Datasheet TDA4800 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA4800

Vertical deflection circuit for monitor
applications

Product specification
Supersedes data of February 1992
File under Integrated Circuits, IC02

1997 Mar 27

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

FEATURES

• Fully integrated, few external components

• RC oscillator with wide sync range of 1 : 3 (e.g.

50 to 150 Hz)

• Synchronization by positive or negative going sync
pulse

• Blanking pulse duration is determined externally

• Dual frequency criterion for automatic amplitude

switch-over (e.g. 50 to 60 Hz)

• Guard circuit for screen protection

• Sawtooth generator with buffer stage supplied by

external voltage

• Preamplifier

• Power output stage with thermal and SOAR protection

• Flyback generator

• Internal voltage stabilizer.

TDA4800

GENERAL DESCRIPTION

The TDA4800 is an integrated circuit for vertical deflection
primarily in monitors (and TV receivers). The complete
circuit consists of 11 main functional blocks as shown in
Fig.1.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

I

P

I

7(p-p)

f

sync

V

3

V

3

T

amb

supply voltage (pin 6) 10 − 30 V
supply voltage (pin 10) 10 − 45 V
supply current (pins 6 and 10) note 1 − 215 − mA
output current (peak-to-peak value) −−2.6 A
picture frequency notes 1 and 2 −−135 Hz
positive sync input pulse 1.0 − 6.0 V
negative sync input pulse −0.5 −−0.7 V
operating ambient temperature note 3 −20 − +70 °C

Notes

1. Measured in Fig.4.

2. f

3. P

= 45 Hz (f

o

= 3.6 W for R

tot

sync(max)

th(j-a)

=3fo).

= 20 K/W.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA4800 DBS13P

plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

PACKAGE

SOT141-6

1997 Mar 27 2

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

BLOCK DIAGRAM

handbook, full pagewidth

SYNC

CIRCUIT

OSCILLATOR

TDA4800

RAMP

GENERATOR

BLANKING

PULSE

GENERATOR

BUFFER

STAGE

+

2 V

PRE-

AMPLIFIER

GUARD

CIRCUIT

POWER

OUTPUT STAGE

THERMAL AND

SOAR PROTECTION

TDA4800

VOLTAGE

STABILIZER

FLYBACK

GENERATOR

FREQUENCY

DETECTOR

1

R1
(frequency)

C1

R17
R2

C2

or

sync input

blank

output

4325679810 11 12 13

C7

C8

D2

BAX18

R14

C12

VP2 = 23 V

C9

C4

C5

V

amplitude

R13

R12

MHA590

D1
1N4148

R5

R3
R4

amplitude

R8

P1

linearity

vertical

deflection

unit

6.5 Ω

R6

R7

P2

R9

6.5
mH

R10

C11C10 R15

R16

R11

frequency
criterion

C6

Fig.1 Block diagram.

1997 Mar 27 3

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

PINNING

SYMBOL PIN DESCRIPTION

OSC

R

OSC

C

SYB

O

S

OUT

PRE

I

V

P1

OUTP 7 deflection output
GND 8 ground
C

FLY

V

P2

S

GEN

BP

DU

FRQ

C

1 oscillator resistor
2 oscillator capacitor
3 sync input; blanking pulse output
4 sawtooth output
5 preamplifier input
6 supply voltage 1

9 pin for the flyback generator capacitor
10 supply voltage 2
11 sawtooth generator
12 blanking pulse duration
13 frequency criterion

handbook, halfpage

OSC
OSC
SYB
S

OUT

PRE

V

OUTP

GND

C

FLY
V

S

GEN

BP

DU

FRQ

P1

P2

R
C
O

C

I

TDA4800

1
2
3
4
5
6
7

TDA4800

8

9
10
11
12
13

MHA584

Fig.2 Pin configuration.

1997 Mar 27 4

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

FUNCTIONAL DESCRIPTION

The complete circuit consists of the following functional
blocks as shown in Fig.1:

1. Oscillator

2. Synchronization circuit

3. Blanking pulse generator

4. Frequency detector and storage

5. Ramp generator

6. Buffer stage

7. Preamplifier

8. Power output stage

9. Flyback generator

10. Guard circuit

11. Voltage stabilizer.

Oscillator (pins 1 and 2)

The oscillator is an RC-oscillator with a threshold value
switch, which ensures very good frequency stability.

