5 10

0.5

S12

S22

∞

Fig.11 Reverse transmission and output reflection coefficient (S12and S22) of the IF amplifier (25 to 45 MHz)

(Z chart).

1996 Nov 7 12

MBE372

Page 13

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

INTERNAL PIN CONFIGURATION

SYMBOL

CIN1 1 2.2 CIN2 2 2.2

RFGND 3 0.0

LOOUT1 4 7.3 LOOUT2 5 7.3

DESCRIPTION

TDA5634T BAND C

MBH431

MBH430

AVERAGE DC

VOLTAGE

(1)

(V)

4 5

MBH429

GND 6 0

MBH432

IFIN1 7 9.0 IFIN2 8 9.0

(11)

MBH433

11

(10)

MBH061

12 (9)

IFOUT1 9 3.8 IFOUT2 10 3.8

1996 Nov 7 13

MBH428

Page 14

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

AVERAGE DC

SYMBOL

DESCRIPTION

TDA5634T BAND C

11 supply voltage 9.0 COSCIB1 12 2.3 COSCOC1 13 4.4 COSCOC2 14 4.4 COSCIB2 15 2.3

MBH434

n. c. 16 not connected N.R.

Notes

1. Average DC voltage measured in circuit of Fig.7.

2. N.R. = Not Relevant.

VOLTAGE

(2)

(V)

(1)

1996 Nov 7 14

Page 15

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

TDA5634T

SOT109-1

v M

pin 1 index

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A1A2A3b

max.

0.25

1.75

0.10

0.0098

0.069

0.0039

1.45

1.25

0.057

0.049

0.25

0.01

0.49

0.36

0.019

0.014

0.25

0.19

0.0098

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

10.0

9.8

0.39

0.38

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.24

0.23

1.0

 0.7

1.05

0.4

0.039

0.041

0.016

detail X

0.25

0.6

0.028

0.01 0.004

0.020

(A )

0.25 0.1

0.01

0.7

0.3

0.028

0.012

8

OUTLINE

VERSION

SOT109-1

1996 Nov 7 15

REFERENCES

IEC JEDEC EIAJ

076E07S MS-012AC

EUROPEAN

PROJECTION

ISSUE DATE

91-08-13 95-01-23

Page 16

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR tuners

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reﬂow soldering

Reflow soldering techniques are suitable for all SO packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

(order code 9398 652 90011).

TDA5634T

Wave soldering

Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

1996 Nov 7 16

Page 17

Philips Semiconductors Product speciﬁcation

9 V UHF mixer/oscillator for TV and VCR

TDA5634T

tuners

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Nov 7 17