The upper and lower threshold voltages are defined by an
internal voltage divider.

An external capacitor C1 at pin 2 is charged by a constant
current source. When the scan voltage of C1 reaches the
upper threshold voltage, oscillator flyback starts. Capacitor
C1 discharges via an internal resistor and transistor until
the lower threshold is reached.

The constant charge current and free-running frequency f
are adjusted by an external resistor R1 at pin 1:

=

f

o

1

-------------------------------­KR1× C1×

Synchronization circuit (pin 3)

A positive- or negative-going pulse fed to pin 3
synchronizes the oscillator by lowering the upper threshold
voltage. The synchronizing range is f
fo=50Hz→ f

Blanking pulse generator (pin 3)

Also at pin 3 a blanking pulse is available. Diode D1
separates the synchronization pulse from the blanking
pulse. During scanning, the external capacitor C6 at pin 12
is charged to an internal stabilized voltage V
The blanking pulse starts with the beginning of oscillator
flyback; then capacitor C6 discharges via the external
resistor R13 at pin 12. The blanking pulse stops when the
capacitor voltage is1⁄2V

with K = 0.68.

sync(max)

= 150 Hz.

.

stab2

to 3fo. For example:

o

.

stab2

TDA4800

The blanking pulse duration is determined by the values of
external components R13 and C6 at pin 12:

= R13 × C6 × Ln2.

t

bl

Frequency detector with storage (pin 13)

At the end of the scanning period a frequency detector
detects the oscillator frequency (see “Note” below).

When this frequency is above the threshold a flip-flop is set
to store this information. The output is an open collector
output.

OTE

N
Frequency detector change-over at pin 13 from low (= low

frequency) to high (= high frequency) is determined by fo:
f

threshold

Ramp generator (pin 11)

The ramp generator consists of two external series
capacitors C4 and C5, external charge resistor R12
(connected to pin 11), and an internal differential amplifier
which is synchronously switched by the oscillator.

External capacitors C4 and C5 at pin 11 are charged by
the charging current via the external charge resistor R12
until oscillator flyback starts. C4 and C5 are then
discharged via pin 11 by an internal resistor and transistor.
This generates a positive-going ramp voltage.

Buffer stage (pin 4)

o

The buffer stage consists of two emitter followers.
The ramp voltage is fed via the buffer stage and is
available at pin 4 with a low ohmic output impedance. With
R4 and P1 it generates a ramp function, which, together
with the feedback network of the deflection yoke, gives a
high degree of linearity at the picture tube. The linearity
can be adjusted by P1.

Preamplifier (pin 5)

The preamplifier is a differential amplifier.
The non-inverting input is fixed at about 2 V by an internal
voltage divider. The inverting input at pin 5 is connected to
the ramp voltage via R3 and feedback network P2,
R5 to R11, R15, R16, C7, C10 and C11.

Power output stage (pin 7)

The power output stage is an amplifier with a
quasi-complementary class-B output. The output is
connected to pin 7.

The power stage includes SOAR and thermal protection.

= 1.23 × fo.

1997 Mar 27 5

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

Flyback generator (pin 9)

The flyback generator has an external capacitor C8 at
pin 9. During scanning, the internal circuit switches pin 9
almost to ground; thereby C8 is charged by the supply
voltage via external components R14 and D2.

During the flyback time pin 9 is switched almost to the
supply voltage, so that the supply voltage for the power
output stage (pin 6) is nearly doubled. This high flyback
voltage ensures a very short flyback time.

Guard circuit (pin 3)

When the vertical deflection current is absent (e.g.
short-circuited, or open-circuited of the yoke) the guard
circuit changes the blanking pulse at pin 3 into a DC signal
which blanks the beam current to protect the screen.

Also an oscillator defect (C1 short-circuited or
R1 disconnected from pin 1) switches on the guard circuit.

TDA4800

Voltage stabilizer

The voltage stabilizer circuit provides a stable operating
voltage of about 7.5 V for several internal circuits of the
TDA4800.

INTERNAL CIRCUITRY

handbook, full pagewidth

10

V

stab

11 12 13

TDA4800

789654321

Fig.3 Internal circuitry.

1997 Mar 27 6

MHA588

Philips Semiconductors Product specification

Vertical deflection circuit for monitor

TDA4800

applications

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

2

V

11

V

12

V

13

V

10

V

9

V

7

V

6

V

5

V

4

V

3

I

1

I

3

I

4

, I7, I

I

6

I

9

I

11

T

stg

T

amb

T

j

P

tot

V

ESD

voltages 0 6 V

024V
06V
050V

supply voltages (VP) 0 50 V

050V
060V
060V
06V
024V

−0.7 +6 V

currents 0 −1mA

+3 −10 mA
0 −5mA

8

note 1

−1.5 +1.5 A

−0.1 +30 mA

storage temperature −25 +150 °C
operating ambient temperature note 2 −20 +70 °C
junction temperature note 3 − 150 °C
total power dissipation note 2 −−W
ESD sensitivity note 4 −2000 +2000 V

Notes

1. I

, I7 and I8 are limited by SOAR protection circuit that ensures that short-circuiting between the output pin 7 and

6

supply voltage or ground does not destroy the output stage. A short-circuit may be soldered into the printed-circuit
board or may sometimes (non-periodically) occur in the applied circuit.

2. The maximum value for the operating ambient temperature range and the power dissipation depends on the
heatsink.

3. Internally limited by thermal protection: switching temperature point at Tj= 150 ±8 °C.

4. Human body model: 1.5 kΩ, 100 pF, 5 pulses.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th(j-a)

R

th(j-mb)

thermal resistance from junction to ambient 20 K/W
thermal resistance from junction to mounting base 5 K/W

1997 Mar 27 7

Philips Semiconductors Product specification

Vertical deflection circuit for monitor

TDA4800

applications

CHARACTERISTICS

All voltages are measured to GND (ground; pin 8); T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

I

10

I

6

I

6

V

7(min)

V

7(max)

V

9

I

7

I

9

I

5

V

1

V

3

R

3

I

3

t

bl

V

11

I

11

V

13

I

13

V

4

I

4

V

3

V

3

supply voltage (pin 6) 10 − 30 V
supply voltage (pin 10) 10 − 45 V
supply current V10= 25 V; V5=3V

supply current V6=25V; V5=1V

supply current V6=25V; V5=3V

minimum output voltage I7=1A − 1.4 1.65 V
maximum output voltage I7= −1A V6−2.3 V6− 2.0 − V
output voltage during flyback I9= −1A − V10− 2.2 − V
output current −− ±1.3 A
output current −− ±1.3 A
preamplifier input current −−0.1 −µA
stabilized voltage 6.1 6.8 7.3 V
blanking pulse output voltage − 5.7 − V
blanking pulse output resistance − 300 −Ω
blanking pulse output current 0 −−3mA
blanking pulse duration R = 100 kΩ;

output voltage ramp generator 0.3 − 20 V
output current ramp generator −2 − 15 × 103µA
output voltage frequency detector lower frequency

leakage current frequency detector higher frequency

output voltage buffer stage 0 − 20 V
output current buffer stage −− −4.0 mA
synchronizing input voltage positive sync 1.0 − 6.0 V
synchronizing input voltage negative sync −0.5 −−0.7 V
tolerance of free running oscillator without sync −3.0 − +3.0 %

f∆

1

×

---- -

------------- -

f

∆

T

mb

f∆

1

×

---- -

----------

f

VP∆

oscillator temperature dependency Tmb=20to100°C − 10

oscillator voltage dependency VP=10to30V − 4×10−4− K

=25°C; VP= 23 V; unless otherwise specified.

amb

− 12 − mA

without load

− 20 − mA

without load

− 5 − mA

without load

640 680 730 µs

C = 10 nF (pin 12)

−− 1.0 V

I13=1mA

−− 1.0 µA

V13=50V

−4

− K

−1

−1

f

o

----------- ­f

sync

synchronizing ratio 1 : 2.9 1 : 3 −

1997 Mar 27 8

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

SYNC

CIRCUIT

OSCILLATOR

TDA4800

RAMP

GENERATOR

BLANKING

PULSE

GENERATOR

BUFFER

STAGE

+

2 V

PRE-

AMPLIFIER

GUARD

CIRCUIT

POWER

OUTPUT STAGE

THERMAL AND

SOAR PROTECTION

TDA4800

VOLTAGE

STABILIZER

FLYBACK

GENERATOR

FREQUENCY

DETECTOR

1

100 nF

330 kΩ
(frequency)

100

kΩ

15 kΩ

47 nF

or

sync input

blank

output

4325679810 11 12 13

100

nF

Ω

µF

BAX18

3.3 Ω
(4 W)

100 nF

100

nF

100

nF

100

µF

VP2 = 23 V

V

amplitude

180

kΩ
(R)

562 kΩ

MHA589

1N4148

47 kΩ
47 kΩ

10 kΩ

10
µF

amplitude

2.2 kΩ

100 kΩ

linearity

vertical

deflection

unit

6.5 Ω

15 kΩ

4.7 kΩ

100 Ω

120 Ω

6.5

mH

560 Ω

(0.5 W)

2200

µF

0.82 Ω

(0.5 W)

100

5.6

1.5 kΩ

frequency
criterion
50 Hz: low
60 Hz: high

10

blank pulse

nF

duration:

(C)

tbl = R × C × Ln2

Fig.4 Test and application circuit.

1997 Mar 27 9

Philips Semiconductors Product specification

Vertical deflection circuit for monitor

TDA4800

applications

TDA4800 in the test and application circuit (see Fig.4)

SYMBOL PARAMETER CONDITIONS TYP. UNIT

V

P2

I

P

V

7

V

7M

I

7

I

Y(p-p)

t

fb

t

bl

P

tot

f

o

supply voltage 23 V
supply current 215 mA
DC output voltage 11.8 V
peak output voltage 45 V
output current 0.8 A
vertical deflection current (peak-to-peak value) 1.5 A
flyback time 0.3 ms
blanking pulse duration 1.25 ms
total power dissipation 3.3 W
free running oscillator frequency without sync 45 Hz

1997 Mar 27 10

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

PACKAGE OUTLINE

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

non-concave

x

D

E

h

d

A

D

h

view B: mounting base side

2

TDA4800

SOT141-6

j

113

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A2bpcD

17.0

4.6

4.2

0.75

0.60

15.5

1

e

(1)

0.48

24.0

23.6

20.0

19.6

0.38

w M

b

p

0 5 10 mm

(1)

deD

E

h

12.2

10 3.4

11.8

scale

1

1.7

e

5.08

B

E

A

L

3

L

E

2

h

6

Q

c

m

LL3m

3.4

12.4

3.1

11.0

2.4

1.6

e

2

4.3

2.1

1.8

v M

(1)

v

Qj

0.8

0.25w0.03

Z

x

2.00

1.45

OUTLINE

VERSION

SOT141-6

IEC JEDEC EIAJ

REFERENCES

1997 Mar 27 11

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-03-11

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

MOUNTING INSTRUCTIONS FOR 13-LEAD DBS13P POWER PACKAGE

The rise in temperature caused by
power dissipation in the circuit is
reduced by adding a heatsink with a
sufficiently low thermal resistance:
R

th(mb-h)+Rth(h-a)=Rth(mb-a)

(e.g. the heatsink of Fig.5). It is
possible to attach the package to the
heatsink by screws (Fig.6) or by a
compression spring (Fig.7). A layer of
silicon grease between the heatsink
and the mounting base optimizes
thermal contact.

18.5

10.5

5

86

27 27

22.5

63.5

3.53.5

TDA4800

50

1.5

10

MHA585

M2.5

(2x)

page

heatsink

PC board

Dimensions in mm.

Fig.5 Heatsink made of black-leaded Aluminium.

handbook, halfpage

0.4

27
6

8.5

4.5

22

30°

12

MHA587

MHA586

Fig.6 Package and heatsink

attached by screws.

Dimensions in mm.

Fig.7 Compression spring for easily attaching the package to the

heatsink of Fig.5.

1997 Mar 27 12

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

(order code 9398 652 90011).

TDA4800

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Mar 27 13

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

TDA4800

NOTES

1997 Mar 27 14

Philips Semiconductors Product specification

Vertical deflection circuit for monitor
applications

TDA4800

NOTES

1997 Mar 27 15

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Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/1200/02/pp16 Date of release: 1997 Mar 27 Document order number: 9397 750 01396